CN101573020A - 保护盖 - Google Patents

保护盖 Download PDF

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Publication number
CN101573020A
CN101573020A CN200810066871.8A CN200810066871A CN101573020A CN 101573020 A CN101573020 A CN 101573020A CN 200810066871 A CN200810066871 A CN 200810066871A CN 101573020 A CN101573020 A CN 101573020A
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Prior art keywords
radiator
over cap
framework
heat
conducting glue
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周志勇
秦际云
贺小剑
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Priority to CN200810066871.8A priority Critical patent/CN101573020A/zh
Priority to US12/248,897 priority patent/US7813132B2/en
Publication of CN101573020A publication Critical patent/CN101573020A/zh
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737Organic materials with or without a thermoconductive filler
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Closures For Containers (AREA)

Abstract

一种保护盖,用于保护一散热器上的导热胶,该保护盖与涂有导热胶的散热器顶部对应并罩设于该导热胶上方,其包括一框体及由该框体延伸而出的一盖体,该框体贴合于所述散热器顶部周围,该盖体与散热器顶部之间形成一封闭的保护空间,所述盖体包括一盖板及若干由该盖板的周缘倾斜向下向外延伸并连接于所述框体顶端缘的倾斜壁。与现有技术相比,本发明之保护盖的保护空间由所述框体顶端缘倾斜向上向内并拢延伸而成,即使所述导热胶涂敷于所述散热器整个顶面,也可以避免受到污染,且,该保护盖的整体结构可以承受较大的压力,从而有效地保护了所述导热胶。

Description

保护盖
技术领域
本发明涉及一种保护盖,特别是一种用于保护散热器的导热胶不受污染的保护盖。
背景技术
目前在电子元件的散热领域,通常在电子元件表面加装一散热器,以便将其所产生的热量及时排出,为使散热器与电子元件表面紧密接触从而减小介面热阻,业者通常在散热器与电子元件的接触表面之间涂布一层具有较好的粘性和较高热传导率的导热胶,使得散热器与发热电子元件的表面接触更加紧密,从而增强热传导效果。但是,由于导热胶是一种膏状易污染性化学物质,因此有必要对导热胶进行保护。
现有的保护盖通常在散热器顶部涂敷的导热胶上对应具有一矩形的盖体罩设该导热胶。在一定程度上,现有技术可以有效地保护导热胶。然而,当导热胶的面积接近甚至等于散热器顶部的面积时,现有的保护盖结构一方面会刮伤并污染导热胶,另一方面由于盖体面积过大造成受力时容易变形,不能有效地保护导热胶。
发明内容
有鉴于此,有必要提供一种能够有效保护导热胶不受污染的保护盖。
一种保护盖,用于保护一散热器上的导热胶,该保护盖与涂有导热胶的散热器顶部对应并罩设于该导热胶上方,其包括一框体及由该框体延伸而出的一盖体,该框体贴合于所述散热器顶部周围,该盖体与散热器顶部之间形成一封闭的保护空间,所述盖体包括一盖板及若干由该盖板的周缘倾斜向下向外延伸并连接于所述框体顶端缘的倾斜壁。
与现有技术相比,本发明之保护盖的保护空间由所述框体顶端缘倾斜向上向内并拢延伸而成,即使所述导热胶涂敷于所述散热器整个顶面,也可以避免受到污染,且,该保护盖的整体结构可以承受较大的压力,从而有效地保护了所述导热胶。
附图说明
图1是本发明一优选实施例的保护盖与一散热器及一扣具的立体分解图。
图2是图1中保护盖翻转后的立体图。
图3是图1中保护盖与散热器及扣具的立体组合图。
具体实施方式
请参阅图1,为本发明一优选实施例的保护盖10与一散热器20及一扣具40的立体图。该散热器20用于吸收、散发一发热电子元件如中央处理器(图未示)所产生的热量,该散热器20的顶部与该发热电子元件接触,一层导热胶30涂敷在该散热器20的顶部,该保护盖10罩设在该散热器20顶部以保护导热胶30,所述扣具40加设于所述散热器20上,用来固定该散热器20使其与所述发热电子元件紧密接触。
请一并参阅图2,所述保护盖10整体上为一中空壳体,采用塑料或金属材料等一体形成。该保护盖10包括一框体12、由该框体12底部水平向两侧延伸而出的二容置部14及从该框体12顶部向内延伸而出的一盖体16,该盖体16包括一矩形盖板164及由该盖板164四边(未标示)分别倾斜向下延伸出的四梯形倾斜壁162。该保护盖10的框体12为一由四竖直框边122首尾相连围成的矩形框体。该框体12在外形上与所述散热器20的顶部相一致。二所述容置部14呈矩形,分别由所述框体12两相对框边122的底端中部向外延伸而出,该二容置部14内部中空并与所述框体12相连通以供容置所述扣具40的对应部分。所述盖体16的盖板164为一薄平矩形板,其对应位于所述倾斜壁162的上方。该盖板164与所述框边122相垂直且平行与散热器20的顶面。四所述倾斜壁162分别由所述盖板164的周缘倾斜向下向外延伸而出并连接于所述四所述框边122顶端缘,从而在所述盖体16内部形成一半封闭的容置空间160。
上述散热器20由导热性能良好的金属材料如铝、铜等一体形成,其包括一基板22及从该基板22底面垂直向下延伸且平行间隔排列的若干散热鳍片24。所述基板22为一矩形板,其外形与所述框体12所围成的空间(未标示)形状相一致。该基板22底面中部二散热鳍片24之间形成一沟槽26,用以放置所述扣具40。
上述扣具40为线型扣具,由弹性金属线一体弯折而成,其包括一抵压部42及从该抵压部42两端分别延伸出的二扣臂44,二所述扣臂44的末端分别形成一扣钩46。所述抵压部42容置于所述散热器20基板22底面上形成的沟槽26内,其长度略大于所述沟槽26的长度,使得二所述扣臂44分别位于所述散热器20相对两侧。
请同时参阅图3,组装时,将所述保护盖10罩设于所述散热器20顶部,其中,所述保护盖10框体12四框边122分别与所述散热器20基板22四侧边(未标示)相贴合,所述扣具40的抵压部42对应置于所述散热器20的沟槽26内,该抵压部42两端(未标示)分别伸出所述散热器20的部分对应容置于所述保护盖10的二容置部14内,所述保护盖10盖体16与所述散热器20基板22之间形成一封闭空间(未标示),以供容纳涂敷在该基板22顶面的导热胶30。另外,为增加装配所述保护盖的牢固性,可以直接在该保护盖10框体12的框边122内侧面涂覆粘胶加固该保护盖10,也可以在所述框体12外侧面加设胶带,粘接所述保护盖10与所述散热器20。
综上所述,本发明之保护盖10框体12贴合于所述散热器20顶部周围,安装牢固方便。且,所述保护盖10盖体16由框体12整个顶部倾斜向内延伸而出,即使所述导热胶30涂敷于散热器20整个顶面,也可以有效地避免导热胶30受到污染。此外,所述保护盖10框体12延伸出的容置部14一方面可以避免所述扣具40产生相对滑动时使所述保护盖10松动甚至脱落,另一方面在拆卸所述保护盖10时可以作为受力点,便于拆卸。

Claims (10)

1.一种保护盖,用于保护一散热器上的导热胶,该保护盖与涂有导热胶的散热器顶部对应并罩设于该导热胶上方,其包括一框体及由该框体延伸而出的一盖体,该框体贴合于所述散热器顶部周围,该盖体与散热器顶部之间形成一封闭的保护空间,其特征在于:所述盖体包括一盖板及若干由该盖板的周缘倾斜向下向外延伸并连接于所述框体顶端缘的倾斜壁。
2.如权利要求1所述的保护盖,其特征在于:所述盖板位于散热器顶部中部的上方并与散热器顶部平行。
3.如权利要求2所述的保护盖,其特征在于:所述盖板呈矩形,所述倾斜壁呈梯形。
4.如权利要求2所述的保护盖,其特征在于:所述保护盖的框体为一由四框边首尾相连围成的矩形框体,每一所述框边垂直于所述盖体的盖板。
5.如权利要求1或2所述的保护盖,其特征在于:还有一扣具加设于所述散热器上,用来固定安装该散热器,该扣具部分伸出所述散热器之外以与其它元件卡扣。
6.如权利要求5所述的保护盖,其特征在于:所述保护盖还包括至少一容置部,其内部中空以容置部分所述扣具。
7.如权利要求6所述的保护盖,其特征在于:所述容置部由所述框体框边的底端中部向外延伸而出,该容置部所述框体相互连通。
8.如权利要求6所述的保护盖,其特征在于:所述容置部整体上呈矩形。
9.如权利要求1或2所述的保护盖,其特征在于:所述保护盖的框体内侧面涂敷有粘胶。
10.如权利要求1或2所述的保护盖,其特征在于:所述保护盖还包括一贴附在框体外侧面的胶带,该胶带粘接所述保护盖与所述散热器。
CN200810066871.8A 2008-04-28 2008-04-28 保护盖 Pending CN101573020A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200810066871.8A CN101573020A (zh) 2008-04-28 2008-04-28 保护盖
US12/248,897 US7813132B2 (en) 2008-04-28 2008-10-10 Heat dissipation assembly

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CN200810066871.8A CN101573020A (zh) 2008-04-28 2008-04-28 保护盖

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Application publication date: 20091104