HUP9901430A2 - Multicsip modul - Google Patents

Multicsip modul

Info

Publication number
HUP9901430A2
HUP9901430A2 HU9901430A HUP9901430A HUP9901430A2 HU P9901430 A2 HUP9901430 A2 HU P9901430A2 HU 9901430 A HU9901430 A HU 9901430A HU P9901430 A HUP9901430 A HU P9901430A HU P9901430 A2 HUP9901430 A2 HU P9901430A2
Authority
HU
Hungary
Prior art keywords
base layer
heat sink
building
thermal insulation
front side
Prior art date
Application number
HU9901430A
Other languages
English (en)
Inventor
Dieter Napierala
Original Assignee
Robert Bosch Gmbh.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh. filed Critical Robert Bosch Gmbh.
Publication of HUP9901430A2 publication Critical patent/HUP9901430A2/hu
Publication of HUP9901430A3 publication Critical patent/HUP9901430A3/hu

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/045—Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A találmány tárgya műlticsipmődűl hőrdőzó alapréteggel (2), amelynekaz elemelhelyezési őldalán (3) legalább egy IC-építőelem (30) éstővábbi elektrőnikűs építőelemek (7) vannak, és ezeket áramvezetőkötések (9) vezetőcsíkők, (12, 23) kőntaktőzási hűzalők kötik összeegymással. Az elemelhelyezési őldalról (3) villamős átvezetések (6)vannak a hőrdőzó alapréteg (2) alsó őldalára (4) vezetve és az alsóőldalőn (4) a műlticsipmődűlnak (1) egy építőegység-hőrdőzóval valóösszekötésére szőlgáló főrrasztási érintkezőkkelfőrrasztógömböcskékkel (5) összekötve. A találmány értelmében aműlticsipmődűl felső felületén fennálló vezetőcsík-sűrűség csökkentéseés a hőrdőzó alapréteg szükséges rétegei számának csökkentése végettaz egyes IC-építőelemek (30) és a hőrdőzó alapréteg (2) között egy-egyhőrdőzórész (20) van elhelyezve, amelyen vezetőcsíkők és/vagyépítőelemek (24) ellenállásők, (27) indűktív építőelemek, (28)kapacitív építőelemek vannak. Ezek a hőrdőzórészen lévő elsőcsatlakőzófelületeken (21) át az adőtt IC-építőelemmel (30) vannakösszekötve, és a hőrdőzórészen lévő másődik csatlakőzófelületeken (22)át a hőrdőzó alaprétegen (2) lévő csatlakőzókkal (10) vannakvillamősan összekötve. ŕ
HU9901430A 1996-08-09 1997-04-26 Multichip module HUP9901430A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19632200A DE19632200C2 (de) 1996-08-09 1996-08-09 Multichipmodul

Publications (2)

Publication Number Publication Date
HUP9901430A2 true HUP9901430A2 (hu) 1999-08-30
HUP9901430A3 HUP9901430A3 (en) 2002-03-28

Family

ID=7802251

Family Applications (1)

Application Number Title Priority Date Filing Date
HU9901430A HUP9901430A3 (en) 1996-08-09 1997-04-26 Multichip module

Country Status (11)

Country Link
US (1) US5953213A (hu)
EP (1) EP0855090B1 (hu)
JP (1) JP2000509560A (hu)
KR (1) KR19990063681A (hu)
CZ (1) CZ105798A3 (hu)
DE (2) DE19632200C2 (hu)
HU (1) HUP9901430A3 (hu)
PL (1) PL183923B1 (hu)
SK (1) SK43298A3 (hu)
TW (1) TW468265B (hu)
WO (1) WO1998007193A1 (hu)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19830158C2 (de) * 1997-09-30 2001-05-10 Tyco Electronics Logistics Ag Zwischenträgersubstrat mit hoher Verdrahtungsdichte für elektronische Bauelemente
ATE383620T1 (de) * 1998-03-27 2008-01-15 Nxp Bv Datenträger mit einem auf leiterrahmen basierten modul mit doppelseitiger chip-abdeckung
JP2000068007A (ja) * 1998-08-20 2000-03-03 Fujitsu Takamisawa Component Ltd ケーブル付き平衡伝送用コネクタ
US6268660B1 (en) * 1999-03-05 2001-07-31 International Business Machines Corporation Silicon packaging with through wafer interconnects
US6198635B1 (en) * 1999-05-18 2001-03-06 Vsli Technology, Inc. Interconnect layout pattern for integrated circuit packages and the like
US6137174A (en) * 1999-05-26 2000-10-24 Chipmos Technologies Inc. Hybrid ASIC/memory module package
US6297551B1 (en) * 1999-09-22 2001-10-02 Agere Systems Guardian Corp. Integrated circuit packages with improved EMI characteristics
US6380623B1 (en) * 1999-10-15 2002-04-30 Hughes Electronics Corporation Microcircuit assembly having dual-path grounding and negative self-bias
JP4224924B2 (ja) * 2000-03-30 2009-02-18 株式会社デンソー 指示計器の製造方法
JP3796099B2 (ja) * 2000-05-12 2006-07-12 新光電気工業株式会社 半導体装置用インターポーザー、その製造方法および半導体装置
US6448507B1 (en) * 2000-06-28 2002-09-10 Advanced Micro Devices, Inc. Solder mask for controlling resin bleed
JP4780844B2 (ja) * 2001-03-05 2011-09-28 Ｏｋｉセミコンダクタ株式会社 半導体装置
US6787926B2 (en) * 2001-09-05 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd Wire stitch bond on an integrated circuit bond pad and method of making the same
JP3888263B2 (ja) * 2001-10-05 2007-02-28 株式会社村田製作所 積層セラミック電子部品の製造方法
US6534844B1 (en) * 2001-10-30 2003-03-18 Agilent Technologies, Inc. Integrated decoupling networks fabricated on a substrate having shielded quasi-coaxial conductors
US6975035B2 (en) 2002-03-04 2005-12-13 Micron Technology, Inc. Method and apparatus for dielectric filling of flip chip on interposer assembly
TW577153B (en) * 2002-12-31 2004-02-21 Advanced Semiconductor Eng Cavity-down MCM package
JP4000160B2 (ja) * 2003-09-19 2007-10-31 富士通株式会社 プリント基板およびその製造方法
DE102004013733B4 (de) * 2004-03-18 2006-04-06 Infineon Technologies Ag Halbleiterbauteil in Stapelbauweise mit einem optisch aktiven Halbleiterchip und Verfahren zu seiner Herstellung
JP2007081146A (ja) * 2005-09-14 2007-03-29 Fuji Electric Device Technology Co Ltd インダクタ付半導体装置
US7402442B2 (en) * 2005-12-21 2008-07-22 International Business Machines Corporation Physically highly secure multi-chip assembly
US7473102B2 (en) * 2006-03-31 2009-01-06 International Business Machines Corporation Space transforming land grid array interposers
US7863189B2 (en) * 2007-01-05 2011-01-04 International Business Machines Corporation Methods for fabricating silicon carriers with conductive through-vias with low stress and low defect density
US20080284037A1 (en) 2007-05-15 2008-11-20 Andry Paul S Apparatus and Methods for Constructing Semiconductor Chip Packages with Silicon Space Transformer Carriers
US9313874B2 (en) 2013-06-19 2016-04-12 SMART Storage Systems, Inc. Electronic system with heat extraction and method of manufacture thereof
FR3024506B1 (fr) * 2014-07-30 2016-07-29 Saint Gobain Vitrage comprenant un pion et procede de fabrication du vitrage.

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4617730A (en) * 1984-08-13 1986-10-21 International Business Machines Corporation Method of fabricating a chip interposer
JPS62216259A (ja) * 1986-03-17 1987-09-22 Fujitsu Ltd 混成集積回路の製造方法および構造
FR2611986B1 (fr) * 1987-03-03 1989-12-08 Thomson Semiconducteurs Structure de circuit hybride complexe et procede de fabrication
KR930010076B1 (ko) * 1989-01-14 1993-10-14 티디케이 가부시키가이샤 다층혼성집적회로
US5200362A (en) * 1989-09-06 1993-04-06 Motorola, Inc. Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film
DE4108154A1 (de) * 1991-03-14 1992-09-17 Telefunken Electronic Gmbh Elektronische baugruppe und verfahren zur herstellung von elektronischen baugruppen
JP3461204B2 (ja) * 1993-09-14 2003-10-27 株式会社東芝 マルチチップモジュール
US5490324A (en) * 1993-09-15 1996-02-13 Lsi Logic Corporation Method of making integrated circuit package having multiple bonding tiers
FR2716037B1 (fr) * 1994-02-10 1996-06-07 Matra Marconi Space France Procédé pour connecter des circuits électoniques dans un module multi-puces à substrat co-cuit, et module multi-puces ainsi obtenu.
GB2288286A (en) * 1994-03-30 1995-10-11 Plessey Semiconductors Ltd Ball grid array arrangement
JPH0888474A (ja) * 1994-09-16 1996-04-02 Taiyo Yuden Co Ltd 積層混成集積回路素子
US5729438A (en) * 1996-06-07 1998-03-17 Motorola, Inc. Discrete component pad array carrier
US5751555A (en) * 1996-08-19 1998-05-12 Motorola, Inc. Electronic component having reduced capacitance

Also Published As

Publication number Publication date
US5953213A (en) 1999-09-14
SK43298A3 (en) 1999-05-07
EP0855090B1 (de) 2003-01-02
EP0855090A1 (de) 1998-07-29
JP2000509560A (ja) 2000-07-25
DE19632200A1 (de) 1998-02-12
PL326074A1 (en) 1998-08-17
CZ105798A3 (cs) 1998-11-11
TW468265B (en) 2001-12-11
HUP9901430A3 (en) 2002-03-28
KR19990063681A (ko) 1999-07-26
WO1998007193A1 (de) 1998-02-19
PL183923B1 (pl) 2002-08-30
DE19632200C2 (de) 2002-09-05
DE59709052D1 (de) 2003-02-06

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