KR970703617A - 전도선을 가진 리드프레임 리드를 포함한 고밀도 집적회로 조립체(a high density integrated circuit assembly combining leadframe leads with conductive traces) - Google Patents

전도선을 가진 리드프레임 리드를 포함한 고밀도 집적회로 조립체(a high density integrated circuit assembly combining leadframe leads with conductive traces) Download PDF

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Publication number
KR970703617A
KR970703617A KR1019960706590A KR19960706590A KR970703617A KR 970703617 A KR970703617 A KR 970703617A KR 1019960706590 A KR1019960706590 A KR 1019960706590A KR 19960706590 A KR19960706590 A KR 19960706590A KR 970703617 A KR970703617 A KR 970703617A
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South Korea
Prior art keywords
chip
integrated circuit
circuit assembly
electrically
leadframe leads
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KR1019960706590A
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English (en)
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KR100299560B1 (ko
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사트야 칠랄라
샤흐람 모스타파자데흐
Original Assignee
클라크 3세 존 엠. 시니어
내셔널 세미컨덕터 코오포레이션
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Publication of KR970703617A publication Critical patent/KR970703617A/ko
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Publication of KR100299560B1 publication Critical patent/KR100299560B1/ko

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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
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  • Physics & Mathematics (AREA)
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  • Lead Frames For Integrated Circuits (AREA)

Abstract

집적회로 조립체(30)가 여기에 개시된다. 조립체는 전기 전도선(40)의 소정 어레이와 전도선(40)에 전기적으로 접속된 땜납볼(42)의 어레이가 형성된 절연기판(32)을 구비한다. 일련의 입력/출력 패드를 가진 집적회로칩(44)이 기판(36)위에서 지지된다. 일 실시예에서, 다수의 리드프레임 리드는 전도선(40)과 전기적으로 절연되어 기판에 의해 지지된다. 일련의 제1결합선 및 일련의 제2결합선은 IC 칩(44)위의 입력/출력 패드의 임의의 하나를 리드프레임 리드(48) 및 전도선(40)에 전기접속시킨다. 다른 실시예에서, 하나 이상의 전기절연된 전도층(142,144)은 선(128) 및 리드프레임 리드(130) 상부의 절연기판(122)에 의해 지지된다. 이 실시예들에 따라서, 집접회로 조립체(120)는 1C 칩(132)을 위한 매우 고밀도의 전기 상호접속 배치와 작은 패키지 영역을 제공한다.

Description

전도선을 가진 리드프레임 리드를 포함한 고밀도 집적회로 조립체(A HIGH DENSITY INTEGRATED CIRCUIT ASSEMBLY COMBINING LEADFRAME LEADS WITH CONDUCTIVE TRACES )
[도면의 간단한 설명]
제2도는 본 발명의 실시예 1에 따라 설계된 집적회로 조립체의 개략적 입면도. 제2a도는 제2도의 조립체의 개략적 단면도.
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (13)

  1. 집적회로 조립체에 있어서, 제1표면 위에 전기전도선의 소정 어레이가 형성된 절연기판과, 상기 기판에 의해 지지되고 상기 전도선과 전기절연된 다수의 리드프레임 리드와, 상기 제1표면 위에서 기판에 의해 지지되고, 일련의 입력/출력 패드를 포함한 IC 칩 및, IC 칩이 상기 전기전도선과 상기 리드프레임 리드를 통과하는 소정의 방식으로 외부소자에 접속될 수 있도록, 상기 IC 칩의 입력/출력 패드의 임의의 하나를 상기 전도선의 각각에 각각 전기접속시키는 일련의 제1결합선과, IC 칩의 입력/출력 패드의 임의의 다른 하나를 상기 리드프레임 리드의 각각에 각각 전기접속시키는 일련의 제2결합선을 구비하며, 상기 기판은 상기 제1표면과 제2반대 표면을 적어도 추가로 포함하며, 상기 제1표면은 상기 IC 칩과 상기 리드프레임 리드를 지지하고, 상기 기판은 상기 제2표면에 부착된 다수의 연장, 전기전도성 부분을 소정위치에 추가로 포함하며, 상기 전도선은 상기 제1표면에서 상기 제2표면까지 연장되어 있으며, 각각의 상기 전도선은 상기 연장된 부분의 관련된 한쪽에 전기접속되는 것을 특징으로 하는 집적회로 조립체.
  2. 제1항에 있어서, 상기 연장된 부분은 소정의 그리드 어레이내의 상기 제2표면에 부착되는 것을 특징으로하는 집접회로 조립체.
  3. 제1항에 있어서, 각각의 상기 연장된 부분은 땜납열인 것을 특징으로 하는 집적회로 조립체.
  4. 제1항에 있어서, 각각의 상기 연장된 부분은 부착핀인 것을 특징으로 하는 집적회로 조립체.
  5. 집적회로 조립체에 있어서, 전기전도선의 소정 어레이를 포함하고, 상기 전도선이 상기 제1표면에서 제2표면까지 연장되도록 반대쪽인 제1표면 및 제2표면을 추가로 포함하고, 각각의 부분이 상기 전도선의 각각에 전기접속되도록 상기 제2표면에 소정위치에서 부착된 다수의 연장된 부분을 추가로 포함하는 절연 기판과, 리드프레임 리드의 적어도 일부가 상기 전도선위에 놓여지도록 상기 기판의 상기 제1표면에 의해 지지되는 다수의 리드프레임 리드와, 상기 기판의 제1표면상에 지지되고 일련의 입력/출력 패드와. 하나 이상의 전력단자 및 하나 이상의 접지단자를 포함하는 IC 칩과, IC 칩 위의 상기 입력/출력 패드의 임의의 하나를 상기 전도선의 각각에 각각 전기접속하는 일련의 제1결합선 및, IC 칩 위의 입력/출력 패드의 임의의 다른 하나를 상기 제1표면위의 상기 리드프레임 리드의 각각에 각각 전기접속하는 일련의 제2결합선과, 상기 기판위에 상호간에 스택 형태로 위치되고 상기 리드프레임 리드의 적어도 일부 위에 놓여지며, 전력면 또는 접지면으로 각각 선택하여 사용하는 제1전기전도층 및 제2전기 전도층과, 상기 전도층을 상호간 절연시키고 그 아래의 상기 리드프레임 리드와 전기적으로 절연시키는 수단 및, 상기 제1층과 제2층을 상기 리드프레임 리드 또는 전도선의 특정하나에 전기접속시키고 상기 제1층과 제2층을 상기 IC 칩 위의 각각의 전력단자와 접지단자에 전기접속시켜, IC 칩의 전기 상호접속을 위한 사전선택가능한 전력면 및 접지면을 제공하기 위한 수단을 구비하는 것을 특징으로 하는 집적회로 조립체.
  6. 제5항에 있어서, 각각의 상기 연장된 부분은 땜납열인 것을 특징으로 하는 집적회로 조립체.
  7. 제5항에 있어서, 각각의 상기 연장된 부분은 부착핀인 것을 특징으로 하는 집적회로 조립체.
  8. 집적회로 조립체에 있어서, 전기 전도선의 소정 어레이를 포함하고, 상기 전도선이 제1표면과 제2표면까지 연장되도록 반대편인 제1표면 및 제2표면을 추가로 포함하며, 각각의 연장된 부분이 상기 전도선의 각각에 전기접속되도록 소정위치에서 상기 제2표면에 부착된 다수의 연장된 부분을 추가로 포함하는 절연기판과, 상기 리드프레임 리드의 적어도 일부가 상기 전도선위에 놓여지도록 상기 기판의 상기 제1표면에 의해 지지되는 다수의 리드프레임 리드와, 상기 기판의 제1표면상에서 지지되며 일련의 입력/출력 패드와, 하나 이상의 전력단자 및 하나 이상의 접지단자를 포함하는 IC 칩과, IC 칩을 소정방식으로 외부에 전기접속시키기 위해, 상기 IC 칩의 입력/출력 패드의 임의의 하나를 상기 제1표면위의 상기 전도선의 각각에 각각 전기접속시키는 제1어레이의 결합선 및, 상기 IC 칩의 입력/출력 패드의 임의의 다른 하나를 상기 제1표면의의 상기 리드프레임 리드의 각각에 각각 전기접속시키는 제2어레이의 결합선과, 상기 기관위에서 상호간에 스택 형태로 위치되어 있으며 상기 리드프레임 리드의 적어도 일부위에 놓여지고, 전력면과 접지면으로 각각 선택하여 사용하는 제1전도층 및 제2전도층과, 상기 제1층 및 제2층을 상호간 절연시키며 그 아래의 상기 리드프레임 리드와 전기절연시키며, 상기 층을 상호간 결합시키고 기판과 결합시키기 위해 사용되는 절연재료와, 상기 IC 칩의 전기상호접속을 위해 사전선택가능한 전력면과 접지면을 제공하기 위해, 상기 제1층 및 제2층을 상기 리드프레임 리드 또는 전도선의 특정하나에 전기접속시키는 일련의 제1결합선 및, 상기 제1충 및 제2층을 상기 IC 칩 위의 각각의 사전선택된 전력단자 또는 접지단자에 전기접속시키는 일련의 제2결합선과, 상기 집적회로 조립체의 적어도 일부를 캡슐화하는 절연재료를 구비하는 것을 특징으로 하는 집적회로 조립체.
  9. 제8항에 있어서, 각각의 상기 연장된 부분은 땜납열인 것을 특징으로 하는 집적회로 조립체.
  10. 제8항에 있어서, 각각의 상기 연장된 부분은 부착핀인 것을 특징으로 하는 집적회로 조립체.
  11. 집적회로 조립체에 있어서, 전기전도선의 소정 어레이를 포함하고, 상기 전도선이 제1표면에서 제2표면까지 연장되도록 반대쪽인 제1표면 및 제2표면을 추가로 포함하며, 각각의 부분이 상기 전도선의 각각의 하나에 전기 접속되도록 그리드 어레이내의 상기 제2표면에 부착된 다수의 연장된 부분을 추가로 포함하는 절연기판과, 상기 리드프레임 리드의 적어도 일부가 상기 전도선위에 놓여지도록 상기 기판의 상기 제1표면에 의해 지지되는 다수의 리드프레임 리드와, 상기 기판의 제1표면 위에서 지지되고, 일련의 입력/출력 패드를 포함하며, 부가적인 전기단자를 추가로 포함하는1C 칩과, 상기 1C 칩의 입력/출력 패드의 임의의 하나를 상기 제1표면의 상기 전도선의 각각에 각각 전기접속하는 제1어레이의 결합선 및, IC 칩의 입력/출력 패드의 임의의 다른 하나를 상기 제1표면위의 상기 리드프레임 리드의 각각에 각각 전기접속하는 제2어레이의 결합선과, 상기 기판 위에서 상호간에 스택형태로 위치되고 상기 리드프레임 리드의 적어도 일부위에 놓여지며, 소정의 회로설계에 따라서 상기 IC 칩에 각각 사전선택가능한 전기접속을 위한 전도면으로 선택하여 사용하는 제1전기전도층 및 제2전기전도층, 상기 제1층과 제2층을 상호간 전기절연시키고 그 아래의 상기 리드프레임 리드와 전기절연시켜, 상기 전도층을 상호간 접착시키고 기판과 접착시키기 위해 사용하는 절연재료와, 상기 IC 칩의 사전선택가능한 전기 상호접속을 제공하기 위해, 상기 제l 및 제2층을 상기 리드프레임 리드 또는 전도선의 특정하나에 전기접속시키는 일련의 제1결합선 및, 상기 제1층과 제2층을 IC 칩 위의 상기 부가적인 단자에 전기접속시키기 위한 일련의 제2결합선과, 상기 집적회로 조립체의 적어도 일부를 캡슐화하는 절연재료를 구비하는 것을 특징으로 하는 집적회로 조립체.
  12. 제11항에 있어서, 각각의 상기 연장된 부분은 땜납열인 것을 특징으로 하는 집적회로 조립체.
  13. 제11항에 있어서, 각각의 상기 연장된 부분은 부착핀인 것을 특징으로 하는 집적회로 조립체.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960706590A 1995-03-20 1996-03-20 리드프레임리드와도전성트레이스를조합한고밀도집적회로어셈블리 KR100299560B1 (ko)

Applications Claiming Priority (3)

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US08/406,726 US5569955A (en) 1994-09-16 1995-03-20 High density integrated circuit assembly combining leadframe leads with conductive traces
US08/406,726 1995-03-20
PCT/US1996/003770 WO1996029737A1 (en) 1995-03-20 1996-03-20 A high density integrated circuit assembly combining leadframe leads with conductive traces

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KR970703617A true KR970703617A (ko) 1997-07-03
KR100299560B1 KR100299560B1 (ko) 2001-11-22

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EP0760164B1 (en) 2002-01-30
US5569955A (en) 1996-10-29
DE69618872T2 (de) 2002-11-28
WO1996029737A1 (en) 1996-09-26
EP0760164A1 (en) 1997-03-05
KR100299560B1 (ko) 2001-11-22
DE69618872D1 (de) 2002-03-14

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