SE8103779L - HALF CONDUCTOR OR SIMILAR REFRIGERATOR - Google Patents

HALF CONDUCTOR OR SIMILAR REFRIGERATOR

Info

Publication number
SE8103779L
SE8103779L SE8103779A SE8103779A SE8103779L SE 8103779 L SE8103779 L SE 8103779L SE 8103779 A SE8103779 A SE 8103779A SE 8103779 A SE8103779 A SE 8103779A SE 8103779 L SE8103779 L SE 8103779L
Authority
SE
Sweden
Prior art keywords
half conductor
similar refrigerator
fins
refrigerator
similar
Prior art date
Application number
SE8103779A
Other languages
Swedish (sv)
Other versions
SE457584B (en
Inventor
U Bock
Original Assignee
Alusuisse
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alusuisse filed Critical Alusuisse
Publication of SE8103779L publication Critical patent/SE8103779L/en
Publication of SE457584B publication Critical patent/SE457584B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A sectional insert 10 may be placed between each two adjacent longer fins 3 to give additional cooling surfaces and divide the spaces into four ducts 14, 15. A heat sink for a semiconductor device is provided with fins 3, 4 of different heights arranged alternately. <IMAGE>
SE8103779A 1980-06-30 1981-06-16 REFRIGERATOR FOR SEMI-CONDUCTOR SE457584B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3024748A DE3024748C2 (en) 1980-06-30 1980-06-30 Heat sinks for semiconductor components

Publications (2)

Publication Number Publication Date
SE8103779L true SE8103779L (en) 1981-12-31
SE457584B SE457584B (en) 1989-01-09

Family

ID=6106046

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8103779A SE457584B (en) 1980-06-30 1981-06-16 REFRIGERATOR FOR SEMI-CONDUCTOR

Country Status (4)

Country Link
DE (1) DE3024748C2 (en)
FR (1) FR2485807A1 (en)
GB (1) GB2079052B (en)
SE (1) SE457584B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3518310A1 (en) * 1985-05-22 1986-11-27 Aluminium-Walzwerke Singen Gmbh, 7700 Singen REFRIGERATOR BODY FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF
DE8703604U1 (en) * 1987-03-11 1988-07-21 Euroatlas Gmbh Fuer Umformertechnik Und Optronik, 2800 Bremen, De
DE59106364D1 (en) * 1990-10-24 1995-10-05 Alusuisse Lonza Services Ag Heatsinks for semiconductor devices.
DE9319259U1 (en) * 1993-12-15 1994-03-24 Siemens Ag Heatsink
GB2333353A (en) * 1998-01-16 1999-07-21 Kuo Ching Sung Heat dissipating device
DE19806978B4 (en) * 1998-02-19 2008-08-21 Behr Gmbh & Co. Kg Cooling device for cooling by convection
DE102004040557A1 (en) * 2004-08-16 2006-02-23 Kern, Dietmar, Dr.-Ing. Electronics heatsink
DE102009037259B4 (en) * 2009-08-12 2012-04-19 Semikron Elektronik Gmbh & Co. Kg Arrangement with a cooling device and a power semiconductor module
US20160369995A1 (en) * 2015-06-16 2016-12-22 Posco Led Company Ltd. Optical semiconductor lighting apparatus
EP3403937B1 (en) * 2017-05-19 2021-01-13 Goodrich Lighting Systems GmbH Exterior aircraft light unit
DE102019107280A1 (en) * 2019-03-21 2020-09-24 apt Extrusions GmbH & Co. KG Cooling device for cooling a third-party object to be cooled
WO2020244727A1 (en) * 2019-06-03 2020-12-10 Huawei Technologies Co., Ltd. An apparatus for transferring heat from a heat source to air

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1959193A1 (en) * 1969-11-25 1971-05-27 Leonhard Roesch Knitting loops and courses indicator
DE7913126U1 (en) * 1979-05-07 1979-08-23 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt HEAT SINK MADE OF EXTRUDED ALUMINUM FOR PERFORMANCE SEMICONDUCTORS

Also Published As

Publication number Publication date
SE457584B (en) 1989-01-09
FR2485807A1 (en) 1981-12-31
GB2079052B (en) 1984-10-24
GB2079052A (en) 1982-01-13
DE3024748C2 (en) 1986-09-04
FR2485807B3 (en) 1983-07-18
DE3024748A1 (en) 1982-02-04

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