GB2079052B - Cooling bodies for semiconductors or the like - Google Patents

Cooling bodies for semiconductors or the like

Info

Publication number
GB2079052B
GB2079052B GB8120125A GB8120125A GB2079052B GB 2079052 B GB2079052 B GB 2079052B GB 8120125 A GB8120125 A GB 8120125A GB 8120125 A GB8120125 A GB 8120125A GB 2079052 B GB2079052 B GB 2079052B
Authority
GB
United Kingdom
Prior art keywords
semiconductors
cooling bodies
bodies
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8120125A
Other versions
GB2079052A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcan Holdings Switzerland AG
Original Assignee
Alusuisse Holdings AG
Schweizerische Aluminium AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alusuisse Holdings AG, Schweizerische Aluminium AG filed Critical Alusuisse Holdings AG
Publication of GB2079052A publication Critical patent/GB2079052A/en
Application granted granted Critical
Publication of GB2079052B publication Critical patent/GB2079052B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB8120125A 1980-06-30 1981-06-30 Cooling bodies for semiconductors or the like Expired GB2079052B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3024748A DE3024748C2 (en) 1980-06-30 1980-06-30 Heat sinks for semiconductor components

Publications (2)

Publication Number Publication Date
GB2079052A GB2079052A (en) 1982-01-13
GB2079052B true GB2079052B (en) 1984-10-24

Family

ID=6106046

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8120125A Expired GB2079052B (en) 1980-06-30 1981-06-30 Cooling bodies for semiconductors or the like

Country Status (4)

Country Link
DE (1) DE3024748C2 (en)
FR (1) FR2485807A1 (en)
GB (1) GB2079052B (en)
SE (1) SE457584B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3518310A1 (en) * 1985-05-22 1986-11-27 Aluminium-Walzwerke Singen Gmbh, 7700 Singen REFRIGERATOR BODY FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF
DE8703604U1 (en) * 1987-03-11 1988-07-21 Euroatlas Gmbh Fuer Umformertechnik Und Optronik, 2800 Bremen, De
DE59106364D1 (en) * 1990-10-24 1995-10-05 Alusuisse Lonza Services Ag Heatsinks for semiconductor devices.
DE9319259U1 (en) * 1993-12-15 1994-03-24 Siemens Ag Heatsink
GB2333353A (en) * 1998-01-16 1999-07-21 Kuo Ching Sung Heat dissipating device
DE19806978B4 (en) * 1998-02-19 2008-08-21 Behr Gmbh & Co. Kg Cooling device for cooling by convection
DE102004040557A1 (en) * 2004-08-16 2006-02-23 Kern, Dietmar, Dr.-Ing. Electronics heatsink
DE102009037259B4 (en) * 2009-08-12 2012-04-19 Semikron Elektronik Gmbh & Co. Kg Arrangement with a cooling device and a power semiconductor module
US20160369995A1 (en) * 2015-06-16 2016-12-22 Posco Led Company Ltd. Optical semiconductor lighting apparatus
EP3403937B1 (en) * 2017-05-19 2021-01-13 Goodrich Lighting Systems GmbH Exterior aircraft light unit
DE102019107280A1 (en) * 2019-03-21 2020-09-24 apt Extrusions GmbH & Co. KG Cooling device for cooling a third-party object to be cooled
WO2020244727A1 (en) * 2019-06-03 2020-12-10 Huawei Technologies Co., Ltd. An apparatus for transferring heat from a heat source to air

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1959193A1 (en) * 1969-11-25 1971-05-27 Leonhard Roesch Knitting loops and courses indicator
DE7913126U1 (en) * 1979-05-07 1979-08-23 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt HEAT SINK MADE OF EXTRUDED ALUMINUM FOR PERFORMANCE SEMICONDUCTORS

Also Published As

Publication number Publication date
SE457584B (en) 1989-01-09
FR2485807A1 (en) 1981-12-31
GB2079052A (en) 1982-01-13
DE3024748C2 (en) 1986-09-04
SE8103779L (en) 1981-12-31
FR2485807B3 (en) 1983-07-18
DE3024748A1 (en) 1982-02-04

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19980630