DE3024748A1 - RADIATOR FOR SEMICONDUCTOR OR THE LIKE - Google Patents
RADIATOR FOR SEMICONDUCTOR OR THE LIKEInfo
- Publication number
- DE3024748A1 DE3024748A1 DE19803024748 DE3024748A DE3024748A1 DE 3024748 A1 DE3024748 A1 DE 3024748A1 DE 19803024748 DE19803024748 DE 19803024748 DE 3024748 A DE3024748 A DE 3024748A DE 3024748 A1 DE3024748 A1 DE 3024748A1
- Authority
- DE
- Germany
- Prior art keywords
- heat sink
- sink according
- cooling fins
- profile insert
- profile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 5
- 238000001816 cooling Methods 0.000 claims description 47
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
Kühlkörper für Halbleiter od. dgl.Heat sink for semiconductors or the like.
Die Erfindung betrifft einen Kühlkörper für Halbleiter od. dgl. mit von einer Grundplatte etwa rechtwinkelig abstehenden Kühlrippen.The invention relates to a heat sink for semiconductors or the like with approximately at right angles protruding from a base plate Cooling fins.
Die Kühlrippen sind an ihrer Grundplatte üblicherweise kammförmig angeordnet und von gleicher Länge. Zu Erreichung eines möglichst großen Kühleffekts wird allgemein angestrebt, auf möglichst geringem Raum eine sehr große Oberfläche unterzubringen.The cooling fins are usually arranged in a comb shape on their base plate and are of the same length. To achieve The greatest possible cooling effect is generally aimed for, and a very large surface in the smallest possible space accommodate.
Diese Forderung führt u. a. zu fertigungstechnischen Problemen deshalb, weil der Wunsch, auf kleinem Raum große Oberfläche unterzubringen den preßtechnischen Möglichkeiten entgegengesetzt ist.This requirement leads inter alia. to manufacturing problems because of the desire to have a large surface in a small space to accommodate the press technology is contrary to the possibilities.
130065/0075130065/0075
AL-153AL-153
Versuche, die Kühlrippen im Querschnitt konisch zu gestalten haben zwar fertigungstechnische gute Ergebnisse gebracht, die jedoch vom Wirkungsgrad her nicht befriedigend waren, da anstelle der größten Wärmeabgabe auf Grund der Enge des Querschnittes die Luftgeschwindigkeit am geringsten war.Attempts to make the cooling fins conical in cross section have good results in terms of production engineering brought, which, however, were not satisfactory in terms of efficiency, because instead of the greatest heat dissipation Due to the narrow cross-section, the air speed was the lowest.
Angesichts dieser Gegebenheiten hat sich der Erfinder das Ziel gesetzt, einen Kühlkörper der eingangs erwähnten Art zu entwickeln, welcher zum einen eine optimale Kühlwirkung erbringt und zum anderen problemlos sowie kostengünstig herzustellen ist.In view of these circumstances, the inventor has set himself the goal of developing a heat sink of the type mentioned at the beginning Art to develop, which on the one hand provides an optimal cooling effect and on the other hand problem-free and is inexpensive to manufacture.
Zur Lösung dieser Aufgabe führt, daß die Kühlrippen von zumindest zwei unterschiedlichen Höhen und — bezogen auf die Höhen — wechselweise angebracht sind. Zudem hat es sich als günstig erwiesen, zwischen zwei benachbarten Kühlrippen einen Profileinsatz einzubringen und dort festzulegen.To solve this problem leads that the cooling fins of at least two different heights and - related on the heights - are attached alternately. In addition, it has proven to be cheap, between two to introduce a profile insert in adjacent cooling fins and to fix it there.
Nach einem weiteren Merk^tjl der Erfindung ist zwischen zwei langen Kühlrippen ein Profileinsatz eingebracht und an der zwischen jenen vorgesehenen kurzen Kühlrippe klemmend festgelegt. Hierzu weisen die kurzen Kühlrippen im Bereich ihrer Spitze bevorzugtermaßen reibungsfördernde Elemente auf und sind beispielsweise geriffelt.According to a further aspect of the invention is between two long cooling fins introduced a profile insert and on the short cooling fin provided between them clamped fixed. For this purpose, the short cooling fins preferably have friction-promoting fins in the area of their tips Elements and are, for example, corrugated.
Auf die — glatten oder geriffelten — Spitzen der kurzen Kühlrippen wird nach einem weiteren Merkmal der Erfindung der Profileinsatz aufgeschoben, der hierzu ein Klemmaul aufweist.On the - smooth or fluted - tips of the short ones According to a further feature of the invention, the profile insert is pushed on by cooling ribs, which has a clamping jaw for this purpose having.
130065/0075130065/0075
Es liegt im Rahmen der Erfindung, daß sich der Profileinsatz durch von seinem Profilkörper abstehende Spreizarme an den einander zugekehrten Flanken der langen Kühlrippen abstützt. Hierdurch bilden erfindungsgemäß jeweils zwei lange Kühlrippen und eine kurze Kühlrippe mit dem Profileinsatz zumindest zwei — bevorzugt vier — Kammern.It is within the scope of the invention that the profile insert is extended by spreading arms projecting from its profile body supported on the facing flanks of the long cooling fins. This forms according to the invention two long cooling ribs and one short cooling rib with the profile insert at least two - preferred four-chambers.
Zur Erhöhung des Kühleffektes ragen vom Profilkörper des Profileinsatzes quer zu dessen Längsachse Querrippen ab, welche gegenüber den Spreizarmen von etwa halber Lange sind, also in die vorab erwähnten Kammern einragen, ohne die Flanken der Kühlrippen zu berühren.To increase the cooling effect, transverse ribs protrude from the profile body of the profile insert transversely to its longitudinal axis which are about half the length of the spreader arms, i.e. in the chambers mentioned above protrude without touching the flanks of the cooling fins.
Als günstig hat es sich erwiesen, den Profileinsatz mit einem Klemmkopf auszubilden, welcher zwischen zwei Spreizarmen den Einsatzschlitz anbietet.It has proven to be advantageous to design the profile insert with a clamping head which is positioned between two Spreader arms offers the insert slot.
Dank der voranstehenden Maßgaben werden die Strömungsverhältnisse durch die besondere Form des Kühlkörpers bei wesentlich reduziertem Rippenverhaltnis erheblich verbessert.Thanks to the above stipulations, the flow conditions are determined by the special shape of the heat sink significantly improved with a significantly reduced rib ratio.
Der erfindungsgemäße Kühlkörper weist also Rippen unterschiedlicher Höhe auf, wobei die Höhenunterschiede durch die aufgeklemmten Profileinsätze ausgeglichen werden, welche ihrerseits Querrippen aufweisen und damit zum Kühlverhalten erheblich beitragen. Auf diese Weise kann das Rippenverhältnis von bisher 7,25 : 1 auf etwa 4 : 1 gesenkt werden. Darüber hinaus wird eine erhebliche Fertigungsvereinfachung erreicht; sowohl der Kühlkörper selbst als auch der Profileinsatz werden von stranggepreßten Profilen abgelängt.The heat sink according to the invention thus has different ribs Height, whereby the height differences are compensated by the clamped profile inserts, which in turn have transverse ribs and thus contribute significantly to the cooling behavior. This way the rib ratio can can be reduced from 7.25: 1 to around 4: 1. In addition, there is a considerable simplification of production achieved; Both the heat sink itself and the profile insert are cut to length from extruded profiles.
130065/0075130065/0075
AL-153 "T'AL-153 'T'
Weitere Vorteile, Merkmale und Einzelheiten der Erfindung ergeben sich auÄ der nachfolgenden Beschreibung eines bevorzugten Ausführungsbeispiels sowie anhand der Zeichnung^ diese zeigt in:Further advantages, features and details of the invention emerge from the following description of a preferred one Embodiment and based on the drawing ^ this shows in:
Fig. 1: den Querschnitt durch einen Teil eines Kühlkörpers mit Profileinsatz;1: the cross section through part of a heat sink with a profile insert;
Fig. 2: den Querschnitt durch den Profileinsatz; Fig. 3: ein Ausführungsbeispiel des Kühlkörpers.2: the cross section through the profile insert; Fig. 3: an embodiment of the heat sink.
Ein Kühlkörper 1 weist gemäß Fig. 1 eine Grundplatte 2 der Stärke i von beispielsweise 15 mm mit davon abragenden Kühlrippen 3, 4 unterschiedlicher Höhe a (beispielsweise 40 mm) bzw. b (70 mm ) und sich zur gerundeten Rippenspitze 5, 6 hin verjüngendem Querschnitt auf.According to FIG. 1, a heat sink 1 has a base plate 2 of thickness i of, for example, 15 mm with protruding parts Cooling fins 3, 4 of different heights a (for example 40 mm) or b (70 mm) and towards the rounded tip of the fin 5, 6 tapering cross-section.
Die Sockelbreite d der längeren Kühlrippen 3 beträgt 5 mm und ist gerinfügig größer als die Sockelbreite e der kürzeren Kühlrippen 4; ebenso ist die Profilbreite f an der Spitze 5 der längeren Kühlrippen 3 mit 2,5 mm nur wenig größer als die Breite g an der Spitze 6 der kürzeren Kühlrippen 4.The base width d of the longer cooling fins 3 is 5 mm and is slightly larger than the base width e the shorter cooling fins 4; likewise the profile width f at the tip 5 of the longer cooling fins 3 is 2.5 mm only slightly larger than the width g at the tip 6 of the shorter cooling fins 4.
Die Rippenhöhe b der langen Kühlrippe 3 verhält sich zum lichten Rippenabstand m wie 3:1, die Rippenhöhe a der kurzen Kühlrippe 4 zu dem in Fig. 1 verdeutlichten engen Rippenabstand η zur benachbarten langen Kühlrippe 3 wie 4:1. Der Sockelabstand ρ mißt etwa 7 mm.The rib height b of the long cooling rib 3 is related to the clear rib spacing m as 3: 1, the rib height a the short cooling fin 4 to the narrow fin spacing η illustrated in FIG. 1 to the adjacent long cooling fin 3 such as 4: 1. The base distance ρ measures about 7 mm.
130086/0075130086/0075
AL-153AL-153
Die Rippenspitzen 6 können geriffelte Flächen aufweisen, um einem Profileinsatz 10 einen besseren Halt zu geben, welcher mit einem klammerartigen Kopfteil 11 auf die kurzen Kühlrippen 4 aufgesteckt werden kann und sich dann mit Spreizarmen 12, 13 gegen die FlankenThe rib tips 6 can have corrugated surfaces in order to give a profile insert 10 a better hold to give, which can be attached to the short cooling fins 4 with a clamp-like head part 11 and then with spreading arms 12, 13 against the flanks
9 der langen Kühlrippen 3 abstützt. So entstehen zwischen jeweils einem benachbarten Tal langer Kühlrippen 3 vier Kammern 14, 15; deren innere Kammern 14 werden von der Grundplatte 2, den Kühlrippen 3, 4, 3 und den Spreizarmen 12 des klammerartigen Kopfteils 11 gebildet, die äußeren Kammern 15 von den spitzen Bereichen der langen Kühlrippen 3 und dem Profileinsatz oder Aufsteckprofil9 of the long cooling fins 3 is supported. Thus, between each adjacent valley, long cooling fins 3 four arise Chambers 14, 15; whose inner chambers 14 are of the Base plate 2, the cooling fins 3, 4, 3 and the spreading arms 12 of the clip-like head part 11 formed, the outer chambers 15 from the pointed areas of the long Cooling fins 3 and the profile insert or clip-on profile
Vom stufenartigen Profilkörper 20 des ProfileinsatzesFrom the step-like profile body 20 of the profile insert
10 ragen quer zu dessen Längsachse M beidseits Querrippen 21 ab, die von unterschiedlicher Höhe h sein können (Fig. 2) oder aber gleich lang (Fig. 3).10 project transversely to its longitudinal axis M on both sides of transverse ribs 21, which can be of different heights h (Fig. 2) or the same length (Fig. 3).
Die beiden Spreizarme 12 bzw. 13 eines Spreizarmpaares sind in jeweils gleichem Winkel t bzw. w zur Längsachse M geneigt, wobei die Spreizarme 12 am Kopfteil 11 einen Klemmschlitz 22 bilden. Die Spreizarme 12, 13 jeder Seite verlaufen zueinander etwa parallel.The two spreading arms 12 and 13 of a pair of spreading arms are each at the same angle t and w to the longitudinal axis M inclined, the spreading arms 12 forming a clamping slot 22 on the head part 11. The spreading arms 12, 13 each Side run approximately parallel to each other.
Die Gesamtlänge q des Profileinsatzes 10 mißt etwa 35The total length q of the profile insert 10 measures approximately 35
130065/00 7 5130065/00 7 5
LeerseiteBlank page
Claims (14)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3024748A DE3024748C2 (en) | 1980-06-30 | 1980-06-30 | Heat sinks for semiconductor components |
SE8103779A SE457584B (en) | 1980-06-30 | 1981-06-16 | REFRIGERATOR FOR SEMI-CONDUCTOR |
FR8112876A FR2485807A1 (en) | 1980-06-30 | 1981-06-30 | HEAT DISSIPATOR FOR SEMICONDUCTORS OR THE LIKE |
GB8120125A GB2079052B (en) | 1980-06-30 | 1981-06-30 | Cooling bodies for semiconductors or the like |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3024748A DE3024748C2 (en) | 1980-06-30 | 1980-06-30 | Heat sinks for semiconductor components |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3024748A1 true DE3024748A1 (en) | 1982-02-04 |
DE3024748C2 DE3024748C2 (en) | 1986-09-04 |
Family
ID=6106046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3024748A Expired DE3024748C2 (en) | 1980-06-30 | 1980-06-30 | Heat sinks for semiconductor components |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE3024748C2 (en) |
FR (1) | FR2485807A1 (en) |
GB (1) | GB2079052B (en) |
SE (1) | SE457584B (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3518310A1 (en) * | 1985-05-22 | 1986-11-27 | Aluminium-Walzwerke Singen Gmbh, 7700 Singen | REFRIGERATOR BODY FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF |
US5844313A (en) * | 1993-12-15 | 1998-12-01 | Siemens Aktiengesellschaft | Heat sink |
DE102009037259A1 (en) * | 2009-08-12 | 2011-02-17 | Semikron Elektronik Gmbh & Co. Kg | Arrangement with a cooling device and a power semiconductor module |
WO2020187657A1 (en) * | 2019-03-21 | 2020-09-24 | apt Extrusions GmbH & Co. KG | Cooling device for cooling a separate object to be cooled |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE8703604U1 (en) * | 1987-03-11 | 1988-07-21 | Euroatlas Gmbh Fuer Umformertechnik Und Optronik, 2800 Bremen, De | |
ATE127276T1 (en) * | 1990-10-24 | 1995-09-15 | Alusuisse Lonza Services Ag | HEAT SINK FOR SEMICONDUCTOR COMPONENTS. |
GB2333353A (en) * | 1998-01-16 | 1999-07-21 | Kuo Ching Sung | Heat dissipating device |
DE19806978B4 (en) * | 1998-02-19 | 2008-08-21 | Behr Gmbh & Co. Kg | Cooling device for cooling by convection |
DE102004040557A1 (en) * | 2004-08-16 | 2006-02-23 | Kern, Dietmar, Dr.-Ing. | Electronics heatsink |
US20160369995A1 (en) * | 2015-06-16 | 2016-12-22 | Posco Led Company Ltd. | Optical semiconductor lighting apparatus |
EP3403937B1 (en) * | 2017-05-19 | 2021-01-13 | Goodrich Lighting Systems GmbH | Exterior aircraft light unit |
EP3973749A1 (en) * | 2019-06-03 | 2022-03-30 | Huawei Technologies Co., Ltd. | An apparatus for transferring heat from a heat source to air |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1959193A1 (en) * | 1969-11-25 | 1971-05-27 | Leonhard Roesch | Knitting loops and courses indicator |
DE7913126U1 (en) * | 1979-05-07 | 1979-08-23 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | HEAT SINK MADE OF EXTRUDED ALUMINUM FOR PERFORMANCE SEMICONDUCTORS |
-
1980
- 1980-06-30 DE DE3024748A patent/DE3024748C2/en not_active Expired
-
1981
- 1981-06-16 SE SE8103779A patent/SE457584B/en not_active IP Right Cessation
- 1981-06-30 GB GB8120125A patent/GB2079052B/en not_active Expired
- 1981-06-30 FR FR8112876A patent/FR2485807A1/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1959193A1 (en) * | 1969-11-25 | 1971-05-27 | Leonhard Roesch | Knitting loops and courses indicator |
DE7913126U1 (en) * | 1979-05-07 | 1979-08-23 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | HEAT SINK MADE OF EXTRUDED ALUMINUM FOR PERFORMANCE SEMICONDUCTORS |
Non-Patent Citations (1)
Title |
---|
Prospekt:"Elektronische Bauteile", H. Schaffner v. 25.10.66 * |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3518310A1 (en) * | 1985-05-22 | 1986-11-27 | Aluminium-Walzwerke Singen Gmbh, 7700 Singen | REFRIGERATOR BODY FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF |
US5844313A (en) * | 1993-12-15 | 1998-12-01 | Siemens Aktiengesellschaft | Heat sink |
DE102009037259A1 (en) * | 2009-08-12 | 2011-02-17 | Semikron Elektronik Gmbh & Co. Kg | Arrangement with a cooling device and a power semiconductor module |
DE102009037259B4 (en) * | 2009-08-12 | 2012-04-19 | Semikron Elektronik Gmbh & Co. Kg | Arrangement with a cooling device and a power semiconductor module |
WO2020187657A1 (en) * | 2019-03-21 | 2020-09-24 | apt Extrusions GmbH & Co. KG | Cooling device for cooling a separate object to be cooled |
KR20210139415A (en) * | 2019-03-21 | 2021-11-22 | 아페테 익스트루션스 게엠베하 운트 코. 카게 | Cooling device for cooling a separate cooling object |
US20220178625A1 (en) * | 2019-03-21 | 2022-06-09 | apt Extrusions GmbH & Co. KG | Cooling device for cooling a separate object to be cooled |
KR102560647B1 (en) * | 2019-03-21 | 2023-07-27 | 아페테 익스트루션스 게엠베하 운트 코. 카게 | A cooling device for cooling a separate cooling object |
Also Published As
Publication number | Publication date |
---|---|
DE3024748C2 (en) | 1986-09-04 |
GB2079052B (en) | 1984-10-24 |
FR2485807A1 (en) | 1981-12-31 |
FR2485807B3 (en) | 1983-07-18 |
GB2079052A (en) | 1982-01-13 |
SE457584B (en) | 1989-01-09 |
SE8103779L (en) | 1981-12-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: ALUSINGEN GMBH, 7700 SINGEN, DE |
|
8339 | Ceased/non-payment of the annual fee |