WO1999051069A3 - Fiber heat sink and fiber heat exchanger - Google Patents
Fiber heat sink and fiber heat exchanger Download PDFInfo
- Publication number
- WO1999051069A3 WO1999051069A3 PCT/US1999/004282 US9904282W WO9951069A3 WO 1999051069 A3 WO1999051069 A3 WO 1999051069A3 US 9904282 W US9904282 W US 9904282W WO 9951069 A3 WO9951069 A3 WO 9951069A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fiber heat
- fiber
- heat exchanger
- heat sink
- sink
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU31819/99A AU3181999A (en) | 1998-03-30 | 1999-03-30 | Fiber heat sink and fiber heat exchanger |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US7997798P | 1998-03-30 | 1998-03-30 | |
US60/079,977 | 1998-03-30 | ||
US9866998P | 1998-09-01 | 1998-09-01 | |
US60/098,669 | 1998-09-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1999051069A2 WO1999051069A2 (en) | 1999-10-07 |
WO1999051069A3 true WO1999051069A3 (en) | 1999-12-09 |
Family
ID=26762644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1999/004282 WO1999051069A2 (en) | 1998-03-30 | 1999-03-30 | Fiber heat sink and fiber heat exchanger |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU3181999A (en) |
WO (1) | WO1999051069A2 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0008897D0 (en) | 2000-04-12 | 2000-05-31 | Cheiros Technology Ltd | Improvements relating to heat transfer |
DE10212754B4 (en) * | 2002-03-20 | 2004-04-08 | Krause, Günter | Heat exchanger |
WO2006041325A1 (en) * | 2004-10-08 | 2006-04-20 | Verteletsky, Pavel Vasilievich | Multi-filament heat sink |
CN102483010B (en) | 2009-07-10 | 2015-03-18 | 埃塔里姆有限公司 | Stirling cycle transducer for converting between thermal energy and mechanical energy |
JP2014501868A (en) | 2010-11-18 | 2014-01-23 | エタリム インコーポレイテッド | Stirling cycle converter device |
SE541352C2 (en) * | 2015-06-03 | 2019-08-13 | Apr Tech Ab | Microfluidic array |
SE543734C2 (en) * | 2019-03-11 | 2021-07-06 | Apr Tech Ab | Cooling of electronic components with an electrohydrodynamic flow unit |
SE543441C2 (en) * | 2019-03-26 | 2021-02-16 | Centropy Ab | Heat transfer device |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4485429A (en) * | 1982-06-09 | 1984-11-27 | Sperry Corporation | Apparatus for cooling integrated circuit chips |
US5077637A (en) * | 1989-09-25 | 1991-12-31 | The Charles Stark Draper Lab., Inc. | Solid state directional thermal cable |
US5150748A (en) * | 1990-06-18 | 1992-09-29 | Mcdonnell Douglas Corporation | Advanced survivable radiator |
US5390734A (en) * | 1993-05-28 | 1995-02-21 | Lytron Incorporated | Heat sink |
US5542471A (en) * | 1993-11-16 | 1996-08-06 | Loral Vought System Corporation | Heat transfer element having the thermally conductive fibers |
US5566752A (en) * | 1994-10-20 | 1996-10-22 | Lockheed Fort Worth Company | High heat density transfer device |
US5655600A (en) * | 1995-06-05 | 1997-08-12 | Alliedsignal Inc. | Composite plate pin or ribbon heat exchanger |
US5769158A (en) * | 1996-03-28 | 1998-06-23 | Mitsubishi Denki Kabushiki Kaisha | Interface portion structure and reinforcing structure of flexible thermal joint |
US5852548A (en) * | 1994-09-09 | 1998-12-22 | Northrop Grumman Corporation | Enhanced heat transfer in printed circuit boards and electronic components thereof |
-
1999
- 1999-03-30 AU AU31819/99A patent/AU3181999A/en not_active Abandoned
- 1999-03-30 WO PCT/US1999/004282 patent/WO1999051069A2/en active Application Filing
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4485429A (en) * | 1982-06-09 | 1984-11-27 | Sperry Corporation | Apparatus for cooling integrated circuit chips |
US5077637A (en) * | 1989-09-25 | 1991-12-31 | The Charles Stark Draper Lab., Inc. | Solid state directional thermal cable |
US5150748A (en) * | 1990-06-18 | 1992-09-29 | Mcdonnell Douglas Corporation | Advanced survivable radiator |
US5390734A (en) * | 1993-05-28 | 1995-02-21 | Lytron Incorporated | Heat sink |
US5542471A (en) * | 1993-11-16 | 1996-08-06 | Loral Vought System Corporation | Heat transfer element having the thermally conductive fibers |
US5852548A (en) * | 1994-09-09 | 1998-12-22 | Northrop Grumman Corporation | Enhanced heat transfer in printed circuit boards and electronic components thereof |
US5566752A (en) * | 1994-10-20 | 1996-10-22 | Lockheed Fort Worth Company | High heat density transfer device |
US5655600A (en) * | 1995-06-05 | 1997-08-12 | Alliedsignal Inc. | Composite plate pin or ribbon heat exchanger |
US5769158A (en) * | 1996-03-28 | 1998-06-23 | Mitsubishi Denki Kabushiki Kaisha | Interface portion structure and reinforcing structure of flexible thermal joint |
Also Published As
Publication number | Publication date |
---|---|
AU3181999A (en) | 1999-10-18 |
WO1999051069A2 (en) | 1999-10-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2003095917A3 (en) | Sorptive heat exchanger and related cooled sorption process | |
WO2004003713A3 (en) | Cooling unit for cooling heat generating component | |
WO2003012357A3 (en) | Heat exchanger assembly and heat exchange manifold | |
WO2003078044A3 (en) | Method and apparatus for minimizing adverse effects of thermal expansion in a heat exchange reactor | |
TW200626059A (en) | Systems to cool multiple electrical components | |
WO2001063983A3 (en) | Thermal management system | |
WO2003052819A3 (en) | Apparatus and method for augmented cooling of computers | |
DE69101619D1 (en) | High performance heat transfer surface for high pressure coolant. | |
WO2007001317A3 (en) | Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management | |
EP1328022A3 (en) | Cooling apparatus for electronic devices | |
WO2007103628A3 (en) | Method and apparatus for dissipating heat | |
WO1999051069A3 (en) | Fiber heat sink and fiber heat exchanger | |
AU1419295A (en) | A method concerning a thermal energy distribution system, and a thermal energy distribution system | |
MY116712A (en) | Thermal transfer film | |
AU1419695A (en) | A method and system for transferring heating and/or cooling power | |
EP1289011A3 (en) | Switching or control apparatus | |
AU7264294A (en) | Arrangement for cooling supply air in an air-conditioning installation | |
CA2037505A1 (en) | Semiconductor element | |
TW357251B (en) | Heat exchanging unit, heat exchanging unit assembly and thermoelectric refrigeration system each accommodating a thermoelectric module | |
PL292007A1 (en) | Preformed panel member for panel-type heat exchanger used in air conditioning systems | |
EP0766308A3 (en) | Reduced thermal cycling of water cooled power electronic devices | |
GB9716001D0 (en) | High performance, high aspect ratio copper heat sink for air cooling | |
FI980217A (en) | A method and apparatus for treating poorly conductive material | |
EP0281404A3 (en) | Cooling system for electronic equipment | |
FR2825457B1 (en) | HEAT EXCHANGE DEVICE AND METHOD FOR MANUFACTURING THE HEAT EXCHANGE DEVICE |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT UA UG US UZ VN YU ZA ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GH GM KE LS MW SD SL SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
AK | Designated states |
Kind code of ref document: A3 Designated state(s): AE AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT UA UG US UZ VN YU ZA ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): GH GM KE LS MW SD SL SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
NENP | Non-entry into the national phase |
Ref country code: KR |
|
REG | Reference to national code |
Ref country code: DE Ref legal event code: 8642 |
|
122 | Ep: pct application non-entry in european phase |