WO2003052819A3 - Apparatus and method for augmented cooling of computers - Google Patents

Apparatus and method for augmented cooling of computers Download PDF

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Publication number
WO2003052819A3
WO2003052819A3 PCT/US2002/040122 US0240122W WO03052819A3 WO 2003052819 A3 WO2003052819 A3 WO 2003052819A3 US 0240122 W US0240122 W US 0240122W WO 03052819 A3 WO03052819 A3 WO 03052819A3
Authority
WO
WIPO (PCT)
Prior art keywords
computer
heat
heat transfer
removal system
transfer module
Prior art date
Application number
PCT/US2002/040122
Other languages
French (fr)
Other versions
WO2003052819A2 (en
Inventor
Robert Otey
Brian Rabe
Original Assignee
Robert Otey
Brian Rabe
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Otey, Brian Rabe filed Critical Robert Otey
Priority to AU2002364002A priority Critical patent/AU2002364002A1/en
Publication of WO2003052819A2 publication Critical patent/WO2003052819A2/en
Publication of WO2003052819A3 publication Critical patent/WO2003052819A3/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0251—Removal of heat by a gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2500/00—Problems to be solved
    • F25B2500/01—Geometry problems, e.g. for reducing size
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A combination of a computer and an external heat transfer module to improve the heat removing capability of a computer's internal heat removal system, the combination includes a computer with a thermal interface port connected to the computer's internal heat removal system and a heat transfer module connected to the thermal interface port. The heat transfer module has a heat dissipation component and at least one heat transfer conduit having one end thermally coupled to the computer's internal heat removal system, and the other end thermally coupled to the heat dissipation component.
PCT/US2002/040122 2001-12-14 2002-12-12 Apparatus and method for augmented cooling of computers WO2003052819A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002364002A AU2002364002A1 (en) 2001-12-14 2002-12-12 Apparatus and method for augmented cooling of computers

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/017,710 2001-12-14
US10/017,710 US20030110779A1 (en) 2001-12-14 2001-12-14 Apparatus and method for augmented cooling of computers

Publications (2)

Publication Number Publication Date
WO2003052819A2 WO2003052819A2 (en) 2003-06-26
WO2003052819A3 true WO2003052819A3 (en) 2003-11-27

Family

ID=21784115

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/040122 WO2003052819A2 (en) 2001-12-14 2002-12-12 Apparatus and method for augmented cooling of computers

Country Status (3)

Country Link
US (1) US20030110779A1 (en)
AU (1) AU2002364002A1 (en)
WO (1) WO2003052819A2 (en)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050145371A1 (en) * 2003-12-31 2005-07-07 Eric Distefano Thermal solution for electronics cooling using a heat pipe in combination with active loop solution
US7074123B2 (en) * 2004-01-13 2006-07-11 Power Of 4, L.L.C. Cabinet for computer devices with air distribution device
US20050257532A1 (en) * 2004-03-11 2005-11-24 Masami Ikeda Module for cooling semiconductor device
US7587901B2 (en) 2004-12-20 2009-09-15 Amerigon Incorporated Control system for thermal module in vehicle
US7325406B2 (en) * 2005-10-06 2008-02-05 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Cooling system for computer
US20080087316A1 (en) 2006-10-12 2008-04-17 Masa Inaba Thermoelectric device with internal sensor
US7805955B2 (en) * 2006-12-30 2010-10-05 Intel Corporation Using refrigeration and heat pipe for electronics cooling applications
EP2102564B1 (en) * 2007-01-10 2015-09-02 Gentherm Incorporated Thermoelectric device
WO2008103742A2 (en) * 2007-02-23 2008-08-28 Dhama Apparel Innovations Private Ltd Apparel with heating and cooling capabilities
WO2009036077A1 (en) 2007-09-10 2009-03-19 Amerigon, Inc. Operational control schemes for ventilated seat or bed assemblies
EP2234839B1 (en) 2008-02-01 2016-06-29 Gentherm Incorporated Condensation and humidity sensors for thermoelectric devices
US20090323276A1 (en) * 2008-06-25 2009-12-31 Mongia Rajiv K High performance spreader for lid cooling applications
EP2341800B8 (en) 2008-07-18 2012-12-26 Gentherm Incorporated Climate controlled bed assembly
TW201248946A (en) * 2011-05-18 2012-12-01 Neobulb Technologies Inc Semiconductor optoelectronic converting system and the fabricating method thereof
WO2013052823A1 (en) 2011-10-07 2013-04-11 Gentherm Incorporated Thermoelectric device controls and methods
US9989267B2 (en) 2012-02-10 2018-06-05 Gentherm Incorporated Moisture abatement in heating operation of climate controlled systems
US8397518B1 (en) 2012-02-20 2013-03-19 Dhama Innovations PVT. Ltd. Apparel with integral heating and cooling device
US9662962B2 (en) 2013-11-05 2017-05-30 Gentherm Incorporated Vehicle headliner assembly for zonal comfort
US10472986B2 (en) * 2014-01-24 2019-11-12 United Technologies Corporation Systems for thermoelectric cooling for jet aircraft propulsion systems
WO2015123585A1 (en) 2014-02-14 2015-08-20 Gentherm Incorporated Conductive convective climate controlled seat
US11857004B2 (en) 2014-11-14 2024-01-02 Gentherm Incorporated Heating and cooling technologies
US11639816B2 (en) 2014-11-14 2023-05-02 Gentherm Incorporated Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system
US11033058B2 (en) 2014-11-14 2021-06-15 Gentherm Incorporated Heating and cooling technologies
US9516783B2 (en) * 2014-11-26 2016-12-06 Hoffman Enclosures, Inc. Thermoelectric cooler controller
US10502463B2 (en) 2014-11-26 2019-12-10 Hoffman Enclosures, Inc. Thermoelectric cooler controller and angled mounting thereof
US10991869B2 (en) 2018-07-30 2021-04-27 Gentherm Incorporated Thermoelectric device having a plurality of sealing materials
KR20210095206A (en) 2018-11-30 2021-07-30 젠썸 인코포레이티드 Thermoelectric air conditioning system and method
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
US11649993B2 (en) * 2019-06-28 2023-05-16 Intel Corporation Hybrid thermal cooling system
CN111596746B (en) * 2020-05-17 2022-01-04 江苏科腾环境科技有限公司 Device for cooling liquid by using semiconductor refrigeration piece and liquid-cooled CPU radiator
CN111562832B (en) * 2020-05-17 2021-11-09 济南得德环保科技有限公司 Refrigerating device adopting semiconductor refrigerating sheet for refrigeration and CPU radiator
US11409340B2 (en) * 2020-06-23 2022-08-09 Qualcomm Incorporated Thermal mitigation in a portable computing device by active heat transfer to a docking device
US11599168B2 (en) * 2021-07-27 2023-03-07 Dell Products L.P. Extended thermal battery for cooling portable devices
US20230247755A1 (en) * 2022-01-31 2023-08-03 Microsoft Technology Licensing, Llc Electronic device with active heat transfer

Citations (4)

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Publication number Priority date Publication date Assignee Title
US5704212A (en) * 1996-09-13 1998-01-06 Itronix Corporation Active cooling system for cradle of portable electronic devices
US5974556A (en) * 1997-05-02 1999-10-26 Intel Corporation Circuit and method for controlling power and performance based on operating environment
US20010007525A1 (en) * 1998-11-12 2001-07-12 Tracy Mark S. Docking station with thermoelectric heat dissipation system for docked portable computer
US6276448B1 (en) * 1999-09-22 2001-08-21 Kel Corporation Heat-transfer connector

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5704212A (en) * 1996-09-13 1998-01-06 Itronix Corporation Active cooling system for cradle of portable electronic devices
US5974556A (en) * 1997-05-02 1999-10-26 Intel Corporation Circuit and method for controlling power and performance based on operating environment
US20010007525A1 (en) * 1998-11-12 2001-07-12 Tracy Mark S. Docking station with thermoelectric heat dissipation system for docked portable computer
US6276448B1 (en) * 1999-09-22 2001-08-21 Kel Corporation Heat-transfer connector

Also Published As

Publication number Publication date
AU2002364002A1 (en) 2003-06-30
US20030110779A1 (en) 2003-06-19
WO2003052819A2 (en) 2003-06-26
AU2002364002A8 (en) 2003-06-30

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