FR2579371B1 - Procede et dispositif de refroidissement pour diodes et thyristors de puissance, mettant en oeuvre le principe du thermosiphon biphase - Google Patents

Procede et dispositif de refroidissement pour diodes et thyristors de puissance, mettant en oeuvre le principe du thermosiphon biphase

Info

Publication number
FR2579371B1
FR2579371B1 FR8504027A FR8504027A FR2579371B1 FR 2579371 B1 FR2579371 B1 FR 2579371B1 FR 8504027 A FR8504027 A FR 8504027A FR 8504027 A FR8504027 A FR 8504027A FR 2579371 B1 FR2579371 B1 FR 2579371B1
Authority
FR
France
Prior art keywords
thyristors
principle
cooling method
power diodes
phase thermosiphon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8504027A
Other languages
English (en)
Other versions
FR2579371A1 (fr
Inventor
Giuseppe Carnevali
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CONTARDO SpA
Original Assignee
CONTARDO SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CONTARDO SpA filed Critical CONTARDO SpA
Priority to FR8504027A priority Critical patent/FR2579371B1/fr
Priority to ES543609A priority patent/ES8702082A1/es
Publication of FR2579371A1 publication Critical patent/FR2579371A1/fr
Application granted granted Critical
Publication of FR2579371B1 publication Critical patent/FR2579371B1/fr
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR8504027A 1985-03-19 1985-03-19 Procede et dispositif de refroidissement pour diodes et thyristors de puissance, mettant en oeuvre le principe du thermosiphon biphase Expired FR2579371B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR8504027A FR2579371B1 (fr) 1985-03-19 1985-03-19 Procede et dispositif de refroidissement pour diodes et thyristors de puissance, mettant en oeuvre le principe du thermosiphon biphase
ES543609A ES8702082A1 (es) 1985-03-19 1985-05-29 Perfeccionamientos en los sistemas de enfriaiento de dispositivos electronicos de potencia.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8504027A FR2579371B1 (fr) 1985-03-19 1985-03-19 Procede et dispositif de refroidissement pour diodes et thyristors de puissance, mettant en oeuvre le principe du thermosiphon biphase

Publications (2)

Publication Number Publication Date
FR2579371A1 FR2579371A1 (fr) 1986-09-26
FR2579371B1 true FR2579371B1 (fr) 1987-09-11

Family

ID=9317330

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8504027A Expired FR2579371B1 (fr) 1985-03-19 1985-03-19 Procede et dispositif de refroidissement pour diodes et thyristors de puissance, mettant en oeuvre le principe du thermosiphon biphase

Country Status (2)

Country Link
ES (1) ES8702082A1 (fr)
FR (1) FR2579371B1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6302192B1 (en) 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6896039B2 (en) 1999-05-12 2005-05-24 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
JP5757086B2 (ja) * 2008-10-29 2015-07-29 日本電気株式会社 冷却構造及び電子機器並びに冷却方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2102254B2 (de) * 1971-01-19 1973-05-30 Robert Bosch Gmbh, 7000 Stuttgart Kuehlvorrichtung fuer leistungshalbleiterbauelemente

Also Published As

Publication number Publication date
ES543609A0 (es) 1987-01-01
ES8702082A1 (es) 1987-01-01
FR2579371A1 (fr) 1986-09-26

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Legal Events

Date Code Title Description
ST Notification of lapse