FR2577102B1 - Structure de montage pour modules de circuits electroniques - Google Patents

Structure de montage pour modules de circuits electroniques

Info

Publication number
FR2577102B1
FR2577102B1 FR8601626A FR8601626A FR2577102B1 FR 2577102 B1 FR2577102 B1 FR 2577102B1 FR 8601626 A FR8601626 A FR 8601626A FR 8601626 A FR8601626 A FR 8601626A FR 2577102 B1 FR2577102 B1 FR 2577102B1
Authority
FR
France
Prior art keywords
mounting structure
electronic circuit
circuit modules
modules
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR8601626A
Other languages
English (en)
Other versions
FR2577102A1 (fr
Inventor
Minoru Okano
Mitsuo Kohmoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of FR2577102A1 publication Critical patent/FR2577102A1/fr
Application granted granted Critical
Publication of FR2577102B1 publication Critical patent/FR2577102B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
FR8601626A 1985-02-07 1986-02-06 Structure de montage pour modules de circuits electroniques Expired - Lifetime FR2577102B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2088485 1985-02-07
JP2088385 1985-02-07
JP2131785 1985-02-19

Publications (2)

Publication Number Publication Date
FR2577102A1 FR2577102A1 (fr) 1986-08-08
FR2577102B1 true FR2577102B1 (fr) 1994-06-03

Family

ID=27283206

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8601626A Expired - Lifetime FR2577102B1 (fr) 1985-02-07 1986-02-06 Structure de montage pour modules de circuits electroniques

Country Status (3)

Country Link
US (1) US4682268A (fr)
JP (1) JPH073916B2 (fr)
FR (1) FR2577102B1 (fr)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2608355B1 (fr) * 1986-12-16 1989-02-24 Merlin Gerin Cellule de logement d'une pluralite de sous-ensembles electroniques d'une alimentation statique sans coupure
US4772999A (en) * 1986-12-16 1988-09-20 Merlin Gerin Static converter, especially for an uninterruptible electrical power supply system
JPS63268100A (ja) * 1987-04-27 1988-11-04 Showa Shell Sekiyu Kk 太陽電池を用いた表示器
JPS6474798A (en) * 1987-09-16 1989-03-20 Nec Corp Integrated type power amplifier
JPH0632404B2 (ja) * 1988-12-06 1994-04-27 株式会社日立製作所 電子装置の実装構造
US5060115A (en) * 1990-09-28 1991-10-22 The United States Of America As Represented By The Secretary Of The Navy Heat sink device for electronics modules packaged in cylindrical casings
US5335722A (en) * 1993-09-30 1994-08-09 Global Win Technology Co., Ltd Cooling assembly for an integrated circuit
JPH07202464A (ja) * 1993-12-28 1995-08-04 Toshiba Corp 電子機器装置並びに電子機器装置用冷却方法及びファン装置
TW265430B (en) * 1994-06-30 1995-12-11 Intel Corp Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
JPH09283958A (ja) * 1996-04-16 1997-10-31 Nec Corp 集積回路の高効率冷却構造
DE19756250C2 (de) 1997-12-17 2000-11-02 Siemens Ag Selbstgeführter Stromrichter eines spannungseinprägenden Umrichters mit Hochleistungs-Modulen
GB0207382D0 (en) * 2002-03-28 2002-05-08 Holland Heating Uk Ltd Computer cabinet
US6891132B2 (en) * 2003-10-09 2005-05-10 Micro Control Company Shutters for burn-in-board connector openings
US7296430B2 (en) * 2003-11-14 2007-11-20 Micro Control Company Cooling air flow control valve for burn-in system
JP2006085422A (ja) * 2004-09-16 2006-03-30 Internatl Business Mach Corp <Ibm> 筐体の内部および表面の冷却装置を備える電子機器
US7178587B2 (en) * 2004-12-20 2007-02-20 Asia Vital Component Co., Ltd. Heat-dissipating module
US8654528B2 (en) * 2006-11-16 2014-02-18 Autonetworks Technologies, Ltd. Electric connection box
US8407841B2 (en) * 2009-06-17 2013-04-02 Paul Wessel Dock leveler blanket apparatus and methods
CN204406297U (zh) * 2015-02-02 2015-06-17 北京京东方茶谷电子有限公司 一种主机机箱和主机
US11222830B2 (en) * 2018-01-03 2022-01-11 Lenovo (Beijing) Co., Ltd. Heat dissipation structure and electronic device
CN111668714B (zh) * 2020-07-08 2022-04-01 陕西宇澳电器有限公司 一种配电柜
US11690195B2 (en) * 2020-09-11 2023-06-27 Abb Schweiz Ag Power semiconductor cooling system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR96241E (fr) * 1967-07-28 1972-05-19 Ibm Assemblage de circuits.
US3706010A (en) * 1971-08-20 1972-12-12 Singer Co Packaging structure having cooling means for a multiplicity of hermetic modules for integrated circuit chips
US3940665A (en) * 1972-03-06 1976-02-24 Matsushita Electric Industrial Co., Ltd. Chassis device having vented base and radiation member for supporting heat sources
US3956673A (en) * 1974-02-14 1976-05-11 Lockheed Aircraft Corporation Printed circuit modules cooled by rack with forced air
JPS6011830B2 (ja) * 1977-05-24 1985-03-28 日本電気株式会社 電子部品の冷却装置
DE2805019C2 (de) * 1978-02-06 1982-04-15 Siemens AG, 1000 Berlin und 8000 München Spannungsversorgungsgerät für Werkzeugmaschinenantriebe
US4403271A (en) * 1980-07-28 1983-09-06 International Business Machines Corporation Apparatus for mounting and packaging data processing devices
IN158133B (fr) * 1981-06-09 1986-09-13 Gen Electric

Also Published As

Publication number Publication date
JPS621300A (ja) 1987-01-07
JPH073916B2 (ja) 1995-01-18
US4682268A (en) 1987-07-21
FR2577102A1 (fr) 1986-08-08

Similar Documents

Publication Publication Date Title
FR2577102B1 (fr) Structure de montage pour modules de circuits electroniques
KR860005572A (ko) 전자 부품 장착 장치
DE3663614D1 (en) Cooling system for electronic circuit components
DE3572909D1 (en) Cooling system for electronic circuit device
FR2559637B1 (fr) Accessoire de montage de plaquette de circuit imprime
FR2596231B1 (fr) Boitier pour circuits electroniques
HK106391A (en) Mounting circuit elements on circuit boards
GB8314294D0 (en) Mounting multilead components on circuit boards
DE3277283D1 (en) Circuit board module mounting units
FR2592222B1 (fr) Module de montage et de cablage pour puces semi-conductrices
GB8921490D0 (en) Circuit element mounting structure for electronic still camera
GB2169751B (en) An electronic circuit module
KR850008034A (ko) 회로기판 설치장치
FR2588419B1 (fr) Structure de montage pour puce de circuits integres
GB8415652D0 (en) Mounting electronic circuit element on circuit board
KR850700100A (ko) 전자 회로 조립체
FR2572240B1 (fr) Appareil de montage de plaquettes de circuits imprimes
GB8314293D0 (en) Mounting multilead components on circuit boards
FR2591054B1 (fr) Montage de cartes de circuit imprime
GB8511686D0 (en) Mounting electronic part on circuit board
FR2564244B1 (fr) Structure de montage pour circuits integres rapides
DE3650709T2 (de) Kühlmodule für Vorrichtungen mit elektronischem Schaltkreis
GB2191046B (en) Circuit board mounting devices
DE3472332D1 (en) Mounting of semiconductor components on a circuit board
DE3650719D1 (de) Kühlmodule für Vorrichtungen mit elektronischem Schaltkreis