IT1222991B - Metodo e apparecchiatura per l'asportazione di un nastro adesivo avvolto su una piastra per circuiti stampati - Google Patents

Metodo e apparecchiatura per l'asportazione di un nastro adesivo avvolto su una piastra per circuiti stampati

Info

Publication number
IT1222991B
IT1222991B IT22415/87A IT2241587A IT1222991B IT 1222991 B IT1222991 B IT 1222991B IT 22415/87 A IT22415/87 A IT 22415/87A IT 2241587 A IT2241587 A IT 2241587A IT 1222991 B IT1222991 B IT 1222991B
Authority
IT
Italy
Prior art keywords
removal
equipment
plate
adhesive tape
printed circuits
Prior art date
Application number
IT22415/87A
Other languages
English (en)
Other versions
IT8722415A0 (it
Inventor
Ivano Orlandi
Original Assignee
Orlandi Aldo Orlandi Ivano S D
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orlandi Aldo Orlandi Ivano S D filed Critical Orlandi Aldo Orlandi Ivano S D
Priority to IT22415/87A priority Critical patent/IT1222991B/it
Publication of IT8722415A0 publication Critical patent/IT8722415A0/it
Priority to US07/260,050 priority patent/US4897148A/en
Priority to DE3836498A priority patent/DE3836498A1/de
Application granted granted Critical
Publication of IT1222991B publication Critical patent/IT1222991B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/935—Delaminating means in preparation for post consumer recycling
    • Y10S156/937—Means for delaminating specified electronic component in preparation for recycling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/195—Delaminating roller means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Adhesive Tape Dispensing Devices (AREA)
IT22415/87A 1987-10-27 1987-10-27 Metodo e apparecchiatura per l'asportazione di un nastro adesivo avvolto su una piastra per circuiti stampati IT1222991B (it)

Priority Applications (3)

Application Number Priority Date Filing Date Title
IT22415/87A IT1222991B (it) 1987-10-27 1987-10-27 Metodo e apparecchiatura per l'asportazione di un nastro adesivo avvolto su una piastra per circuiti stampati
US07/260,050 US4897148A (en) 1987-10-27 1988-10-20 Apparatus for removing adhesive tape wrapped around a printed circuit board
DE3836498A DE3836498A1 (de) 1987-10-27 1988-10-26 Verfahren und vorrichtung zum entfernen eines um eine platte fuer gedruckte schaltungen gewickelten klebebandes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT22415/87A IT1222991B (it) 1987-10-27 1987-10-27 Metodo e apparecchiatura per l'asportazione di un nastro adesivo avvolto su una piastra per circuiti stampati

Publications (2)

Publication Number Publication Date
IT8722415A0 IT8722415A0 (it) 1987-10-27
IT1222991B true IT1222991B (it) 1990-09-12

Family

ID=11196001

Family Applications (1)

Application Number Title Priority Date Filing Date
IT22415/87A IT1222991B (it) 1987-10-27 1987-10-27 Metodo e apparecchiatura per l'asportazione di un nastro adesivo avvolto su una piastra per circuiti stampati

Country Status (3)

Country Link
US (1) US4897148A (it)
DE (1) DE3836498A1 (it)
IT (1) IT1222991B (it)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3838271A1 (de) * 1988-11-11 1990-05-17 Krupp Maschinentechnik Verfahren zur herstellung von mattenstreifen aus breiteren klebrigen, mit deckfolien belegten werkstoffbahnen und vorrichtung zur durchfuehrung des verfahrens
DE4112887A1 (de) * 1991-04-19 1992-10-22 Peter Bechmann Verfahren und vorrichtung zum entstrippen eines laminierten folienzuschnittes
US5658416A (en) * 1994-06-17 1997-08-19 Polaroid Corporation Method and apparatus for peeling a laminate
JP3914606B2 (ja) * 1997-04-25 2007-05-16 松下電器産業株式会社 接着層の製造装置、両面基板の製造装置および多層基板の製造装置
CN101310974B (zh) * 2007-05-21 2010-08-25 北京京东方光电科技有限公司 剥膜设备和剥膜方法
KR101929527B1 (ko) * 2012-09-17 2018-12-17 삼성디스플레이 주식회사 필름 박리 장치
CN103223765B (zh) * 2013-03-07 2015-12-09 京东方科技集团股份有限公司 剥膜设备
CN105799303A (zh) * 2014-12-29 2016-07-27 富泰华工业（深圳）有限公司 自动撕膜机
JP6665021B2 (ja) * 2016-05-10 2020-03-13 株式会社日立プラントメカニクス フィルム剥離装置
CN113631357B (zh) * 2019-03-29 2023-04-11 东丽株式会社 纤维铺放装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4466849A (en) * 1982-02-24 1984-08-21 Ers Engineering Corporation Process for removing adhesive tape
US4724032A (en) * 1985-10-02 1988-02-09 Thomas Kay Sheet separating machine and method

Also Published As

Publication number Publication date
US4897148A (en) 1990-01-30
DE3836498A1 (de) 1989-05-24
IT8722415A0 (it) 1987-10-27

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