JP6665021B2 - フィルム剥離装置 - Google Patents
フィルム剥離装置 Download PDFInfo
- Publication number
- JP6665021B2 JP6665021B2 JP2016094416A JP2016094416A JP6665021B2 JP 6665021 B2 JP6665021 B2 JP 6665021B2 JP 2016094416 A JP2016094416 A JP 2016094416A JP 2016094416 A JP2016094416 A JP 2016094416A JP 6665021 B2 JP6665021 B2 JP 6665021B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- film
- peeling
- holding mechanism
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 157
- 230000007246 mechanism Effects 0.000 claims description 53
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000032258 transport Effects 0.000 description 24
- 238000003825 pressing Methods 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1174—Using roller for delamination [e.g., roller pairs operating at differing speeds or directions, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/195—Delaminating roller means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/195—Delaminating roller means
- Y10T156/1956—Roller pair delaminating means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
そのため、基板に貼付されたフィルムを剥離するには、フィルムの貼付位置を基板先端から間隔を空けてフィルムを貼り付け、基板クランプ代を設ける必要があり、基板の先端まで貼付されたフィルムは剥離することができなかった。
また、基板の先端部をクランプせずに剥離動作を行うと基板が上下に折れ曲がり破損することがあった。
ここで、図1はフィルム剥離装置の概略構造を示す平面図、図2はフィルム剥離装置の概略構造を示す正面図、図3は図2の実施形態における基板保持機構及びフィルム保持機構の概略構造を示す拡大正面図、図4は図2の実施形態における基板保持機構及びフィルム保持機構の構造を示す部分斜視図である。
基板2は、図2に矢印Aで示すように、フィルム剥離装置100の左側(搬入口)から右側(搬出口)に向かって搬送される。
レジスト膜2aは、熱処理により基板2の表面に接着され、フィルム2bは、レジスト膜2a自体が持つ粘着性でレジスト膜2aに貼られている。
フィルム2bは、基板2が基板製造工程で処理される際にその表面に接着されたレジスト膜2aを保護するためのものである。
このブロック43A、43Bは、基板端面接触部に傾斜角度を設けた傾斜面、具体的には、ブロック43Aは下向きの傾斜面、ブロック43Bは上向きの傾斜面が設けてあり、基板2をクランプせずに、初期剥離時の基板2が上下に振れないように、基板2の端面の上下の端縁に線接触することで保持することができるようにしている。
このフィルム剥離搬送機構50は、フィルム2bの端部を保持するフィルム保持具52と、このフィルム保持具52を伸張させるためのシリンダ54と、このシリンダ54を左右に取り付けた支持部材56と、支持部材56を伸張させるシリンダ53と、シリンダ53を移動させるためのフィルム搬送部駆動機構55とから構成されている。
このブロック43A、43Bは、基板端面接触部に傾斜角度を設けた傾斜面、具体的には、ブロック43Aは下向きの傾斜面、ブロック43Bは上向きの傾斜面が設けてあり、基板2をクランプせずに、初期剥離時の基板2が上下に振れないように、基板2の端面の上下の端縁に線接触することで保持する。
図5において、図4との相違点は次の点である。
図4ではクランプ具41が4つの場合を示していたが、図5ではクランプ具41及びブロック43を基板2の全幅に設置したものである。
本構成とすることで、基板2に作用する保持力を調整でき、図4に比べてさらに均一に保持することが可能である。
(1)基板保持機構40のブロック43は単数でも複数個設置でもよい。
(2)基板に貼付されたフィルムが基板先端より間隔が空いている場合は、基板保持機構40のブロック43の平面部分で基板先端をクランプしてもよい。
(3)基板保持機構40の駆動用のシリンダ42は単数でも複数でもよい。
(4)基板保持機構40の駆動用のシリンダ42の駆動源は空圧でも電動でもよい。
(5)基板はガラス、セラミック、樹脂、半導体、積層板の基板でもよい。
(6)基板の上面あるいは下面の片側に貼られたフィルムを剥離させるものでもよい。
2 基板
2a レジスト膜
2b フィルム
3 回収容器
4 圧接ローラ
11 シリンダ
30 粘着剥離機構
31 シリンダ
32 板状押し付け具
40 基板保持機構
41 クランプ具
42 シリンダ
43 ブロック
50 フィルム剥離搬送機構
52 フィルム保持具
53 シリンダ
54 シリンダ
55 フィルム搬送部駆動機構
100 フィルム剥離装置
Claims (1)
- 基板を搬送する基板搬送手段と、該基板搬送手段により搬送されてきた基板の両面に貼られたフィルムを剥離するフィルム剥離装置において、下向きの傾斜面を設けた第1のクランプ具及び上向きの傾斜面を設けた第2のクランプ具を備えることによって、基板の先端面の上下の端縁に線接触することで基板を保持する基板保持機構と、基板保持機構により保持された基板から粘着力でフィルムを剥離する粘着剥離機構と、粘着剥離機構により捲り挙げられた基板の両面に貼られたフィルムの先端部を、それぞれ把持するフィルム保持具と、フィルムを把持したフィルム保持具を基板搬送方向と反対方向に搬送するフィルム搬送部駆動機構と、フィルム保持具で把持されて搬送されてきたフィルムを収納する回収容器とを備えたことを特徴とするフィルム剥離装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016094416A JP6665021B2 (ja) | 2016-05-10 | 2016-05-10 | フィルム剥離装置 |
TW106109002A TWI690476B (zh) | 2016-05-10 | 2017-03-17 | 薄膜剝離裝置 |
US15/467,133 US9975321B2 (en) | 2016-05-10 | 2017-03-23 | Film peeling device |
CN201710263439.7A CN107351517A (zh) | 2016-05-10 | 2017-04-21 | 薄膜剥离装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016094416A JP6665021B2 (ja) | 2016-05-10 | 2016-05-10 | フィルム剥離装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017202896A JP2017202896A (ja) | 2017-11-16 |
JP6665021B2 true JP6665021B2 (ja) | 2020-03-13 |
Family
ID=60271633
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016094416A Expired - Fee Related JP6665021B2 (ja) | 2016-05-10 | 2016-05-10 | フィルム剥離装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9975321B2 (ja) |
JP (1) | JP6665021B2 (ja) |
CN (1) | CN107351517A (ja) |
TW (1) | TWI690476B (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018115025A (ja) * | 2017-01-20 | 2018-07-26 | 株式会社東芝 | ラベル剥離装置 |
US10384434B2 (en) * | 2017-08-31 | 2019-08-20 | Industrial Technology Research Institute | Separating device and separating method |
WO2019171681A1 (ja) | 2018-03-05 | 2019-09-12 | 日本飛行機株式会社 | 保護シート自動剥離装置および保護シート自動剥離方法 |
KR20200078773A (ko) * | 2018-12-21 | 2020-07-02 | 세메스 주식회사 | 반전 유닛 및 이를 가지는 기판 처리 장치 |
JP7256643B2 (ja) * | 2019-01-15 | 2023-04-12 | 株式会社ディスコ | 剥離装置 |
JP6916223B2 (ja) * | 2019-01-30 | 2021-08-11 | 日機装株式会社 | 剥離装置 |
CN112298717B (zh) * | 2020-09-15 | 2024-08-16 | 苏州领裕电子科技有限公司 | 一种自动撕产品保护膜的机械手 |
KR20220061297A (ko) * | 2020-11-05 | 2022-05-13 | 삼성디스플레이 주식회사 | 필름 박리 장치 및 필름 박리 방법 |
CN112874226A (zh) * | 2021-01-12 | 2021-06-01 | 浙江机电职业技术学院 | 一种贴刮一体式手持贴墙纸装置及其使用方法 |
CN112976911A (zh) * | 2021-01-26 | 2021-06-18 | 上海中息信息科技有限公司 | 一种墙贴画移动配合转动水平粘贴装置 |
JP2022124709A (ja) * | 2021-02-16 | 2022-08-26 | 株式会社ディスコ | 剥離装置 |
CN116512734B (zh) * | 2023-06-29 | 2023-08-25 | 山东莱蔚特复合材料有限责任公司 | 一种碳纤维预浸料定型后处理去膜设备 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3650208T2 (de) * | 1985-08-30 | 1995-09-07 | Somar Corp | Vorrichtung zum Abschälen eines Films. |
IT1222991B (it) * | 1987-10-27 | 1990-09-12 | Orlandi Aldo Orlandi Ivano S D | Metodo e apparecchiatura per l'asportazione di un nastro adesivo avvolto su una piastra per circuiti stampati |
JPH06171823A (ja) * | 1992-12-09 | 1994-06-21 | Canon Inc | ドライフィルムレジスト用保護フィルム除去装置 |
TWI246124B (en) * | 2001-11-27 | 2005-12-21 | Tokyo Electron Ltd | Liquid processing apparatus and method |
WO2006003816A1 (ja) * | 2004-07-02 | 2006-01-12 | Sharp Kabushiki Kaisha | フィルム剥離方法と装置 |
JP4231018B2 (ja) | 2005-03-23 | 2009-02-25 | 株式会社日立プラントテクノロジー | フィルム剥離方法とフィルム剥離装置 |
JP2007254030A (ja) * | 2006-03-20 | 2007-10-04 | Adtec Engineeng Co Ltd | フィルム剥離装置 |
KR20080071337A (ko) * | 2007-01-30 | 2008-08-04 | 삼성전자주식회사 | 편광판 보호 필름의 제거 장치 및 그 방법 |
JP4779132B2 (ja) | 2007-07-19 | 2011-09-28 | 株式会社日立プラントテクノロジー | フィルム剥離装置 |
JP2009029525A (ja) * | 2007-07-24 | 2009-02-12 | Hitachi Plant Technologies Ltd | フィルム剥離装置 |
JP2010150040A (ja) * | 2008-11-28 | 2010-07-08 | Sharp Corp | フィルム剥離装置および剥離方法 |
KR101857288B1 (ko) * | 2011-08-26 | 2018-05-14 | 삼성디스플레이 주식회사 | 기판으로부터 도너 필름을 분리하기 위한 방법 및 장치 |
KR101818473B1 (ko) * | 2011-11-30 | 2018-01-16 | 엘지디스플레이 주식회사 | 보호필름 박리장치 및 박리방법 |
KR101989484B1 (ko) * | 2012-07-09 | 2019-06-17 | 삼성디스플레이 주식회사 | 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템 |
KR101929527B1 (ko) * | 2012-09-17 | 2018-12-17 | 삼성디스플레이 주식회사 | 필름 박리 장치 |
CN103223765B (zh) * | 2013-03-07 | 2015-12-09 | 京东方科技集团股份有限公司 | 剥膜设备 |
KR102130153B1 (ko) * | 2013-10-15 | 2020-07-06 | 삼성디스플레이 주식회사 | 필름 박리 장치 |
-
2016
- 2016-05-10 JP JP2016094416A patent/JP6665021B2/ja not_active Expired - Fee Related
-
2017
- 2017-03-17 TW TW106109002A patent/TWI690476B/zh not_active IP Right Cessation
- 2017-03-23 US US15/467,133 patent/US9975321B2/en not_active Expired - Fee Related
- 2017-04-21 CN CN201710263439.7A patent/CN107351517A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
US20170326865A1 (en) | 2017-11-16 |
US9975321B2 (en) | 2018-05-22 |
CN107351517A (zh) | 2017-11-17 |
TWI690476B (zh) | 2020-04-11 |
TW201805225A (zh) | 2018-02-16 |
JP2017202896A (ja) | 2017-11-16 |
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