JP6916223B2 - 剥離装置 - Google Patents
剥離装置 Download PDFInfo
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- JP6916223B2 JP6916223B2 JP2019014751A JP2019014751A JP6916223B2 JP 6916223 B2 JP6916223 B2 JP 6916223B2 JP 2019014751 A JP2019014751 A JP 2019014751A JP 2019014751 A JP2019014751 A JP 2019014751A JP 6916223 B2 JP6916223 B2 JP 6916223B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H41/00—Machines for separating superposed webs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/003—Cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
- B65H29/54—Article strippers, e.g. for stripping from advancing elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/06—Angles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/16—Capacitors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/11—Dimensional aspect of article or web
- B65H2701/113—Size
- B65H2701/1133—Size of webs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1126—Using direct fluid current against work during delaminating
- Y10T156/1132—Using vacuum directly against work during delaminating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1126—Using direct fluid current against work during delaminating
- Y10T156/1137—Using air blast directly against work during delaminating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
- Y10T156/1184—Piercing layer during delaminating [e.g., cutting, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1928—Differential fluid pressure delaminating means
- Y10T156/1933—Spraying delaminating means [e.g., atomizer, etc.
- Y10T156/1939—Air blasting delaminating means]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1928—Differential fluid pressure delaminating means
- Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1961—Severing delaminating means [e.g., chisel, etc.]
- Y10T156/1967—Cutting delaminating means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
Description
図1には、本実施形態に係る剥離装置が例示される。当該剥離装置は、シートステージ10、キャッチャーステージ40、及び制御器80を含んで構成される。
図8には、本実施形態に係る剥離装置による、キャリアフィルム92の剥離フローが例示される。この剥離フローは、制御器80により実行される。また図9〜図17には、剥離フローに則った剥離プロセスが例示される。なお、図9〜図17について、折れ線92BはX−Y軸に対して45°の角度で形成される。これに伴い、ブレード110の刃面、起こし爪122及びクランプ爪124の対向面も、X−Y軸に対して45°の角度で形成される。図9〜図15、図17には、これらの向きを基準にした側面視、言い換えるとブレード110の刃面、起こし爪122及びクランプ爪124の対向面を側面視した図が例示される。このような画角において、X軸とY軸は互いに重なり合う。
上述の実施形態では、図4に例示されるように、シートテーブル20に空隙24Aを設けていたが、本実施形態に係る剥離装置は、この形態に限らない。要するにブレード110の押し込みに対して積層シート90が下方に(つまりテーブル側に)沈み込めばよいので、例えば図18に例示されるように、キャリアフィルム92の端部92Aに対応する箇所に、弾性シート29が設けられてもよい。
また上述の実施形態では、図16に例示されるように、積層シート90の対角線上に剥離経路L1が設けられていたが、本実施形態に係る剥離プロセスは、この形態に限らない。例えば図19に例示されるように、積層シート90の一辺に平行に、剥離経路が設けられてもよい。この場合、折れ線92Bは積層シート90の一辺に平行に設けられ、剥離経路は当該折れ線に対して垂直に設けられる。また水平移動制御から斜め移動制御への切り替えは、積層シート90の一辺の中点を超過した時点で行われてよい。
Claims (5)
- 下地層であるキャリアフィルムにシートが積層された積層シートを、前記シートの表面を前記積層シートの吸着面とし前記キャリアフィルムの表面を前記積層シートの露出面として吸着保持する、シートテーブルと、
前記キャリアフィルムの端部に押し当てられる刃先を有しその押し当てにより当該端部を前記シートに対して折り上げるブレードと、
前記折り上げられた前記キャリアフィルムの前記端部を把持して移動することで、前記シートから前記キャリアフィルムを剥離するクランプ機構と、
前記クランプ機構の動作を制御する制御器を備え、
前記制御器は、
前記クランプ機構によって前記キャリアフィルムの前記端部を把持させた後に、前記クランプ機構を、前記積層シートの前記露出面と平行に移動させる平行移動制御と、
前記平行移動制御の実行後、前記クランプ機構を、前記露出面に対して離間するように傾斜する方向に斜め移動させる斜め移動制御と、
を実行する、剥離装置。 - 下地層であるキャリアフィルムにシートが積層された積層シートを、前記シートの表面を前記積層シートの吸着面とし前記キャリアフィルムの表面を前記積層シートの露出面として吸着保持する吸着板を備える、シートテーブルと、
前記キャリアフィルムの端部に押し当てられる刃先を有しその押し当てにより当該端部を前記シートに対して折り上げるブレードと、
前記折り上げられた前記キャリアフィルムの端部を把持して移動することで、前記シートから前記キャリアフィルムを剥離するクランプ機構と、
を備え、
前記シートテーブルの前記吸着板には、前記積層シートの端部が配置される切欠き部が形成され、前記切欠き部には、前記積層シートの端部から離隔され当該端部との間に空隙を生じさせる傾斜面が形成され、
前記ブレードは、前記空隙上の前記キャリアフィルムの端部に押し当てられる、
剥離装置。 - 請求項1または2に記載の剥離装置であって、
前記ブレードの刃物角は、25°以上60°以下である、剥離装置。 - 請求項1または請求項1に従属する請求項3に記載の剥離装置であって、
前記クランプ機構は、前記積層シートの前記露出面に平行に突出する突起を備える起こし爪と、前記起こし爪と対向し当該起こし爪に対して相対移動するクランプ爪とを有し、
前記制御器は、前記平行移動制御の実行前に、前記キャリアフィルムの前記シートからの剥離を促進させるフィルム起こし制御を実行し、
前記フィルム起こし制御として、前記制御器は、前記起こし爪を前記クランプ爪とは離間した状態で、前記キャリアフィルムの前記端部と前記シートとの間隙に前記起こし爪の前記突起を配置させ、さらに前記起こし爪を前記積層シートの前記露出面に平行に往復移動させる、剥離装置。 - 請求項4に記載の剥離装置であって、
前記フィルム起こし制御の実行時に、前記キャリアフィルムの前記端部と前記シートとの間隙に空気を噴射するエアノズルを備える、剥離装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2019014751A JP6916223B2 (ja) | 2019-01-30 | 2019-01-30 | 剥離装置 |
TW108144285A TWI796534B (zh) | 2019-01-30 | 2019-12-04 | 剝離裝置 |
US16/704,047 US11001044B2 (en) | 2019-01-30 | 2019-12-05 | Peel-off device |
CN202010009655.0A CN111498579B (zh) | 2019-01-30 | 2020-01-06 | 剥离装置 |
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JP2019014751A JP6916223B2 (ja) | 2019-01-30 | 2019-01-30 | 剥離装置 |
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JP2020121855A JP2020121855A (ja) | 2020-08-13 |
JP6916223B2 true JP6916223B2 (ja) | 2021-08-11 |
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US (1) | US11001044B2 (ja) |
JP (1) | JP6916223B2 (ja) |
CN (1) | CN111498579B (ja) |
TW (1) | TWI796534B (ja) |
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CN112659720B (zh) * | 2020-12-10 | 2022-11-29 | 成都冠佳科技有限公司 | 一种产品抽膜防止掉张的装置及方法 |
JP2022124709A (ja) * | 2021-02-16 | 2022-08-26 | 株式会社ディスコ | 剥離装置 |
CN116062264A (zh) * | 2021-10-29 | 2023-05-05 | 三赢科技(深圳)有限公司 | 撕膜装置 |
CN114030918B (zh) * | 2021-11-29 | 2023-09-19 | 宁波泰科威橡胶科技有限公司 | 一种离型纸剥离装置 |
JP7406675B2 (ja) | 2021-12-27 | 2023-12-27 | 三井金属鉱業株式会社 | シート固定装置、シート剥離装置及びシートの剥離方法 |
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