FR2431812A1 - Procede de montage de composants electroniques sur des substrats et ensembles obtenus - Google Patents

Procede de montage de composants electroniques sur des substrats et ensembles obtenus

Info

Publication number
FR2431812A1
FR2431812A1 FR7918655A FR7918655A FR2431812A1 FR 2431812 A1 FR2431812 A1 FR 2431812A1 FR 7918655 A FR7918655 A FR 7918655A FR 7918655 A FR7918655 A FR 7918655A FR 2431812 A1 FR2431812 A1 FR 2431812A1
Authority
FR
France
Prior art keywords
substrates
electronic components
mounting electronic
components
assemblies obtained
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7918655A
Other languages
English (en)
Other versions
FR2431812B1 (fr
Inventor
Yasuo Taki
Yoshihiko Misawa
Shigeru Araki
Kazuhiro Mori
Souhei Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP8883378A external-priority patent/JPS5515270A/ja
Priority claimed from JP54004530A external-priority patent/JPS588156B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of FR2431812A1 publication Critical patent/FR2431812A1/fr
Application granted granted Critical
Publication of FR2431812B1 publication Critical patent/FR2431812B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0411—Pick-and-place heads or apparatus, e.g. with jaws having multiple mounting heads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y10T156/1093—All laminae planar and face to face with covering of discrete laminae with additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y10T156/1097—Lamina is running length web
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y10T156/1097—Lamina is running length web
    • Y10T156/1098—Feeding of discrete laminae from separate sources
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention s'applique à un procédé de montage de composants électroniques de très petites dimensions sur des substrats. Il met en oeuvre un dispositif d'alimentation de matériau adhésif pour coller les composants sur chacun des substrats, un dispositif de montage de ces composants sur chacun des substrats, et un dispositif d'inspection de la position et/ou des propriétés électriques des composants montes, tous ces dispositifs étant disposés dans les mêmes positions relatives que celles des substrats. Applications courantes.
FR7918655A 1978-07-19 1979-07-18 Procede de montage de composants electroniques sur des substrats et ensembles obtenus Granted FR2431812A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8883378A JPS5515270A (en) 1978-07-19 1978-07-19 Method of attaching electronic part
JP54004530A JPS588156B2 (ja) 1979-01-18 1979-01-18 電子部品の装着方法

Publications (2)

Publication Number Publication Date
FR2431812A1 true FR2431812A1 (fr) 1980-02-15
FR2431812B1 FR2431812B1 (fr) 1984-03-30

Family

ID=26338330

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7918655A Granted FR2431812A1 (fr) 1978-07-19 1979-07-18 Procede de montage de composants electroniques sur des substrats et ensembles obtenus

Country Status (6)

Country Link
US (1) US4239576A (fr)
CA (1) CA1111628A (fr)
DE (1) DE2929314C2 (fr)
FR (1) FR2431812A1 (fr)
GB (1) GB2025804B (fr)
NL (1) NL7905518A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2535983A1 (fr) * 1982-11-15 1984-05-18 Usm Corp Distributeur d'adhesif, notamment pour le positionnement de composants sur des circuits imprimes

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55118698A (en) * 1979-03-05 1980-09-11 Matsushita Electric Ind Co Ltd Device for mounting electronic part
IT1193984B (it) * 1980-10-03 1988-08-31 Ferco Spa Procedimento e apparecchiatura atta a realizzare l'applicazione di colla su zone prescelte di una piastra per circuiti stampati
US4396140A (en) * 1981-01-27 1983-08-02 Bell Telephone Laboratories, Incorporated Method of bonding electronic components
JPS5851530A (ja) * 1981-09-22 1983-03-26 Toshiba Corp 半導体ペレツト配列装置および方法
US4569305A (en) * 1981-10-09 1986-02-11 Ferco S.R.L. Apparatus to provide the application of glue on preselected zones of printed circuit boards
DE3390320T1 (de) * 1982-11-11 1985-02-21 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka Vorrichtung zur Montage von elektronischen Teilen
JPS59161040A (ja) * 1983-03-03 1984-09-11 Shinkawa Ltd インナ−リ−ドボンダ−
JPS6012799A (ja) * 1983-07-01 1985-01-23 三洋電機株式会社 チップ状電子部品の自動装着装置
NL8304185A (nl) * 1983-12-06 1985-07-01 Philips Nv Stempel en inrichting voor het aanbrengen van druppels van een viskeuze vloeistof op een substraat.
EP0171466A1 (fr) * 1984-07-24 1986-02-19 Siemens Aktiengesellschaft Méthode pour appliquer du gluten sur un support de puces et dispositif pour la mise en application de la méthode
DE3532500C2 (de) * 1984-09-17 1996-03-14 Tdk Corp Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette
US4978414A (en) * 1985-01-18 1990-12-18 Nippon Cmk Corp. Apparatus for stretching silk including means to move cramp members independently of each other
DE3675734D1 (de) * 1985-09-30 1991-01-03 Siemens Ag Bauelement fuer die oberflaechenmontage und verfahren zur befestigung eines bauelements fuer die oberflaechenmontage.
US4803124A (en) * 1987-01-12 1989-02-07 Alphasem Corporation Bonding semiconductor chips to a mounting surface utilizing adhesive applied in starfish patterns
US5187123A (en) * 1988-04-30 1993-02-16 Matsushita Electric Industrial Co., Ltd. Method for bonding a semiconductor device to a lead frame die pad using plural adhesive spots
KR900015590A (ko) * 1989-03-23 1990-10-27 프레데릭 얀 스미트 캐리어상에 부품을 배치하는 방법 및 그 방법을 수행하기 위한 장치
GB2236217A (en) * 1989-08-23 1991-03-27 Itt Ind Ltd Improvement relating to electrical connectors
JP2547895B2 (ja) * 1990-03-20 1996-10-23 シャープ株式会社 半導体装置の実装方法
DE59202991D1 (de) * 1991-01-28 1995-08-31 Siemens Ag Vorrichtung zum Bestücken von Leiterplatten.
US5336357A (en) * 1993-03-12 1994-08-09 Quantum Materials, Inc. Manually operable die attach apparatus
US5435481A (en) * 1994-01-18 1995-07-25 Motorola, Inc. Soldering process
US5686226A (en) * 1995-08-03 1997-11-11 Motorola, Inc. Method of forming an applicator for applying tacking media to a circuit substrate
KR100431031B1 (ko) * 1996-10-10 2004-07-27 삼성전자주식회사 반도체칩의장착방법
DE19808171A1 (de) * 1998-02-26 1999-09-02 Resma Gmbh Anordnung zur Bestückung von Leiterplatten mit integrierten Schaltungen
US8225739B2 (en) * 2009-07-25 2012-07-24 Cheng Uei Precision Industry Co., Ltd. Automatic dispensing machine

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3552177A (en) * 1968-02-19 1971-01-05 Ibm Strap former and placement apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3600246A (en) * 1968-05-17 1971-08-17 Rca Corp Method of making laminated semiconductor devices
US3611561A (en) * 1969-04-21 1971-10-12 Paul A Dosier Transfer mechanism with loading nest
US3666588A (en) * 1970-01-26 1972-05-30 Western Electric Co Method of retaining and bonding articles
US3965277A (en) * 1972-05-09 1976-06-22 Massachusetts Institute Of Technology Photoformed plated interconnection of embedded integrated circuit chips

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3552177A (en) * 1968-02-19 1971-01-05 Ibm Strap former and placement apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2535983A1 (fr) * 1982-11-15 1984-05-18 Usm Corp Distributeur d'adhesif, notamment pour le positionnement de composants sur des circuits imprimes

Also Published As

Publication number Publication date
US4239576A (en) 1980-12-16
FR2431812B1 (fr) 1984-03-30
DE2929314C2 (de) 1984-04-19
DE2929314A1 (de) 1980-02-14
GB2025804A (en) 1980-01-30
NL7905518A (nl) 1980-01-22
GB2025804B (en) 1982-06-09
CA1111628A (fr) 1981-11-03

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