JPS6489346A - Semiconductor substrate - Google Patents
Semiconductor substrateInfo
- Publication number
- JPS6489346A JPS6489346A JP24501487A JP24501487A JPS6489346A JP S6489346 A JPS6489346 A JP S6489346A JP 24501487 A JP24501487 A JP 24501487A JP 24501487 A JP24501487 A JP 24501487A JP S6489346 A JPS6489346 A JP S6489346A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- outer peripheral
- peripheral end
- semiconductor
- standard size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Local Oxidation Of Silicon (AREA)
- Recrystallisation Techniques (AREA)
Abstract
PURPOSE:To reduce the waste of a semiconductor material by disposing the outer peripheral end of one substrate inside the outer peripheral end of the other substrate in a semiconductor substrate in which two semiconductor substrates are bonded. CONSTITUTION:First and second semiconductor substrates 1, 2 are bonded, and at least the outer peripheral end of the substrate 1 is disposed inside that of the substrate 2. According to a substrate 3 of this construction, the substrate 2 has a specification of standard size by allowing at least part of the outer peripheral end to remain. Accordingly, the outer peripheral end of only the substrate 1 is removed to have a small diameter, thereby avoiding an irregular stepwise difference due to a gap between the substrates 1 and 3 or displacement of them. Thus, a problem of contamination in steps of manufacturing a semiconductor device can be avoided. Further, since the entirety has a diameter of standard size, an apparatus for manufacturing in standard size can be employed, thereby minimizing the waste of a semiconductor material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62245014A JP2535957B2 (en) | 1987-09-29 | 1987-09-29 | Semiconductor substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62245014A JP2535957B2 (en) | 1987-09-29 | 1987-09-29 | Semiconductor substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6489346A true JPS6489346A (en) | 1989-04-03 |
JP2535957B2 JP2535957B2 (en) | 1996-09-18 |
Family
ID=17127292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62245014A Expired - Lifetime JP2535957B2 (en) | 1987-09-29 | 1987-09-29 | Semiconductor substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2535957B2 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03250616A (en) * | 1990-02-28 | 1991-11-08 | Shin Etsu Handotai Co Ltd | Bonded wafer and its manufacture |
JPH0590545A (en) * | 1991-09-30 | 1993-04-09 | Shin Etsu Handotai Co Ltd | Soi substrate and manufacture thereof |
US5918139A (en) * | 1997-01-31 | 1999-06-29 | Shin Etsu Handotai Co., Ltd. | Method of manufacturing a bonding substrate |
EP0964436A2 (en) * | 1998-06-04 | 1999-12-15 | Shin-Etsu Handotai Company Limited | Method for manufacturing SOI wafer and SOI wafer |
JP2004281878A (en) * | 2003-03-18 | 2004-10-07 | Seiko Epson Corp | Method for manufacturing semiconductor substrate, semiconductor substrate to be manufactured by the method, electro-optical device, and electronic apparatus |
JP2009071128A (en) * | 2007-09-14 | 2009-04-02 | Naoetsu Electronics Co Ltd | Method of manufacturing semiconductor-bonded wafer |
EP2259301A3 (en) * | 2003-10-14 | 2010-12-22 | S.O.I. Tec Silicon on Insulator Technologies | Method for preparing and assembling substrates |
US8530331B2 (en) | 2006-04-10 | 2013-09-10 | Commissariat A L'energie Atomique | Process for assembling substrates with low-temperature heat treatments |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4066889B2 (en) | 2003-06-09 | 2008-03-26 | 株式会社Sumco | Bonded substrate and manufacturing method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54116888A (en) * | 1978-03-03 | 1979-09-11 | Hitachi Ltd | Manufacture of dielectric separate substrate |
JPS61144839A (en) * | 1984-12-18 | 1986-07-02 | Toshiba Corp | Bonding method for semiconductor wafer |
JPS61256621A (en) * | 1985-05-08 | 1986-11-14 | Toshiba Corp | Production of bound-type semiconductor substrate |
-
1987
- 1987-09-29 JP JP62245014A patent/JP2535957B2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54116888A (en) * | 1978-03-03 | 1979-09-11 | Hitachi Ltd | Manufacture of dielectric separate substrate |
JPS61144839A (en) * | 1984-12-18 | 1986-07-02 | Toshiba Corp | Bonding method for semiconductor wafer |
JPS61256621A (en) * | 1985-05-08 | 1986-11-14 | Toshiba Corp | Production of bound-type semiconductor substrate |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03250616A (en) * | 1990-02-28 | 1991-11-08 | Shin Etsu Handotai Co Ltd | Bonded wafer and its manufacture |
JPH0590545A (en) * | 1991-09-30 | 1993-04-09 | Shin Etsu Handotai Co Ltd | Soi substrate and manufacture thereof |
US5918139A (en) * | 1997-01-31 | 1999-06-29 | Shin Etsu Handotai Co., Ltd. | Method of manufacturing a bonding substrate |
EP0964436A2 (en) * | 1998-06-04 | 1999-12-15 | Shin-Etsu Handotai Company Limited | Method for manufacturing SOI wafer and SOI wafer |
EP0964436A3 (en) * | 1998-06-04 | 2000-10-18 | Shin-Etsu Handotai Company Limited | Method for manufacturing SOI wafer and SOI wafer |
US6534384B2 (en) | 1998-06-04 | 2003-03-18 | Shin-Etsu Handotai Co., Ltd. | Method for manufacturing SOI wafer including heat treatment in an oxidizing atmosphere |
JP2004281878A (en) * | 2003-03-18 | 2004-10-07 | Seiko Epson Corp | Method for manufacturing semiconductor substrate, semiconductor substrate to be manufactured by the method, electro-optical device, and electronic apparatus |
EP2259301A3 (en) * | 2003-10-14 | 2010-12-22 | S.O.I. Tec Silicon on Insulator Technologies | Method for preparing and assembling substrates |
EP2259301B1 (en) * | 2003-10-14 | 2020-08-19 | Soitec | Method for preparing and assembling substrates |
US8530331B2 (en) | 2006-04-10 | 2013-09-10 | Commissariat A L'energie Atomique | Process for assembling substrates with low-temperature heat treatments |
JP2009071128A (en) * | 2007-09-14 | 2009-04-02 | Naoetsu Electronics Co Ltd | Method of manufacturing semiconductor-bonded wafer |
Also Published As
Publication number | Publication date |
---|---|
JP2535957B2 (en) | 1996-09-18 |
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