JPS5650549A - Manufacture of semiconductor device and lead frame used therefor - Google Patents

Manufacture of semiconductor device and lead frame used therefor

Info

Publication number
JPS5650549A
JPS5650549A JP12538779A JP12538779A JPS5650549A JP S5650549 A JPS5650549 A JP S5650549A JP 12538779 A JP12538779 A JP 12538779A JP 12538779 A JP12538779 A JP 12538779A JP S5650549 A JPS5650549 A JP S5650549A
Authority
JP
Japan
Prior art keywords
frame
lead
plate
chips
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12538779A
Other languages
Japanese (ja)
Inventor
Tamotsu Usami
Kanji Otsuka
Hiroaki Doi
Toshihiro Tsuboi
Shuichi Sugimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP12538779A priority Critical patent/JPS5650549A/en
Publication of JPS5650549A publication Critical patent/JPS5650549A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the deformation of lead chips in a handling process in transportation and the like by providing a suspending plate which is commonly connected to a plurality of the lead chips of a lead frame and separating the suspending plate immediately before the lead chips are fixed to a ceramic plate. CONSTITUTION:The lead frame 21 comprises a picture-frame shaped frame 211, a plurality of lead chips 212 which extend inward from the frame 211, and a suspending plate 213 which is located approximately at the center of the frame 211 and is connected to the inner ends of all the lead chips. Said lead frame 21 is punched out of belt shaped metal plate and formed by machining. Immediately before the lead frame is placed on a ceramic plate, the suspending plate 213 is separated from the lead chips 212. Then, the lead frame 21 is fixed to the periphery of the one surface of the ceramic plate. A semiconductor pellet is fixed to the recess at the central portion of the ceramic plate and connected by bonding wires. Then, the frame 211 is separated, a ceramic cap is placed, and the sealing is accomplished by low-melting- point glass.
JP12538779A 1979-10-01 1979-10-01 Manufacture of semiconductor device and lead frame used therefor Pending JPS5650549A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12538779A JPS5650549A (en) 1979-10-01 1979-10-01 Manufacture of semiconductor device and lead frame used therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12538779A JPS5650549A (en) 1979-10-01 1979-10-01 Manufacture of semiconductor device and lead frame used therefor

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP60226797A Division JPS61123165A (en) 1985-10-14 1985-10-14 Lead frame

Publications (1)

Publication Number Publication Date
JPS5650549A true JPS5650549A (en) 1981-05-07

Family

ID=14908870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12538779A Pending JPS5650549A (en) 1979-10-01 1979-10-01 Manufacture of semiconductor device and lead frame used therefor

Country Status (1)

Country Link
JP (1) JPS5650549A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4415917A (en) * 1980-08-20 1983-11-15 Nippon Electric Co., Ltd. Lead frame for integrated circuit devices
JPS6043336A (en) * 1983-08-18 1985-03-07 Nisshin Oil Mills Ltd:The Preparation of soybean milk containing powdered green tea
CN104309989A (en) * 2014-10-15 2015-01-28 苏州速腾电子科技有限公司 High stability chip conveying device and assembly line using same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49107675A (en) * 1973-02-05 1974-10-12
JPS5013629A (en) * 1973-05-09 1975-02-13
JPS54114975A (en) * 1978-02-27 1979-09-07 Nec Corp Semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49107675A (en) * 1973-02-05 1974-10-12
JPS5013629A (en) * 1973-05-09 1975-02-13
JPS54114975A (en) * 1978-02-27 1979-09-07 Nec Corp Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4415917A (en) * 1980-08-20 1983-11-15 Nippon Electric Co., Ltd. Lead frame for integrated circuit devices
JPS6043336A (en) * 1983-08-18 1985-03-07 Nisshin Oil Mills Ltd:The Preparation of soybean milk containing powdered green tea
JPH0158939B2 (en) * 1983-08-18 1989-12-14 Nisshin Oil Mills Ltd
CN104309989A (en) * 2014-10-15 2015-01-28 苏州速腾电子科技有限公司 High stability chip conveying device and assembly line using same

Similar Documents

Publication Publication Date Title
DE3369428D1 (en) Process for encapsulating semi-conductor components and encapsulated components so obtained
GB2075921B (en) Processing semiconductor wafers
GB2127217B (en) Semiconductor chip carriers and housings
GB956286A (en) Inverter circuits
CA1007760A (en) Solder bond between the semiconductor chip and substrate
EP0179577A3 (en) Method for making a semiconductor device having conductor pins
CA951024A (en) Packaging structure having cooling means for a multiplicity of hermetic modules for integrated circuit chips
DE3573355D1 (en) Semiconductor package substrate and manufacturing process
DE3279378D1 (en) Package for semiconductor device and method for its production
JPS5650549A (en) Manufacture of semiconductor device and lead frame used therefor
EP0187260A3 (en) Semiconductor integrated-circuit device comprising a misfet and process for producing the same
EP0111932A3 (en) Resin-molded semiconductor devices and a process for manufacturing the same
JPS6489346A (en) Semiconductor substrate
IT8321156A1 (en) GRINDING PROCEDURE AND DEVICE FOR CARRYING OUT THE PROCESS AND PROCESSING OF PIECES MADE UP OF FRAGILE BREAKING MATERIALS
EP0268859A3 (en) Method of dividing semiconductor wafers
JPS56137664A (en) Lead frame and semiconductor device having lead frame
JPS5339862A (en) Production of beam lead type semiconductor device
GB2202372B (en) Pre-testable semiconductor die package and fabrication method
EP0240070A3 (en) Process for manufacturing semi-conductor devices
JPS61123165A (en) Lead frame
JPS57210653A (en) Manufacture of glass-sealed semiconductor device
DE3271874D1 (en) Indium-antimony complex crystal semiconductor and process for production thereof
JPS5240974A (en) Package for semiconductor chips
JPS56104458A (en) Semiconductor device
JPS642338A (en) Wafer-scale semiconductor integrate circuit