MY186266A - Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board - Google Patents

Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board

Info

Publication number
MY186266A
MY186266A MYPI2017703411A MYPI2017703411A MY186266A MY 186266 A MY186266 A MY 186266A MY PI2017703411 A MYPI2017703411 A MY PI2017703411A MY PI2017703411 A MYPI2017703411 A MY PI2017703411A MY 186266 A MY186266 A MY 186266A
Authority
MY
Malaysia
Prior art keywords
copper foil
copper
roughened
substantially spherical
spherical protrusions
Prior art date
Application number
MYPI2017703411A
Other languages
English (en)
Inventor
Hiroto Iida
Mitsuyoshi Matsuda
Kazuhiro Yoshikawa
Nobuyuki Kawai
Tsubasa Kato
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY186266A publication Critical patent/MY186266A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • ing And Chemical Polishing (AREA)
  • Chemically Coating (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
MYPI2017703411A 2015-03-31 2016-03-25 Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board MY186266A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015073356 2015-03-31
PCT/JP2016/059671 WO2016158775A1 (ja) 2015-03-31 2016-03-25 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Publications (1)

Publication Number Publication Date
MY186266A true MY186266A (en) 2021-07-01

Family

ID=57004659

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017703411A MY186266A (en) 2015-03-31 2016-03-25 Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board

Country Status (6)

Country Link
JP (1) JP6293365B2 (ko)
KR (1) KR102273442B1 (ko)
CN (1) CN107429417B (ko)
MY (1) MY186266A (ko)
TW (1) TWI620662B (ko)
WO (1) WO2016158775A1 (ko)

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KR102340473B1 (ko) * 2017-04-25 2021-12-16 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박
KR102297790B1 (ko) 2017-05-19 2021-09-06 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판
KR102016494B1 (ko) * 2017-10-23 2019-09-02 삼성전기주식회사 코일 부품
WO2019111914A1 (ja) * 2017-12-05 2019-06-13 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板
US10337115B1 (en) * 2018-01-05 2019-07-02 Chang Chun Petrochemical Co., Ltd. Surface treated copper foil for high speed printed circuit board products including the copper foil and methods of making
CN111886367B (zh) 2018-03-27 2023-05-16 三井金属矿业株式会社 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板
CN110783727A (zh) 2018-11-09 2020-02-11 广州方邦电子股份有限公司 一种连接器及制作方法
CN110783728A (zh) 2018-11-09 2020-02-11 广州方邦电子股份有限公司 一种柔性连接器及制作方法
JP7453154B2 (ja) * 2018-11-19 2024-03-19 三井金属鉱業株式会社 表面処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
JP7410128B2 (ja) * 2019-03-26 2024-01-09 三井金属鉱業株式会社 プリント配線板の製造方法
US20220183158A1 (en) * 2019-03-26 2022-06-09 Mitsui Mining & Smelting Co., Ltd. Method of manufacturing printed wiring board
JP6816193B2 (ja) * 2019-03-26 2021-01-20 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板
KR20240009937A (ko) * 2021-05-20 2024-01-23 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판

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JP3664533B2 (ja) * 1995-11-28 2005-06-29 信越ポリマー株式会社 プリント配線板用積層板
JP2003243785A (ja) * 2002-02-18 2003-08-29 Hitachi Cable Ltd 樹脂接着用銅箔、銅箔／樹脂接着フィルム、および樹脂接着用銅箔の製造方法
JP2009176770A (ja) * 2008-01-21 2009-08-06 Ube Ind Ltd 銅配線絶縁フィルムの製造法、及びこれらから製造された銅配線絶縁フィルム
JP2009293103A (ja) * 2008-06-09 2009-12-17 Nippon Denkai Kk 支持体付極薄銅箔及びその製造方法
KR20130054447A (ko) * 2009-03-27 2013-05-24 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 프린트 배선판용 동박 및 그 제조 방법
JP5400447B2 (ja) * 2009-03-31 2014-01-29 三井金属鉱業株式会社 粗化処理銅箔、粗化処理銅箔の製造方法及び銅張積層板
WO2011010540A1 (ja) * 2009-07-24 2011-01-27 三菱瓦斯化学株式会社 樹脂複合電解銅箔、銅張積層板及びプリント配線板
JP4927963B2 (ja) * 2010-01-22 2012-05-09 古河電気工業株式会社 表面処理銅箔、その製造方法及び銅張積層基板
JP5242710B2 (ja) * 2010-01-22 2013-07-24 古河電気工業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
WO2011108467A1 (ja) * 2010-03-01 2011-09-09 古河電気工業株式会社 銅箔の表面処理方法、表面処理銅箔およびリチウムイオン二次電池の負極集電体用銅箔
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JP5654416B2 (ja) * 2011-06-07 2015-01-14 Jx日鉱日石金属株式会社 液晶ポリマー銅張積層板及び当該積層板に用いる銅箔
CN103857833B (zh) * 2011-09-30 2018-09-07 Jx日矿日石金属株式会社 与树脂粘着性优良的铜箔、其制造方法以及使用该电解铜箔的印刷布线板或电池用负极材料
JP5204908B1 (ja) * 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
KR20150090265A (ko) * 2013-02-28 2015-08-05 미쓰이금속광업주식회사 흑색화 표면 처리 구리박, 흑색화 표면 처리 구리박의 제조 방법, 구리 클래드 적층판 및 플렉시블 프린트 배선판
TW201504038A (zh) * 2013-06-04 2015-02-01 Jx Nippon Mining & Metals Corp 附載體銅箔、覆銅積層板、印刷配線板、電子機器及附載體銅箔之製造方法
JP6593979B2 (ja) * 2013-07-24 2019-10-23 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、基材、銅張積層板の製造方法、電子機器の製造方法及びプリント配線板の製造方法
JP6379055B2 (ja) * 2015-01-30 2018-08-22 Ｊｘ金属株式会社 表面処理銅箔及び積層板

Also Published As

Publication number Publication date
CN107429417A (zh) 2017-12-01
JP6293365B2 (ja) 2018-03-14
CN107429417B (zh) 2019-11-22
WO2016158775A1 (ja) 2016-10-06
TW201707948A (zh) 2017-03-01
JPWO2016158775A1 (ja) 2017-07-27
KR102273442B1 (ko) 2021-07-06
KR20170132128A (ko) 2017-12-01
TWI620662B (zh) 2018-04-11

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