TWI620662B - Roughening copper foil, copper foil with carrier, copper clad laminate and printed wiring board - Google Patents
Roughening copper foil, copper foil with carrier, copper clad laminate and printed wiring board Download PDFInfo
- Publication number
- TWI620662B TWI620662B TW105109852A TW105109852A TWI620662B TW I620662 B TWI620662 B TW I620662B TW 105109852 A TW105109852 A TW 105109852A TW 105109852 A TW105109852 A TW 105109852A TW I620662 B TWI620662 B TW I620662B
- Authority
- TW
- Taiwan
- Prior art keywords
- copper foil
- roughened
- ave
- slightly spherical
- carrier
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Chemically Coating (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015073356 | 2015-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201707948A TW201707948A (zh) | 2017-03-01 |
TWI620662B true TWI620662B (zh) | 2018-04-11 |
Family
ID=57004659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105109852A TWI620662B (zh) | 2015-03-31 | 2016-03-29 | Roughening copper foil, copper foil with carrier, copper clad laminate and printed wiring board |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6293365B2 (ko) |
KR (1) | KR102273442B1 (ko) |
CN (1) | CN107429417B (ko) |
MY (1) | MY186266A (ko) |
TW (1) | TWI620662B (ko) |
WO (1) | WO2016158775A1 (ko) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110546313A (zh) * | 2017-04-25 | 2019-12-06 | 古河电气工业株式会社 | 表面处理铜箔 |
JP6430092B1 (ja) * | 2017-05-19 | 2018-11-28 | 三井金属鉱業株式会社 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
KR102016494B1 (ko) * | 2017-10-23 | 2019-09-02 | 삼성전기주식회사 | 코일 부품 |
KR102390417B1 (ko) * | 2017-12-05 | 2022-04-22 | 후루카와 덴키 고교 가부시키가이샤 | 표면 처리 동박, 그리고 이것을 이용한 동 클래드 적층판 및 프린트 배선판 |
TWI798287B (zh) * | 2017-12-08 | 2023-04-11 | 日商日本電產理德股份有限公司 | Mi元件的製造方法及mi元件 |
US10337115B1 (en) * | 2018-01-05 | 2019-07-02 | Chang Chun Petrochemical Co., Ltd. | Surface treated copper foil for high speed printed circuit board products including the copper foil and methods of making |
CN111886367B (zh) | 2018-03-27 | 2023-05-16 | 三井金属矿业株式会社 | 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板 |
CN110783728A (zh) | 2018-11-09 | 2020-02-11 | 广州方邦电子股份有限公司 | 一种柔性连接器及制作方法 |
CN110783727A (zh) | 2018-11-09 | 2020-02-11 | 广州方邦电子股份有限公司 | 一种连接器及制作方法 |
JP7453154B2 (ja) * | 2018-11-19 | 2024-03-19 | 三井金属鉱業株式会社 | 表面処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
JP7411638B2 (ja) * | 2019-03-26 | 2024-01-11 | 三井金属鉱業株式会社 | プリント配線板の製造方法 |
CN113574977A (zh) | 2019-03-26 | 2021-10-29 | 三井金属矿业株式会社 | 印刷电路板的制造方法 |
JP6816193B2 (ja) * | 2019-03-26 | 2021-01-20 | 古河電気工業株式会社 | 表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板 |
WO2022244828A1 (ja) * | 2021-05-20 | 2022-11-24 | 三井金属鉱業株式会社 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120285734A1 (en) * | 2010-01-22 | 2012-11-15 | Furukawa Electric Co., Ltd. | Roughened copper foil, method for producing same, copper clad laminated board, and printed circuit board |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3664533B2 (ja) * | 1995-11-28 | 2005-06-29 | 信越ポリマー株式会社 | プリント配線板用積層板 |
JP2003243785A (ja) * | 2002-02-18 | 2003-08-29 | Hitachi Cable Ltd | 樹脂接着用銅箔、銅箔/樹脂接着フィルム、および樹脂接着用銅箔の製造方法 |
JP2009176770A (ja) * | 2008-01-21 | 2009-08-06 | Ube Ind Ltd | 銅配線絶縁フィルムの製造法、及びこれらから製造された銅配線絶縁フィルム |
JP2009293103A (ja) * | 2008-06-09 | 2009-12-17 | Nippon Denkai Kk | 支持体付極薄銅箔及びその製造方法 |
KR20130054447A (ko) * | 2009-03-27 | 2013-05-24 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 프린트 배선판용 동박 및 그 제조 방법 |
JP5400447B2 (ja) * | 2009-03-31 | 2014-01-29 | 三井金属鉱業株式会社 | 粗化処理銅箔、粗化処理銅箔の製造方法及び銅張積層板 |
CN102574365B (zh) * | 2009-07-24 | 2015-11-25 | 三菱瓦斯化学株式会社 | 树脂复合电解铜箔、覆铜层压板和印刷线路板 |
JP4927963B2 (ja) * | 2010-01-22 | 2012-05-09 | 古河電気工業株式会社 | 表面処理銅箔、その製造方法及び銅張積層基板 |
KR20130027484A (ko) * | 2010-03-01 | 2013-03-15 | 후루카와 덴키 고교 가부시키가이샤 | 동박의 표면처리방법, 표면처리된 동박, 및 리튬 이온 2차 전지의 음극 컬렉터용 동박 |
JP5634103B2 (ja) * | 2010-04-06 | 2014-12-03 | 福田金属箔粉工業株式会社 | 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。 |
JP5654416B2 (ja) * | 2011-06-07 | 2015-01-14 | Jx日鉱日石金属株式会社 | 液晶ポリマー銅張積層板及び当該積層板に用いる銅箔 |
WO2013047272A1 (ja) * | 2011-09-30 | 2013-04-04 | Jx日鉱日石金属株式会社 | 樹脂との密着性に優れた銅箔及びその製造方法並びに該電解銅箔を用いたプリント配線板又は電池用負極材 |
JP5204908B1 (ja) * | 2012-03-26 | 2013-06-05 | Jx日鉱日石金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板 |
MY181562A (en) * | 2013-02-28 | 2020-12-29 | Mitsui Mining & Smelting Co Ltd | Black color surface-treated copper foil, method of manufacturing black color surface-treated copper foil, copper-clad laminate and flexible printed wiring board |
TW201504038A (zh) * | 2013-06-04 | 2015-02-01 | Jx Nippon Mining & Metals Corp | 附載體銅箔、覆銅積層板、印刷配線板、電子機器及附載體銅箔之製造方法 |
JP6593979B2 (ja) * | 2013-07-24 | 2019-10-23 | Jx金属株式会社 | 表面処理銅箔、キャリア付銅箔、基材、銅張積層板の製造方法、電子機器の製造方法及びプリント配線板の製造方法 |
JP6379055B2 (ja) * | 2015-01-30 | 2018-08-22 | Jx金属株式会社 | 表面処理銅箔及び積層板 |
-
2016
- 2016-03-25 WO PCT/JP2016/059671 patent/WO2016158775A1/ja active Application Filing
- 2016-03-25 JP JP2017509918A patent/JP6293365B2/ja active Active
- 2016-03-25 MY MYPI2017703411A patent/MY186266A/en unknown
- 2016-03-25 KR KR1020177016424A patent/KR102273442B1/ko active IP Right Grant
- 2016-03-25 CN CN201680020446.8A patent/CN107429417B/zh active Active
- 2016-03-29 TW TW105109852A patent/TWI620662B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120285734A1 (en) * | 2010-01-22 | 2012-11-15 | Furukawa Electric Co., Ltd. | Roughened copper foil, method for producing same, copper clad laminated board, and printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
JP6293365B2 (ja) | 2018-03-14 |
CN107429417A (zh) | 2017-12-01 |
MY186266A (en) | 2021-07-01 |
TW201707948A (zh) | 2017-03-01 |
JPWO2016158775A1 (ja) | 2017-07-27 |
WO2016158775A1 (ja) | 2016-10-06 |
KR20170132128A (ko) | 2017-12-01 |
KR102273442B1 (ko) | 2021-07-06 |
CN107429417B (zh) | 2019-11-22 |
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