MY122581A - Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil. - Google Patents

Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil.

Info

Publication number
MY122581A
MY122581A MYPI20004855A MYPI20004855A MY122581A MY 122581 A MY122581 A MY 122581A MY PI20004855 A MYPI20004855 A MY PI20004855A MY PI20004855 A MYPI20004855 A MY PI20004855A MY 122581 A MY122581 A MY 122581A
Authority
MY
Malaysia
Prior art keywords
foil
carrier
copper foil
electrolytic copper
carrier foil
Prior art date
Application number
MYPI20004855A
Other languages
English (en)
Inventor
Sakiko Taenaka
Makoto Dobashi
Akiko Sugimoto
Naotomi Takahashi
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of MY122581A publication Critical patent/MY122581A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
MYPI20004855A 1999-11-11 2000-10-17 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil. MY122581A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32168799A JP3670179B2 (ja) 1999-11-11 1999-11-11 キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔を用いた銅張積層板

Publications (1)

Publication Number Publication Date
MY122581A true MY122581A (en) 2006-04-29

Family

ID=18135313

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20004855A MY122581A (en) 1999-11-11 2000-10-17 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil.

Country Status (11)

Country Link
US (1) US6649274B1 (zh)
EP (1) EP1152069B1 (zh)
JP (1) JP3670179B2 (zh)
KR (1) KR100461660B1 (zh)
CN (1) CN1293234C (zh)
AT (1) ATE323185T1 (zh)
DE (1) DE60027271T2 (zh)
HK (1) HK1043612A1 (zh)
MY (1) MY122581A (zh)
TW (1) TW491002B (zh)
WO (1) WO2001034879A1 (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU90532B1 (en) * 2000-02-24 2001-08-27 Circuit Foil Luxembourg Trading Sarl Comosite copper foil and manufacturing method thereof
JP3396465B2 (ja) * 2000-08-25 2003-04-14 三井金属鉱業株式会社 銅張積層板
US6893742B2 (en) * 2001-02-15 2005-05-17 Olin Corporation Copper foil with low profile bond enhancement
FR2833410B1 (fr) * 2001-12-10 2004-03-19 Commissariat Energie Atomique Procede de realisation d'un dispositif d'imagerie
JP4073248B2 (ja) * 2002-05-14 2008-04-09 三井金属鉱業株式会社 高温耐熱用キャリア箔付電解銅箔の製造方法及びその製造方法で得られる高温耐熱用キャリア箔付電解銅箔
JP3534405B1 (ja) 2002-11-28 2004-06-07 鐘淵化学工業株式会社 耐熱性フレキシブル積層板の製造方法およびこれにより製造される耐熱性フレキシブル積層板
US20040156177A1 (en) * 2003-02-12 2004-08-12 Matsushita Electric Industrial Co., Ltd. Package of electronic components and method for producing the same
JP4484442B2 (ja) 2003-04-10 2010-06-16 シスメックス株式会社 細菌測定方法と装置とプログラム
DE10346370A1 (de) * 2003-09-29 2005-04-28 Siemens Ag Verfahren und Herstellungsanlage zum Herstellen eines Bandes auf einem Substratband
JP4846258B2 (ja) * 2005-03-31 2011-12-28 京セラＳｌｃテクノロジー株式会社 配線基板及びその製造方法
US8722199B2 (en) * 2005-03-31 2014-05-13 Mitsui Mining & Smelting Co., Ltd. Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil
JP4573722B2 (ja) * 2005-07-27 2010-11-04 富士フイルム株式会社 接着剤の剥離方法、光学素子の製造方法、プリズムの製造方法及び当該製造方法により製造されたプリズム
CN100593720C (zh) * 2005-10-26 2010-03-10 宁波华远电子科技有限公司 绕性覆铜板制造过程中的胀缩系数的测量方法及补偿方法
WO2010027052A1 (ja) * 2008-09-05 2010-03-11 古河電気工業株式会社 キャリア付き極薄銅箔、並びに銅貼積層板またはプリント配線基板
JP2009143233A (ja) * 2008-12-24 2009-07-02 Nippon Mining & Metals Co Ltd キャリア付金属箔
AT12326U1 (de) * 2009-04-20 2012-03-15 Austria Tech & System Tech Verfahren zum vorbehandeln eines rahmen- bzw. trägerelements für eine herstellung einer leiterplatte, sowie rahmen- bzw. trägerelement und verwendung hiefür
CN102452197B (zh) 2010-10-21 2014-08-20 财团法人工业技术研究院 附载箔铜箔及其制造方法
CN105745360B (zh) * 2013-11-27 2017-12-08 三井金属矿业株式会社 带有载体箔的铜箔、覆铜层压板及印刷线路板
KR101695236B1 (ko) * 2013-12-30 2017-01-11 일진머티리얼즈 주식회사 동박, 이를 포함하는 전기부품 및 전지
KR20180040754A (ko) * 2016-10-12 2018-04-23 케이씨에프테크놀로지스 주식회사 핸들링이 용이한 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
KR102302184B1 (ko) * 2018-02-01 2021-09-13 에스케이넥실리스 주식회사 고온 치수 안정성 및 집합조직 안정성을 갖는 전해동박 및 그 제조방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2413932C2 (de) * 1973-04-25 1984-08-30 Yates Industries, Inc., Bordentown, N.J. Verfahren zum Herstellen einer Verbundfolie für die Ausbildung gedruckter Schaltkreise
EP0207244B2 (en) * 1985-07-05 1999-03-31 Mitsui Mining & Smelting Co., Ltd. Process for the production of an electroposited copper foil.
JPH0235040B2 (ja) * 1987-04-30 1990-08-08 Fukuda Kinzoku Hakufun Kogyo Kk Fukugohakuoyobisonoseizohoho
US4937133A (en) * 1988-03-28 1990-06-26 Nippon Steel Chemical Co., Ltd. Flexible base materials for printed circuits
JPH02113591A (ja) * 1988-10-22 1990-04-25 Matsushita Electric Works Ltd 印刷配線板の製造方法
US5153050A (en) * 1991-08-27 1992-10-06 Johnston James A Component of printed circuit boards
JPH05102630A (ja) * 1991-10-03 1993-04-23 Hitachi Chem Co Ltd キヤリア付銅箔の製造方法及びそれを用いた銅張積層板
JPH05218637A (ja) * 1992-02-07 1993-08-27 Mitsubishi Gas Chem Co Inc 銅張積層板の製造法
JPH08197681A (ja) * 1995-01-25 1996-08-06 Asahi Chem Ind Co Ltd カール性を改良した銅張板の製造方法

Also Published As

Publication number Publication date
DE60027271T2 (de) 2007-01-04
EP1152069A4 (en) 2005-01-05
ATE323185T1 (de) 2006-04-15
JP2001140091A (ja) 2001-05-22
WO2001034879A1 (fr) 2001-05-17
EP1152069A1 (en) 2001-11-07
JP3670179B2 (ja) 2005-07-13
CN1293234C (zh) 2007-01-03
EP1152069B1 (en) 2006-04-12
US6649274B1 (en) 2003-11-18
DE60027271D1 (de) 2006-05-24
KR100461660B1 (ko) 2004-12-16
CN1335897A (zh) 2002-02-13
HK1043612A1 (zh) 2002-09-20
KR20010089706A (ko) 2001-10-08
TW491002B (en) 2002-06-11

Similar Documents

Publication Publication Date Title
MY122581A (en) Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil.
WO2001016402A8 (fr) Feuille de cuivre electrolytique avec feuille support et son procede de fabrication et lamine a gaine de cuivre utilisant la feuille de cuivre electrolytique
EP0911876A3 (en) Low thermal expansion circuit board and multilayer wiring circuit board
EP1154002A4 (en) PRESSURE-SENSITIVE ADHESIVE FILM EXPANDED WITH HEAT
AU1207400A (en) Zoned aircraft de-icing system and method
BR9509010A (pt) Estrutura de adesivo sensível á pressão com múltiplas camadas
AU3965800A (en) Radiation-curable composite board or film
DE69700672T2 (de) Etikett mit einer metallischen Schicht kontrollierter Dicke
WO2000013888A8 (en) Coextruded adhesive constructions
DE69926125D1 (de) Mehrschichtiger hitzeschrumpfbarer film
TW364153B (en) Structure of jointing metal element and ceramic element and method thereof
HK1039968A1 (zh) 帶載體箔的電解銅箔及其製造方法和使用該帶載體箔的電解銅箔的敷銅層壓板
ES8609406A1 (es) Un procedimiento para producir una estructura de pelicula de polipropileno, de capas multiples y orientada.
EP0258452A4 (en) METHOD FOR PRODUCING A LAMINATE COATED WITH COPPER.
AU2675901A (en) Multilayer printed board
TW200606015A (en) Adhesive film and production method therefor and flexible metal-clad laminate and production method therefor
MY136428A (en) Resin/copper/metal laminate and method of producing same
EP1170983A4 (en) CIRCUIT-FORMING PLATE AND MANUFACTURING METHOD OF CIRCUIT-FORMING PLATE
EP1016739A3 (en) Copper foil having glossy surface with excellent oxidation resistance and method of manufacturing the same
CA2393908A1 (en) Foam sign
DE316620T1 (de) Feuchtigkeitundurchlaessige, beschichtete thermoplastische folie mit verbesserter adhaesion fuer tinte und metallische schichten.
WO2004039134A3 (en) Printed circuit heaters with ultrathin low resistivity materials
EP0782376A3 (en) Polyimide-metal foil composite film
MY118391A (en) Organic rust-proof treated copper foil
TW200505314A (en) Copper-clad laminate