MY122581A - Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil. - Google Patents
Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil.Info
- Publication number
- MY122581A MY122581A MYPI20004855A MYPI20004855A MY122581A MY 122581 A MY122581 A MY 122581A MY PI20004855 A MYPI20004855 A MY PI20004855A MY PI20004855 A MYPI20004855 A MY PI20004855A MY 122581 A MY122581 A MY 122581A
- Authority
- MY
- Malaysia
- Prior art keywords
- foil
- carrier
- copper foil
- electrolytic copper
- carrier foil
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electrolytic Production Of Metals (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Cell Electrode Carriers And Collectors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32168799A JP3670179B2 (ja) | 1999-11-11 | 1999-11-11 | キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔を用いた銅張積層板 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY122581A true MY122581A (en) | 2006-04-29 |
Family
ID=18135313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20004855A MY122581A (en) | 1999-11-11 | 2000-10-17 | Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil. |
Country Status (11)
Country | Link |
---|---|
US (1) | US6649274B1 (zh) |
EP (1) | EP1152069B1 (zh) |
JP (1) | JP3670179B2 (zh) |
KR (1) | KR100461660B1 (zh) |
CN (1) | CN1293234C (zh) |
AT (1) | ATE323185T1 (zh) |
DE (1) | DE60027271T2 (zh) |
HK (1) | HK1043612A1 (zh) |
MY (1) | MY122581A (zh) |
TW (1) | TW491002B (zh) |
WO (1) | WO2001034879A1 (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
LU90532B1 (en) * | 2000-02-24 | 2001-08-27 | Circuit Foil Luxembourg Trading Sarl | Comosite copper foil and manufacturing method thereof |
JP3396465B2 (ja) * | 2000-08-25 | 2003-04-14 | 三井金属鉱業株式会社 | 銅張積層板 |
US6893742B2 (en) * | 2001-02-15 | 2005-05-17 | Olin Corporation | Copper foil with low profile bond enhancement |
FR2833410B1 (fr) * | 2001-12-10 | 2004-03-19 | Commissariat Energie Atomique | Procede de realisation d'un dispositif d'imagerie |
JP4073248B2 (ja) * | 2002-05-14 | 2008-04-09 | 三井金属鉱業株式会社 | 高温耐熱用キャリア箔付電解銅箔の製造方法及びその製造方法で得られる高温耐熱用キャリア箔付電解銅箔 |
JP3534405B1 (ja) | 2002-11-28 | 2004-06-07 | 鐘淵化学工業株式会社 | 耐熱性フレキシブル積層板の製造方法およびこれにより製造される耐熱性フレキシブル積層板 |
US20040156177A1 (en) * | 2003-02-12 | 2004-08-12 | Matsushita Electric Industrial Co., Ltd. | Package of electronic components and method for producing the same |
JP4484442B2 (ja) | 2003-04-10 | 2010-06-16 | シスメックス株式会社 | 細菌測定方法と装置とプログラム |
DE10346370A1 (de) * | 2003-09-29 | 2005-04-28 | Siemens Ag | Verfahren und Herstellungsanlage zum Herstellen eines Bandes auf einem Substratband |
KR100941219B1 (ko) * | 2005-03-31 | 2010-02-10 | 미쓰이 긴조꾸 고교 가부시키가이샤 | 전해 동박, 그 전해 동박을 이용하여 얻어진 표면 처리 전해 동박, 그 표면 처리 전해 동박을 이용한 동장 적층판 및 프린트 배선판 |
JP4846258B2 (ja) * | 2005-03-31 | 2011-12-28 | 京セラSlcテクノロジー株式会社 | 配線基板及びその製造方法 |
JP4573722B2 (ja) * | 2005-07-27 | 2010-11-04 | 富士フイルム株式会社 | 接着剤の剥離方法、光学素子の製造方法、プリズムの製造方法及び当該製造方法により製造されたプリズム |
CN100593720C (zh) * | 2005-10-26 | 2010-03-10 | 宁波华远电子科技有限公司 | 绕性覆铜板制造过程中的胀缩系数的测量方法及补偿方法 |
KR101281146B1 (ko) * | 2008-09-05 | 2013-07-02 | 후루카와 덴끼고교 가부시키가이샤 | 캐리어 부착 극박 동박, 및 동장 적층판 또는 프린트 배선 기판 |
JP2009143233A (ja) * | 2008-12-24 | 2009-07-02 | Nippon Mining & Metals Co Ltd | キャリア付金属箔 |
AT12326U1 (de) * | 2009-04-20 | 2012-03-15 | Austria Tech & System Tech | Verfahren zum vorbehandeln eines rahmen- bzw. trägerelements für eine herstellung einer leiterplatte, sowie rahmen- bzw. trägerelement und verwendung hiefür |
CN102452197B (zh) | 2010-10-21 | 2014-08-20 | 财团法人工业技术研究院 | 附载箔铜箔及其制造方法 |
MY187285A (en) * | 2013-11-27 | 2021-09-19 | Mitsui Mining & Smelting Co Ltd | Copper foil provided with carrier foil, copper clad laminate and printed wiring board |
KR101695236B1 (ko) * | 2013-12-30 | 2017-01-11 | 일진머티리얼즈 주식회사 | 동박, 이를 포함하는 전기부품 및 전지 |
KR20180040754A (ko) * | 2016-10-12 | 2018-04-23 | 케이씨에프테크놀로지스 주식회사 | 핸들링이 용이한 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
KR102302184B1 (ko) | 2018-02-01 | 2021-09-13 | 에스케이넥실리스 주식회사 | 고온 치수 안정성 및 집합조직 안정성을 갖는 전해동박 및 그 제조방법 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2413932C2 (de) * | 1973-04-25 | 1984-08-30 | Yates Industries, Inc., Bordentown, N.J. | Verfahren zum Herstellen einer Verbundfolie für die Ausbildung gedruckter Schaltkreise |
EP0207244B2 (en) * | 1985-07-05 | 1999-03-31 | Mitsui Mining & Smelting Co., Ltd. | Process for the production of an electroposited copper foil. |
JPH0235040B2 (ja) * | 1987-04-30 | 1990-08-08 | Fukuda Kinzoku Hakufun Kogyo Kk | Fukugohakuoyobisonoseizohoho |
US4937133A (en) * | 1988-03-28 | 1990-06-26 | Nippon Steel Chemical Co., Ltd. | Flexible base materials for printed circuits |
JPH02113591A (ja) * | 1988-10-22 | 1990-04-25 | Matsushita Electric Works Ltd | 印刷配線板の製造方法 |
US5153050A (en) * | 1991-08-27 | 1992-10-06 | Johnston James A | Component of printed circuit boards |
JPH05102630A (ja) * | 1991-10-03 | 1993-04-23 | Hitachi Chem Co Ltd | キヤリア付銅箔の製造方法及びそれを用いた銅張積層板 |
JPH05218637A (ja) * | 1992-02-07 | 1993-08-27 | Mitsubishi Gas Chem Co Inc | 銅張積層板の製造法 |
JPH08197681A (ja) * | 1995-01-25 | 1996-08-06 | Asahi Chem Ind Co Ltd | カール性を改良した銅張板の製造方法 |
-
1999
- 1999-11-11 JP JP32168799A patent/JP3670179B2/ja not_active Expired - Lifetime
-
2000
- 2000-09-29 US US10/031,280 patent/US6649274B1/en not_active Expired - Fee Related
- 2000-09-29 CN CNB008025088A patent/CN1293234C/zh not_active Expired - Fee Related
- 2000-09-29 KR KR10-2001-7008143A patent/KR100461660B1/ko not_active IP Right Cessation
- 2000-09-29 WO PCT/JP2000/006765 patent/WO2001034879A1/ja active IP Right Grant
- 2000-09-29 DE DE2000627271 patent/DE60027271T2/de not_active Expired - Fee Related
- 2000-09-29 EP EP00962977A patent/EP1152069B1/en not_active Expired - Lifetime
- 2000-09-29 AT AT00962977T patent/ATE323185T1/de not_active IP Right Cessation
- 2000-10-11 TW TW89121224A patent/TW491002B/zh not_active IP Right Cessation
- 2000-10-17 MY MYPI20004855A patent/MY122581A/en unknown
-
2002
- 2002-07-16 HK HK02105249.6A patent/HK1043612A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
DE60027271T2 (de) | 2007-01-04 |
CN1335897A (zh) | 2002-02-13 |
JP2001140091A (ja) | 2001-05-22 |
US6649274B1 (en) | 2003-11-18 |
WO2001034879A1 (fr) | 2001-05-17 |
HK1043612A1 (zh) | 2002-09-20 |
CN1293234C (zh) | 2007-01-03 |
EP1152069A1 (en) | 2001-11-07 |
KR100461660B1 (ko) | 2004-12-16 |
DE60027271D1 (de) | 2006-05-24 |
EP1152069B1 (en) | 2006-04-12 |
ATE323185T1 (de) | 2006-04-15 |
JP3670179B2 (ja) | 2005-07-13 |
EP1152069A4 (en) | 2005-01-05 |
TW491002B (en) | 2002-06-11 |
KR20010089706A (ko) | 2001-10-08 |
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