ATE323185T1 - Elektrolytische kupferfolie mit trägerfolie und kupferkaschiertes laminat wobei die elektrolytische kupferfolie mit trägerfolie verwendet wird - Google Patents

Elektrolytische kupferfolie mit trägerfolie und kupferkaschiertes laminat wobei die elektrolytische kupferfolie mit trägerfolie verwendet wird

Info

Publication number
ATE323185T1
ATE323185T1 AT00962977T AT00962977T ATE323185T1 AT E323185 T1 ATE323185 T1 AT E323185T1 AT 00962977 T AT00962977 T AT 00962977T AT 00962977 T AT00962977 T AT 00962977T AT E323185 T1 ATE323185 T1 AT E323185T1
Authority
AT
Austria
Prior art keywords
foil
backing
carrier
electrolytic copper
copper foil
Prior art date
Application number
AT00962977T
Other languages
English (en)
Inventor
Sakiko Taenaka
Makoto Dobashi
Akiko Sugimoto
Naotomi Takahashi
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Application granted granted Critical
Publication of ATE323185T1 publication Critical patent/ATE323185T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
AT00962977T 1999-11-11 2000-09-29 Elektrolytische kupferfolie mit trägerfolie und kupferkaschiertes laminat wobei die elektrolytische kupferfolie mit trägerfolie verwendet wird ATE323185T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32168799A JP3670179B2 (ja) 1999-11-11 1999-11-11 キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔を用いた銅張積層板

Publications (1)

Publication Number Publication Date
ATE323185T1 true ATE323185T1 (de) 2006-04-15

Family

ID=18135313

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00962977T ATE323185T1 (de) 1999-11-11 2000-09-29 Elektrolytische kupferfolie mit trägerfolie und kupferkaschiertes laminat wobei die elektrolytische kupferfolie mit trägerfolie verwendet wird

Country Status (11)

Country Link
US (1) US6649274B1 (de)
EP (1) EP1152069B1 (de)
JP (1) JP3670179B2 (de)
KR (1) KR100461660B1 (de)
CN (1) CN1293234C (de)
AT (1) ATE323185T1 (de)
DE (1) DE60027271T2 (de)
HK (1) HK1043612A1 (de)
MY (1) MY122581A (de)
TW (1) TW491002B (de)
WO (1) WO2001034879A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU90532B1 (en) * 2000-02-24 2001-08-27 Circuit Foil Luxembourg Trading Sarl Comosite copper foil and manufacturing method thereof
JP3396465B2 (ja) * 2000-08-25 2003-04-14 三井金属鉱業株式会社 銅張積層板
US6893742B2 (en) * 2001-02-15 2005-05-17 Olin Corporation Copper foil with low profile bond enhancement
FR2833410B1 (fr) * 2001-12-10 2004-03-19 Commissariat Energie Atomique Procede de realisation d'un dispositif d'imagerie
JP4073248B2 (ja) * 2002-05-14 2008-04-09 三井金属鉱業株式会社 高温耐熱用キャリア箔付電解銅箔の製造方法及びその製造方法で得られる高温耐熱用キャリア箔付電解銅箔
JP3534405B1 (ja) 2002-11-28 2004-06-07 鐘淵化学工業株式会社 耐熱性フレキシブル積層板の製造方法およびこれにより製造される耐熱性フレキシブル積層板
US20040156177A1 (en) * 2003-02-12 2004-08-12 Matsushita Electric Industrial Co., Ltd. Package of electronic components and method for producing the same
JP4484442B2 (ja) 2003-04-10 2010-06-16 シスメックス株式会社 細菌測定方法と装置とプログラム
DE10346370A1 (de) * 2003-09-29 2005-04-28 Siemens Ag Verfahren und Herstellungsanlage zum Herstellen eines Bandes auf einem Substratband
KR100941219B1 (ko) * 2005-03-31 2010-02-10 미쓰이 긴조꾸 고교 가부시키가이샤 전해 동박, 그 전해 동박을 이용하여 얻어진 표면 처리 전해 동박, 그 표면 처리 전해 동박을 이용한 동장 적층판 및 프린트 배선판
JP4846258B2 (ja) * 2005-03-31 2011-12-28 京セラＳｌｃテクノロジー株式会社 配線基板及びその製造方法
JP4573722B2 (ja) * 2005-07-27 2010-11-04 富士フイルム株式会社 接着剤の剥離方法、光学素子の製造方法、プリズムの製造方法及び当該製造方法により製造されたプリズム
CN100593720C (zh) * 2005-10-26 2010-03-10 宁波华远电子科技有限公司 绕性覆铜板制造过程中的胀缩系数的测量方法及补偿方法
KR101281146B1 (ko) * 2008-09-05 2013-07-02 후루카와 덴끼고교 가부시키가이샤 캐리어 부착 극박 동박, 및 동장 적층판 또는 프린트 배선 기판
JP2009143233A (ja) * 2008-12-24 2009-07-02 Nippon Mining & Metals Co Ltd キャリア付金属箔
AT12326U1 (de) * 2009-04-20 2012-03-15 Austria Tech & System Tech Verfahren zum vorbehandeln eines rahmen- bzw. trägerelements für eine herstellung einer leiterplatte, sowie rahmen- bzw. trägerelement und verwendung hiefür
CN102452197B (zh) 2010-10-21 2014-08-20 财团法人工业技术研究院 附载箔铜箔及其制造方法
MY187285A (en) * 2013-11-27 2021-09-19 Mitsui Mining & Smelting Co Ltd Copper foil provided with carrier foil, copper clad laminate and printed wiring board
KR101695236B1 (ko) * 2013-12-30 2017-01-11 일진머티리얼즈 주식회사 동박, 이를 포함하는 전기부품 및 전지
KR20180040754A (ko) * 2016-10-12 2018-04-23 케이씨에프테크놀로지스 주식회사 핸들링이 용이한 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
KR102302184B1 (ko) 2018-02-01 2021-09-13 에스케이넥실리스 주식회사 고온 치수 안정성 및 집합조직 안정성을 갖는 전해동박 및 그 제조방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2413932C2 (de) * 1973-04-25 1984-08-30 Yates Industries, Inc., Bordentown, N.J. Verfahren zum Herstellen einer Verbundfolie für die Ausbildung gedruckter Schaltkreise
EP0207244B2 (de) * 1985-07-05 1999-03-31 Mitsui Mining & Smelting Co., Ltd. Verfahren zur Herstellung einer Kupferfolie durch elektrolytische Abscheidung.
JPH0235040B2 (ja) * 1987-04-30 1990-08-08 Fukuda Kinzoku Hakufun Kogyo Kk Fukugohakuoyobisonoseizohoho
US4937133A (en) * 1988-03-28 1990-06-26 Nippon Steel Chemical Co., Ltd. Flexible base materials for printed circuits
JPH02113591A (ja) * 1988-10-22 1990-04-25 Matsushita Electric Works Ltd 印刷配線板の製造方法
US5153050A (en) * 1991-08-27 1992-10-06 Johnston James A Component of printed circuit boards
JPH05102630A (ja) * 1991-10-03 1993-04-23 Hitachi Chem Co Ltd キヤリア付銅箔の製造方法及びそれを用いた銅張積層板
JPH05218637A (ja) * 1992-02-07 1993-08-27 Mitsubishi Gas Chem Co Inc 銅張積層板の製造法
JPH08197681A (ja) * 1995-01-25 1996-08-06 Asahi Chem Ind Co Ltd カール性を改良した銅張板の製造方法

Also Published As

Publication number Publication date
DE60027271T2 (de) 2007-01-04
CN1335897A (zh) 2002-02-13
JP2001140091A (ja) 2001-05-22
US6649274B1 (en) 2003-11-18
WO2001034879A1 (fr) 2001-05-17
HK1043612A1 (zh) 2002-09-20
MY122581A (en) 2006-04-29
CN1293234C (zh) 2007-01-03
EP1152069A1 (de) 2001-11-07
KR100461660B1 (ko) 2004-12-16
DE60027271D1 (de) 2006-05-24
EP1152069B1 (de) 2006-04-12
JP3670179B2 (ja) 2005-07-13
EP1152069A4 (de) 2005-01-05
TW491002B (en) 2002-06-11
KR20010089706A (ko) 2001-10-08

Similar Documents

Publication Publication Date Title
ATE323185T1 (de) Elektrolytische kupferfolie mit trägerfolie und kupferkaschiertes laminat wobei die elektrolytische kupferfolie mit trägerfolie verwendet wird
MY123407A (en) Double-faced pressure-sensitive adhesive sheet and pressure-sensitive adhesive member
DK1084035T3 (da) Varmekrympelig flerlagslim
MY144179A (en) Wafer-processing tape and method of producing the same
EP1168110A3 (de) Transferfolie für Hologramme
ATE318698T1 (de) Elektrolytische kupferfolie mit trägerfolie und kupferkaschiertes laminat die elektrolytische kupferfolie benutzend
ATE290578T1 (de) Wärmeabziehbare druckempfindliche klebefolie
EP1021064A3 (de) Elektrische heizende/wärmende Stoffgegenstände
WO2000013888A8 (en) Coextruded adhesive constructions
DE69715471D1 (de) Retroreflektierender artikel mit einer bindeschicht, die ein epoxidharz und ein silikon vernetztes plymer enthält
TW532145U (en) Plaster
DE60313228D1 (de) Elektrische heizende/wärmende Stoffgegenstände
EP0911876A3 (de) Leiterplatte geringer thermischer Ausdehnung und Mehrlagenleiterplatte
EP0237990A3 (de) Überzug für Monatsbinde aus koextrudierter gelochter Folie
DE3675033D1 (de) Flexible polyimid-mehrschichtlaminate.
DE69708417D1 (de) Film mit einer Trägerschicht die ein Antiblockmittel enthält
AU2002349320A1 (en) Laser-transfer film for permanently labeling components
WO2006100818A3 (en) Apparatus for and method of manufacturing photosensitive laminated body
MY136428A (en) Resin/copper/metal laminate and method of producing same
KR970022897A (ko) 라벨 부착부 형성용 점착 시이트
DE59409393D1 (de) Verbundprofil
HUP0100552A2 (hu) Többrétegű dombornyomású papírtapéta sima hátoldallal, valamint eljárás annak előállítására
JPH0211029B2 (de)
JPH0159755B2 (de)
CN219752225U (zh) 一种带有散热功能的胶带

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties