MX2008015288A - Unidad de fuente de luz de diodo emisor de luz. - Google Patents

Unidad de fuente de luz de diodo emisor de luz.

Info

Publication number
MX2008015288A
MX2008015288A MX2008015288A MX2008015288A MX2008015288A MX 2008015288 A MX2008015288 A MX 2008015288A MX 2008015288 A MX2008015288 A MX 2008015288A MX 2008015288 A MX2008015288 A MX 2008015288A MX 2008015288 A MX2008015288 A MX 2008015288A
Authority
MX
Mexico
Prior art keywords
light source
source unit
led light
printed board
heat dissipating
Prior art date
Application number
MX2008015288A
Other languages
English (en)
Inventor
Yoshihiko Okajima
Katsunori Yashima
Takuya Okada
Toshikatsu Mitsunaga
Original Assignee
Denki Kagaku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2006150810 priority Critical
Priority to JP2007019755 priority
Application filed by Denki Kagaku Kogyo Kk filed Critical Denki Kagaku Kogyo Kk
Priority to PCT/JP2007/061121 priority patent/WO2007139195A1/ja
Publication of MX2008015288A publication Critical patent/MX2008015288A/es

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0209Inorganic, non-metallic particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0191Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

Proveer una unidad de fuente de luz LED, la cual es excelente en desempeño de disipación de calor, con la capacidad de evitar el daño al LED y el brillo, y la cual tiene una vida larga; una unidad de fuente de luz LED que comprende una tarjeta impresa, por lo menos un diodo emisor de luz provisto sobre la tarjeta impresa, y una cinta adhesiva para fijar la tarjeta impresa sobre la superficie del elemento disipador de calor, en donde la conductividad térmica de la cinta adhesiva es desde 1 hasta 4 W/mK, y la tolerancia de voltaje entre la cara de fijación de la tarjeta impresa y la cara de fijación del elemento disipador de calor es de por lo menos 1.0 kV.
MX2008015288A 2006-05-31 2007-05-31 Unidad de fuente de luz de diodo emisor de luz. MX2008015288A (es)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006150810 2006-05-31
JP2007019755 2007-01-30
PCT/JP2007/061121 WO2007139195A1 (ja) 2006-05-31 2007-05-31 Led光源ユニット

Publications (1)

Publication Number Publication Date
MX2008015288A true MX2008015288A (es) 2008-12-12

Family

ID=38778712

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2008015288A MX2008015288A (es) 2006-05-31 2007-05-31 Unidad de fuente de luz de diodo emisor de luz.

Country Status (10)

Country Link
US (1) US20090279300A1 (es)
EP (1) EP2023414A4 (es)
JP (1) JPWO2007139195A1 (es)
KR (1) KR20090014153A (es)
CN (1) CN101454909B (es)
CA (1) CA2653867A1 (es)
MX (1) MX2008015288A (es)
SG (1) SG185848A1 (es)
TW (1) TWI418062B (es)
WO (1) WO2007139195A1 (es)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100027261A1 (en) * 2007-01-30 2010-02-04 Denki Kagaku Kogyo Kabushiki Kaisha Led light source unit
US7625104B2 (en) * 2007-12-13 2009-12-01 Philips Lumileds Lighting Company, Llc Light emitting diode for mounting to a heat sink
CN102943966B (zh) * 2007-12-13 2015-02-11 皇家飞利浦电子股份有限公司 用于安装到散热器的发光二极管
JP2011043525A (ja) * 2007-12-14 2011-03-03 Denki Kagaku Kogyo Kk 複合反射シート
JP2009206506A (ja) * 2008-01-31 2009-09-10 Sanyo Electric Co Ltd 素子搭載用基板およびその製造方法、半導体モジュールおよびこれを搭載した携帯機器
JP2009272363A (ja) * 2008-05-01 2009-11-19 Rohm Co Ltd Ledランプ
JP2009302127A (ja) * 2008-06-10 2009-12-24 Dainippon Printing Co Ltd Led用基板、led実装モジュール、およびled用基板の製造方法
JP5553977B2 (ja) * 2008-08-22 2014-07-23 株式会社アイ・ライティング・システム Led照明器具
KR20100092152A (ko) * 2009-02-12 2010-08-20 엘지이노텍 주식회사 백라이트 유닛
CN201407526Y (zh) * 2009-05-10 2010-02-17 柯建锋 Led直型灯管
US8530990B2 (en) 2009-07-20 2013-09-10 Sunpower Corporation Optoelectronic device with heat spreader unit
DE102009041853A1 (de) 2009-09-18 2011-03-24 A. Kayser Automotive Systems Gmbh Ventilbaugruppe
JP5582633B2 (ja) * 2009-11-06 2014-09-03 パナソニック株式会社 Led照明装置
US8829771B2 (en) 2009-11-09 2014-09-09 Lg Innotek Co., Ltd. Lighting device
US8115369B2 (en) * 2009-11-09 2012-02-14 Lg Innotek Co., Ltd. Lighting device
US8304644B2 (en) 2009-11-20 2012-11-06 Sunpower Corporation Device and method for solar power generation
US8809671B2 (en) 2009-12-08 2014-08-19 Sunpower Corporation Optoelectronic device with bypass diode
US20130016494A1 (en) * 2010-01-11 2013-01-17 Ingo Speier Package for light emitting and receiving devices
EP2346100B1 (en) * 2010-01-15 2019-05-22 LG Innotek Co., Ltd. Light emitting apparatus and lighting system
US8592844B2 (en) * 2010-01-29 2013-11-26 Nitto Denko Corporation Light-emitting diode device
JP5629135B2 (ja) * 2010-06-15 2014-11-19 住友電気工業株式会社 フレキシブル基板モジュール
US9911882B2 (en) 2010-06-24 2018-03-06 Sunpower Corporation Passive flow accelerator
US8604404B1 (en) 2010-07-01 2013-12-10 Sunpower Corporation Thermal tracking for solar systems
DE102010026344A1 (de) * 2010-07-07 2012-01-12 Osram Opto Semiconductors Gmbh Leuchtdiode
US8336539B2 (en) 2010-08-03 2012-12-25 Sunpower Corporation Opposing row linear concentrator architecture
US9897346B2 (en) 2010-08-03 2018-02-20 Sunpower Corporation Opposing row linear concentrator architecture
US8563849B2 (en) 2010-08-03 2013-10-22 Sunpower Corporation Diode and heat spreader for solar module
KR101735571B1 (ko) 2010-08-20 2017-05-16 삼성전자주식회사 방열 재료, 상기 방열 재료로 만들어진 접합부를 포함하는 발광 다이오드 패키지
EP2613426A4 (en) * 2010-09-02 2017-10-11 Sumitomo Bakelite Co., Ltd. Fixing resin composition for use in rotor
US9246037B2 (en) 2010-12-03 2016-01-26 Sunpower Corporation Folded fin heat sink
US8839784B2 (en) 2010-12-22 2014-09-23 Sunpower Corporation Locating connectors and methods for mounting solar hardware
US8893713B2 (en) 2010-12-22 2014-11-25 Sunpower Corporation Locating connectors and methods for mounting solar hardware
US9038421B2 (en) 2011-07-01 2015-05-26 Sunpower Corporation Glass-bending apparatus and method
US8796535B2 (en) 2011-09-30 2014-08-05 Sunpower Corporation Thermal tracking for solar systems
US9035168B2 (en) 2011-12-21 2015-05-19 Sunpower Corporation Support for solar energy collectors
US8528366B2 (en) 2011-12-22 2013-09-10 Sunpower Corporation Heat-regulating glass bending apparatus and method
US9397611B2 (en) 2012-03-27 2016-07-19 Sunpower Corporation Photovoltaic systems with local maximum power point tracking prevention and methods for operating same
US8636198B1 (en) 2012-09-28 2014-01-28 Sunpower Corporation Methods and structures for forming and improving solder joint thickness and planarity control features for solar cells
KR20140086474A (ko) * 2012-12-28 2014-07-08 삼성전기주식회사 열전도성 필름 및 회로 기판 모듈
FR3001357B1 (fr) * 2013-01-22 2015-02-06 Sylumis Support de fixation mecanique et de raccordement electrique de diodes electroluminescentes
CN103196057A (zh) * 2013-03-18 2013-07-10 林智勇 大功率液体散热led灯
KR20150002361A (ko) 2013-06-28 2015-01-07 삼성전자주식회사 반도체 발광소자 장치 및 광원 모듈의 제조 방법
JP2013229639A (ja) * 2013-08-13 2013-11-07 Nec Lighting Ltd 発光装置及び発光装置の製造方法
CN103629621B (zh) * 2013-11-21 2018-08-07 董绍品 一种自发光景观灯及其制造方法
JP2016018896A (ja) * 2014-07-08 2016-02-01 大日本印刷株式会社 実装基板および実装基板の製造方法
CN104763902B (zh) * 2015-04-03 2017-07-11 贵州索立得光电科技有限公司 一种高可靠性的led光源模组及其制造方法
CN105111954A (zh) * 2015-09-23 2015-12-02 苏州华周胶带有限公司 一种led发光胶带
JP2018173279A (ja) * 2017-03-31 2018-11-08 株式会社島津製作所 ガスクロマトグラフ

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6043891A (en) * 1983-08-19 1985-03-08 Matsushita Electric Ind Co Ltd High thermal conductivity metal base printed board
SE449693B (sv) * 1985-10-03 1987-05-18 Moelnlycke Ab Absorberande langstreckt alster sasom en bloja eller ett inkontinensskydd
JPS62271442A (en) 1987-04-02 1987-11-25 Denki Kagaku Kogyo Kk Hybrid integrated circuit
JPH01105971U (es) * 1987-12-29 1989-07-17
JPH02172771A (en) * 1988-12-27 1990-07-04 Mitsubishi Electric Corp Manufacture of led array head substrate
JPH06350212A (ja) 1993-06-11 1994-12-22 Denki Kagaku Kogyo Kk 金属ベース回路基板とその製造方法
JPH08202289A (ja) * 1995-01-31 1996-08-09 Mitsubishi Cable Ind Ltd 多色ディスプレイ装置
JP3358694B2 (ja) * 1995-10-16 2002-12-24 電気化学工業株式会社 金属ベース多層回路基板
JPH09199880A (ja) * 1996-01-16 1997-07-31 Denki Kagaku Kogyo Kk 放熱シート
JP3882266B2 (ja) * 1997-05-19 2007-02-14 日亜化学工業株式会社 半導体装置
US6432497B2 (en) * 1997-07-28 2002-08-13 Parker-Hannifin Corporation Double-side thermally conductive adhesive tape for plastic-packaged electronic components
JP4101391B2 (ja) * 1999-03-31 2008-06-18 株式会社東芝 電子部品の放熱部材
JP2001111235A (ja) * 1999-10-13 2001-04-20 Mitsubishi Gas Chem Co Inc フリップチップ搭載用高密度多層プリント配線板の製造方法
JP2001160664A (ja) * 1999-12-01 2001-06-12 Denki Kagaku Kogyo Kk 金属ベース回路基板及びその製造方法
CN1901177B (zh) * 2000-09-25 2010-05-12 揖斐电株式会社 半导体元件及其制造方法、多层印刷布线板及其制造方法
CN1549962A (zh) * 2001-08-30 2004-11-24 日本写真印刷株式会社 可再剥离透明触摸板安装结构及其中所用的安装用片
CN1241157C (zh) * 2002-09-20 2006-02-08 新知科技股份有限公司 具有高散热性的发光二极管显示模组
US6999318B2 (en) * 2003-07-28 2006-02-14 Honeywell International Inc. Heatsinking electronic devices
WO2005066252A2 (en) * 2004-01-08 2005-07-21 Showa Denko K.K. Inorganic powder, resin composition filled with the powder and use thereof
JP2005306718A (ja) * 2004-01-08 2005-11-04 Showa Denko Kk 無機質粉体、およびこれを充填した樹脂組成物とその用途
JP4298559B2 (ja) * 2004-03-29 2009-07-22 新光電気工業株式会社 電子部品実装構造及びその製造方法
JP2005283852A (ja) 2004-03-29 2005-10-13 Kyocera Corp 液晶表示装置
JP4226511B2 (ja) 2004-03-31 2009-02-18 シャープ株式会社 照明装置および液晶表示装置
JP2006150810A (ja) 2004-11-30 2006-06-15 Canon Inc 画像処理方法、装置およびプログラム
JP4672425B2 (ja) * 2005-04-19 2011-04-20 電気化学工業株式会社 金属ベース回路基板およびその製法ならびにそれを用いた混成集積回路
JP4718257B2 (ja) 2005-07-06 2011-07-06 株式会社エヌ・ティ・ティ・ドコモ 分散認証アクセス制御システム
JP4582144B2 (ja) * 2005-07-22 2010-11-17 三菱電機株式会社 熱伝導シートおよびその製造方法、並びに熱伝導シートを用いたパワーモジュール

Also Published As

Publication number Publication date
SG185848A1 (en) 2012-12-28
JPWO2007139195A1 (ja) 2009-10-15
TW200814373A (en) 2008-03-16
US20090279300A1 (en) 2009-11-12
KR20090014153A (ko) 2009-02-06
CN101454909B (zh) 2012-05-23
CA2653867A1 (en) 2007-12-06
CN101454909A (zh) 2009-06-10
WO2007139195A1 (ja) 2007-12-06
EP2023414A4 (en) 2010-02-17
TWI418062B (zh) 2013-12-01
EP2023414A1 (en) 2009-02-11

Similar Documents

Publication Publication Date Title
US10460634B2 (en) LED light assembly with transparent substrate having array of lenses for projecting light to illuminate an area
US8525193B2 (en) Layered structure for use with high power light emitting diode systems
US9423106B2 (en) Lighting system with thermal management system having point contact synthetic jets
US9291316B2 (en) Integrated linear light engine
AU2012238294B2 (en) Edge-lit luminaire
CN102797984B (zh) 灯管
US8304993B2 (en) Separate LED lamp tube and light source module formed therefrom
US8066406B2 (en) Optic positioning device
US7611260B1 (en) Protecting cover and LED lamp tube having the same
US7236366B2 (en) High brightness LED apparatus with an integrated heat sink
US8256926B2 (en) Illumination device
US7455430B2 (en) Lighting device with a multiple layer cooling structure
CA2682389C (en) Lighting assembly having a heat dissipating housing
US9151453B2 (en) Magnetically-mountable lighting device and associated systems and methods
US20100165632A1 (en) Heat dissipation device and luminaire comprising the same
US7755901B2 (en) Heat dissipating structure for light emitting diodes
JP5885985B2 (ja) 照明装置
JP3965419B1 (ja) 照明装置
US20110025211A1 (en) Light emitting diode lighting device
FI116116B (fi) Hybridivalaisin
CH698769A2 (de) Montageanordnung eines Leuchtkörpers.
RU2009144533A (ru) Твердотельное устройство освещения
TW200623472A (en) Semiconductor light emitting device, lighting module, illumination apparatus, surface mount LED, and bullet LED
WO2010053528A3 (en) Light emitting diode emergency lighting module
TW201124671A (en) Lighting device

Legal Events

Date Code Title Description
FG Grant or registration