MX165273B - Un metodo de fabricacion para formar una ventana de contacto de alineamiento automatico y su conexion en una capa epitaxial y las estructuras del dispositivo que emplean el metodo - Google Patents
Un metodo de fabricacion para formar una ventana de contacto de alineamiento automatico y su conexion en una capa epitaxial y las estructuras del dispositivo que emplean el metodoInfo
- Publication number
- MX165273B MX165273B MX008675A MX867587A MX165273B MX 165273 B MX165273 B MX 165273B MX 008675 A MX008675 A MX 008675A MX 867587 A MX867587 A MX 867587A MX 165273 B MX165273 B MX 165273B
- Authority
- MX
- Mexico
- Prior art keywords
- epitaxial layer
- contact window
- connection
- device structures
- self
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
- H01L21/743—Making of internal connections, substrate contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/763—Polycrystalline semiconductor regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/37—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate
- H10B12/373—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate the capacitor extending under or around the transistor
Abstract
La presente invención se refiere a un método de fabricación para formar una capa de material epitaxial sobre un substrato monocristalina y sobre una región de una capa aislante para producir una ventana de contacto de alineamiento propio a través de la región del material aislante, el cual comprende los pasos de: A. dejar crecer una capa del material aislante sobre una región predeterminada de la superficie de un substrato monocristalino, B. dejar crecer una capa de material epitaxial sobre el substrato monocristalino y lateralmente sobre la región del material aislante en una dirección de crecimiento hacia el centro de la región aislante, C. detener el crecimiento de la capa de material epitaxial cuando una región expuesta del área deseada permanece en el centro de la región del material aislante, por lo cual los lados de la capa del material epitaxial que rodean la región expuesta del área de material aislante constituyen una ventana para el material aislante expuesto, y D. utilizar la ventana de la capa epitaxial como una máscara de cauterización para quitar así la región expuesta de material aislante a fin de producir una abertura en la región expuesta del material aislante que queda alineada con la ventana de la capa epitaxial.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/915,310 US4728623A (en) | 1986-10-03 | 1986-10-03 | Fabrication method for forming a self-aligned contact window and connection in an epitaxial layer and device structures employing the method |
Publications (1)
Publication Number | Publication Date |
---|---|
MX165273B true MX165273B (es) | 1992-11-04 |
Family
ID=25435545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX008675A MX165273B (es) | 1986-10-03 | 1987-10-02 | Un metodo de fabricacion para formar una ventana de contacto de alineamiento automatico y su conexion en una capa epitaxial y las estructuras del dispositivo que emplean el metodo |
Country Status (9)
Country | Link |
---|---|
US (1) | US4728623A (es) |
EP (1) | EP0262294B1 (es) |
JP (1) | JPS63127564A (es) |
AT (1) | ATE73962T1 (es) |
AU (1) | AU594200B2 (es) |
CA (1) | CA1244559A (es) |
DE (1) | DE3777514D1 (es) |
ES (1) | ES2031083T3 (es) |
MX (1) | MX165273B (es) |
Families Citing this family (68)
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US4918502A (en) * | 1986-11-28 | 1990-04-17 | Hitachi, Ltd. | Semiconductor memory having trench capacitor formed with sheath electrode |
DE3752286T2 (de) * | 1986-12-22 | 2000-01-13 | Texas Instruments Inc | In einem tiefen Graben formierte Isolation mit Kontakt an der Oberfläche des Substrates |
US4980747A (en) * | 1986-12-22 | 1990-12-25 | Texas Instruments Inc. | Deep trench isolation with surface contact to substrate |
JPH0795568B2 (ja) * | 1987-04-27 | 1995-10-11 | 日本電気株式会社 | 半導体記憶装置 |
JPH0810757B2 (ja) * | 1987-05-25 | 1996-01-31 | 松下電子工業株式会社 | 半導体装置の製造方法 |
US4833516A (en) * | 1987-08-03 | 1989-05-23 | International Business Machines Corporation | High density memory cell structure having a vertical trench transistor self-aligned with a vertical trench capacitor and fabrication methods therefor |
US5046043A (en) * | 1987-10-08 | 1991-09-03 | National Semiconductor Corporation | Ferroelectric capacitor and memory cell including barrier and isolation layers |
US4942554A (en) * | 1987-11-26 | 1990-07-17 | Siemens Aktiengesellschaft | Three-dimensional, one-transistor cell arrangement for dynamic semiconductor memories comprising trench capacitor and method for manufacturing same |
US5100823A (en) * | 1988-02-29 | 1992-03-31 | Motorola, Inc. | Method of making buried stacked transistor-capacitor |
US5200354A (en) * | 1988-07-22 | 1993-04-06 | Hyundai Electronics Industries Co. Ltd. | Method for manufacturing dynamic random access memory cell |
KR910007181B1 (ko) * | 1988-09-22 | 1991-09-19 | 현대전자산업 주식회사 | Sdtas구조로 이루어진 dram셀 및 그 제조방법 |
JPH02135776A (ja) * | 1988-11-17 | 1990-05-24 | Hitachi Ltd | 半導体記憶装置 |
US4962365A (en) * | 1989-03-30 | 1990-10-09 | Texas Instruments Incorporated | Integrated circuit trench resistor |
US4954854A (en) * | 1989-05-22 | 1990-09-04 | International Business Machines Corporation | Cross-point lightly-doped drain-source trench transistor and fabrication process therefor |
US5021355A (en) * | 1989-05-22 | 1991-06-04 | International Business Machines Corporation | Method of fabricating cross-point lightly-doped drain-source trench transistor |
JPH0834298B2 (ja) * | 1989-06-19 | 1996-03-29 | シャープ株式会社 | 半導体装置及び半導体装置の製造方法 |
US5316962A (en) * | 1989-08-15 | 1994-05-31 | Matsushita Electric Industrial Co., Ltd. | Method of producing a semiconductor device having trench capacitors and vertical switching transistors |
US5034787A (en) * | 1990-06-28 | 1991-07-23 | International Business Machines Corporation | Structure and fabrication method for a double trench memory cell device |
US5064777A (en) * | 1990-06-28 | 1991-11-12 | International Business Machines Corporation | Fabrication method for a double trench memory cell device |
US4988637A (en) * | 1990-06-29 | 1991-01-29 | International Business Machines Corp. | Method for fabricating a mesa transistor-trench capacitor memory cell structure |
US5204281A (en) * | 1990-09-04 | 1993-04-20 | Motorola, Inc. | Method of making dynamic random access memory cell having a trench capacitor |
US5198995A (en) * | 1990-10-30 | 1993-03-30 | International Business Machines Corporation | Trench-capacitor-one-transistor storage cell and array for dynamic random access memories |
US5055898A (en) * | 1991-04-30 | 1991-10-08 | International Business Machines Corporation | DRAM memory cell having a horizontal SOI transfer device disposed over a buried storage node and fabrication methods therefor |
US5214603A (en) * | 1991-08-05 | 1993-05-25 | International Business Machines Corporation | Folded bitline, ultra-high density dynamic random access memory having access transistors stacked above trench storage capacitors |
JPH05211239A (ja) * | 1991-09-12 | 1993-08-20 | Texas Instr Inc <Ti> | 集積回路相互接続構造とそれを形成する方法 |
US5264716A (en) * | 1992-01-09 | 1993-11-23 | International Business Machines Corporation | Diffused buried plate trench dram cell array |
US5399516A (en) * | 1992-03-12 | 1995-03-21 | International Business Machines Corporation | Method of making shadow RAM cell having a shallow trench EEPROM |
US5314837A (en) * | 1992-06-08 | 1994-05-24 | Analog Devices, Incorporated | Method of making a registration mark on a semiconductor |
CA2074848C (en) * | 1992-07-29 | 1998-02-10 | Joseph P. Ellul | Method of forming electrodes for trench capacitors |
US5365097A (en) * | 1992-10-05 | 1994-11-15 | International Business Machines Corporation | Vertical epitaxial SOI transistor, memory cell and fabrication methods |
JPH06252153A (ja) * | 1993-03-01 | 1994-09-09 | Toshiba Corp | 半導体装置の製造方法 |
JP2791260B2 (ja) * | 1993-03-01 | 1998-08-27 | 株式会社東芝 | 半導体装置の製造方法 |
US5641694A (en) * | 1994-12-22 | 1997-06-24 | International Business Machines Corporation | Method of fabricating vertical epitaxial SOI transistor |
US5677219A (en) * | 1994-12-29 | 1997-10-14 | Siemens Aktiengesellschaft | Process for fabricating a DRAM trench capacitor |
US6207494B1 (en) * | 1994-12-29 | 2001-03-27 | Infineon Technologies Corporation | Isolation collar nitride liner for DRAM process improvement |
US5851923A (en) * | 1996-01-18 | 1998-12-22 | Micron Technology, Inc. | Integrated circuit and method for forming and integrated circuit |
US6103627A (en) * | 1996-02-21 | 2000-08-15 | Micron Technology, Inc. | Treatment of a surface having an exposed silicon/silica interface |
US5792685A (en) * | 1996-02-22 | 1998-08-11 | Siemens Aktiengesellschaft | Three-dimensional device layout having a trench capacitor |
US5793075A (en) * | 1996-07-30 | 1998-08-11 | International Business Machines Corporation | Deep trench cell capacitor with inverting counter electrode |
US5843820A (en) * | 1997-09-29 | 1998-12-01 | Vanguard International Semiconductor Corporation | Method of fabricating a new dynamic random access memory (DRAM) cell having a buried horizontal trench capacitor |
JPH11186514A (ja) * | 1997-12-22 | 1999-07-09 | Toshiba Corp | 半導体記憶装置及びその製造方法 |
KR100347544B1 (ko) | 1999-02-13 | 2002-08-07 | 주식회사 하이닉스반도체 | 반도체 소자의 접합 제조 방법 |
US6140175A (en) * | 1999-03-03 | 2000-10-31 | International Business Machines Corporation | Self-aligned deep trench DRAM array device |
KR100314276B1 (ko) | 1999-04-12 | 2001-11-15 | 박종섭 | 반도체 소자의 제조방법 |
KR100353526B1 (ko) | 1999-06-18 | 2002-09-19 | 주식회사 하이닉스반도체 | 반도체 소자의 제조방법 |
KR100345681B1 (ko) | 1999-06-24 | 2002-07-27 | 주식회사 하이닉스반도체 | 반도체소자의 삼중웰 형성방법 |
KR100332119B1 (ko) | 1999-06-28 | 2002-04-10 | 박종섭 | 반도체 소자 제조 방법 |
KR100332108B1 (ko) | 1999-06-29 | 2002-04-10 | 박종섭 | 반도체 소자의 트랜지스터 및 그 제조 방법 |
KR100332107B1 (ko) | 1999-06-29 | 2002-04-10 | 박종섭 | 반도체 소자의 트랜지스터 제조 방법 |
KR100301246B1 (ko) | 1999-06-30 | 2001-11-01 | 박종섭 | 반도체 소자의 제조 방법 |
US6320215B1 (en) * | 1999-07-22 | 2001-11-20 | International Business Machines Corporation | Crystal-axis-aligned vertical side wall device |
DE19941148B4 (de) | 1999-08-30 | 2006-08-10 | Infineon Technologies Ag | Speicher mit Grabenkondensator und Auswahltransistor und Verfahren zu seiner Herstellung |
KR20010061029A (ko) | 1999-12-28 | 2001-07-07 | 박종섭 | 엘리베이티드 소오스/드레인 구조의 모스 트랜지스터형성방법 |
KR100510996B1 (ko) | 1999-12-30 | 2005-08-31 | 주식회사 하이닉스반도체 | 선택적 에피텍셜 성장 공정의 최적화 방법 |
KR100327596B1 (ko) | 1999-12-31 | 2002-03-15 | 박종섭 | Seg 공정을 이용한 반도체소자의 콘택 플러그 제조방법 |
FR2819632B1 (fr) * | 2001-01-12 | 2003-09-26 | St Microelectronics Sa | Circuit integre comportant un dispositif analogique de stockage de charges, et procede de fabrication |
US6998305B2 (en) * | 2003-01-24 | 2006-02-14 | Asm America, Inc. | Enhanced selectivity for epitaxial deposition |
US7633110B2 (en) * | 2004-09-21 | 2009-12-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Memory cell |
US7402487B2 (en) * | 2004-10-18 | 2008-07-22 | Infineon Technologies Richmond, Lp | Process for fabricating a semiconductor device having deep trench structures |
US8278176B2 (en) | 2006-06-07 | 2012-10-02 | Asm America, Inc. | Selective epitaxial formation of semiconductor films |
US20080310220A1 (en) * | 2007-06-13 | 2008-12-18 | International Business Machines Corporation | 3-d sram array to improve stability and performance |
US7755926B2 (en) * | 2007-06-13 | 2010-07-13 | International Business Machines Corporation | 3-D SRAM array to improve stability and performance |
US7759199B2 (en) * | 2007-09-19 | 2010-07-20 | Asm America, Inc. | Stressor for engineered strain on channel |
US8367528B2 (en) * | 2009-11-17 | 2013-02-05 | Asm America, Inc. | Cyclical epitaxial deposition and etch |
US8809170B2 (en) | 2011-05-19 | 2014-08-19 | Asm America Inc. | High throughput cyclical epitaxial deposition and etch process |
US9852902B2 (en) | 2014-10-03 | 2017-12-26 | Applied Materials, Inc. | Material deposition for high aspect ratio structures |
US9401410B2 (en) * | 2014-11-26 | 2016-07-26 | Texas Instruments Incorporated | Poly sandwich for deep trench fill |
CN113130510B (zh) * | 2019-11-22 | 2023-06-13 | 长江存储科技有限责任公司 | 存储器件以及其混合间隔物 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5539677A (en) * | 1978-09-14 | 1980-03-19 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Semiconductor device and its manufacturing |
JPS5681968A (en) * | 1979-12-07 | 1981-07-04 | Toshiba Corp | Manufacture of semiconductor device |
US4353086A (en) * | 1980-05-07 | 1982-10-05 | Bell Telephone Laboratories, Incorporated | Silicon integrated circuits |
US4462847A (en) * | 1982-06-21 | 1984-07-31 | Texas Instruments Incorporated | Fabrication of dielectrically isolated microelectronic semiconductor circuits utilizing selective growth by low pressure vapor deposition |
US4522661A (en) * | 1983-06-24 | 1985-06-11 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Low defect, high purity crystalline layers grown by selective deposition |
US4578142A (en) * | 1984-05-10 | 1986-03-25 | Rca Corporation | Method for growing monocrystalline silicon through mask layer |
DE3572422D1 (en) * | 1984-06-14 | 1989-09-21 | Ibm | Dynamic ram cell |
US4649625A (en) * | 1985-10-21 | 1987-03-17 | International Business Machines Corporation | Dynamic memory device having a single-crystal transistor on a trench capacitor structure and a fabrication method therefor |
-
1986
- 1986-10-03 US US06/915,310 patent/US4728623A/en not_active Expired - Fee Related
-
1987
- 1987-05-05 ES ES198787106472T patent/ES2031083T3/es not_active Expired - Lifetime
- 1987-05-05 DE DE8787106472T patent/DE3777514D1/de not_active Expired - Fee Related
- 1987-05-05 AT AT87106472T patent/ATE73962T1/de not_active IP Right Cessation
- 1987-05-05 EP EP87106472A patent/EP0262294B1/en not_active Expired - Lifetime
- 1987-07-20 JP JP62179280A patent/JPS63127564A/ja active Granted
- 1987-09-24 CA CA000547694A patent/CA1244559A/en not_active Expired
- 1987-10-01 AU AU79268/87A patent/AU594200B2/en not_active Ceased
- 1987-10-02 MX MX008675A patent/MX165273B/es unknown
Also Published As
Publication number | Publication date |
---|---|
EP0262294B1 (en) | 1992-03-18 |
AU594200B2 (en) | 1990-03-01 |
JPH0371787B2 (es) | 1991-11-14 |
DE3777514D1 (de) | 1992-04-23 |
AU7926887A (en) | 1988-04-14 |
JPS63127564A (ja) | 1988-05-31 |
CA1244559A (en) | 1988-11-08 |
EP0262294A1 (en) | 1988-04-06 |
ATE73962T1 (de) | 1992-04-15 |
US4728623A (en) | 1988-03-01 |
ES2031083T3 (es) | 1992-12-01 |
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