KR970012986A - 기판처리장치 - Google Patents
기판처리장치 Download PDFInfo
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- KR970012986A KR970012986A KR1019960032496A KR19960032496A KR970012986A KR 970012986 A KR970012986 A KR 970012986A KR 1019960032496 A KR1019960032496 A KR 1019960032496A KR 19960032496 A KR19960032496 A KR 19960032496A KR 970012986 A KR970012986 A KR 970012986A
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Abstract
본 발명은 승강기등에 의해 장치내를 오염되는 것을 방지할 수 있는 기판처리장치를 제공하는 것을 목적으로 하며, 웨이퍼 반송실(50)의 벽(53)에 다수의 반응실 (70)을 적층하여 설치한다. 웨이퍼 반송실(50)의 벽(54)에 웨이퍼 수용실(30)을 설치한다. 카셋(10)을 지지하는 카셋선반(11)을 설치한다. 웨이퍼 반송실(50)을 진공이 형성할 수 있도록, 그내부에는 웨이퍼 반송 진공 로보트(60)를 설치한다. 웨이퍼 반송실(50)의 저면(56)에 관통구멍(57)을 설치한다. 웨이퍼 반송실(50)의 외부의 하측에는 볼 나사(나사축561), 너트(565)를 설치한다. 저트(565)에 승강대(564)를 고정하고, 승강대(564)에 웨이퍼 반송 진공 로보트 지지봉(563)의 일단부를 고정하고, 그 타단부는 웨이퍼 반송 진공 로보트(60)에 고정한다. 벨로우즈(562)의 양단부를 기밀하게 고정한다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도2는 도1의 XX선 단면도이다
Claims (26)
- 감압가능한 기판반송실과, 상기 기판반송실의 제1측벽에 수직방향으로 적층되어 형성된 다수의 기판처리실과, 상기 다수의 기판처리실과 상기 기판반송실과의 사이에 각각 설치되며, 닫힌 경우에는 상기 기판처리실과 상기 기판반송실과의 사이를 진공적으로 기밀하게 할 수 있고, 열린 경우에는 기판이 그 내부를 통하여 이동가능한 다수의 제1밸브와, 상기 기판반송실의 제2측벽에 형성된 기판수용실과, 상기 기판반송실내에 설치되며, 상기 기판처리실과 상기 기판수용실과의 사이에서 상기 기판을 감압하에서 반송 가능한 기판반송기와, 상기 기판 반송실의 외부에 설치되며, 고정부와 상기 고정부에 대해 승강 가능한 승강부를 가지는 승강수단과, 상기 기판 반송실의 소정면에 형성된 관통구멍내를 이동가능한 강체이며, 상기 승강부와 상기 기판반송기를 상기 관통구멍을 통하여 기계적으로 접속하는 접속부재와, 상기 소정면과 상기 소정면에 형성된 상기 관통구멍을 관통하는 상기 접속부재와의 사이를 진공적으로 기밀하게 유지하는 기밀부재를 구비하는 것을 특징으로 하는 기판처리장치.
- 제1항에 있어서, 상기 기판반송기가 상기 기판을 실질적으로 수평방향을 반송가능한 기판반송기인 것을 특징으로 하는 기판처리장치.
- 제1항 또는 제2항에 있어서, 상기 기밀부재가 탄성체로 구성되어 있고, 상기 접속부재가 상기 기밀부재에 의해 피복되어 있고, 상기 접속부재가 상기 기밀부재내를 이동가능하고, 상기 기밀부재의 일단부가 상기 소정면과 진공적으로 기밀하게 접속되어 있고, 상기 기밀부재의 타단부가 상기 접속부재와 진공적으로 기밀하게 접속되어 있는 것을 특징으로 하는 기판처리장치.
- 제3항에 있어서, 상기 기밀부재가 벨로우즈인 것을 특징으로 하는 기판처리장치.
- 청구항1 내지 청구항4항의 어느 한항에 있어서, 상기 고정부가 나사축이고, 상기 승강부는 너트를 구비하고, 사기 나사축과 상기 너트에 의해 볼 나사를 구성하고 있는 것을 특징으로 하는 기판처리장치.
- 제5항에 있어서, 상기 기판반송실의 소정면에 상기 기판반송실의 저면이고, 상기 볼 나사가 상기 기판방송실의 하측에 설치되어 있는 것을 특징으로 하는 기판처리장치.
- 제5항에 있어서, 상기 기판반송실의 상기 소정면이 상기 기판반송실의 상부면이고, 상기 볼 나사가 상기 기판반송실의 상측에 설치되어 있는 것을 특징으로 하는 기판처리장치.
- 제1항 내지 제7항의 어느 한 항에 있어서, 상기 기판반송기가 구동부와 상기 구동부에 의해 실질적으로 수평방향으로 이동가능한 기판반송부와 진공적으로 기밀성의 구동부 수용 용기를 구비하고 있고, 상기 구동부가 상기 구동부 수용 용기내에 수용되어 있는 것을 특징으로 하는 기판처리장치.
- 제8항에 있어서, 상기 강체의 접속부재의 일단부와 상기 구동부 수용 용기의 상기 기판반송부측의 단부근방이 접속되어 있는 것을 특징으로 하는 기판처리장치.
- 제8항 또는 제9항에 있어서, 상기 기판반송실의 상기 소정면이 상기 기판반송실의 저면 및 상부면의 어느 한족이고, 상기 기판반송실의 상기 소정면이 상기 기판반송실의 저면인 경우에는 상기 저면에 상기 구동부 수용 용기의 외형에 맞춘 볼록부를 형성하고, 상기 기판반송실의 상기 소정면이 상기 기판반송실의 상부면인 경우에는 상기 상면부에 상기 구동부 수용 용기의 외형에 맞춘 볼록부를 형성하고, 상기 볼록부내에 상기 구동부 수용 용기를 수용 가능하게 한 것을 특징으로 하는 기판처리장치.
- 제10항에 있어서, 상기 기판반송실의 상기 소정면이 상기 기판반송실의 저면인 것을 특징으로 하는 기판처리장치.
- 청구항 1 내지 청구항 11항의 어느 한 항에 있어서, 상기 기판수용실과 상기 기판반송실과의 사이에는 닫힌 경우에 상기 기판반송실과 상기 기판반송실과의 사이를 진공적으로 기밀하게 할 수 있고, 열린 경우에는 상기 기판이 그 내부를 통하여 이동 가능한 제2밸브가 설치되어 있고, 상기 기판 수용실이 상기 기판반송실과 독립하여 감압 가능한 것을 특징으로 하는 기판처리장치.
- 제12항에 있어서, 상기 기판수용실의 상기 기판반송실이 설치된 쪽과는 다른 쪽에 배치된 대기압부와, 상기 기판수용실과 상기 대기압부와의 사이에 설치되며 닫힌 경우에는 상기 기판 수용실과 상기 대기압부와의 사이를 진공적으로 기밀하게 할 수 있고, 열린 경우에는 상기 기판이 그 내부를 통하여 이동 가능한 제3밸브를 추가로 구비하는 것을 특징으로 하는 기판처리장치.
- 제1내지 제11항의 어느 한 항에 있어서, 상기 기판반송실의 상기 제2 측벽에 다수의 기판수용실의 수직방향으로 적층되어 설치되어 있고, 상기 다수의 기판수용실과 상기 기판반송실과의 사이가 닫힌 경우에는 상기 다수의 기판수용실과 상기 기판반송실과 사이를 각각 진공적으로 기밀하게 할 수 있고, 열린 경우에는 상기 기판이 그 내부를 통하여 이동 가능한 다수의 제4밸브가 각각 설치되어 있고, 상기 다수의 기판수용실의 각각이 다른 기판수용실과 독립해서 감압 가능하고, 상기 다수의 기판 수용실의 각각과 상기 기판반송실이 상호 독립해서 감압 가능한 것을 특징으로 하는 기판처리장치.
- 제1항 내지 제14항에 있어서, 상기 기판수용실의 상기 기판반송실이 형성된 쪽과는 다른쪽에 배치된 대기압부와, 상기 대기압부에 설치된 카셋 지지수단과, 상기 대기압부에 설치되며, 상기 카셋 지지수단에 지지되는 카셋과 상기 기판수용부와의 사이에서 상기 기판을 반송가능한 기판반송수단을 추가로 구비하는 것을 특징으로 하는 기판처리장치.
- 제15항에 있어서, 상기 기판처리실과, 상기 기판반송실과, 상기 기판수용실과, 상기 기판반송수단과 상기 카셋 지지수단을 수용하는 하우징를 추가로 구비하는 것을 특징으로 하는 기판처리장치.
- 제10항 또는 제11항에 있어서, 적어도 상기 기판반송실과 상기 다수의 기판처리실과 상기 기판수용실을 수용하는 하우징를 추가로 구비하고, 상기 기판반송실의 상기 볼록부, 상기 승강수단 및 상기 접속부재의 적어도 일부가 상기 하우징으로부터 돌출하여 설치된 것을 특징으로 하는 기판처리장치.
- 제1항 내지 제17항의 어느 한 항에 있어서, 상기 기판수용실에 설치된 내열성의 제1 기판지지수단을 추가로 가지는 것을 특징으로 하는 기판처리장치.
- 제1항 내지 제18항의 어느 한 항에 있어서, 상기 기판을 지지하며 상기 기판수용실내에 설치된 제1 기판지지수단과, 상기 기판을 지지하며 상기 기판처리실내에 설치된 제2 기판지지수단을 추가로 구비하고, 상기 제2 기판지지수단이 다수매의 기판을 지지가능하고, 상기 제1 기판지지수단이 다수매의 기판을 지지가능하고, 상기 제1 기판지지수단에 지지되는 기판 사이의 피치가 상기 제2 기판지지수단에 의해 지지되는 기판 사이의 피치아 실질적으로 같은 것을 특징으로 하는 기판처리장치.
- 제15항 또는 제16항에 있어서, 상기 기판을 지지하도록 상기 기판 수용실내에 설치된 제1 기판지지수단과, 상기 기판을 지지하도록 상기 기판처리실내에 설치된 제2 기판지지수단을 추가로 구비하고, 상기 제2 기판지지수단이 다수매의 기판을 지지가능하고, 상기 제1 기판지지수단이 다수매의 기판을 지지가능하며, 상기 제1 기판지지수단에 지지되는 기판사이의 피치가 상기 제2 기판지지수단에 의해 지지되는 기판사이의 피치와 실질적으로 같고, 상기 기판 반송 수단이 다수매의 상기 기판을 동시에 반송 가능하고, 상기 다수매의 기판 사이의 피치가 가변인 것을 특징으로 하는 기판처리장치.
- 제19항 또는 제20항에 있어서, 상기 기판반송기가 감압하에서 다수매의 상기 기판을 동시에 반송가능한 것을 특징으로 하는 기판처리장치.
- 제18항 내지 제21항의 어느 한 항에 있어서, 상기 제1 기판지지수단이 상기 기판처리실의 각각에서 한번에 처리되는 상기 기판 매수의 적어도 2배 이상 매수의 기판을 지지가능한 것을 특징으로 하는 기판처리장치.
- 제19항 내지 제21항의 어느 한 항에 있어서, 상기 제1 기판지지수단이 상기 제2 기판지지수단보다도 적어도 2배 이상 매수의 기판을 지지가능한 것을 특징으로 하는 기판처리장치.
- 제1항 내지 제23항의 어느 한 항에 있어서, 상기 기판반송실의 상기 제1측벽과 상기 제2측벽이 상호 대향하고 있고, 상기 기판처리실과, 상기 기판방송실과, 상기 기판수용실이 실질적으로 일직선상에 배치되어 있는 것을 특징으로 하는 기판처리장치.
- 제24항에 있어서, 상기 기판반송실이 평면도적으로는 장방형상인 것을 특징으로 하는 기판처리장치.
- 제15항 또는 제16항에 있어서, 상기 카셋 지지수단이 상기 기판 수수실에 대해 상기 기판반송실과는 반대측에 배치되어 있는 것을 특징으로 하는 기판처리장치.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100310080B1 (ko) * | 1998-01-15 | 2001-12-17 | 문태수 | 기능성솜의제조방법 |
KR100487393B1 (ko) * | 1997-10-13 | 2005-06-16 | 도쿄 오카 고교 가부시키가이샤 | 처리장치구축체 |
Families Citing this family (192)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6296735B1 (en) * | 1993-05-03 | 2001-10-02 | Unaxis Balzers Aktiengesellschaft | Plasma treatment apparatus and method for operation same |
DE59611078D1 (de) | 1995-03-28 | 2004-10-14 | Brooks Automation Gmbh | Be- und Entladestation für Halbleiterbearbeitungsanlagen |
KR100244041B1 (ko) * | 1995-08-05 | 2000-02-01 | 엔도 마코토 | 기판처리장치 |
US6231297B1 (en) * | 1995-10-27 | 2001-05-15 | Brooks Automation, Inc. | Substrate transport apparatus with angled arms |
WO1997034742A1 (fr) * | 1996-03-18 | 1997-09-25 | Komatsu Ltd. | Dispositif de commande d'un systeme de transport de pieces |
US5961269A (en) * | 1996-11-18 | 1999-10-05 | Applied Materials, Inc. | Three chamber load lock apparatus |
US6540466B2 (en) * | 1996-12-11 | 2003-04-01 | Applied Materials, Inc. | Compact apparatus and method for storing and loading semiconductor wafer carriers |
EP0946780B1 (de) * | 1996-12-23 | 2002-01-16 | Unaxis Balzers Aktiengesellschaft | Vakuumbehandlungsanlage |
US5879459A (en) * | 1997-08-29 | 1999-03-09 | Genus, Inc. | Vertically-stacked process reactor and cluster tool system for atomic layer deposition |
US6073366A (en) * | 1997-07-11 | 2000-06-13 | Asm America, Inc. | Substrate cooling system and method |
US6034000A (en) * | 1997-07-28 | 2000-03-07 | Applied Materials, Inc. | Multiple loadlock system |
JPH11129184A (ja) | 1997-09-01 | 1999-05-18 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板搬入搬出装置 |
US6071055A (en) * | 1997-09-30 | 2000-06-06 | Applied Materials, Inc. | Front end vacuum processing environment |
JP3988805B2 (ja) * | 1997-10-02 | 2007-10-10 | 大日本スクリーン製造株式会社 | 基板搬送方法及びその装置 |
DE19748088A1 (de) * | 1997-10-30 | 1999-05-12 | Wacker Siltronic Halbleitermat | Verfahren und Vorrichtung zum Erkennen einer Fehllage einer Halbleiterscheibe |
US6139678A (en) * | 1997-11-20 | 2000-10-31 | Trusi Technologies, Llc | Plasma processing methods and apparatus |
US5931626A (en) * | 1998-01-16 | 1999-08-03 | Brooks Automation Inc. | Robot mounting de-coupling technique |
NL1008143C2 (nl) * | 1998-01-27 | 1999-07-28 | Asm Int | Stelsel voor het behandelen van wafers. |
US6000905A (en) * | 1998-03-13 | 1999-12-14 | Toro-Lira; Guillermo L. | High speed in-vacuum flat panel display handler |
KR100265287B1 (ko) | 1998-04-21 | 2000-10-02 | 윤종용 | 반도체소자 제조용 식각설비의 멀티챔버 시스템 |
US6079927A (en) * | 1998-04-22 | 2000-06-27 | Varian Semiconductor Equipment Associates, Inc. | Automated wafer buffer for use with wafer processing equipment |
IT1308606B1 (it) * | 1999-02-12 | 2002-01-08 | Lpe Spa | Dispositivo per maneggiare substrati mediante un istema autolivellante a depressione in reattori epistassiali ad induzione con suscettore |
JP2000299367A (ja) * | 1999-04-15 | 2000-10-24 | Tokyo Electron Ltd | 処理装置及び被処理体の搬送方法 |
US6350097B1 (en) * | 1999-04-19 | 2002-02-26 | Applied Materials, Inc. | Method and apparatus for processing wafers |
DE19921072A1 (de) | 1999-05-08 | 2000-11-09 | Acr Automation In Cleanroom | Einrichtung zum Handhaben von Substraten innerhalb und außerhalb eines Reinstarbeitsraumes |
JP2000332096A (ja) * | 1999-05-21 | 2000-11-30 | Bridgestone Corp | 製品ホルダー |
US6440261B1 (en) * | 1999-05-25 | 2002-08-27 | Applied Materials, Inc. | Dual buffer chamber cluster tool for semiconductor wafer processing |
US6486444B1 (en) * | 1999-06-03 | 2002-11-26 | Applied Materials, Inc. | Load-lock with external staging area |
JP2001031213A (ja) * | 1999-07-26 | 2001-02-06 | Murata Mach Ltd | 自動倉庫とそれを用いた搬送システム |
AU7124100A (en) | 1999-09-10 | 2001-04-10 | Unaxis Usa Inc. | Magnetic pole fabrication process and device |
KR100327801B1 (ko) * | 1999-09-14 | 2002-03-15 | 구자홍 | 광디스크 장치에서의 디스크 로딩 확인방법 |
US6547975B1 (en) | 1999-10-29 | 2003-04-15 | Unaxis Usa Inc. | Magnetic pole fabrication process and device |
US6568899B1 (en) * | 1999-11-30 | 2003-05-27 | Wafermasters, Inc. | Wafer processing system including a robot |
US6402508B2 (en) * | 1999-12-09 | 2002-06-11 | Tokyo Electron Limited | Heat and cooling treatment apparatus and substrate processing system |
US6949143B1 (en) | 1999-12-15 | 2005-09-27 | Applied Materials, Inc. | Dual substrate loadlock process equipment |
US6503330B1 (en) | 1999-12-22 | 2003-01-07 | Genus, Inc. | Apparatus and method to achieve continuous interface and ultrathin film during atomic layer deposition |
US6551399B1 (en) | 2000-01-10 | 2003-04-22 | Genus Inc. | Fully integrated process for MIM capacitors using atomic layer deposition |
KR100462237B1 (ko) * | 2000-02-28 | 2004-12-17 | 주성엔지니어링(주) | 기판 냉각장치를 가지는 반도체 소자 제조용 클러스터 장비 |
WO2001069263A1 (fr) * | 2000-03-15 | 2001-09-20 | Hitachi, Ltd. | Analyseur automatique et dispositif d'alimentation en pieces servant a l'analyseur |
US6576568B2 (en) * | 2000-04-04 | 2003-06-10 | Applied Materials, Inc. | Ionic additives for extreme low dielectric constant chemical formulations |
US6420864B1 (en) * | 2000-04-13 | 2002-07-16 | Nanophotonics Ag | Modular substrate measurement system |
US6582175B2 (en) * | 2000-04-14 | 2003-06-24 | Applied Materials, Inc. | Robot for handling semiconductor wafers |
US6919001B2 (en) * | 2000-05-01 | 2005-07-19 | Intevac, Inc. | Disk coating system |
US6427623B2 (en) * | 2000-06-23 | 2002-08-06 | Anelva Corporation | Chemical vapor deposition system |
US6620723B1 (en) | 2000-06-27 | 2003-09-16 | Applied Materials, Inc. | Formation of boride barrier layers using chemisorption techniques |
US7964505B2 (en) | 2005-01-19 | 2011-06-21 | Applied Materials, Inc. | Atomic layer deposition of tungsten materials |
US7405158B2 (en) | 2000-06-28 | 2008-07-29 | Applied Materials, Inc. | Methods for depositing tungsten layers employing atomic layer deposition techniques |
US7732327B2 (en) | 2000-06-28 | 2010-06-08 | Applied Materials, Inc. | Vapor deposition of tungsten materials |
US7101795B1 (en) | 2000-06-28 | 2006-09-05 | Applied Materials, Inc. | Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer |
US6551929B1 (en) | 2000-06-28 | 2003-04-22 | Applied Materials, Inc. | Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques |
CN1440564A (zh) * | 2000-07-07 | 2003-09-03 | 应用材料有限公司 | 锁料室 |
US6709522B1 (en) * | 2000-07-11 | 2004-03-23 | Nordson Corporation | Material handling system and methods for a multichamber plasma treatment system |
JP4342745B2 (ja) * | 2000-09-27 | 2009-10-14 | 株式会社日立国際電気 | 基板処理方法および半導体装置の製造方法 |
US6370796B1 (en) * | 2000-09-29 | 2002-04-16 | Sony Corporation | Heater block cooling system for wafer processing apparatus |
US6617173B1 (en) | 2000-10-11 | 2003-09-09 | Genus, Inc. | Integration of ferromagnetic films with ultrathin insulating film using atomic layer deposition |
US20030190424A1 (en) * | 2000-10-20 | 2003-10-09 | Ofer Sneh | Process for tungsten silicide atomic layer deposition |
US6825447B2 (en) * | 2000-12-29 | 2004-11-30 | Applied Materials, Inc. | Apparatus and method for uniform substrate heating and contaminate collection |
US6765178B2 (en) | 2000-12-29 | 2004-07-20 | Applied Materials, Inc. | Chamber for uniform substrate heating |
US6609869B2 (en) * | 2001-01-04 | 2003-08-26 | Asm America | Transfer chamber with integral loadlock and staging station |
JP5034138B2 (ja) * | 2001-01-25 | 2012-09-26 | 東京エレクトロン株式会社 | 熱処理方法及び熱処理装置 |
US6951804B2 (en) | 2001-02-02 | 2005-10-04 | Applied Materials, Inc. | Formation of a tantalum-nitride layer |
US6660126B2 (en) | 2001-03-02 | 2003-12-09 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
US6878206B2 (en) | 2001-07-16 | 2005-04-12 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
KR20020071393A (ko) * | 2001-03-06 | 2002-09-12 | 주식회사 아이피에스 | 자동연속 웨이퍼가공시스템 및 그를 이용한 웨이퍼가공방법 |
US6734020B2 (en) | 2001-03-07 | 2004-05-11 | Applied Materials, Inc. | Valve control system for atomic layer deposition chamber |
US20020137346A1 (en) * | 2001-03-12 | 2002-09-26 | Applied Materials. Inc. | Workpiece distribution and processing in a high throughput stacked frame |
KR100398877B1 (ko) * | 2001-05-09 | 2003-09-19 | 삼성전자주식회사 | 현상기 소음 및 진동방지구조를 갖는 화상형성장치 |
US6852194B2 (en) * | 2001-05-21 | 2005-02-08 | Tokyo Electron Limited | Processing apparatus, transferring apparatus and transferring method |
JP4078813B2 (ja) * | 2001-06-12 | 2008-04-23 | ソニー株式会社 | 成膜装置および成膜方法 |
US6683006B2 (en) * | 2001-06-25 | 2004-01-27 | Tokyo Electron Limited | Film forming method and film forming apparatus |
US20040096300A1 (en) * | 2001-06-30 | 2004-05-20 | Ilya Perlov | Loadlock chamber |
US7211144B2 (en) | 2001-07-13 | 2007-05-01 | Applied Materials, Inc. | Pulsed nucleation deposition of tungsten layers |
JP4731755B2 (ja) * | 2001-07-26 | 2011-07-27 | 東京エレクトロン株式会社 | 移載装置の制御方法および熱処理方法並びに熱処理装置 |
US20030022498A1 (en) * | 2001-07-27 | 2003-01-30 | Jeong In Kwon | CMP system and method for efficiently processing semiconductor wafers |
JP3886424B2 (ja) * | 2001-08-28 | 2007-02-28 | 鹿児島日本電気株式会社 | 基板処理装置及び方法 |
US7316966B2 (en) | 2001-09-21 | 2008-01-08 | Applied Materials, Inc. | Method for transferring substrates in a load lock chamber |
US6936906B2 (en) | 2001-09-26 | 2005-08-30 | Applied Materials, Inc. | Integration of barrier layer and seed layer |
US6916398B2 (en) | 2001-10-26 | 2005-07-12 | Applied Materials, Inc. | Gas delivery apparatus and method for atomic layer deposition |
US7780785B2 (en) | 2001-10-26 | 2010-08-24 | Applied Materials, Inc. | Gas delivery apparatus for atomic layer deposition |
KR100499211B1 (ko) * | 2001-11-13 | 2005-07-07 | 가부시키가이샤 히다치 고쿠사이 덴키 | 반도체 장치의 제조 방법 및 기판 처리 장치 |
JP2003183728A (ja) * | 2001-12-14 | 2003-07-03 | Jh Corp | 真空熱処理装置 |
US6729824B2 (en) | 2001-12-14 | 2004-05-04 | Applied Materials, Inc. | Dual robot processing system |
US7006888B2 (en) | 2002-01-14 | 2006-02-28 | Applied Materials, Inc. | Semiconductor wafer preheating |
US20030131458A1 (en) * | 2002-01-15 | 2003-07-17 | Applied Materials, Inc. | Apparatus and method for improving throughput in a cluster tool for semiconductor wafer processing |
US6620670B2 (en) | 2002-01-18 | 2003-09-16 | Applied Materials, Inc. | Process conditions and precursors for atomic layer deposition (ALD) of AL2O3 |
US6911391B2 (en) | 2002-01-26 | 2005-06-28 | Applied Materials, Inc. | Integration of titanium and titanium nitride layers |
US6998014B2 (en) | 2002-01-26 | 2006-02-14 | Applied Materials, Inc. | Apparatus and method for plasma assisted deposition |
US6899507B2 (en) * | 2002-02-08 | 2005-05-31 | Asm Japan K.K. | Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections |
US6827978B2 (en) | 2002-02-11 | 2004-12-07 | Applied Materials, Inc. | Deposition of tungsten films |
US6833161B2 (en) | 2002-02-26 | 2004-12-21 | Applied Materials, Inc. | Cyclical deposition of tungsten nitride for metal oxide gate electrode |
US7439191B2 (en) | 2002-04-05 | 2008-10-21 | Applied Materials, Inc. | Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications |
US6846516B2 (en) | 2002-04-08 | 2005-01-25 | Applied Materials, Inc. | Multiple precursor cyclical deposition system |
US6720027B2 (en) | 2002-04-08 | 2004-04-13 | Applied Materials, Inc. | Cyclical deposition of a variable content titanium silicon nitride layer |
JP2003293134A (ja) * | 2002-04-09 | 2003-10-15 | Tdk Corp | 薄膜形成装置および方法、および当該装置を用いた電子部品の製造方法 |
US6875271B2 (en) | 2002-04-09 | 2005-04-05 | Applied Materials, Inc. | Simultaneous cyclical deposition in different processing regions |
US6869838B2 (en) | 2002-04-09 | 2005-03-22 | Applied Materials, Inc. | Deposition of passivation layers for active matrix liquid crystal display (AMLCD) applications |
US20030194299A1 (en) * | 2002-04-15 | 2003-10-16 | Yoo Woo Sik | Processing system for semiconductor wafers |
US7279432B2 (en) | 2002-04-16 | 2007-10-09 | Applied Materials, Inc. | System and method for forming an integrated barrier layer |
KR100481277B1 (ko) * | 2002-05-10 | 2005-04-07 | 한국디엔에스 주식회사 | 반도체 제조 장치 및 방법 |
KR100475077B1 (ko) * | 2002-05-31 | 2005-03-10 | 삼성전자주식회사 | 캐패시터의 유전막 형성방법 |
US6589850B1 (en) * | 2002-06-04 | 2003-07-08 | Newport Fab, Llc | Method and system for fabricating a bipolar transistor and related structure |
US20060083495A1 (en) * | 2002-07-15 | 2006-04-20 | Qiu Taiquing | Variable heater element for low to high temperature ranges |
US20070183871A1 (en) * | 2002-07-22 | 2007-08-09 | Christopher Hofmeister | Substrate processing apparatus |
US6869263B2 (en) | 2002-07-22 | 2005-03-22 | Brooks Automation, Inc. | Substrate loading and unloading station with buffer |
US8960099B2 (en) * | 2002-07-22 | 2015-02-24 | Brooks Automation, Inc | Substrate processing apparatus |
US7677859B2 (en) | 2002-07-22 | 2010-03-16 | Brooks Automation, Inc. | Substrate loading and uploading station with buffer |
US7959395B2 (en) * | 2002-07-22 | 2011-06-14 | Brooks Automation, Inc. | Substrate processing apparatus |
US7988398B2 (en) | 2002-07-22 | 2011-08-02 | Brooks Automation, Inc. | Linear substrate transport apparatus |
US20040081546A1 (en) * | 2002-08-31 | 2004-04-29 | Applied Materials, Inc. | Method and apparatus for supplying substrates to a processing tool |
US6696367B1 (en) * | 2002-09-27 | 2004-02-24 | Asm America, Inc. | System for the improved handling of wafers within a process tool |
US6821563B2 (en) | 2002-10-02 | 2004-11-23 | Applied Materials, Inc. | Gas distribution system for cyclical layer deposition |
US6916374B2 (en) * | 2002-10-08 | 2005-07-12 | Micron Technology, Inc. | Atomic layer deposition methods and atomic layer deposition tools |
JP2006506818A (ja) * | 2002-11-15 | 2006-02-23 | ユナキス・バルツェルス・アクチェンゲゼルシャフト | 二次元的に拡大化された基板を真空処理するための装置および同基板の製造方法 |
US20040179923A1 (en) * | 2002-12-23 | 2004-09-16 | Lockheed Martin Corporation | Automated transportation mechanism for conveyence and positioning of test containers |
US7262133B2 (en) | 2003-01-07 | 2007-08-28 | Applied Materials, Inc. | Enhancement of copper line reliability using thin ALD tan film to cap the copper line |
US20040141832A1 (en) * | 2003-01-10 | 2004-07-22 | Jang Geun-Ha | Cluster device having dual structure |
US20050158883A1 (en) * | 2003-03-05 | 2005-07-21 | Fujitsu Limited | Multilayered structure film and method of making the same |
US20050194096A1 (en) * | 2003-08-29 | 2005-09-08 | Crossing Automation, Inc. | Method and apparatus for semiconductor processing |
KR100923263B1 (ko) * | 2003-09-25 | 2009-10-23 | 가부시키가이샤 히다치 고쿠사이 덴키 | 기판 처리 장치, 반도체 디바이스의 제조 방법 및 기판의 이동 적재 방법 |
US7207766B2 (en) | 2003-10-20 | 2007-04-24 | Applied Materials, Inc. | Load lock chamber for large area substrate processing system |
US20070269297A1 (en) | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
US7210246B2 (en) | 2003-11-10 | 2007-05-01 | Blueshift Technologies, Inc. | Methods and systems for handling a workpiece in vacuum-based material handling system |
US7458763B2 (en) | 2003-11-10 | 2008-12-02 | Blueshift Technologies, Inc. | Mid-entry load lock for semiconductor handling system |
US10086511B2 (en) | 2003-11-10 | 2018-10-02 | Brooks Automation, Inc. | Semiconductor manufacturing systems |
KR100527671B1 (ko) * | 2004-02-19 | 2005-11-28 | 삼성전자주식회사 | 웨이퍼 상에 막을 형성하는 방법 |
US7355715B2 (en) * | 2004-10-12 | 2008-04-08 | Tokyo Electron Limited | Temperature measuring apparatus, temperature measurement method, temperature measurement system, control system and control method |
US20060102078A1 (en) * | 2004-11-18 | 2006-05-18 | Intevac Inc. | Wafer fab |
US7611322B2 (en) * | 2004-11-18 | 2009-11-03 | Intevac, Inc. | Processing thin wafers |
US7467916B2 (en) * | 2005-03-08 | 2008-12-23 | Asm Japan K.K. | Semiconductor-manufacturing apparatus equipped with cooling stage and semiconductor-manufacturing method using same |
JP4502127B2 (ja) * | 2005-04-01 | 2010-07-14 | 株式会社ダイフク | カセット保管及び被処理板の処理設備 |
KR100621775B1 (ko) * | 2005-04-15 | 2006-09-15 | 삼성전자주식회사 | 기판 세정장치 |
US9104650B2 (en) | 2005-07-11 | 2015-08-11 | Brooks Automation, Inc. | Intelligent condition monitoring and fault diagnostic system for preventative maintenance |
EP2998894B1 (en) * | 2005-07-11 | 2021-09-08 | Brooks Automation, Inc. | Intelligent condition monitoring and fault diagnostic system |
CN101305318B (zh) | 2005-07-11 | 2011-07-06 | 布鲁克斯自动化公司 | 具有自动化对准的衬底输送设备 |
US20070020890A1 (en) * | 2005-07-19 | 2007-01-25 | Applied Materials, Inc. | Method and apparatus for semiconductor processing |
US20070084716A1 (en) * | 2005-10-16 | 2007-04-19 | Makoto Nagashima | Back-biased face target sputtering based high density non-volatile data storage |
JP5259415B2 (ja) * | 2005-11-23 | 2013-08-07 | サーフェス・コンバスチョン・インコーポレーテッド | 雰囲気炉における金属製品の表面処理 |
US7553516B2 (en) * | 2005-12-16 | 2009-06-30 | Asm International N.V. | System and method of reducing particle contamination of semiconductor substrates |
US7845891B2 (en) | 2006-01-13 | 2010-12-07 | Applied Materials, Inc. | Decoupled chamber body |
WO2007118252A2 (en) * | 2006-04-11 | 2007-10-18 | Applied Materials, Inc. | System architecture and method for solar panel formation |
JP4727500B2 (ja) * | 2006-05-25 | 2011-07-20 | 東京エレクトロン株式会社 | 基板搬送装置、基板処理システムおよび基板搬送方法 |
US8398355B2 (en) * | 2006-05-26 | 2013-03-19 | Brooks Automation, Inc. | Linearly distributed semiconductor workpiece processing tool |
US7665951B2 (en) | 2006-06-02 | 2010-02-23 | Applied Materials, Inc. | Multiple slot load lock chamber and method of operation |
US7880155B2 (en) * | 2006-06-15 | 2011-02-01 | Brooks Automation, Inc. | Substrate alignment apparatus comprising a controller to measure alignment during transport |
US7695232B2 (en) * | 2006-06-15 | 2010-04-13 | Applied Materials, Inc. | Multi-level load lock chamber, transfer chamber, and robot suitable for interfacing with same |
US7833351B2 (en) * | 2006-06-26 | 2010-11-16 | Applied Materials, Inc. | Batch processing platform for ALD and CVD |
US7845618B2 (en) | 2006-06-28 | 2010-12-07 | Applied Materials, Inc. | Valve door with ball coupling |
US8124907B2 (en) | 2006-08-04 | 2012-02-28 | Applied Materials, Inc. | Load lock chamber with decoupled slit valve door seal compartment |
JP4904995B2 (ja) * | 2006-08-28 | 2012-03-28 | シンフォニアテクノロジー株式会社 | ロードポート装置 |
JP2008100805A (ja) * | 2006-10-18 | 2008-05-01 | Ihi Corp | 基板保管庫 |
JP4744427B2 (ja) * | 2006-12-27 | 2011-08-10 | 大日本スクリーン製造株式会社 | 基板処理装置 |
US20080173350A1 (en) * | 2007-01-18 | 2008-07-24 | Applied Materials, Inc. | Multi-junction solar cells and methods and apparatuses for forming the same |
US20080206021A1 (en) * | 2007-02-27 | 2008-08-28 | Smith John M | Stacked process chambers for magnetic media processing tool |
US20080202892A1 (en) * | 2007-02-27 | 2008-08-28 | Smith John M | Stacked process chambers for substrate vacuum processing tool |
US20080202417A1 (en) * | 2007-02-27 | 2008-08-28 | Smith John M | Self-contained process modules for vacuum processing tool |
WO2008141106A1 (en) * | 2007-05-09 | 2008-11-20 | Applied Materials, Inc. | Transfer chamber with vacuum extension for shutter disks |
US20080276867A1 (en) * | 2007-05-09 | 2008-11-13 | Jason Schaller | Transfer chamber with vacuum extension for shutter disks |
JP5006122B2 (ja) | 2007-06-29 | 2012-08-22 | 株式会社Sokudo | 基板処理装置 |
JP4989398B2 (ja) * | 2007-09-27 | 2012-08-01 | 大日本スクリーン製造株式会社 | 基板処理装置 |
DE102008019023B4 (de) * | 2007-10-22 | 2009-09-24 | Centrotherm Photovoltaics Ag | Vakuum-Durchlaufanlage zur Prozessierung von Substraten |
US7741144B2 (en) * | 2007-11-02 | 2010-06-22 | Applied Materials, Inc. | Plasma treatment between deposition processes |
JP5128918B2 (ja) | 2007-11-30 | 2013-01-23 | 株式会社Sokudo | 基板処理装置 |
US20090162170A1 (en) * | 2007-12-19 | 2009-06-25 | Asm Japan K.K. | Tandem type semiconductor-processing apparatus |
JP5179170B2 (ja) | 2007-12-28 | 2013-04-10 | 株式会社Sokudo | 基板処理装置 |
JP5001828B2 (ja) | 2007-12-28 | 2012-08-15 | 株式会社Sokudo | 基板処理装置 |
US8899171B2 (en) | 2008-06-13 | 2014-12-02 | Kateeva, Inc. | Gas enclosure assembly and system |
US9048344B2 (en) | 2008-06-13 | 2015-06-02 | Kateeva, Inc. | Gas enclosure assembly and system |
US12018857B2 (en) | 2008-06-13 | 2024-06-25 | Kateeva, Inc. | Gas enclosure assembly and system |
US11975546B2 (en) | 2008-06-13 | 2024-05-07 | Kateeva, Inc. | Gas enclosure assembly and system |
US8383202B2 (en) | 2008-06-13 | 2013-02-26 | Kateeva, Inc. | Method and apparatus for load-locked printing |
US10434804B2 (en) | 2008-06-13 | 2019-10-08 | Kateeva, Inc. | Low particle gas enclosure systems and methods |
US10442226B2 (en) | 2008-06-13 | 2019-10-15 | Kateeva, Inc. | Gas enclosure assembly and system |
JP2010171388A (ja) * | 2008-12-25 | 2010-08-05 | Hitachi Kokusai Electric Inc | 基板処理装置及び半導体装置の製造方法及び基板処理用反応管 |
US8602706B2 (en) * | 2009-08-17 | 2013-12-10 | Brooks Automation, Inc. | Substrate processing apparatus |
JP2011049507A (ja) * | 2009-08-29 | 2011-03-10 | Tokyo Electron Ltd | ロードロック装置及び処理システム |
US8759084B2 (en) * | 2010-01-22 | 2014-06-24 | Michael J. Nichols | Self-sterilizing automated incubator |
JP5318005B2 (ja) * | 2010-03-10 | 2013-10-16 | 株式会社Sokudo | 基板処理装置、ストッカー装置および基板収納容器の搬送方法 |
JP2012009519A (ja) * | 2010-06-23 | 2012-01-12 | Hitachi High-Technologies Corp | 真空処理装置 |
JP5243569B2 (ja) * | 2011-03-07 | 2013-07-24 | 東京エレクトロン株式会社 | 基板搬送装置、基板搬送方法及びその基板搬送方法を実行させるためのプログラムを記録した記録媒体 |
JP5666361B2 (ja) | 2011-03-29 | 2015-02-12 | 株式会社Screenセミコンダクターソリューションズ | 基板処理装置 |
JP5925217B2 (ja) * | 2011-12-15 | 2016-05-25 | タツモ株式会社 | ウエハ搬送装置 |
KR101215511B1 (ko) * | 2012-06-27 | 2012-12-26 | (주)이노시티 | 프로세스 챔버 및 기판 처리 장치 |
EP3787016B1 (en) * | 2013-12-26 | 2023-09-20 | Kateeva, Inc. | Apparatus and techniques for thermal treatment of electronic devices |
KR102022816B1 (ko) | 2014-01-21 | 2019-11-04 | 카티바, 인크. | 전자 장치 인캡슐레이션을 위한 기기 및 기술 |
WO2015168036A1 (en) | 2014-04-30 | 2015-11-05 | Kateeva, Inc. | Gas cushion apparatus and techniques for substrate coating |
US20160035563A1 (en) * | 2014-08-01 | 2016-02-04 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus and method for processing semiconductor wafers |
KR20180082498A (ko) | 2015-11-16 | 2018-07-18 | 카티바, 인크. | 기판을 열처리하기 위한 시스템 및 방법 |
KR101627983B1 (ko) * | 2015-12-17 | 2016-06-13 | 주식회사 일신에프에이 | 퍼지용 접이식 웨이퍼 캐리어 버퍼장치 |
KR102359048B1 (ko) * | 2017-09-01 | 2022-02-08 | 가부시키가이샤 코쿠사이 엘렉트릭 | 기판 처리 장치, 반도체 장치의 제조 방법 및 프로그램 |
US11133207B2 (en) * | 2018-08-30 | 2021-09-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for forming films on wafers separated by different distances |
JP7516403B2 (ja) | 2019-02-08 | 2024-07-16 | ヤスカワ アメリカ インコーポレイティッド | スルービーム自動ティーチング |
CN112687587A (zh) * | 2020-12-25 | 2021-04-20 | 上海华力集成电路制造有限公司 | 真空腔体晶圆传送阀门控制结构 |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4263872A (en) * | 1980-01-31 | 1981-04-28 | Rca Corporation | Radiation heated reactor for chemical vapor deposition on substrates |
US4681773A (en) * | 1981-03-27 | 1987-07-21 | American Telephone And Telegraph Company At&T Bell Laboratories | Apparatus for simultaneous molecular beam deposition on a plurality of substrates |
JPH0666295B2 (ja) * | 1983-06-29 | 1994-08-24 | 東京応化工業株式会社 | 多段プラズマ処理装置 |
JPS63139811A (ja) * | 1986-11-29 | 1988-06-11 | Toshiba Corp | 枚葉製造装置 |
US4775281A (en) * | 1986-12-02 | 1988-10-04 | Teradyne, Inc. | Apparatus and method for loading and unloading wafers |
JP2592511B2 (ja) * | 1988-12-03 | 1997-03-19 | 株式会社フレンドテック研究所 | 縦型半導体製造システム |
US5076205A (en) * | 1989-01-06 | 1991-12-31 | General Signal Corporation | Modular vapor processor system |
US5186718A (en) * | 1989-05-19 | 1993-02-16 | Applied Materials, Inc. | Staged-vacuum wafer processing system and method |
JPH0330320A (ja) * | 1989-06-27 | 1991-02-08 | M B K Maikurotetsuku:Kk | 気相化学反応生成装置のロードロック機構 |
JP2825616B2 (ja) * | 1990-05-21 | 1998-11-18 | 東京エレクトロン株式会社 | 板状体搬送装置 |
US5067218A (en) * | 1990-05-21 | 1991-11-26 | Motorola, Inc. | Vacuum wafer transport and processing system and method using a plurality of wafer transport arms |
JP2889657B2 (ja) * | 1990-05-28 | 1999-05-10 | 東京エレクトロン株式会社 | 板状体搬送装置 |
JP2644912B2 (ja) * | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
KR0162102B1 (ko) * | 1991-05-29 | 1999-02-01 | 이노우에 아키라 | 반도체 제조장치 |
JP3238432B2 (ja) * | 1991-08-27 | 2001-12-17 | 東芝機械株式会社 | マルチチャンバ型枚葉処理装置 |
JP2533706B2 (ja) * | 1991-09-13 | 1996-09-11 | 株式会社日立製作所 | 基板搬送方法、及びその装置 |
JPH05152215A (ja) * | 1991-11-29 | 1993-06-18 | Hitachi Ltd | 成膜装置 |
JP2867194B2 (ja) * | 1992-02-05 | 1999-03-08 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
US5303671A (en) * | 1992-02-07 | 1994-04-19 | Tokyo Electron Limited | System for continuously washing and film-forming a semiconductor wafer |
JPH05238513A (ja) * | 1992-02-19 | 1993-09-17 | Nec Corp | 半導体ウェハー収納カセットと半導体ウェハー搬送機構との位置決め方法 |
US5404894A (en) * | 1992-05-20 | 1995-04-11 | Tokyo Electron Kabushiki Kaisha | Conveyor apparatus |
JP2548062B2 (ja) * | 1992-11-13 | 1996-10-30 | 日本エー・エス・エム株式会社 | 縦型熱処理装置用ロードロックチャンバー |
JPH06219513A (ja) * | 1993-01-27 | 1994-08-09 | Nikon Corp | 搬送装置 |
ES2090893T3 (es) * | 1993-01-28 | 1996-10-16 | Applied Materials Inc | Aparato de tratamiento en vacio que tiene una capacidad de produccion mejorada. |
US5474410A (en) * | 1993-03-14 | 1995-12-12 | Tel-Varian Limited | Multi-chamber system provided with carrier units |
JP3218488B2 (ja) * | 1993-03-16 | 2001-10-15 | 東京エレクトロン株式会社 | 処理装置 |
KR100221983B1 (ko) * | 1993-04-13 | 1999-09-15 | 히가시 데쓰로 | 처리장치 |
KR100267617B1 (ko) * | 1993-04-23 | 2000-10-16 | 히가시 데쓰로 | 진공처리장치 및 진공처리방법 |
CH687986A5 (de) * | 1993-05-03 | 1997-04-15 | Balzers Hochvakuum | Plasmabehandlungsanlage und Verfahren zu deren Betrieb. |
JP2969034B2 (ja) * | 1993-06-18 | 1999-11-02 | 東京エレクトロン株式会社 | 搬送方法および搬送装置 |
US5616208A (en) * | 1993-09-17 | 1997-04-01 | Tokyo Electron Limited | Vacuum processing apparatus, vacuum processing method, and method for cleaning the vacuum processing apparatus |
JP3066691B2 (ja) * | 1993-09-17 | 2000-07-17 | 東京エレクトロン株式会社 | マルチチャンバー処理装置及びそのクリーニング方法 |
US5562387A (en) * | 1993-10-04 | 1996-10-08 | Tokyo Electron Limited | Device for transferring plate-like objects |
TW295677B (ko) * | 1994-08-19 | 1997-01-11 | Tokyo Electron Co Ltd | |
US5534074A (en) * | 1995-05-17 | 1996-07-09 | Heraeus Amersil, Inc. | Vertical boat for holding semiconductor wafers |
JP3288200B2 (ja) * | 1995-06-09 | 2002-06-04 | 東京エレクトロン株式会社 | 真空処理装置 |
US5613821A (en) * | 1995-07-06 | 1997-03-25 | Brooks Automation, Inc. | Cluster tool batchloader of substrate carrier |
KR100244041B1 (ko) * | 1995-08-05 | 2000-02-01 | 엔도 마코토 | 기판처리장치 |
US5879459A (en) * | 1997-08-29 | 1999-03-09 | Genus, Inc. | Vertically-stacked process reactor and cluster tool system for atomic layer deposition |
-
1996
- 1996-08-03 KR KR1019960032496A patent/KR100244041B1/ko not_active IP Right Cessation
- 1996-08-03 KR KR1019960032495A patent/KR100310249B1/ko not_active IP Right Cessation
- 1996-08-05 US US08/692,461 patent/US6066210A/en not_active Expired - Lifetime
- 1996-08-05 US US08/691,946 patent/US5788447A/en not_active Expired - Lifetime
-
1999
- 1999-12-02 US US09/453,031 patent/US6143083A/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100487393B1 (ko) * | 1997-10-13 | 2005-06-16 | 도쿄 오카 고교 가부시키가이샤 | 처리장치구축체 |
KR100310080B1 (ko) * | 1998-01-15 | 2001-12-17 | 문태수 | 기능성솜의제조방법 |
Also Published As
Publication number | Publication date |
---|---|
US6143083A (en) | 2000-11-07 |
US5788447A (en) | 1998-08-04 |
KR100310249B1 (ko) | 2001-12-17 |
KR100244041B1 (ko) | 2000-02-01 |
KR970013175A (ko) | 1997-03-29 |
US6066210A (en) | 2000-05-23 |
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