KR960006763B1 - 배선기판과 그 제조방법, 박막 캐리어, 반도체 장치 및 그 장착구조와 반도체 장치장착 방법 - Google Patents

배선기판과 그 제조방법, 박막 캐리어, 반도체 장치 및 그 장착구조와 반도체 장치장착 방법 Download PDF

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Publication number
KR960006763B1
KR960006763B1 KR1019890016132A KR890016132A KR960006763B1 KR 960006763 B1 KR960006763 B1 KR 960006763B1 KR 1019890016132 A KR1019890016132 A KR 1019890016132A KR 890016132 A KR890016132 A KR 890016132A KR 960006763 B1 KR960006763 B1 KR 960006763B1
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KR
South Korea
Prior art keywords
thin film
semiconductor device
insulating
film carrier
region
Prior art date
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KR1019890016132A
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English (en)
Korean (ko)
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KR900008918A (ko
Inventor
마사까즈 스기모또
가즈오 오우찌
미끼오 아이자와
아쯔시 히노
가즈또 시노자끼
데쯔야 데라다
다까노리 미요시
무네까즈 다나까
쇼지 모리따
아마네 모찌즈끼
요시나리 다까야마
Original Assignee
닛또 덴꼬 가부시끼가이샤
가마이 고로우
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP28320788A external-priority patent/JPH0760840B2/ja
Priority claimed from JP1050793A external-priority patent/JP2785832B2/ja
Priority claimed from JP1050792A external-priority patent/JP2815113B2/ja
Priority claimed from JP1181272A external-priority patent/JP2634672B2/ja
Priority claimed from JP19768189A external-priority patent/JP2654190B2/ja
Priority claimed from JP19768289A external-priority patent/JP2654191B2/ja
Priority claimed from JP19768089A external-priority patent/JP2654189B2/ja
Priority claimed from JP1200847A external-priority patent/JP2808703B2/ja
Application filed by 닛또 덴꼬 가부시끼가이샤, 가마이 고로우 filed Critical 닛또 덴꼬 가부시끼가이샤
Publication of KR900008918A publication Critical patent/KR900008918A/ko
Application granted granted Critical
Publication of KR960006763B1 publication Critical patent/KR960006763B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
KR1019890016132A 1988-11-09 1989-11-08 배선기판과 그 제조방법, 박막 캐리어, 반도체 장치 및 그 장착구조와 반도체 장치장착 방법 KR960006763B1 (ko)

Applications Claiming Priority (16)

Application Number Priority Date Filing Date Title
JP28320788A JPH0760840B2 (ja) 1988-11-09 1988-11-09 配線基板およびその製法
JP63-283207 1988-11-09
JP1050793A JP2785832B2 (ja) 1989-03-01 1989-03-01 半導体装置の実装構造
JP50,792 1989-03-01
JP1050792A JP2815113B2 (ja) 1989-03-01 1989-03-01 フィルムキャリアおよび半導体装置の製造方法
JP50,793 1989-03-01
JP1181272A JP2634672B2 (ja) 1989-07-14 1989-07-14 半導体装置
JP181,272 1989-07-14
JP19768189A JP2654190B2 (ja) 1989-07-28 1989-07-28 半導体装置の実装方法
JP19768289A JP2654191B2 (ja) 1989-07-28 1989-07-28 半導体装置の実装方法
JP197,681 1989-07-28
JP197,582 1989-07-28
JP197,680 1989-07-28
JP19768089A JP2654189B2 (ja) 1989-07-28 1989-07-28 半導体装置の実装方法
JP1200847A JP2808703B2 (ja) 1989-08-02 1989-08-02 フィルムキャリアおよび半導体装置
JP200,847 1989-08-02

Publications (2)

Publication Number Publication Date
KR900008918A KR900008918A (ko) 1990-06-03
KR960006763B1 true KR960006763B1 (ko) 1996-05-23

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KR1019890016132A KR960006763B1 (ko) 1988-11-09 1989-11-08 배선기판과 그 제조방법, 박막 캐리어, 반도체 장치 및 그 장착구조와 반도체 장치장착 방법

Country Status (5)

Country Link
US (1) US5072289A (de)
EP (1) EP0368262B1 (de)
KR (1) KR960006763B1 (de)
DE (1) DE68929282T2 (de)
SG (1) SG49842A1 (de)

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JPS6148952A (ja) * 1984-08-16 1986-03-10 Toshiba Corp 半導体装置
JPS61111561A (ja) * 1984-10-05 1986-05-29 Fujitsu Ltd 半導体装置
FR2584235B1 (fr) * 1985-06-26 1988-04-22 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
US4926241A (en) * 1988-02-19 1990-05-15 Microelectronics And Computer Technology Corporation Flip substrate for chip mount

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DE68929282T2 (de) 2001-06-07
EP0368262A3 (de) 1990-11-28
KR900008918A (ko) 1990-06-03
SG49842A1 (en) 1998-06-15
EP0368262A2 (de) 1990-05-16
DE68929282D1 (de) 2001-03-22
EP0368262B1 (de) 2001-02-14
US5072289A (en) 1991-12-10

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