EP0501358B1 - Vorrichtung und Verfahren zur Verbindung elektrischer Bauelemente - Google Patents

Vorrichtung und Verfahren zur Verbindung elektrischer Bauelemente Download PDF

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Publication number
EP0501358B1
EP0501358B1 EP92103025A EP92103025A EP0501358B1 EP 0501358 B1 EP0501358 B1 EP 0501358B1 EP 92103025 A EP92103025 A EP 92103025A EP 92103025 A EP92103025 A EP 92103025A EP 0501358 B1 EP0501358 B1 EP 0501358B1
Authority
EP
European Patent Office
Prior art keywords
carrier
electric circuit
circuit components
connecting member
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP92103025A
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English (en)
French (fr)
Other versions
EP0501358A2 (de
EP0501358A3 (en
Inventor
Takahiro C/O Sumitomo Metal Ind. Ltd Okabayashi
Tetsuo c/o Canon Kabushiki Kaisha Yoshizawa
Toyohide c/o CANON KABUSHIKI KAISHA Miyazaki
Hiroshi C/O Canon Kabushiki Kaisha Kondo
Yoshimi c/o Canon Kabushiki Kaisha Terayama
Takashi c/o Canon Kabushiki Kaisha Sakaki
Yuichi c/o Sumitomo Metal Ind. Ltd. Ikegami
Kazuo c/o SUMITOMO METAL IND. LTD. Kondo
Yoichi c/o SUMITOMO METAL IND. LTD. Tamura
Yasuo c/o SUMITOMO METAL IND. LTD. Nakatsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Nippon Steel Corp
Original Assignee
Canon Inc
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP03053903A external-priority patent/JP3113987B2/ja
Priority claimed from JP3069089A external-priority patent/JPH04282582A/ja
Priority claimed from JP3089827A external-priority patent/JPH04298976A/ja
Priority claimed from JP8982691A external-priority patent/JPH04299546A/ja
Priority claimed from JP14694491A external-priority patent/JPH04342971A/ja
Application filed by Canon Inc, Sumitomo Metal Industries Ltd filed Critical Canon Inc
Publication of EP0501358A2 publication Critical patent/EP0501358A2/de
Publication of EP0501358A3 publication Critical patent/EP0501358A3/en
Application granted granted Critical
Publication of EP0501358B1 publication Critical patent/EP0501358B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75313—Removable bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Definitions

  • the present invention relates to a connecting method for connecting electric circuit components by using a connecting member, and an apparatus therefore.
  • the methods for obtaining the electrical connecting state between electric circuit components include a wire bonding method, an automatic bonding method based on a tape carrier method as disclosed in JP-A-59-139636, and a so-called TAB (Tape Automated Bonding) method.
  • Fig. 15 is a half-size view illustrating a conventional connecting form between electric circuit components, in which 21, 22 are long size substrates which are electric circuit components such as printed boards, and 23, 24 are presser members.
  • Each substrate 21, 22 of electric circuit component has the printed wiring disposed on its surface, or electrical joints 21a, 22a located closer to one side, arranged in parallel, and in the vicinity of the arrangement of electrical joints 21a, 22a, there are provided holes 21b, 22b for passing pressure bonding screws 25 therethrough, both substrates 21, 22 are joined one on the other in the state in which the electrical joints 21a, 22a and holes 21b, 22b are opposed to each other, so as to be interposed between the presser members 23, 24.
  • Each presser member 23, 24 is formed of a metallic plate having a respective thickness, with a screw hole 23a formed on the presser member 23, and a hole 24a formed on the presser member 24, respectively, and further the presser member 24 is formed with a presser section 24b slightly bent toward the substrate 2 on a portion opposed to the electrical joints 21a, 22a for the connection so as to apply the pressure to the substrates 1, 2 in a secure manner, so that the electrical joints 21a, 22a are bonded with each other by inserting the pressure bonding screws 25 through the holes 24a of the presser member 24 and the holes 21b, 22b of the substrates 21, 22, threadingly engaging and tightening them into threaded holes 23a of the presser member 23.
  • Fig. 18 shows a conventional electrical connecting member and the connected state of substrates such as printed boards by the use of that member
  • Figs. 16A and 16B are explanation views for illustrating the forms before and after the connection of electrical connecting member, respectively.
  • 1 is an electrical connecting member
  • 4, 5 are substrates such as printed boards which are electrical circuit boards to be connected.
  • the electrical connecting member 1 is constituted in such a manner that holes are bored into a film-like carrier 2 made of an electrical insulating member, spaced at predetermined intervals, and a plurality of conductive members 3 are provided within the holes in the mutually insulating state.
  • each conductive member 45 is exposed to one face of the carrier 2, and the other end is exposed to the other face of the carrier 2, in the form of slightly projecting from the surface of the carrier 2, the diameter of each end portion being slightly larger than that of the hole to prevent the member from getting out of the hole.
  • each portion in the electrical connecting member 41 is such that the thickness of the carrier 2 is about 10 ⁇ m, the diameter of the hole (column portion of conductive member) is about 20 ⁇ m, the pitch between holes is about 40 ⁇ m, and the amount of projection of the conductive member 3 is about several ⁇ m on both front and back faces, as shown in Fig. 16A.
  • the conductive members 3 are made of a metal having an excellent conductivity, which may be often gold (Au) or gold alloy.
  • the interval between conductive members 3 can be determined under the condition in which the insulating property is assured between adjacent conductive members 3.
  • FIG. 16B The connecting form of the electric circuit component with this electrical connecting member 1 is shown in Fig. 16B.
  • 4, 5 are electric circuit components to be connected, and when they are connected using the electrical connecting member 41, the electric circuit components 4, 5 are laid on both faces of the carrier 2, the electrodes 6, 7 for use as the connecting ends are aligned with each other in a plan view, and then these electric circuit components are pressurized and bonded by appropriate means against exposed ends of conductive members 3 on respective opposed faces. Thereby, the electrodes 6, 7, i.e., the electric circuit components 4, 5 are electrically connected via the conductive member 3.
  • thermocompression bonding method As the method for joining the electric circuit components using the electrical connecting member more securely, a thermocompression bonding method is well known.
  • Fig. 17 is a typical view illustrating the conventional thermocompression method and its apparatus for connecting the printed boards with each other, on a partially enlarged scale, in which 4, 5 are substrates such as printed boards which are electric circuit components, 1 is an electrical connecting member interposed between both substrates 4, 5, and 50 is a press.
  • the substrates 4, 5 have the printed wirings applied on one face (or both faces), electrical joints 6, 7 being collectively arranged at positions closer to one side, and the electrical connecting member 1 is formed in such a manner that a plurality of holes 3b bored into the carrier 2 made of an electrical insulating material are filled with conductive members made of gold, each one end of which is exposed to one face of the carrier and the other end thereof is exposed to the other face of the carrier, in the form of being slightly protruded from the surface of the carrier.
  • the electrical connecting member 1 is sandwiched and joined between substrates 4, 5, with the electrical joints 7 of the substrate 5 being opposed to one ends of the conductive members 3 provided on the electrical connecting member 1, and the electrical joints 6 of the substrate 4 being opposed to the other ends of the conductive members 3, and then disposed in this state between the upper and lower halves 51, 52 containing heaters in the press 50.
  • the upper and lower halves 51, 52 each are secured to pressurizing portions P on a base board B with the interposition of heat insulating members 53, 54, respectively, the electrical joints 6, 7 of the substrates 4, 5 and the conductive members 3 of the electrical connecting member 1 are heated up to a temperature of 350 to 400°C and pressed under a predetermined pressure.
  • the electrical joints 6, 7 of the substrates 4, 5 and the conductive members 3 of the electrical connecting member 11 are bonded together under pressure in the heated state to be electrically connected with each other in an alloyed state due to the solid phase metal diffusion.
  • FIG. 18 is a typical cross-sectional view showing the process of bonding compressively the electrical connecting member 1 sandwiched between the substrates 4, 5.
  • the electrical joints 6, 7 of the substrates 4, 5 are placed into contact with the conductive members 3 of the electrical connecting member 1 carried therebetween from both face sides, and if the substrates 4, 5 are pressurized, the carrier 2 between adjacent conductive members 3 starts to bulge in the upper and lower directions, due to the deformation of each conductive member 3, particularly with the increasing diameter of column portion located within the carrier 12 (Fig. 19B), then making contact with the surfaces of the substrates 4, 5 if further pressurized (Fig. 19C), and finally the conductive members 3 and the carrier 2 fill a gap between the substrates 4, 5 (Fig. 19D).
  • Fig. 20 is a graph showing the relation between the amount of deformation of the conductive member and the pressure against the substrate 4, 5 in the above-mentioned process, with the amount of deformation in the axis of abscissas and the pressure in the axis of ordinates.
  • the pressure may suffice to be small in a process in which the conductive member mainly deforms as shown in Fig. 28B, and if the carrier 2 is placed into contact with the substrates 4, 5 and starts to be deformed, the pressure starts to increase abruptly, and at a state as shown in Fig. 19D, the deformation does not arise even if the pressure is increased.
  • Document US-A-4 814 040 discloses a method and apparatus for electrically connecting electrical joints of electric circuit components via an electric connecting member having a plurality of conductive members carried on a carrier in a mutually insulating state, one end of the conductive members being exposed to one face of the carrier, and the other end of the conductive members being exposed to the other face of the carrier. Therein, the entire base plates of the electric circuit components are heated and pressed against each other such that the electrical joints are thermally compressed to each other via the electrical connecting member.
  • thermocompressing only a portion of the electric circuit components and moving the position of pressure application along the connecting surface of the electric circuit components, the pressed portion can be kept small enough to prevent warpage and thermocompression bonding can be achieved under a uniform pressure even in case of relatively long electric circuit components.
  • Fig. 1 is a typical view showing a thermocompression bonding method and its example.
  • Fig. 2 is a partially enlarged view of Fig. 1.
  • Fig. 3 is a side view showing a specific constitution of a thermocompression bonding apparatus.
  • Fig. 4 is a typical view showing the state in operation in another example of the present invention.
  • Fig. 5 is a typical view showing another state in operation in the example of the present invention.
  • Figs. 6A-6E are typical views showing the manufacturing process of an electrical connecting member.
  • Figs. 7A-7E are typical views showing the manufacturing process of an electrical connecting member.
  • Figs. 8A and 8B are explanation views for a connection method of electric circuit components with an electrical connecting member.
  • Fig. 9 is a typical cross-sectional view of an electrical connecting member fabricated with the example.
  • Figs. 10A and 10B are graphs showing the relation between the rate of junction and the rate of deformation and the pressure.
  • Fig. 11 is a graph showing the relation between the amount of decrease in height and the radius of column portion of conductive member when the height of conductive member is varied with the pitch of conductive member fixed.
  • Fig. 12 is a graph showing the relation between the amount of decrease in height and the radius of conductive member when the height of conductive member is varied with the pitch of conductive member fixed.
  • Fig. 13 is a graph showing the relation between the amount of decrease in height and the pressure when the height of conductive member is varied with the pitch of conductive member fixed.
  • Figs. 14A-14F are views showing a main manufacturing process of an electrical connecting member according to the present invention.
  • Fig. 15 is a typical view showing a connecting method in the background art.
  • Figs. 16A and 16B are explanation views showing the connecting form between typical electric circuit components and an electrical connecting member.
  • Fig. 17 is a typical view showing a thermocompression bonding apparatus in the background art.
  • Fig. 18 is a typical view showing an example of the connection using the apparatus of Fig. 17.
  • Figs. 19A-19D are typical cross-sectional views showing a process for the compression bonding between an electrical connecting member and printed boards which are electric circuit components.
  • Fig. 20 is a graph showing the relation between the amount of deformation in height of conductive member and the pressure against the electric circuit component.
  • Fig. 1 is a typical view showing a method and its apparatus for the thermocompression bonding between electric circuit components, according to the present invention
  • Fig. 2 is a partial enlarged cross-sectional view.
  • 4, 5 are substrates such as printed boards which are electric circuit components
  • 1 is an electrical connecting member
  • 16 is a supporting base containing heaters 16a and thermocouples 16b
  • 17 is a pressurizing board
  • B is a base.
  • the substrates 4, 5 have the printed wirings (not shown) applied on one face (or both faces), the electrical joints 6, 7 being collectively arranged at the positions closer to one side, and the electrical connecting member 1 is formed in such a manner that a plurality of holes 3b bored into the carrier 2 made of an electrical insulating material are filled with the conductive members made of gold, each one end of which is swollen slightly from the surface of the carrier 2.
  • a pair of stoppers 19a, 19b movable for the positioning are spaced at a predetermined interval on the base board B, and between both stoppers 19a, 19b is disposed the supporting board 16 with the interposition of a heat insulating member 18, on which supporting board 16 are disposed both substrates 4, 5, laid one on the other, with the electrical joints 6 of the substrate 4 being opposed to one end portions of the conductive members 3 exposed to one face of the electrical connecting member 1, and the electrical joints 7 of the substrate 5 opposed to the other end portions of the conductive members 3, in which the pressure is applied by the pressurizing board 17 from upward of the substrate 4.
  • the pressurizing board 17 is formed like a sector having a pressure face 17a curved as a circular shape at a predetermined radius of curvature, and contains heaters 17b and thermocouples 17c along the pressure face 17a, in which the center of curvature or the point O is borne on an arm constituting a pressurizing apparatus as shown in Fig. 3.
  • Fig. 3 is a side view of the pressurizing apparatus, in which there are disposed the stoppers 19a, 19b for arranging the substrates 4, 5 on a central portion of the base board B, a strut 22 on one side, and an air cylinder 23 for the evacuation on the other side, with a rod 23b mounting a roll 23a being directed upward.
  • the strut 22 has its lower end portion supported on a linear guide 24 of the base board B, and stood movable horizontally as indicated by the arrow.
  • This strut 12 is provided with a nut member 22a near the lower end, through which a ball screw 22b is inserted, one end of the ball screw 22b being borne through a supporting plate 22c provided on the base board B, which is linked via a belt to a motor M, whereby the strut 22 can be reciprocated horizontally as indicated by the arrow with the driving of the motor M.
  • the arm 21 On an upper end of the strut 22, the arm 21 has its one end secured with a shaft 21a, and is rotatable around the shaft 21a upward or downward.
  • the other end portion of the arm 21 has a weight 21c suspended via a rod 21b vertically provided thereon, and on a substantial central portion thereof, the pressure board 5 is secured swingably around a shaft 21d as indicated by the arrow.
  • a guide rail 21e is fixed at a position opposed to the roll 23a of the air cylinder 23, the driving of which causes the roll 23a to make contact with the guide rail 21e, lifting the arm 21 to be moved between a position indicated by the solid line and a position indicated by the dashed line around the shaft 21a at its one end, and causing the pressurizing board 17 to be retreated from between the stoppers 19a, 19b to make contact with the substrate 1 between the stoppers 19a, 19b.
  • thermocompression bonding apparatus 20 With this thermocompression bonding apparatus 20, the air cylinder 23 for the evacuation is driven to rotate the arm 21 around the shaft 21a to retreat back to a position indicated by the dashed line, at which position a set screw 19c is loosened to open the stoppers 19a, 19b at a predetermined interval, between which stoppers 19a, 19b the heat insulating member 18 and the supporting board 16 are disposed, and the electrical connecting member 1 sandwiched between the substrates 4, 5 is laid thereon, whereby the stoppers 19a or 19b are positioned with the set screws 19c.
  • the heaters 16a of the supporting board 16 and the heaters 17b of the pressure board 17 are activated under the monitoring of the detected values of the thermocouples 16b, 17b, in which the substrates 4, 5 are set in a range from 340 to 400°C, and the weight 21 is set at a predetermined weight.
  • the air cylinder 23 for the evacuation is retreated to place the central portion on the lower face of the pressurizing board 17 into contact with the central portion on the upper face of the substrate 4, under a load of the weight 21c, in which state the motor M is driven to retract the strut 22, and the arm 21 to a position indicated by the broken line.
  • the pressurizing board 17 is rotated around the shaft 21d, thereby moving the abutting point against the upper face of the substrate 4 to the left side in succession.
  • the electrical joints 6, 7 of the substrates 4, 5 and the conductive members 3 of the electrical connecting member 1 are bonded together compressively, plural parts each time, successively, with the pressure welding and the rolling of the pressurizing board 17.
  • the motor M is reversely rotated, causing the pressurizing board 17 to a position at which the other side of the pressurizing board 17 is in parallel to the inner face of the stopper 19b.
  • the operation is repeated by plural number until the compression bonding is terminated.
  • the inner faces of the stoppers 17a, 17b abutting on both ends of the pressurizing board 17 may be formed as a concave face to prevent any slippage between the pressurizing board 17 and the substrate 4. Also, to prevent the slippage of the pressurizing board 17 with respect to the substrate 4, a number of curved lines crossing on the pressure face may be formed as a rough face.
  • the electrical joints 6, 7 of the substrates 4, 5 correspond to the conductive members 3 of the electrical connecting member 1, one to one, but a plurality of conductive members 3 can correspond to each electrical joint 6, 7, by providing a smaller pitch, in which case the substrates 4, 5 and the electrical connecting member 1 can be opposed to each other only with the alignment, whereby the operation efficiency can be further improved.
  • a pressure roll 24 is used instead of the pressurizing board 17 as shown in the example.
  • Fig. 4 is a typical view'showing the operation state of the example.
  • 24 is the pressure roll, in which both end portions are borne on supporting legs, not shown, which serve to reciprocate horizontally the pressure roll 24 by applying a predetermined load against the surface of the substrate 4, and thereby press the electrical joints 6, 7 of the substrates 4, 5 and the conductive members 3 of the electrical connecting member 1 for the compression bonding.
  • the heater and the thermocouple may be provided in the neighborhood of a peripheral face of the pressure roll 24.
  • the peripheral face of the pressure roll may be a rough face to be useful for the prevention of slippage.
  • a press 25 having a smaller size than the width of the substrate 4, 5 is used to press a part of the substrate 4 with a predetermined pressure, which is then lifted once to be moved to the left or the right by a predetermined length, and the above-described operation is repeated.
  • the heater and the thermocouple may be provided in the neighborhood of the pressure face.
  • a metallic plate e.g., copper plate
  • a negative-type photosensitive polyimide resin 27 containing an adhesive 28 in a number of capsule-like lumps is applied.
  • This polyimide resin 27 constitutes a carrier 2 on the electrical connecting member 1, as will be described later, the application thickness of polyimide resin being thicker than the thickness of the carrier 2 to be obtained, in consideration of an decrease with the splashing of the solvent and the shrinkage in the subsequent curing process.
  • the adhesive contained in the polyimide resin requires to have the thermosetting property, and may be an adhesive resin such as epoxy, polyester, polyurethan, phenol, resorcinol, urea, or melamine.
  • the surface of coating layer made of polyimide resin is covered with a photomask (not shown) having a predetermined pattern formed, and then irradiated (exposed) via the photomask and developed. Thereby, an unexposed portion is removed, and a number of through holes 3b penetrating through the coating layer of polyimide resin from the inside to the outside are formed, as shown in Fig. 6B.
  • the etching is made from the surface side of polyimide resin, so that the metallic plate 26 located beneath the through holes 3b is etched and recess portions 29 are formed, as shown in Fig. 6C. Note that this etching process is continued until the diameter of recess portions 29 is slightly larger than that of the through holes 3b.
  • the through holes 36 and the recess portions 29 are filled with gold 30 through the electroplating having the metallic plate 26 as a common electrode. This filling is made until gold 30 is swollen up to the thickness nearly corresponding to that of the recess portions 29 at the opening end portion for the through holes 3b on the surface of polyimide resin 27, as shown in Fig. 6D.
  • the filling with the electroplating is not limited to the use of gold (Au), but the metal such as Ag, Cu, Be, Mo, Ni or the alloy thereof may be used.
  • the electrical connecting member 1 can be constituted as shown in Fig. 6E, in which a number of conductive members 3 made of gold are embedded into the carrier 2 made of polyimide resin 27 which is an insulating material and containing an adhesive 28 in the insulating state, their both ends being exposed to the inside and the outside of the carrier 2, respectively.
  • the fabrication of the electrical connecting member is performed in the following way.
  • the negative photosensitive polyimide resin 27 is coated on the metallic plate 26 which is the base, as shown in Fig. 7A.
  • the coating layer should have a greater thickness than the carrier 2, as previously described.
  • the surface of the coating layer made of polyimide resin 27 is exposed via the photomask having a predetermined pattern formed, and further developed, so that a number of through holes 3b penetrating from the inside of the coating layer to the outside are formed. Then, they are heated to cure the coating layer of polyimide resin 27 with the conversion into the imide, the metallic plate 26 located beneath the through holes 3b is etched with the etching from the surface side of the coating layer to form the recess portions 29, and the through holes 3b, and the recess portions 29 are filled with gold 30 with the electroplating having the metallic plate 26 as the common electrode.
  • the process from the state of Fig. 7A to this state is the same as from Fig. 6B to Fig. 6D in the fabrication of the electrical connecting member 1 according to the previous example, and therefore the figures are omitted.
  • a crude product 1 is constituted as shown in Fig. 7B, in which a number of conductive members 3 made of gold are embedded into the carrier 2 made of polyimide resin which is an insulating material, in the mutually insulating state, and their both ends are exposed to the inside and the outside of the carrier 2. It will be appreciated that this crude product 1 corresponds to a conventional electrical connecting member.
  • a resist layer 31 having an adequate thickness is formed only on an exposed portion of each conductive member 3 on the inside and the outside of the carrier 2 for the crude product 1, as shown in Fig. 7C.
  • the formation of such resist layer 31 can be performed in the same procedure as the formation of the through holes 3b, that is, in such a procedure that first, the photosensitive resist agent is coated on the entire surface of the carrier 2, the surface of the coating layer is covered with the photomask having a predetermined pattern formed, exposed via the photomask and then developed, and the unexposed portion is removed, so that the residual portion becomes a resist layer.
  • an adhesive 28 is applied onto a portion of the inside and the outside of the carrier 2 uncoated with the resist layer 31, as shown in Fig. 7D, and finally the resist layer 31 is peeled off.
  • the electrical connecting member 1 can be obtained as shown in Fig. 7E, in which the adhesive 28 is coated a predetermined thickness on the inside and the outside of the carrier 2 carrying the conductive members 3.
  • the adhesive 28 coated on the surface of the carrier 2 requires to have the thermosetting property, and may be an adhesive resin such as epoxy, polyester, polyurethan, phenol, resorcinol, urea, or melamine. It is also possible that the coating of the adhesive 28 is made on the entire surface of the carrier 2, and the adhesive applied on the formation portion of the layer 31 is removed at the same time when the resist layer 31 is peeled off after the coating.
  • Fig. 8 is a typical view shoring a connecting form of electric circuit components with the electrical connecting member in this example as obtained in the above-described manner, in which Fig. 8A shows the use of an electrical connecting member 1 in the previous example, and Fig. 8B shows the use of an electrical connecting member 1 in another example.
  • 4, 5 are electric circuit components to be connected, and the electric circuit components 4, 5 are disposed on both front and back faces of the carrier 2, as conventionally performed, and electrodes 6, 7 for use at connection ends are aligned in a plan view.
  • the electric circuit components 4, 5 are placed into contact with the both faces of the carrier 2, as shown in Fig. 8A, if the electrical connecting member 1 according to Fig. 7 is used, or after the electric circuit components 4, 5 are placed into contact with the coating layer surfaces 28 of the adhesive on both faces of the carrier 2, as shown in Fig. 8B, if the electrical connecting member 1 according to Fig. 7 is used, the whole entity is heated.
  • This heating is applied until the adhesive contained in the carrier 2 or the adhesive 28 applied on the surface of the carrier 2 reaches a curing temperature, whereby the electric circuit components. 4, 5 are adhered to the carrier 2 or the coating layer of the adhesive on the surface of the carrier 2, and further, with the curing and shrinkage of the adhesive caused by the heating, the carrier 2 itself in the electrical connecting member 1 of Fig. 8A or the coating layer of the adhesive 20 in the electrical connecting member 1 of Fig.
  • the electric circuit components 4, 5 are subjected to the pressure for maintaining the contact with the carrier 2 and the heating for curing the adhesive 28, in which as the curing temperature of the thermosetting adhesive 28 is normally about 100 to 200°C, there is no risk that the electric circuit components 4, 5 and the carrier 2 are damaged due to the heating and the pressure, and as the thermal stress arising in the conductive members 3, is small, it is possible to eliminate the occurrence of conduction failures and the increase in the electrical resistance after the connection.
  • the electric circuit components 4, 5 and the electrical connecting member 1 are connected with a joining force between the electrodes 6, 7 and the conductive members 3, as well as an adhesive force between the whole of electric circuit components 4, 5 and the carrier 2, so that there is an additional advantage that an extreme high bond strength can be obtained.
  • the present inventors made the experiments and studies with efforts for the amount of deformation in the conductive member for obtaining the metallic solid phase diffusion state in a secure manner without incurring the unbonding between the electrical joints of the electric circuit components and the conductive member of the electrical connecting member in order to assure a stable and secure electrical connection using the electrical connecting member, and thus consequently obtained such a view that when the amount of deformation in the conductive member of electrical connecting member (the amount of deformation in view of the diameter of bump) is 17% or more in a condition in which the temperature of the conductive members of the electrical connecting member is from 250 to 400°C, the metallic solid phase diffusion state is obtained in the connection between the conductive members and the electrical joints, and the unbonding may be incurred before the conductive members reach such an amount of deformation.
  • Fig. 9 is a typical cross-sectional view showing an electrical connecting member, in which 1 is an electrical connecting member, 2 is a carrier made of an electrical insulating material, and 3 is a conductive member made of for example gold.
  • the carrier 2 is made of a photosensitive polyimide resin, in which the conductive members 3 made of gold are provided within the holes 3 bored therein. one end of the conductive member 3 is exposed to one face of the carrier 2, and the other end thereof is exposed to the other face of the carrier 2, in the state of slightly protruding from the surface of the carrier 2.
  • Fig. 10 is a graph showing the relation between the pressure being applied increasingly and the rate of deformation and the rate of junction in the conductive member 3, with the electrical connecting member of Fig. 9 sandwiched between the substrates.
  • the electrical connecting member 1 having the conductive members 3 is pressed between the substrates which are electric circuit components, in which the pitch between conductive members 3 is L, the protruding height of the conductive member 3 from the surface of the carrier 2 is h, the maximum diameter of the conductive member 3 is D, and the diameter of the column portion 3a of the conductive member 3 located within the carrier 2 is r.
  • the interrelation between the height h of the conductive member 3, the pitch L, the diameter r of the column portion of the conductive member is as follows.
  • Fig. 11 is a graph showing the relation between the amount of decrease in height h from the surface of the carrier and the radius of column portion of conductive member, in which in the graph, the pitch L of conductive member is fixed at 30 ⁇ m, and the height h of conductive member is changed as 2 ⁇ m (solid line), 5 ⁇ m (dashed line) and 8 ⁇ m (broken line). It will be clearly found from the graph that the larger the height h, the greater increase in the radius of column portion when it is pressed and deformed. The increase of column portion can set the height h of conductive member properly because of the corresponding increase in the swelling amount on the carrier 2.
  • Fig. 12 is a graph showing the relation between the amount of decrease in height h and the radius of column portion of conductive member, in which the pitch L of conductive member is fixed at 40 ⁇ m, and the height h of conductive member is changed as 2 ⁇ m (solid line), 5 ⁇ m (dashed line) and 8 ⁇ m (broken line).
  • Fig. 13 is a graph showing the relation between the amount of decrease in height h and the pressure (Kgf/mm 2 ) required for the compression bonding, in which the pitch L of conductive member is fixed at 30 ⁇ m, and the height h of conductive member is changed as 2 ⁇ m (solid line), 5 ⁇ m (dashed line) and 8 ⁇ m (broken line). It will be clearly found from the graph that when the height h of the conductive member is small, the deformation reaches a limit with a slight decrease of the height h, requiring some wasteful pressure.
  • Fig. 14 is a typical cross-sectional view showing a principal process of the fabrication method for the electrical connecting member, in which first, a metallic sheet 26 which is a base is prepared (Fig. 14A), and a negative-type photosensitive resin is applied on this metallic sheet 26 with a spinner for the prebake (Fig. 14B).
  • the photosensitive resin 27 is irradiated and exposed via a photomask (not shown) having a predetermined pattern, and then developed (Fig. 14C). Thereby, the photosensitive resin 27 remains on the exposed portion, while the photosensitive resin 27 is removed from the unexposed portion with the processing, so that holes 3b through which the surface of metallic sheet is exposed are formed on the bottom.
  • the photosensitive resin is cured with the rise in the temperature, it is dipped in an etching liquid to allow the etching for the surface of metallic sheet 11 exposed within the holes 3b, and form the recess portions (Fig. 14D).
  • the holes 3b and the recess portions 29 are filled with gold 30, and the gold plating is applied to be swollen a predetermined amount above the surface of photosensitive resin 27, so that the conductive members 3 are formed (Fig. 14E).
  • the metallic sheet 27 is removed with the etching, so that the electrical connecting member 1 constituted of the conductive members 3 made of gold and the carrier 2 made of the photosensitive resin 27 respectively can be fabricated, as shown in Fig. 14F.
  • Table 1 Size conditions for conductive member Detected Data Height ( ⁇ m) Max. diameter ( ⁇ m) Pitch ( ⁇ m) Max.
  • Table 1 shows the results in which the heating compression bonding is made by changing the height h of conductive member from the carrier, the maximum diameter R of conductive member, and the pitch L of conductive member, respectively, with a target of 100% compression bonding between the conductive members and the electrical joints of the substate, the compression bonding ratio (the ratio % of the number of compression bonded conductive members to the total number of conductive members) and the pressure (Kgf/mm 2 ) under the heating was obtained in respective cases, and the integrated evaluation was made. Note that in the integrated evaluation, the sign ⁇ indicates the compression bonding ratio of 100%, the sign ⁇ indicates the compression bonding ratio of 80% or greater, and the sign x indicates the compression bonding ratio below 80%.
  • an elastic member is used in the compression bonding between a plurality of electrical joints, and may be suitable for the multipoint joints particularly on a long substrate, from an intermediate point in the electrical connecting area, allowing for the application of a uniform bonding load to each electrical joint, whereby the compression bonding structure is simplified, and as elastic member for the protection are interposed between the previously-described elastic member and the electric circuit components, it is possible to make the compression bonding load more uniform by absorbing minute irregularities on the elastic member such as a leaf spring or the electric circuit components themselves. Moreover, since the compression bonding is made between elastic members producing the biasing force, a further uniform bonding load can be applied, whereby the method of the present invention can exhibit excellent effects.
  • the electric circuit components, laid one on the other, with the electrical connecting member carried therebetween, are pressed gradually on a part thereof in succession to make the compression bonding for all of the electrical joints, so that there is a less influence from the mechanical error, thermal distortion error and secular change, and a higher accuracy can be obtained in the compression bonding as compared with the collective bonding, with a less dispersion of the characteristics, because of a higher operation efficiency and a more uniform bonding load as compared with the single point junction.
  • the electrical connecting member is such that the carrier carrying conductive members embedded contains a thermosetting adhesive or has a coating layer of thermosetting adhesive on its surface
  • the connecting method of electric circuit components using the electrical connecting member is one in which the electric circuit components to be connected are laid on both sides of the carrier and then heated, and with the shrinkage of the carrier itself or the coating layer due to the curing of the adhesive, the electric circuit components are pressed against the conductive members, in which as the pressure for maintaining the contact and the heating for attaining the curing temperature of adhesive are only required, no special apparatus is necessary, and there is no risk that the pressure and the heating may damage the electric circuit components and the electrical connecting member, so that an excellent connecting state can be obtained between two components, with a decreased thermal stress in the conductive members, whereby excellent effects can be exhibited such as effective prevention of the occurrence of conduction failures and the increase in the electrical resistance after the connection, and the easy connection between electric circuit components inferior in the thermal resistivity such as a liquid crystal substrate.
  • the pitch of conductive member provided on the carrier and the protruding height of conductive member from the surface of the carrier are set so that the amount of deformation in the conductive member may reach 17% or greater, it is possible to make a secure compression bonding between the conductive members and the electrical joints of electric circuit components in the metallic solid phase diffused junction state, thereby enabling the uniform compression bonding at a lower pressure.

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Claims (11)

  1. Verfahren zur elektrischen Verbindung elektrischer Verbindungsstellen (6, 7) von elektrischen Bauelementen (4, 5) über ein elektrisches Verbindungselement (1), das eine Vielzahl von leitfähigen Elementen (3) hat, die in einem voneinander isolierten Zustand auf einem Träger (2) gehalten sind, wobei ein Endabschnitt der leitfähigen Elemente (3) auf einer Fläche des Trägers (2) freiliegt, und der andere Endabschnitt der leitfähigen Elemente (3) auf der anderen Fläche des Trägers (2) freiliegt, wobei das Verfahren gekennzeichnet ist durch die Schritte Komprimieren eines Abschnitts und Aufbringen von Wärme auf einen Abschnitt der elektrischen Bauelemente (4, 5) über das elektrische Verbindungselement (1), während die Position der Druckaufbringung verschoben wird, um einen Thermokompressionsverbund zwischen den elektrischen Bauelementen (4, 5) und dem elektrischen Anschlußelement (1) zu erzielen.
  2. Verbindungsverfahren gemäß Anspruch 1,
    ferner gekennzeichnet durch die Schritte
    Versehen des Trägers (2) des elektrischen Verbindungselements (1) mit einem wärmeaushärtenden Klebstoff (27) und Erwärmen des Trägers (2) bis auf eine festgelegte Temperatur, um das Aushärten und Schrumpfen des wärmeaushärtenden Klebstoffs (27) zu verursachen, so daß die elektrischen Bauelemente (4, 5) und das elektrische Verbindungselement (1) mittels Aushärten und Schrumpfen des wärmeaushärtenden Klebstoffs (27) verbunden werden.
  3. Verbindungsverfahren gemäß Anspruch 2,
    ferner gekennzeichnet durch den Schritt
    Auftragen des wärmeaushärtenden Klebstoffs (27) auf eine Verbindungsfläche des Trägers (2) des elektrischen Verbindungselements (1).
  4. Verbindungsverfahren gemäß Anspruch 2,
    dadurch gekennzeichnet, daß
    der wärmeaushärtende Klebstoff (27) in dem Träger (2) des elektrischen Verbindungselements (1) enthalten ist.
  5. Verbindungsverfahren gemäß einem der Ansprüche 1 bis 4,
    ferner gekennzeichnet durch den Schritt
    Komprimieren der elektrischen Bauelemente (4, 5) derart, daß der Betrag der Verformung bei dem Durchmesser der auf dem Träger (2) freiliegenden leitfähigen Elemente (2) gleich oder mehr als 17% ist.
  6. Verbindungsvorrichtung zur elektrischen Verbindung elektrischer Verbindungsstellen (6, 7) von elektrischen Bauelementen (4, 5) über ein elektrisches Verbindungselement (1), das eine Vielzahl von leitfähigen Elementen (3) hat, die in einem voneinander isolierten Zustand auf einem Träger (2) gehalten sind, wobei ein Endabschnitt der leitfähigen Elemente (3) auf einer Fläche des Trägers (2) freiliegt, und der andere Endabschnitt der leitfähigen Elemente (1) auf der anderen Fläche des Trägers (2) freiliegt,
    wobei die Verbindungsvorrichtung gekennzeichnet ist durch
    a) einen Druckmechanismus (17, 24, 25) zur Ausübung einer Vorspannkraft auf einen Abschnitt der elektrischen Bauelemente (4, 5), um die elektrische Verbindung zu erreichen,
    b) eine Einrichtung (21-23) zum Verschieben der Position der Druckaufbringung mittels des Druckmechanismus (17, 24, 25), während die Vorspannkraft auf den Abschnitt der elektrischen Bauelemente (4, 5) ausgeübt wird,
    c) eine Einrichtung (21c) zur Einstellung der auf die elektrischen Bauelemente (4, 5) aufzubringenden Vorspannkraft, und
    d) einen Heizabschnitt (16a, 17b) zur Erzielung des Thermokompressionsverbunds zwischen dem elektrischen Bauelementen (4, 5) und dem elektrischen Verbindungselement (1).
  7. Verbindungsvorrichtung gemäß Anspruch 6,
    dadurch gekennzeichnet, daß
    der Druckmechanismus eine gebogene Druckplatte (17a) hat, die auf einem Abschnitt der elektrischen Bauelemente (4, 5) anliegt.
  8. Verbindungsvorrichtung gemäß Anspruch 6,
    dadurch gekennzeichnet, daß
    der Druckmechanismus eine Druckrolle (24) hat, die auf einem Abschnitt der elektrischen Bauelemente (4, 5) anliegt.
  9. Verbindungsvorrichtung gemäß einem der Ansprüche 6 bis 8,
    dadurch gekennzeichnet, daß
    die leitfähigen Elemente (3) aus Gold gefertigt sind.
  10. Verbindungsvorrichtung gemäß einem der Ansprüche 6 bis 9,
    dadurch gekennzeichnet, daß
    der Träger (2) des elektrischen Verbindungselements (1) einen wärmeaushärtenden Klebstoff (27) enthält.
  11. Verbindungsvorrichtung gemäß einem der Ansprüche 6 bis 9,
    gekennzeichnet durch
    einen wärmeaushärtenden Klebstoff (27), welcher auf mindestens eine Fläche des Trägers (2) des elektrischen Verbindungselements (1) aufgetragen wird.
EP92103025A 1991-02-25 1992-02-24 Vorrichtung und Verfahren zur Verbindung elektrischer Bauelemente Expired - Lifetime EP0501358B1 (de)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP03053903A JP3113987B2 (ja) 1991-02-25 1991-02-25 電気的接続部材及びこれを用いた電気回路部品の接続方法
JP53903/91 1991-02-25
JP69089/91 1991-03-09
JP3069089A JPH04282582A (ja) 1991-03-09 1991-03-09 電気回路部品の接続方法
JP3089827A JPH04298976A (ja) 1991-03-27 1991-03-27 電気回路部品の接続方法
JP89827/91 1991-03-27
JP89826/91 1991-03-27
JP8982691A JPH04299546A (ja) 1991-03-27 1991-03-27 電気回路部品の熱圧着方法及びその装置
JP14694491A JPH04342971A (ja) 1991-05-21 1991-05-21 電気的接続部材の製造方法
JP146944/91 1991-05-21

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Publication Number Publication Date
EP0501358A2 EP0501358A2 (de) 1992-09-02
EP0501358A3 EP0501358A3 (en) 1992-12-16
EP0501358B1 true EP0501358B1 (de) 1997-01-15

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DE69216658T2 (de) 1997-08-07
EP0501358A2 (de) 1992-09-02
EP0501358A3 (en) 1992-12-16
US6015081A (en) 2000-01-18
DE69216658D1 (de) 1997-02-27

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