KR950034544A - 반도체 웨이퍼 및 반도체 디바이스 - Google Patents

반도체 웨이퍼 및 반도체 디바이스 Download PDF

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Publication number
KR950034544A
KR950034544A KR1019950011231A KR19950011231A KR950034544A KR 950034544 A KR950034544 A KR 950034544A KR 1019950011231 A KR1019950011231 A KR 1019950011231A KR 19950011231 A KR19950011231 A KR 19950011231A KR 950034544 A KR950034544 A KR 950034544A
Authority
KR
South Korea
Prior art keywords
conductive layer
semiconductor wafer
semiconductor
wafer according
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019950011231A
Other languages
English (en)
Korean (ko)
Inventor
가쯔히로 기지마
히또시 하또리
Original Assignee
윌리엄 이.힐러
텍사스 인스트루먼츠 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윌리엄 이.힐러, 텍사스 인스트루먼츠 인코포레이티드 filed Critical 윌리엄 이.힐러
Publication of KR950034544A publication Critical patent/KR950034544A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/277—Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Dicing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1019950011231A 1994-05-06 1995-05-06 반도체 웨이퍼 및 반도체 디바이스 Ceased KR950034544A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6117626A JPH07302773A (ja) 1994-05-06 1994-05-06 半導体ウエハ及び半導体装置
JP94-117626 1994-05-06

Publications (1)

Publication Number Publication Date
KR950034544A true KR950034544A (ko) 1995-12-28

Family

ID=14716396

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950011231A Ceased KR950034544A (ko) 1994-05-06 1995-05-06 반도체 웨이퍼 및 반도체 디바이스

Country Status (5)

Country Link
US (1) US5654582A (https=)
EP (1) EP0681323A3 (https=)
JP (1) JPH07302773A (https=)
KR (1) KR950034544A (https=)
TW (1) TW279246B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200059888A (ko) * 2018-11-22 2020-05-29 삼성전자주식회사 반도체 장치, 반도체 칩 및 반도체 기판의 반도체 기판의 소잉 방법

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3473218B2 (ja) * 1995-10-24 2003-12-02 日産自動車株式会社 半導体集積回路
US6133582A (en) 1998-05-14 2000-10-17 Lightspeed Semiconductor Corporation Methods and apparatuses for binning partially completed integrated circuits based upon test results
JP2001135597A (ja) * 1999-08-26 2001-05-18 Fujitsu Ltd 半導体装置の製造方法
TW451436B (en) * 2000-02-21 2001-08-21 Advanced Semiconductor Eng Manufacturing method for wafer-scale semiconductor packaging structure
TW559970B (en) * 2001-04-05 2003-11-01 Kawasaki Microelectronics Inc Test circuit, semiconductor product wafer having the test circuit, and method of monitoring manufacturing process using the test circuit
JP3726711B2 (ja) * 2001-05-31 2005-12-14 セイコーエプソン株式会社 半導体装置
KR100395880B1 (ko) 2001-09-11 2003-08-25 삼성전자주식회사 테스트 소자 그룹 구조
JP4443092B2 (ja) * 2002-03-25 2010-03-31 セイコーインスツル株式会社 半導体装置および製造方法
US20050023260A1 (en) * 2003-01-10 2005-02-03 Shinya Takyu Semiconductor wafer dividing apparatus and semiconductor device manufacturing method
KR100505665B1 (ko) * 2003-01-14 2005-08-03 삼성전자주식회사 테스트용 패드가 이면에 형성된 테이프 패키지 및 그검사방법
JP3940694B2 (ja) * 2003-04-18 2007-07-04 株式会社東芝 半導体装置及びその製造方法
JP2005158832A (ja) * 2003-11-21 2005-06-16 Matsushita Electric Ind Co Ltd 半導体ウエハとその製造方法および半導体チップの製造方法
JP4744078B2 (ja) * 2003-12-26 2011-08-10 パナソニック株式会社 半導体ウェーハ
US7075107B2 (en) * 2004-05-06 2006-07-11 Advanced Analog Technology, Inc Semiconductor wafer and manufacturing process thereof
JP2008085043A (ja) * 2006-09-27 2008-04-10 Oki Electric Ind Co Ltd 半導体ウェハ、半導体チップおよび半導体チップの製造方法。
US20080164469A1 (en) * 2007-01-08 2008-07-10 Myoung-Soo Kim Semiconductor device with measurement pattern in scribe region
US20080246031A1 (en) * 2007-04-09 2008-10-09 Hao-Yi Tsai PCM pad design for peeling prevention
US8017942B2 (en) * 2008-11-25 2011-09-13 Infineon Technologies Ag Semiconductor device and method
TWI501358B (zh) * 2011-04-08 2015-09-21 Unimicron Technology Crop 載板及其製作方法
JP2013168624A (ja) * 2012-01-20 2013-08-29 Semiconductor Components Industries Llc 半導体装置
KR101918608B1 (ko) 2012-02-28 2018-11-14 삼성전자 주식회사 반도체 패키지
US9075103B2 (en) * 2012-10-05 2015-07-07 United Microelectronics Corp. Test structure for wafer acceptance test and test process for probecard needles
WO2016079969A1 (ja) * 2014-11-19 2016-05-26 株式会社デンソー 半導体ウェハおよび半導体装置の製造方法
KR102677081B1 (ko) 2016-12-28 2024-06-21 삼성전자주식회사 소잉 라인 상에 비아 홀이 내재된 패드가 배치되는 스크라이브 레인 구조
US20210305138A1 (en) * 2020-03-24 2021-09-30 Intel Corporation Package land pad in closed-loop trace for high speed data signaling
CN111653548A (zh) * 2020-06-18 2020-09-11 京东方科技集团股份有限公司 一种显示基板、显示面板及其制备方法
US11714123B2 (en) 2020-09-02 2023-08-01 United Semiconductor Japan Co., Ltd. Probe position monitoring structure and method of monitoring position of probe

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2176653B (en) * 1985-06-20 1988-06-15 Gen Electric Plc Method of manufacturing integrated circuits
JPH0666392B2 (ja) * 1988-04-20 1994-08-24 日本電気株式会社 半導体装置の製造方法
US5003374A (en) * 1988-05-23 1991-03-26 North American Philips Corporation Semiconductor wafer
JP2905500B2 (ja) * 1988-07-27 1999-06-14 三菱電機株式会社 半導体装置の製造方法
US5016080A (en) * 1988-10-07 1991-05-14 Exar Corporation Programmable die size continuous array
US5414297A (en) * 1989-04-13 1995-05-09 Seiko Epson Corporation Semiconductor device chip with interlayer insulating film covering the scribe lines
US5136354A (en) * 1989-04-13 1992-08-04 Seiko Epson Corporation Semiconductor device wafer with interlayer insulating film covering the scribe lines
JPH0758725B2 (ja) * 1990-01-19 1995-06-21 株式会社東芝 半導体ウェハ
US5206181A (en) * 1991-06-03 1993-04-27 Motorola, Inc. Method for manufacturing a semiconductor device with a slotted metal test pad to prevent lift-off during wafer scribing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200059888A (ko) * 2018-11-22 2020-05-29 삼성전자주식회사 반도체 장치, 반도체 칩 및 반도체 기판의 반도체 기판의 소잉 방법

Also Published As

Publication number Publication date
TW279246B (https=) 1996-06-21
EP0681323A3 (en) 1998-04-15
US5654582A (en) 1997-08-05
EP0681323A2 (en) 1995-11-08
JPH07302773A (ja) 1995-11-14

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