KR930011295A - 박막 트랜지스터의 제조방법 - Google Patents
박막 트랜지스터의 제조방법 Download PDFInfo
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- KR930011295A KR930011295A KR1019920020521A KR920020521A KR930011295A KR 930011295 A KR930011295 A KR 930011295A KR 1019920020521 A KR1019920020521 A KR 1019920020521A KR 920020521 A KR920020521 A KR 920020521A KR 930011295 A KR930011295 A KR 930011295A
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- Prior art keywords
- thin film
- film transistor
- manufacturing
- laser
- amorphous silicon
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- 239000010409 thin film Substances 0.000 title claims abstract 11
- 238000004519 manufacturing process Methods 0.000 title claims abstract 9
- 229910021417 amorphous silicon Inorganic materials 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 3
- 239000002184 metal Substances 0.000 claims abstract description 3
- 230000003287 optical effect Effects 0.000 claims abstract 2
- 239000010410 layer Substances 0.000 claims 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims 2
- 238000001953 recrystallisation Methods 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- 229910001362 Ta alloys Inorganic materials 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052786 argon Inorganic materials 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- 230000009977 dual effect Effects 0.000 claims 1
- 238000010899 nucleation Methods 0.000 claims 1
- 230000006911 nucleation Effects 0.000 claims 1
- 239000011241 protective layer Substances 0.000 claims 1
- 239000010979 ruby Substances 0.000 claims 1
- 229910001750 ruby Inorganic materials 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 238000002425 crystallisation Methods 0.000 abstract description 2
- 230000008025 crystallization Effects 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 230000005669 field effect Effects 0.000 abstract 1
- 238000013532 laser treatment Methods 0.000 abstract 1
- 239000004973 liquid crystal related substance Substances 0.000 abstract 1
- 238000010956 selective crystallization Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02686—Pulsed laser beam
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02422—Non-crystalline insulating materials, e.g. glass, polymers
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02491—Conductive materials
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02502—Layer structure consisting of two layers
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02678—Beam shaping, e.g. using a mask
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02683—Continuous wave laser beam
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
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- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/127—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
- H01L27/1274—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor
- H01L27/1281—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor by using structural features to control crystal growth, e.g. placement of grain filters
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- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Recrystallisation Techniques (AREA)
Abstract
본 발명은 액정표시 소자용 박막 트랜지스터의 제조방법과 관련된 것으로서, 종래에는 이러한 박막 트랜지스터의 제조 공정이 복잡하고 레이저 빔에 의한 선택적 결정화수단을 이용하기 때문에 광결합부분의 존재로 전계 효과이동도가 낮아지는 등의 불리한 문제짐이 많았으나, 본 발명은 박막 트랜지스터 제조시 비정질 실리콘층 성장이후 레이저 처리를 광결함 부분을 오버랩하여 처리하는 방법으로 게이트 금속부의 실리콘층 결정화를 양호히 이를 수 있는 박막 트랜지스터의 제조법을 제공하는데 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제5도는 본 발명의 비정질실리콘 표면에 레이저빔을 순차 주사하는 방법을 나타낸 도면.
제6도는 본 발명의 게이트 금속에 대한 히트 싱크 효과를 나타낸 단면도와 평면도.
제7도는 본 발명의 결정화에 필요한 레이저 전력을 갖는 상태에서 빔크기를 증가시키는 관계를 설명한 도면.
Claims (7)
- 기판(21), 게이트 전극(22), 절연층(23), 비정질실리콘층(24)을 차례로 성장시키고, 상기 비정질실리콘(24)이 성형된 표면에는 레이저 빔을 직접 실린더리컬렌즈(11)의 이용으로 주사하여 비정질실리콘을 재결정 처리하면서 결정의 핵형성이 게이트 전극위에서 부터 일어나고 레이저 빔은 광결함 부분(x)을 고려하여 오버랩부분(y)이 존재하게 주사하거나, 또는 오버랩 부분(y)이 존재하지 않게 처리하는 방법을 특징으로 하는 박막 트랜지스터의 제조방법.
- 제1항에 있어서, 재결정화 처리시 레이저 빔이 입사되는 시료(1) 상방에 일정간격으로 프리즘(2)이 다수 배열된 광학계(3)를 이용한 것을 특징으로 하는 박막 트랜지스터의 제조방법.
- 제2항에 있어서, 프리즘(2)의 배열은 오버랩부분(y)과 일치함을 특징으로 하는 박막 트랜지스터의 제조방법.
- 제1항에 있어서, 상기 비정질실리콘(24)을 레이저로 조사하기 이전에 보호층을 입힌후 처리하는 방법을 특징으로 하는 박막 트랜지스터의 제조방법.
- 제1항에 있어서, 상기 박막 트랜지스터의 게이트 전극의 금속을 크롬, 탄탈륨, 탄탈륨합금, 알루미늄 또는 복합층으로 처리하는 방법을 특징으로 하는 박막 트랜지스터의 제조방법.
- 제1항 내지 제5항중 어느 한 항에 있어서, 상기 레이저빔을 출사하는 레이저 장치의 엑시머레이져, 아르곤레이져, 아그레이져, 루비레이져중 어느 하나로 처리하는 방법을 특징으로 하는 박막 트랜지스터의 제조방법.
- 제1항 내지 제5항 중 어느 한 항에 있어서, 박막 트랜지스터의 구조는 듀얼 게이트의 구조로 함을 특징으로하는 박막 트랜지스터의 제조 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019920020521A KR100269350B1 (ko) | 1991-11-26 | 1992-11-03 | 박막트랜지스터의제조방법 |
US08/147,635 US5432122A (en) | 1992-11-03 | 1993-11-03 | Method of making a thin film transistor by overlapping annealing using lasers |
JP29890593A JPH07106599A (ja) | 1992-11-03 | 1993-11-04 | 薄膜トランジスタの製造方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR910021315 | 1991-11-26 | ||
KR91-21315 | 1991-11-26 | ||
KR1019920020521A KR100269350B1 (ko) | 1991-11-26 | 1992-11-03 | 박막트랜지스터의제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR930011295A true KR930011295A (ko) | 1993-06-24 |
KR100269350B1 KR100269350B1 (ko) | 2000-10-16 |
Family
ID=19342408
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920020521A KR100269350B1 (ko) | 1991-11-26 | 1992-11-03 | 박막트랜지스터의제조방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5432122A (ko) |
JP (1) | JPH07106599A (ko) |
KR (1) | KR100269350B1 (ko) |
Families Citing this family (92)
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US6149988A (en) * | 1986-09-26 | 2000-11-21 | Semiconductor Energy Laboratory Co., Ltd. | Method and system of laser processing |
US6261856B1 (en) | 1987-09-16 | 2001-07-17 | Semiconductor Energy Laboratory Co., Ltd. | Method and system of laser processing |
JPH06124913A (ja) * | 1992-06-26 | 1994-05-06 | Semiconductor Energy Lab Co Ltd | レーザー処理方法 |
JPH06232069A (ja) * | 1993-02-04 | 1994-08-19 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
US5477073A (en) * | 1993-08-20 | 1995-12-19 | Casio Computer Co., Ltd. | Thin film semiconductor device including a driver and a matrix circuit |
KR100321541B1 (ko) * | 1994-03-09 | 2002-06-20 | 야마자끼 순페이 | 능동 매트릭스 디스플레이 장치의 작동 방법 |
US6723590B1 (en) * | 1994-03-09 | 2004-04-20 | Semiconductor Energy Laboratory Co., Ltd. | Method for laser-processing semiconductor device |
US6700133B1 (en) | 1994-03-11 | 2004-03-02 | Semiconductor Energy Laboratory Co., Ltd. | Method for producing semiconductor device |
JP3150840B2 (ja) * | 1994-03-11 | 2001-03-26 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP3195157B2 (ja) * | 1994-03-28 | 2001-08-06 | シャープ株式会社 | 半導体装置の製造方法およびその製造装置 |
TW280037B (en) * | 1994-04-22 | 1996-07-01 | Handotai Energy Kenkyusho Kk | Drive circuit of active matrix type display device and manufacturing method |
JP3326654B2 (ja) * | 1994-05-02 | 2002-09-24 | ソニー株式会社 | 表示用半導体チップの製造方法 |
JP3897826B2 (ja) * | 1994-08-19 | 2007-03-28 | 株式会社半導体エネルギー研究所 | アクティブマトリクス型の表示装置 |
US5756364A (en) * | 1994-11-29 | 1998-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Laser processing method of semiconductor device using a catalyst |
US6008101A (en) * | 1994-11-29 | 1999-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Laser processing method of semiconductor device |
JP3469337B2 (ja) | 1994-12-16 | 2003-11-25 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
TW305063B (ko) * | 1995-02-02 | 1997-05-11 | Handotai Energy Kenkyusho Kk | |
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KR100214074B1 (ko) * | 1995-11-03 | 1999-08-02 | 김영환 | 박막트랜지스터 및 그 제조방법 |
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JP3580033B2 (ja) * | 1996-06-20 | 2004-10-20 | ソニー株式会社 | 薄膜半導体装置及びその製造方法とレーザアニール装置 |
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US4309225A (en) * | 1979-09-13 | 1982-01-05 | Massachusetts Institute Of Technology | Method of crystallizing amorphous material with a moving energy beam |
US4439245A (en) * | 1982-01-25 | 1984-03-27 | Rca Corporation | Electromagnetic radiation annealing of semiconductor material |
JPS6346776A (ja) * | 1986-08-14 | 1988-02-27 | Nec Corp | 薄膜トランジスタの製造方法 |
JPH0233935A (ja) * | 1988-07-23 | 1990-02-05 | Seiko Epson Corp | 薄膜トランジスタの製造方法 |
-
1992
- 1992-11-03 KR KR1019920020521A patent/KR100269350B1/ko not_active IP Right Cessation
-
1993
- 1993-11-03 US US08/147,635 patent/US5432122A/en not_active Expired - Lifetime
- 1993-11-04 JP JP29890593A patent/JPH07106599A/ja active Pending
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KR100269350B1 (ko) | 2000-10-16 |
JPH07106599A (ja) | 1995-04-21 |
US5432122A (en) | 1995-07-11 |
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