KR930011295A - 박막 트랜지스터의 제조방법 - Google Patents

박막 트랜지스터의 제조방법 Download PDF

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KR930011295A
KR930011295A KR1019920020521A KR920020521A KR930011295A KR 930011295 A KR930011295 A KR 930011295A KR 1019920020521 A KR1019920020521 A KR 1019920020521A KR 920020521 A KR920020521 A KR 920020521A KR 930011295 A KR930011295 A KR 930011295A
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thin film
film transistor
manufacturing
laser
amorphous silicon
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KR1019920020521A
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KR100269350B1 (ko
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채기성
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이헌조
주식회사 금성사
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Publication of KR930011295A publication Critical patent/KR930011295A/ko
Priority to US08/147,635 priority patent/US5432122A/en
Priority to JP29890593A priority patent/JPH07106599A/ja
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Publication of KR100269350B1 publication Critical patent/KR100269350B1/ko

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  • Recrystallisation Techniques (AREA)

Abstract

본 발명은 액정표시 소자용 박막 트랜지스터의 제조방법과 관련된 것으로서, 종래에는 이러한 박막 트랜지스터의 제조 공정이 복잡하고 레이저 빔에 의한 선택적 결정화수단을 이용하기 때문에 광결합부분의 존재로 전계 효과이동도가 낮아지는 등의 불리한 문제짐이 많았으나, 본 발명은 박막 트랜지스터 제조시 비정질 실리콘층 성장이후 레이저 처리를 광결함 부분을 오버랩하여 처리하는 방법으로 게이트 금속부의 실리콘층 결정화를 양호히 이를 수 있는 박막 트랜지스터의 제조법을 제공하는데 있다.

Description

박막 트랜지스터의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제5도는 본 발명의 비정질실리콘 표면에 레이저빔을 순차 주사하는 방법을 나타낸 도면.
제6도는 본 발명의 게이트 금속에 대한 히트 싱크 효과를 나타낸 단면도와 평면도.
제7도는 본 발명의 결정화에 필요한 레이저 전력을 갖는 상태에서 빔크기를 증가시키는 관계를 설명한 도면.

Claims (7)

  1. 기판(21), 게이트 전극(22), 절연층(23), 비정질실리콘층(24)을 차례로 성장시키고, 상기 비정질실리콘(24)이 성형된 표면에는 레이저 빔을 직접 실린더리컬렌즈(11)의 이용으로 주사하여 비정질실리콘을 재결정 처리하면서 결정의 핵형성이 게이트 전극위에서 부터 일어나고 레이저 빔은 광결함 부분(x)을 고려하여 오버랩부분(y)이 존재하게 주사하거나, 또는 오버랩 부분(y)이 존재하지 않게 처리하는 방법을 특징으로 하는 박막 트랜지스터의 제조방법.
  2. 제1항에 있어서, 재결정화 처리시 레이저 빔이 입사되는 시료(1) 상방에 일정간격으로 프리즘(2)이 다수 배열된 광학계(3)를 이용한 것을 특징으로 하는 박막 트랜지스터의 제조방법.
  3. 제2항에 있어서, 프리즘(2)의 배열은 오버랩부분(y)과 일치함을 특징으로 하는 박막 트랜지스터의 제조방법.
  4. 제1항에 있어서, 상기 비정질실리콘(24)을 레이저로 조사하기 이전에 보호층을 입힌후 처리하는 방법을 특징으로 하는 박막 트랜지스터의 제조방법.
  5. 제1항에 있어서, 상기 박막 트랜지스터의 게이트 전극의 금속을 크롬, 탄탈륨, 탄탈륨합금, 알루미늄 또는 복합층으로 처리하는 방법을 특징으로 하는 박막 트랜지스터의 제조방법.
  6. 제1항 내지 제5항중 어느 한 항에 있어서, 상기 레이저빔을 출사하는 레이저 장치의 엑시머레이져, 아르곤레이져, 아그레이져, 루비레이져중 어느 하나로 처리하는 방법을 특징으로 하는 박막 트랜지스터의 제조방법.
  7. 제1항 내지 제5항 중 어느 한 항에 있어서, 박막 트랜지스터의 구조는 듀얼 게이트의 구조로 함을 특징으로하는 박막 트랜지스터의 제조 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920020521A 1991-11-26 1992-11-03 박막트랜지스터의제조방법 KR100269350B1 (ko)

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Application Number Priority Date Filing Date Title
KR1019920020521A KR100269350B1 (ko) 1991-11-26 1992-11-03 박막트랜지스터의제조방법
US08/147,635 US5432122A (en) 1992-11-03 1993-11-03 Method of making a thin film transistor by overlapping annealing using lasers
JP29890593A JPH07106599A (ja) 1992-11-03 1993-11-04 薄膜トランジスタの製造方法

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Application Number Priority Date Filing Date Title
KR910021315 1991-11-26
KR91-21315 1991-11-26
KR1019920020521A KR100269350B1 (ko) 1991-11-26 1992-11-03 박막트랜지스터의제조방법

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KR930011295A true KR930011295A (ko) 1993-06-24
KR100269350B1 KR100269350B1 (ko) 2000-10-16

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Families Citing this family (92)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6149988A (en) * 1986-09-26 2000-11-21 Semiconductor Energy Laboratory Co., Ltd. Method and system of laser processing
US6261856B1 (en) 1987-09-16 2001-07-17 Semiconductor Energy Laboratory Co., Ltd. Method and system of laser processing
JPH06124913A (ja) * 1992-06-26 1994-05-06 Semiconductor Energy Lab Co Ltd レーザー処理方法
JPH06232069A (ja) * 1993-02-04 1994-08-19 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
US5477073A (en) * 1993-08-20 1995-12-19 Casio Computer Co., Ltd. Thin film semiconductor device including a driver and a matrix circuit
KR100321541B1 (ko) * 1994-03-09 2002-06-20 야마자끼 순페이 능동 매트릭스 디스플레이 장치의 작동 방법
US6723590B1 (en) * 1994-03-09 2004-04-20 Semiconductor Energy Laboratory Co., Ltd. Method for laser-processing semiconductor device
US6700133B1 (en) 1994-03-11 2004-03-02 Semiconductor Energy Laboratory Co., Ltd. Method for producing semiconductor device
JP3150840B2 (ja) * 1994-03-11 2001-03-26 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP3195157B2 (ja) * 1994-03-28 2001-08-06 シャープ株式会社 半導体装置の製造方法およびその製造装置
TW280037B (en) * 1994-04-22 1996-07-01 Handotai Energy Kenkyusho Kk Drive circuit of active matrix type display device and manufacturing method
JP3326654B2 (ja) * 1994-05-02 2002-09-24 ソニー株式会社 表示用半導体チップの製造方法
JP3897826B2 (ja) * 1994-08-19 2007-03-28 株式会社半導体エネルギー研究所 アクティブマトリクス型の表示装置
US5756364A (en) * 1994-11-29 1998-05-26 Semiconductor Energy Laboratory Co., Ltd. Laser processing method of semiconductor device using a catalyst
US6008101A (en) * 1994-11-29 1999-12-28 Semiconductor Energy Laboratory Co., Ltd. Laser processing method of semiconductor device
JP3469337B2 (ja) 1994-12-16 2003-11-25 株式会社半導体エネルギー研究所 半導体装置の作製方法
TW305063B (ko) * 1995-02-02 1997-05-11 Handotai Energy Kenkyusho Kk
TW297138B (ko) * 1995-05-31 1997-02-01 Handotai Energy Kenkyusho Kk
US6524977B1 (en) * 1995-07-25 2003-02-25 Semiconductor Energy Laboratory Co., Ltd. Method of laser annealing using linear beam having quasi-trapezoidal energy profile for increased depth of focus
JP3865803B2 (ja) * 1995-08-29 2007-01-10 株式会社半導体エネルギー研究所 光処理方法および半導体装置の作製方法
JP3348334B2 (ja) * 1995-09-19 2002-11-20 ソニー株式会社 薄膜半導体装置の製造方法
KR100214074B1 (ko) * 1995-11-03 1999-08-02 김영환 박막트랜지스터 및 그 제조방법
US5817548A (en) * 1995-11-10 1998-10-06 Sony Corporation Method for fabricating thin film transistor device
US6555449B1 (en) 1996-05-28 2003-04-29 Trustees Of Columbia University In The City Of New York Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidfication
JP3580033B2 (ja) * 1996-06-20 2004-10-20 ソニー株式会社 薄膜半導体装置及びその製造方法とレーザアニール装置
US6759628B1 (en) * 1996-06-20 2004-07-06 Sony Corporation Laser annealing apparatus
JP3349355B2 (ja) 1996-08-19 2002-11-25 三洋電機株式会社 半導体膜のレーザーアニール方法
JP3487173B2 (ja) * 1997-05-26 2004-01-13 セイコーエプソン株式会社 Tab用テープキャリア、集積回路装置及び電子機器
JP3503427B2 (ja) * 1997-06-19 2004-03-08 ソニー株式会社 薄膜トランジスタの製造方法
JPH1184418A (ja) * 1997-09-08 1999-03-26 Sanyo Electric Co Ltd 表示装置
KR100269312B1 (ko) * 1997-10-14 2000-10-16 윤종용 실리콘막의결정화방법및이를이용한박막트랜지스터-액정표시장치(tft-lcd)의제조방법
WO1999031719A1 (fr) * 1997-12-17 1999-06-24 Matsushita Electric Industrial Co., Ltd. Couche mince de semi-conducteur, son procede et son dispositif de fabrication, composant a semi-conducteur et son procede de fabrication
KR19990058636A (ko) 1997-12-30 1999-07-15 구자홍 레이저 조사 방법
JPH11214700A (ja) 1998-01-23 1999-08-06 Semiconductor Energy Lab Co Ltd 半導体表示装置
JPH11338439A (ja) * 1998-03-27 1999-12-10 Semiconductor Energy Lab Co Ltd 半導体表示装置の駆動回路および半導体表示装置
JP3844613B2 (ja) 1998-04-28 2006-11-15 株式会社半導体エネルギー研究所 薄膜トランジスタ回路およびそれを用いた表示装置
KR100296110B1 (ko) 1998-06-09 2001-08-07 구본준, 론 위라하디락사 박막트랜지스터 제조방법
US6326286B1 (en) 1998-06-09 2001-12-04 Lg. Philips Lcd Co., Ltd. Method for crystallizing amorphous silicon layer
KR100292048B1 (ko) 1998-06-09 2001-07-12 구본준, 론 위라하디락사 박막트랜지스터액정표시장치의제조방법
KR100296109B1 (ko) 1998-06-09 2001-10-26 구본준, 론 위라하디락사 박막트랜지스터제조방법
FR2780736B1 (fr) * 1998-07-03 2000-09-29 Thomson Csf Procede de cristallisation d'un materiau semiconducteur et systeme de cristallisation
KR100430231B1 (ko) * 1998-10-02 2004-07-19 엘지.필립스 엘시디 주식회사 레이저어닐장비
US6299681B1 (en) * 1998-11-27 2001-10-09 General Electric Company Single crystal conversion control
US6506635B1 (en) * 1999-02-12 2003-01-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, and method of forming the same
JP4827276B2 (ja) 1999-07-05 2011-11-30 株式会社半導体エネルギー研究所 レーザー照射装置、レーザー照射方法及び半導体装置の作製方法
JP2001023918A (ja) * 1999-07-08 2001-01-26 Nec Corp 半導体薄膜形成装置
TW544727B (en) 1999-08-13 2003-08-01 Semiconductor Energy Lab Method of manufacturing a semiconductor device
EP1076359B1 (en) * 1999-08-13 2011-02-23 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation device
CN100382245C (zh) * 1999-08-13 2008-04-16 株式会社半导体能源研究所 半导体器件的制造方法
US6548370B1 (en) 1999-08-18 2003-04-15 Semiconductor Energy Laboratory Co., Ltd. Method of crystallizing a semiconductor layer by applying laser irradiation that vary in energy to its top and bottom surfaces
KR100303142B1 (ko) 1999-10-29 2001-11-02 구본준, 론 위라하디락사 액정표시패널의 제조방법
US6780687B2 (en) 2000-01-28 2004-08-24 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device having a heat absorbing layer
US6872607B2 (en) * 2000-03-21 2005-03-29 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
US7078321B2 (en) 2000-06-19 2006-07-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
US6831299B2 (en) * 2000-11-09 2004-12-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7009140B2 (en) * 2001-04-18 2006-03-07 Cymer, Inc. Laser thin film poly-silicon annealing optical system
US7061959B2 (en) * 2001-04-18 2006-06-13 Tcz Gmbh Laser thin film poly-silicon annealing system
US20050259709A1 (en) * 2002-05-07 2005-11-24 Cymer, Inc. Systems and methods for implementing an interaction between a laser shaped as a line beam and a film deposited on a substrate
US7088758B2 (en) 2001-07-27 2006-08-08 Cymer, Inc. Relax gas discharge laser lithography light source
JP4209606B2 (ja) * 2001-08-17 2009-01-14 株式会社半導体エネルギー研究所 半導体装置の作製方法
TWI282126B (en) * 2001-08-30 2007-06-01 Semiconductor Energy Lab Method for manufacturing semiconductor device
US7317205B2 (en) * 2001-09-10 2008-01-08 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and method of manufacturing a semiconductor device
US7112517B2 (en) 2001-09-10 2006-09-26 Semiconductor Energy Laboratory Co., Ltd. Laser treatment device, laser treatment method, and semiconductor device fabrication method
JP4135347B2 (ja) * 2001-10-02 2008-08-20 株式会社日立製作所 ポリシリコン膜生成方法
US7050878B2 (en) * 2001-11-22 2006-05-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductror fabricating apparatus
US7133737B2 (en) 2001-11-30 2006-11-07 Semiconductor Energy Laboratory Co., Ltd. Program for controlling laser apparatus and recording medium for recording program for controlling laser apparatus and capable of being read out by computer
US7214573B2 (en) * 2001-12-11 2007-05-08 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device that includes patterning sub-islands
US6933527B2 (en) * 2001-12-28 2005-08-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and semiconductor device production system
US6841797B2 (en) 2002-01-17 2005-01-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device formed over a surface with a drepession portion and a projection portion
TWI272666B (en) 2002-01-28 2007-02-01 Semiconductor Energy Lab Semiconductor device and method of manufacturing the same
TWI261358B (en) * 2002-01-28 2006-09-01 Semiconductor Energy Lab Semiconductor device and method of manufacturing the same
US7749818B2 (en) 2002-01-28 2010-07-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
KR100979926B1 (ko) * 2002-03-05 2010-09-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체소자 및 그것을 사용한 반도체장치
US6930326B2 (en) * 2002-03-26 2005-08-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor circuit and method of fabricating the same
US6977775B2 (en) * 2002-05-17 2005-12-20 Sharp Kabushiki Kaisha Method and apparatus for crystallizing semiconductor with laser beams
US7023500B2 (en) * 2002-06-05 2006-04-04 Hitachi, Ltd. Display device with active-matrix transistor having silicon film modified by selective laser irradiation
TW575866B (en) * 2002-06-05 2004-02-11 Hitachi Ltd Display device with active-matrix transistor and method for manufacturing the same
US7232715B2 (en) * 2002-11-15 2007-06-19 Semiconductor Energy Laboratory Co., Ltd. Method for fabricating semiconductor film and semiconductor device and laser processing apparatus
KR100542984B1 (ko) * 2003-02-26 2006-01-20 삼성에스디아이 주식회사 다결정 실리콘 박막의 제조 방법 및 그 제조 방법에 의해제조된 다결정 실리콘 박막을 사용하여 제조되는 박막트랜지스터
JP4511803B2 (ja) * 2003-04-14 2010-07-28 株式会社半導体エネルギー研究所 D/a変換回路及びそれを内蔵した半導体装置の製造方法
US7277188B2 (en) * 2003-04-29 2007-10-02 Cymer, Inc. Systems and methods for implementing an interaction between a laser shaped as a line beam and a film deposited on a substrate
TWI351713B (en) 2003-09-16 2011-11-01 Univ Columbia Method and system for providing a single-scan, con
WO2005029551A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Processes and systems for laser crystallization processing of film regions on a substrate utilizing a line-type beam, and structures of such film regions
JP2005217214A (ja) * 2004-01-30 2005-08-11 Hitachi Ltd 半導体薄膜の製造方法及び画像表示装置
KR101041066B1 (ko) * 2004-02-13 2011-06-13 삼성전자주식회사 실리콘 결정화 방법, 이를 이용한 실리콘 결정화 장치,이를 이용한 박막 트랜지스터, 박막 트랜지스터의 제조방법 및 이를 이용한 표시장치
US7317179B2 (en) 2005-10-28 2008-01-08 Cymer, Inc. Systems and methods to shape laser light as a homogeneous line beam for interaction with a film deposited on a substrate
US7679029B2 (en) 2005-10-28 2010-03-16 Cymer, Inc. Systems and methods to shape laser light as a line beam for interaction with a substrate having surface variations
JP2008270540A (ja) * 2007-04-20 2008-11-06 Sony Corp 半導体装置の製造方法および表示装置
JP5499432B2 (ja) * 2007-10-05 2014-05-21 ソニー株式会社 撮像装置
US8395156B2 (en) * 2009-11-24 2013-03-12 Semiconductor Energy Laboratory Co., Ltd. Display device
EP2966671B1 (en) * 2013-03-07 2022-08-31 Mitsubishi Electric Corporation Laser annealing device, and method of producing semiconductor device
US11433486B2 (en) * 2016-11-03 2022-09-06 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus, stack processing apparatus, and laser processing method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4309225A (en) * 1979-09-13 1982-01-05 Massachusetts Institute Of Technology Method of crystallizing amorphous material with a moving energy beam
US4439245A (en) * 1982-01-25 1984-03-27 Rca Corporation Electromagnetic radiation annealing of semiconductor material
JPS6346776A (ja) * 1986-08-14 1988-02-27 Nec Corp 薄膜トランジスタの製造方法
JPH0233935A (ja) * 1988-07-23 1990-02-05 Seiko Epson Corp 薄膜トランジスタの製造方法

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