KR920018827A - 처리시스템 - Google Patents
처리시스템 Download PDFInfo
- Publication number
- KR920018827A KR920018827A KR1019920003309A KR920003309A KR920018827A KR 920018827 A KR920018827 A KR 920018827A KR 1019920003309 A KR1019920003309 A KR 1019920003309A KR 920003309 A KR920003309 A KR 920003309A KR 920018827 A KR920018827 A KR 920018827A
- Authority
- KR
- South Korea
- Prior art keywords
- load lock
- lock chamber
- carrying
- casing
- processing system
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B35/00—Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
- C30B35/005—Transport systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67213—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one ion or electron beam chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 처리시스템의 실시예를 나타낸 개략 평면도.
제2도는 제1도의 나타낸 로드로크챔버의 일부의 구성예를 나타낸 측면도.
제3도는 공지의 이온주입장치의 전체 구성을 나타낸 개략도.
Claims (12)
- 피처리체가 수납되고, 그 내부에서 이 피처리체가 처리되는 고감압분위기로 조정가능한 공간을 규정하는 제1케이싱과, 상기 제1케이싱과 상기 피처리체의 반송로를 통하여 접속되고, 고감압분위기로 조정가능한 공간을 규정하는 제2케이싱과, 상기 제2케이싱에 형성된 상기 피처리체의 반입구와, 상기 제2케이싱에 형성된 상기 피처리체의 반출구와, 상기 반입구 및 반출구는 서로 따로 형성되어 있는 것과, 상기 반입구에 접속되고, 이것을 개폐하는 게이트(G)를 가지는 제1로드로크챔버(10),(11)와, 상기 반출구에 접속되고, 이것을 개폐하는 게이트를 가지는 제2로드로크챔버(16),(17)와, 상기 제1 및 제2로드로크챔버(10),(11),(16),(17)는 다른 공간을 규정하거나, 서로 독립적으로 내부 분위기를 조정가능하는 것과, 상기 제1로드로크챔버(10),(11)로부터 상기 반입구를 통하여 상기 제2케이싱내로 상기 피처리체를 반입하기 위하여 상기 제2케이싱내에 배열설치된 제1실어서 이송하는 수단(12)과 상기 제2케이싱내로부터 상기 반출구를 통하여 상기 제2로드로크챔버(16),(17)내로 상기 피처리체를 반출하기 위하여 상기 제2케이싱내에 배설된 제2실어서 이송하는 수단(13)과, 상기 제1및 제2실어서 이송하는 수단(12),(13)이 서로 별개체이며, 독립적으로 작동가능한 것과, 상기 제1 및 제2케이싱외의 공간으로 연결되어 통하도록 상기 제1로드로크챔버(10),(11)에 형성된 반입포트와, 상기 반입포트는 게이트(G)에 의하여 개폐되는 것과, 상기 반입포트를 통하여 상기 제2로드로크챔버(16),(17)내로 상기 피처리체를 반입하는 반입수단과, 상기 제1 및 제2케이싱외의 공간으로 연결되어 통하도록 상기 제1로드로크챔버(10),(11)에 형성된 반출포트와, 상기 반출포트는 게이트(G)에 의하여 개폐되는 것과, 상기 반출포트를 통하여 상기 제2로드로크챔버(16),(17)내로 상기 피처리체를 반출하는 반출수단과, 를 구비하는 처리시스템.
- 제1항에 있어서, 상기 제1로드로크챔버(10),(11)는, 상기 피처리체의 위치오차를 검출하는 검출수단을 가지하는 처리시스템.
- 제1항에 있어서, 상기 반입구 및 반출구, 상기 제1 및 제2로드로크챔버(10),(11),(16),(17)상기 반입포트 및 반출포트, 상기 제1및 제2실어서 이송하는 수단(12),(13), 상기 반입수단 및 반출수단의 각 쌍이 좌우대칭으로 배치되는 처리시스템.
- 제1항에 있어서, 상기 반입구 및 반출구, 상기 제1및 제2로드로크챔버(10),(11),(16),(17), 상기 반입포트 및 반출포트가 각각 여러개가 배열설치되는 처리시스템.
- 제1항에 있어서, 상기 제1로드로크챔버(10),(11)가 한 개의 피처리체를 수납하는 구조를 이루는 처리시스템.
- 제1항에 있어서, 상기 제2로드로크챔버(16),(17)가 여러개의 피처리체를 수납하는 구조를 이루는 처리시스템.
- 제1항에 있어서, 상기 제1로드로크챔버(10),(11)가 여러개의 피처리체를 수납하는 구조를 이루는 처리시스템.
- 제1항에 있어서, 상기 제2로드로크챔버(16),(17)가 한 개의 피처리체를 수납하는 구조를 이루는 처리시스템.
- 제1항에 있어서, 상기 제1 및 제2케이싱내가 공통된 분위기를 가지는 처리시스템.
- 제9항에 있어서, 상기 제1케이싱이 이온주입장치가 처리탱크(1)를 구비하고, 상기 처리탱크(1)내에 여러개의 상기 피처리체를 재치하는 재치대가 배열 설치되는 처리시스템.
- 제10항에 있어서, 상기 제1실어서 이송하는 수단(12)이 상기 제1로드로크챔버(10), (11)로부터 상기 재치대상에 상기 피처리체를 반송하고, 상기 제2실어서 이송하는 수단(13)이 상기 재치대상으로부터 상기 제2로드로크챔버(16),(17)내에 상기 피처리체를 반송하는 처리시스템.
- 제11항에 있어서, 상기 재치대상에 상기 피처리체의 더미로서 재치하는 더미체를 수납하는 수납부가 상기 제2케이싱내에 배열설치되고, 상기 제1실어서 이송하는 수단(12)이 상기 수납부로부터 상기 재치대상에 상기 더미체를 반송하고, 상기 제2실어서 이송하는 수단(13)이 상기 재치대상으로부터 상기 수납부에 상기 더미체를 반송하는 처리시스템.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3062660A JPH05275511A (ja) | 1991-03-01 | 1991-03-01 | 被処理体の移載システム及び処理装置 |
JP91-62660 | 1991-03-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920018827A true KR920018827A (ko) | 1992-10-22 |
KR0170411B1 KR0170411B1 (ko) | 1999-03-30 |
Family
ID=13206680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920003309A KR0170411B1 (ko) | 1991-03-01 | 1992-02-29 | 처리시스템 |
Country Status (5)
Country | Link |
---|---|
US (2) | US5248886A (ko) |
EP (1) | EP0502412B1 (ko) |
JP (1) | JPH05275511A (ko) |
KR (1) | KR0170411B1 (ko) |
DE (1) | DE69210290T2 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100333158B1 (ko) * | 1995-09-08 | 2002-04-18 | 야마자끼 순페이 | 반도체 장치 제작 방법 |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2644912B2 (ja) * | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
US7089680B1 (en) * | 1990-08-29 | 2006-08-15 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
US5516732A (en) * | 1992-12-04 | 1996-05-14 | Sony Corporation | Wafer processing machine vacuum front end method and apparatus |
TW276353B (ko) | 1993-07-15 | 1996-05-21 | Hitachi Seisakusyo Kk | |
DE4340522A1 (de) * | 1993-11-29 | 1995-06-01 | Leybold Ag | Vorrichtung und Verfahren zum schrittweisen und automatischen Be- und Entladen einer Beschichtungsanlage |
JP3288554B2 (ja) * | 1995-05-29 | 2002-06-04 | 株式会社日立製作所 | イオン注入装置及びイオン注入方法 |
JPH09102530A (ja) * | 1995-06-07 | 1997-04-15 | Varian Assoc Inc | ウェーハの向き検査システム |
JPH0936198A (ja) | 1995-07-19 | 1997-02-07 | Hitachi Ltd | 真空処理装置およびそれを用いた半導体製造ライン |
US6672819B1 (en) | 1995-07-19 | 2004-01-06 | Hitachi, Ltd. | Vacuum processing apparatus and semiconductor manufacturing line using the same |
US5746565A (en) * | 1996-01-22 | 1998-05-05 | Integrated Solutions, Inc. | Robotic wafer handler |
KR100213439B1 (ko) * | 1996-10-24 | 1999-08-02 | 윤종용 | 더미 웨이퍼를 사용하지 않는 웨이퍼상에 막형성 방법 |
US5943230A (en) * | 1996-12-19 | 1999-08-24 | Applied Materials, Inc. | Computer-implemented inter-chamber synchronization in a multiple chamber substrate processing system |
KR100246860B1 (ko) * | 1997-01-14 | 2000-03-15 | 윤종용 | 스퍼터링장치의 웨이퍼 이송장치 |
US6239441B1 (en) * | 1997-01-20 | 2001-05-29 | Kabushiki Kaisha Toshiba | Apparatus for manufacturing a semiconductor device and a method for manufacturing a semiconductor device |
KR100251274B1 (ko) * | 1997-02-14 | 2000-04-15 | 윤종용 | 매엽식반도체시스템의시퀀스처리방법 |
JP3737604B2 (ja) * | 1997-06-03 | 2006-01-18 | 大日本スクリーン製造株式会社 | 基板処理装置 |
CH692741A5 (de) * | 1997-07-08 | 2002-10-15 | Unaxis Trading Ltd C O Balzers | Verfahren zur Herstellung in Vakuum oberflächenbehandelter Werkstücke und Vakuumbehandlungsanlage zu dessen Durchführung |
US5882413A (en) * | 1997-07-11 | 1999-03-16 | Brooks Automation, Inc. | Substrate processing apparatus having a substrate transport with a front end extension and an internal substrate buffer |
US6313469B1 (en) * | 1998-03-13 | 2001-11-06 | Ebara Corporation | Substrate handling apparatus and ion implantation apparatus |
US6672358B2 (en) | 1998-11-06 | 2004-01-06 | Canon Kabushiki Kaisha | Sample processing system |
JP2000150836A (ja) * | 1998-11-06 | 2000-05-30 | Canon Inc | 試料の処理システム |
TW484184B (en) | 1998-11-06 | 2002-04-21 | Canon Kk | Sample separating apparatus and method, and substrate manufacturing method |
TW442891B (en) * | 1998-11-17 | 2001-06-23 | Tokyo Electron Ltd | Vacuum processing system |
EP1189275A1 (en) * | 2000-03-29 | 2002-03-20 | Daikin Industries, Ltd. | Substrate transfer device |
JP2002043229A (ja) * | 2000-07-25 | 2002-02-08 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
US6516244B1 (en) * | 2000-08-25 | 2003-02-04 | Wafermasters, Inc. | Wafer alignment system and method |
US6609877B1 (en) * | 2000-10-04 | 2003-08-26 | The Boc Group, Inc. | Vacuum chamber load lock structure and article transport mechanism |
US6591161B2 (en) | 2001-01-31 | 2003-07-08 | Wafermasters, Inc. | Method for determining robot alignment |
KR100781351B1 (ko) * | 2001-04-02 | 2007-11-30 | 엘지.필립스 엘시디 주식회사 | 패턴 검사장치 |
JP4937459B2 (ja) * | 2001-04-06 | 2012-05-23 | 東京エレクトロン株式会社 | クラスタツールおよび搬送制御方法 |
JP2002353081A (ja) | 2001-05-25 | 2002-12-06 | Canon Inc | 板部材の分離装置及び分離方法 |
JP2002353423A (ja) * | 2001-05-25 | 2002-12-06 | Canon Inc | 板部材の分離装置及び処理方法 |
ATE339773T1 (de) * | 2001-11-29 | 2006-10-15 | Diamond Semiconductor Group Ll | Waferhandhabungsvorrichtung und verfahren dafür |
US6729824B2 (en) | 2001-12-14 | 2004-05-04 | Applied Materials, Inc. | Dual robot processing system |
JP4070994B2 (ja) * | 2001-12-20 | 2008-04-02 | 株式会社ダイヘン | ワーク搬送用ロボット及びこのロボットを備えたワーク加工装置 |
JP2003264214A (ja) | 2002-03-07 | 2003-09-19 | Hitachi High-Technologies Corp | 真空処理装置及び真空処理方法 |
JP4040499B2 (ja) * | 2003-03-06 | 2008-01-30 | キヤノン株式会社 | ロードロック室、処理システム及び処理方法 |
US6748293B1 (en) * | 2003-03-24 | 2004-06-08 | Varian Semiconductor Equipment Associates, Inc. | Methods and apparatus for high speed object handling |
US7010388B2 (en) * | 2003-05-22 | 2006-03-07 | Axcelis Technologies, Inc. | Work-piece treatment system having load lock and buffer |
TWI290901B (en) * | 2003-06-23 | 2007-12-11 | Au Optronics Corp | Warehousing conveyor system |
TW200532043A (en) | 2004-02-10 | 2005-10-01 | Ulvac Inc | Thin film forming apparatus |
JP4281065B2 (ja) * | 2004-10-18 | 2009-06-17 | 村田機械株式会社 | 搬送車システム |
CN100591799C (zh) * | 2005-06-15 | 2010-02-24 | 株式会社爱发科 | 成膜装置、薄膜的制造装置及成膜方法 |
KR100673006B1 (ko) * | 2005-07-15 | 2007-01-24 | 삼성전자주식회사 | 이온 주입 장치 |
US7949425B2 (en) * | 2006-12-06 | 2011-05-24 | Axcelis Technologies, Inc. | High throughput wafer notch aligner |
US20080138178A1 (en) * | 2006-12-06 | 2008-06-12 | Axcelis Technologies,Inc. | High throughput serial wafer handling end station |
JP4546556B2 (ja) * | 2008-04-18 | 2010-09-15 | 株式会社日立ハイテクノロジーズ | 真空処理装置及び真空処理方法 |
JP5336885B2 (ja) | 2009-03-03 | 2013-11-06 | 東京エレクトロン株式会社 | 基板搬送装置及び基板搬送方法 |
JP5249098B2 (ja) * | 2009-03-17 | 2013-07-31 | 東京エレクトロン株式会社 | 基板処理システム及び基板処理方法 |
JP5433290B2 (ja) * | 2009-04-20 | 2014-03-05 | 東京エレクトロン株式会社 | 基板収納方法及び制御装置 |
JP5223778B2 (ja) * | 2009-05-28 | 2013-06-26 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
JP5187274B2 (ja) | 2009-05-28 | 2013-04-24 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
JP5101567B2 (ja) * | 2009-06-23 | 2012-12-19 | シャープ株式会社 | 搬送装置および搬送方法 |
JP5394969B2 (ja) * | 2010-03-30 | 2014-01-22 | 大日本スクリーン製造株式会社 | 基板処理装置、基板処理システム、および基板処理方法 |
US9004788B2 (en) | 2010-06-08 | 2015-04-14 | Tokyo Electron Limited | Substrate processing apparatus, substrate processing method, and storage medium |
JP5348290B2 (ja) * | 2012-07-17 | 2013-11-20 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
WO2014157358A1 (ja) * | 2013-03-28 | 2014-10-02 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法及び記録媒体 |
JP6271322B2 (ja) * | 2014-03-31 | 2018-01-31 | 東京エレクトロン株式会社 | 基板処理システム |
US9378992B2 (en) | 2014-06-27 | 2016-06-28 | Axcelis Technologies, Inc. | High throughput heated ion implantation system and method |
US9607803B2 (en) | 2015-08-04 | 2017-03-28 | Axcelis Technologies, Inc. | High throughput cooled ion implantation system and method |
JP6598242B2 (ja) * | 2015-08-19 | 2019-10-30 | 芝浦メカトロニクス株式会社 | 基板処理装置、および基板処理方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4433951A (en) * | 1981-02-13 | 1984-02-28 | Lam Research Corporation | Modular loadlock |
US4553069A (en) * | 1984-01-05 | 1985-11-12 | General Ionex Corporation | Wafer holding apparatus for ion implantation |
US5004924A (en) * | 1985-01-28 | 1991-04-02 | Tokyo Electron Limited | Wafer transport apparatus for ion implantation apparatus |
JPS6235513A (ja) * | 1985-08-09 | 1987-02-16 | Hitachi Ltd | 分子線エピタキシ装置 |
US4700077A (en) * | 1986-03-05 | 1987-10-13 | Eaton Corporation | Ion beam implanter control system |
US4705951A (en) * | 1986-04-17 | 1987-11-10 | Varian Associates, Inc. | Wafer processing system |
US4745287A (en) * | 1986-10-23 | 1988-05-17 | Ionex/Hei | Ion implantation with variable implant angle |
US4831270A (en) * | 1987-05-21 | 1989-05-16 | Ion Implant Services | Ion implantation apparatus |
US4986715A (en) * | 1988-07-13 | 1991-01-22 | Tokyo Electron Limited | Stock unit for storing carriers |
US5064337A (en) * | 1988-07-19 | 1991-11-12 | Tokyo Electron Limited | Handling apparatus for transferring carriers and a method of transferring carriers |
-
1991
- 1991-03-01 JP JP3062660A patent/JPH05275511A/ja active Pending
-
1992
- 1992-02-26 EP EP92103255A patent/EP0502412B1/en not_active Expired - Lifetime
- 1992-02-26 DE DE69210290T patent/DE69210290T2/de not_active Expired - Fee Related
- 1992-02-27 US US07/842,421 patent/US5248886A/en not_active Expired - Lifetime
- 1992-02-29 KR KR1019920003309A patent/KR0170411B1/ko not_active IP Right Cessation
-
1993
- 1993-08-20 US US08/109,733 patent/US5357115A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100333158B1 (ko) * | 1995-09-08 | 2002-04-18 | 야마자끼 순페이 | 반도체 장치 제작 방법 |
Also Published As
Publication number | Publication date |
---|---|
DE69210290T2 (de) | 1996-10-02 |
JPH05275511A (ja) | 1993-10-22 |
US5248886A (en) | 1993-09-28 |
EP0502412A1 (en) | 1992-09-09 |
EP0502412B1 (en) | 1996-05-01 |
US5357115A (en) | 1994-10-18 |
DE69210290D1 (de) | 1996-06-05 |
KR0170411B1 (ko) | 1999-03-30 |
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