DE69210290D1 - Behandlungsvorrichtung - Google Patents

Behandlungsvorrichtung

Info

Publication number
DE69210290D1
DE69210290D1 DE69210290T DE69210290T DE69210290D1 DE 69210290 D1 DE69210290 D1 DE 69210290D1 DE 69210290 T DE69210290 T DE 69210290T DE 69210290 T DE69210290 T DE 69210290T DE 69210290 D1 DE69210290 D1 DE 69210290D1
Authority
DE
Germany
Prior art keywords
treatment device
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69210290T
Other languages
English (en)
Other versions
DE69210290T2 (de
Inventor
Teruo Asakawa
Tetsuo Osawa
Noboru Hosaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of DE69210290D1 publication Critical patent/DE69210290D1/de
Application granted granted Critical
Publication of DE69210290T2 publication Critical patent/DE69210290T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B35/00—Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
    • C30B35/005—Transport systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67213—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one ion or electron beam chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
DE69210290T 1991-03-01 1992-02-26 Behandlungsvorrichtung Expired - Fee Related DE69210290T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3062660A JPH05275511A (ja) 1991-03-01 1991-03-01 被処理体の移載システム及び処理装置

Publications (2)

Publication Number Publication Date
DE69210290D1 true DE69210290D1 (de) 1996-06-05
DE69210290T2 DE69210290T2 (de) 1996-10-02

Family

ID=13206680

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69210290T Expired - Fee Related DE69210290T2 (de) 1991-03-01 1992-02-26 Behandlungsvorrichtung

Country Status (5)

Country Link
US (2) US5248886A (de)
EP (1) EP0502412B1 (de)
JP (1) JPH05275511A (de)
KR (1) KR0170411B1 (de)
DE (1) DE69210290T2 (de)

Families Citing this family (62)

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JP2644912B2 (ja) * 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
US7089680B1 (en) * 1990-08-29 2006-08-15 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US5516732A (en) * 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
JP3654597B2 (ja) 1993-07-15 2005-06-02 株式会社ルネサステクノロジ 製造システムおよび製造方法
DE4340522A1 (de) * 1993-11-29 1995-06-01 Leybold Ag Vorrichtung und Verfahren zum schrittweisen und automatischen Be- und Entladen einer Beschichtungsanlage
JP3288554B2 (ja) * 1995-05-29 2002-06-04 株式会社日立製作所 イオン注入装置及びイオン注入方法
JPH09102530A (ja) * 1995-06-07 1997-04-15 Varian Assoc Inc ウェーハの向き検査システム
JPH0936198A (ja) 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
US6672819B1 (en) 1995-07-19 2004-01-06 Hitachi, Ltd. Vacuum processing apparatus and semiconductor manufacturing line using the same
TW371796B (en) * 1995-09-08 1999-10-11 Semiconductor Energy Lab Co Ltd Method and apparatus for manufacturing a semiconductor device
US5746565A (en) * 1996-01-22 1998-05-05 Integrated Solutions, Inc. Robotic wafer handler
KR100213439B1 (ko) * 1996-10-24 1999-08-02 윤종용 더미 웨이퍼를 사용하지 않는 웨이퍼상에 막형성 방법
US5943230A (en) * 1996-12-19 1999-08-24 Applied Materials, Inc. Computer-implemented inter-chamber synchronization in a multiple chamber substrate processing system
KR100246860B1 (ko) * 1997-01-14 2000-03-15 윤종용 스퍼터링장치의 웨이퍼 이송장치
US6239441B1 (en) 1997-01-20 2001-05-29 Kabushiki Kaisha Toshiba Apparatus for manufacturing a semiconductor device and a method for manufacturing a semiconductor device
KR100251274B1 (ko) * 1997-02-14 2000-04-15 윤종용 매엽식반도체시스템의시퀀스처리방법
JP3737604B2 (ja) * 1997-06-03 2006-01-18 大日本スクリーン製造株式会社 基板処理装置
CH692741A5 (de) * 1997-07-08 2002-10-15 Unaxis Trading Ltd C O Balzers Verfahren zur Herstellung in Vakuum oberflächenbehandelter Werkstücke und Vakuumbehandlungsanlage zu dessen Durchführung
US5882413A (en) * 1997-07-11 1999-03-16 Brooks Automation, Inc. Substrate processing apparatus having a substrate transport with a front end extension and an internal substrate buffer
US6313469B1 (en) * 1998-03-13 2001-11-06 Ebara Corporation Substrate handling apparatus and ion implantation apparatus
US6672358B2 (en) * 1998-11-06 2004-01-06 Canon Kabushiki Kaisha Sample processing system
JP2000150836A (ja) * 1998-11-06 2000-05-30 Canon Inc 試料の処理システム
TW484184B (en) * 1998-11-06 2002-04-21 Canon Kk Sample separating apparatus and method, and substrate manufacturing method
TW442891B (en) * 1998-11-17 2001-06-23 Tokyo Electron Ltd Vacuum processing system
US20020157691A1 (en) * 2000-03-29 2002-10-31 Sadayuki Wada Substrate transfer device
JP2002043229A (ja) * 2000-07-25 2002-02-08 Hitachi Kokusai Electric Inc 半導体製造装置
US6516244B1 (en) * 2000-08-25 2003-02-04 Wafermasters, Inc. Wafer alignment system and method
US6609877B1 (en) * 2000-10-04 2003-08-26 The Boc Group, Inc. Vacuum chamber load lock structure and article transport mechanism
US6591161B2 (en) 2001-01-31 2003-07-08 Wafermasters, Inc. Method for determining robot alignment
KR100781351B1 (ko) * 2001-04-02 2007-11-30 엘지.필립스 엘시디 주식회사 패턴 검사장치
JP4937459B2 (ja) * 2001-04-06 2012-05-23 東京エレクトロン株式会社 クラスタツールおよび搬送制御方法
JP2002353081A (ja) 2001-05-25 2002-12-06 Canon Inc 板部材の分離装置及び分離方法
JP2002353423A (ja) * 2001-05-25 2002-12-06 Canon Inc 板部材の分離装置及び処理方法
JP4327599B2 (ja) * 2001-11-29 2009-09-09 ダイアモンド セミコンダクタ グループ エルエルシー ウエーハ取り扱い装置及び方法
US6729824B2 (en) * 2001-12-14 2004-05-04 Applied Materials, Inc. Dual robot processing system
JP4070994B2 (ja) * 2001-12-20 2008-04-02 株式会社ダイヘン ワーク搬送用ロボット及びこのロボットを備えたワーク加工装置
JP2003264214A (ja) 2002-03-07 2003-09-19 Hitachi High-Technologies Corp 真空処理装置及び真空処理方法
JP4040499B2 (ja) * 2003-03-06 2008-01-30 キヤノン株式会社 ロードロック室、処理システム及び処理方法
US6748293B1 (en) * 2003-03-24 2004-06-08 Varian Semiconductor Equipment Associates, Inc. Methods and apparatus for high speed object handling
US7010388B2 (en) * 2003-05-22 2006-03-07 Axcelis Technologies, Inc. Work-piece treatment system having load lock and buffer
TWI290901B (en) * 2003-06-23 2007-12-11 Au Optronics Corp Warehousing conveyor system
TW200532043A (en) 2004-02-10 2005-10-01 Ulvac Inc Thin film forming apparatus
JP4281065B2 (ja) * 2004-10-18 2009-06-17 村田機械株式会社 搬送車システム
JP4855398B2 (ja) * 2005-06-15 2012-01-18 株式会社アルバック 成膜装置、薄膜の製造装置、及び成膜方法
KR100673006B1 (ko) * 2005-07-15 2007-01-24 삼성전자주식회사 이온 주입 장치
US20080138178A1 (en) * 2006-12-06 2008-06-12 Axcelis Technologies,Inc. High throughput serial wafer handling end station
US7949425B2 (en) * 2006-12-06 2011-05-24 Axcelis Technologies, Inc. High throughput wafer notch aligner
JP4546556B2 (ja) * 2008-04-18 2010-09-15 株式会社日立ハイテクノロジーズ 真空処理装置及び真空処理方法
JP5336885B2 (ja) * 2009-03-03 2013-11-06 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
JP5249098B2 (ja) * 2009-03-17 2013-07-31 東京エレクトロン株式会社 基板処理システム及び基板処理方法
JP5433290B2 (ja) * 2009-04-20 2014-03-05 東京エレクトロン株式会社 基板収納方法及び制御装置
JP5187274B2 (ja) 2009-05-28 2013-04-24 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP5223778B2 (ja) * 2009-05-28 2013-06-26 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP5101567B2 (ja) * 2009-06-23 2012-12-19 シャープ株式会社 搬送装置および搬送方法
JP5394969B2 (ja) * 2010-03-30 2014-01-22 大日本スクリーン製造株式会社 基板処理装置、基板処理システム、および基板処理方法
US9004788B2 (en) 2010-06-08 2015-04-14 Tokyo Electron Limited Substrate processing apparatus, substrate processing method, and storage medium
JP5348290B2 (ja) * 2012-07-17 2013-11-20 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
WO2014157358A1 (ja) * 2013-03-28 2014-10-02 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び記録媒体
JP6271322B2 (ja) * 2014-03-31 2018-01-31 東京エレクトロン株式会社 基板処理システム
US9378992B2 (en) 2014-06-27 2016-06-28 Axcelis Technologies, Inc. High throughput heated ion implantation system and method
US9607803B2 (en) 2015-08-04 2017-03-28 Axcelis Technologies, Inc. High throughput cooled ion implantation system and method
JP6598242B2 (ja) * 2015-08-19 2019-10-30 芝浦メカトロニクス株式会社 基板処理装置、および基板処理方法

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Also Published As

Publication number Publication date
KR920018827A (ko) 1992-10-22
KR0170411B1 (ko) 1999-03-30
JPH05275511A (ja) 1993-10-22
EP0502412B1 (de) 1996-05-01
US5357115A (en) 1994-10-18
DE69210290T2 (de) 1996-10-02
US5248886A (en) 1993-09-28
EP0502412A1 (de) 1992-09-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee