KR960002616A - 기판표면 처리장치 및 기판표면 처리방법 - Google Patents

기판표면 처리장치 및 기판표면 처리방법 Download PDF

Info

Publication number
KR960002616A
KR960002616A KR1019950016644A KR19950016644A KR960002616A KR 960002616 A KR960002616 A KR 960002616A KR 1019950016644 A KR1019950016644 A KR 1019950016644A KR 19950016644 A KR19950016644 A KR 19950016644A KR 960002616 A KR960002616 A KR 960002616A
Authority
KR
South Korea
Prior art keywords
cassette
conveying
transfer
processing
substrate
Prior art date
Application number
KR1019950016644A
Other languages
English (en)
Other versions
KR0168192B1 (ko
Inventor
야스히코 오오하시
Original Assignee
이시다 아키라
다이닛뽕스크린 세이조오 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이시다 아키라, 다이닛뽕스크린 세이조오 가부시키가이샤 filed Critical 이시다 아키라
Publication of KR960002616A publication Critical patent/KR960002616A/ko
Application granted granted Critical
Publication of KR0168192B1 publication Critical patent/KR0168192B1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781Batch transfer of wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/045Cleaning involving contact with liquid using perforated containers, e.g. baskets, or racks immersed and agitated in a liquid bath
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00Cleaning and liquid contact with solids
    • Y10S134/902Semiconductor wafer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/14Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)

Abstract

전공정에서 반송되어온 반송용카셋트가 로더부에 반송된다. 이 반송용카셋트에는 복수매의 처리전 기판이 소정의 수납피치로 수납되어 있다. 로더부에는 빈처리용카셋트가 대기하고 있다. 이 처리용카셋트는 본 장치에서의 표면처리를 행하는데 최적의 수납피치(반송용카셋트의 수납피치에 의존하지 않는 수납피치)로 복수매의 기판을 수납할 수가 있다. 로더부에서는 로더부기판이송로보트가 각 카셋트의 수납피치의 차를 흡수하면서 반송용카셋트에서 빈 처리용카셋트에의 처리전기판의 이송을 행한다. 처리전기판의 이송이 끝난후의 반송용카셋트는 반송용카셋트버퍼부를 거쳐 온로더부에 반송한다. 한편 처리전기판이수납된 처리용카셋트는 소정의 반송경로를 따라 각 처리조에서 세정·건조처리가 행하여진 후 언로더부에 반송된다. 언로더부에는 언로더부기판 이송로보트가 각 카셋트의 수납피치의 차를 흡수하면서 처리용 카셋트에서 빈 반송용 카셋트에의 처리가 끝난 기판의 이송을 행한다. 처리가 끝난 기판의 이송에 끝난 빈 처리용카셋트는 처리용카셋트 버퍼부를 거쳐 로더부로 반송되어 대기한다. 한편 처리가 끝난 기판이 수납된 반송용카셋트는 본 장치에 반출되어 다음 공정으로 반송된다.

Description

기판표면 처리장치 및 기판표면 처리방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예에 관한 기판 표면처리장치의 외관을 나타내는 사시도이고,
제2도는 제1실시예 장치 내의 구성을 나타내는 평면도이고,
제3A도, 제3B도, 제3C도는 반송용 카셋트의 구성을 나타내는 도면이고,
제4A도, 제4B도, 제4C도는 처리용 카셋트의 구성을 나타내는 도면이고,
제5도는 제1실시예 장치의 로더부·언로더부 부근의 개략구성을 나타내는 도면이고,
제6도는 로더부 기판 이송로보트의 구성을 나타내는 도면이고,
제7도는 기판의 이송 순서를 설명하기 위한 도면이고,
제8도는 자세전환 로보트의 구성과 처리카셋트를 Y방향으로 반송하는 표면처리 로보트의 구성을 나타내는 도면이고,
제9도는 처리용카셋트를 X방향으로 반송하는 표면처리 로보트의 구성을 나타내는 도면이고,
제10도는 반송용카셋트 반송로보트의 구성을 나타내는 도면이고,
제11도는 기판 이송 로보트의 변형예의 구성을 나타내는 도면이다.

Claims (7)

  1. 카셋트에 수납된 복수매의 기판에 대하여 표면처리를 행하는 기판표면처리장치로서, 복수매의 기판을 소정의 피치로 수납하는 반송용카셋트가 얹혀지는 반송용카셋트 이송부와, 상기 반송용카셋트와는 다른 피치로 복수매의 기판을 수납하는 처리용카셋트가 얹혀지는 처리용카셋트 이송부와, 상기 반송용카셋트 이송부의 반송용카셋트와, 상기 처리용카셋트 이송부의 처리용카셋트와의 사이에서 각 카셋트의 수납피치로 각 기판이 수납되어 복수매의 기판 이송을 행하는 기판이송수단과, 상기 처리용카셋트에 수납된 복수매의 기판에 대하여 표면처리를 행하는 표면처리부와를 포함하고, 상기 기판 이송수단에 의한 상기 반송용카셋트에서 상기 처리용카셋트로의 기판의 이송에 의하여 표면처리전의 복수매의 기판이 수납된 처리용카셋트를 상기 처리용카셋트 이송부에서 상기 표면처리부를 거쳐 상기 처리용카셋트 이송부에 반송하는 표면처리용 반송수단.
  2. 제1항에 있어서, 상기 기판이송수단은, 상기 반송용카셋트 또는 상기 처리용카셋트에 수납된 기판은 1매씩 수평방향으로 인출함과 동시에 상기 인출된 기판을 상기 처리용카셋트 또는 상기 반송용카셋트에 수평방향으로 삽입하는 기판인출 및 삽입수단과, 상기 기판인출 및 삽입수단을 수직방향으로 변위시키는 수직방향 변위수단을 구비하는 기판표면처리장치.
  3. 제1항에 있어서, 상기 반송용카셋트 이송부는 반송용카셋트 로더이송부와 반송용카셋트 언로더이송부로 구성되고, 상기 처리용카셋트 이송부는, 처리용카셋트 로더이송부와, 처리용카셋트 언로더이송부로 구성되며, 상기기판 이송수단은, 상기반송용카셋트로더 이송부의 반송용카셋트에 수납된 표면처리전의 복수매의 기판을 상기 처리용카셋트의 수납피치로 상기 처리용카셋트 로더이송부의 빈 처리용카셋트에 이송하는 로더부 기판 이송수단과, 상기 처리용카셋트 언로더이송부의 처리용카셋트에 수납된 표면처리가 끝난 복수매의 기판을 상기 반송용카셋트의 수납피치로 상기 반송용카셋트 언로더이송부의 빈 반송용카셋트에 이송하는 언로더부 기판 이송수단으로 구성되고, 상기 표면처리용 반송수단은, 상기로더부 기판이송수단에 의한 기판의 이송에 의하여 표면처리전의 복수매의 기판이 수납된 처리용카셋트를 상기 처리용 카셋트로더 이송부에서 상기 표면처리부를 거쳐 상기 처리용카셋트 언로더 이송부에 반송하도록 구성된 기판표면처리장치.
  4. 제3항에 있어서, 상기 기판 표면처리장치의 밖과 상기 반송용카셋트 이송부와의 사이에서 복수매의 기판이 수납된 상기 반송용카셋트의 송출을 행하는 반송용카셋트송출부를 설치하며, 상기 반송용카셋트 송출부는 상기 기판표면처리장치의 밖과 상기 반송용카셋트로더 이송부와의 사이에서 표면처리전의 복수매의 기판이 수납된 반송용카셋트를 송출하는 반송용카셋트 로더 송출부와, 상기 기판표면처리장치의 밖과 상기 반송용카셋트 언로더 이송부와의 사이에서 표면처리가 끝난 복수매의 기판이 수납된 반송용카셋트를 송출하는 반송용카 셋트 언로더 송출부는 포함하는 기판표면처리장치.
  5. 제4항에 있어서, 상기 표면처리용 반송수단은, 반송방향이 도중에서 반송된 반송경로를 가지며, 또 이 반송경로를 따라 상기 반송용카셋트로더 송출부 상기 반송용카셋트로더 이송부, 상기 로더부기판 이송수단, 상기 처리용카셋트 로더이송부, 상기 표면처리부, 상기 처리용카셋트 언로더 이송부, 상기 언로더부판 이송수단, 상기 반송용카셋트 언로더 이송부, 상기 반송용카셋트 언로더 송출부가 배열설치되어 있는 기판표면처리장치.
  6. 제3항에 있어서, 상기 반송용카셋트로더 이송부와 상기 반송용카셋트언로더 이송부와의 사이에 설치한 빈 반송용카셋트를 대기시켜 두기 위한 반송용카셋트버퍼부와, 상기 로더부기판이송수단에 의한 기판의 이송이 끝난후의 빈 반송용카셋트를 상기 반송용카셋트로더 이송부에서 상기 반송용카셋트 버퍼부를 거쳐 상기 반송용카셋트 언로더 이송부에 반송하는 반송용카셋트 반송수단을 구비하는 기판표면처리장치.
  7. 제6항에 있어서, 상기 반송용카셋트는 버퍼부는 상기 반송용카셋트로더 이송부와 상기 반송용카셋트 언로더 이송부와의 사이에 배열된 복수개의 재치대는 포함하며, 상기 반송용카셋트 반송수단에 의한 빈 반송용카셋트의 반송은 상기 반송용카셋트 언로더 이송부의 사용상황(반송용 카셋트의 재치상태)에 따라 빈 반송용카셋트가 상기 각 재치대상을 상기 반송용카셋트 언로더 이송부 방향으로 차례로 보내지도록 한 기판표면처리장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950016644A 1994-06-27 1995-06-21 기판표면 처리장치 및 기판표면 처리방법 KR0168192B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-168714 1994-06-27
JP6168714A JPH0817894A (ja) 1994-06-27 1994-06-27 基板表面処理装置

Publications (2)

Publication Number Publication Date
KR960002616A true KR960002616A (ko) 1996-01-26
KR0168192B1 KR0168192B1 (ko) 1999-02-01

Family

ID=15873094

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950016644A KR0168192B1 (ko) 1994-06-27 1995-06-21 기판표면 처리장치 및 기판표면 처리방법

Country Status (3)

Country Link
US (1) US5603777A (ko)
JP (1) JPH0817894A (ko)
KR (1) KR0168192B1 (ko)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5976198A (en) * 1995-06-09 1999-11-02 Dainippon Screen Mfg. Co., Ltd. Substrate transfer and bath apparatus
US6723174B2 (en) * 1996-03-26 2004-04-20 Semitool, Inc. Automated semiconductor processing system
US6942738B1 (en) * 1996-07-15 2005-09-13 Semitool, Inc. Automated semiconductor processing system
JPH1022358A (ja) * 1996-06-28 1998-01-23 Dainippon Screen Mfg Co Ltd 基板処理装置
US6540466B2 (en) * 1996-12-11 2003-04-01 Applied Materials, Inc. Compact apparatus and method for storing and loading semiconductor wafer carriers
US6736148B2 (en) 1997-05-05 2004-05-18 Semitool, Inc. Automated semiconductor processing system
US20030051974A1 (en) * 1997-05-05 2003-03-20 Semitool, Inc. Automated semiconductor processing system
US6183186B1 (en) * 1997-08-29 2001-02-06 Daitron, Inc. Wafer handling system and method
JP3988805B2 (ja) * 1997-10-02 2007-10-10 大日本スクリーン製造株式会社 基板搬送方法及びその装置
JPH11274282A (ja) 1998-03-23 1999-10-08 Toshiba Corp 基板収納容器、基板収納容器清浄化装置、基板収納容器清浄化方法および基板処理装置
KR100646906B1 (ko) 1998-09-22 2006-11-17 동경 엘렉트론 주식회사 기판처리장치 및 기판처리방법
US6449522B1 (en) * 1998-11-17 2002-09-10 Micro Devices, Inc. Managing a semiconductor fabrication facility using wafer lot and cassette attributes
DE29915108U1 (de) * 1999-08-28 2000-03-16 Kuttler, Hans-Jürgen, 78083 Dauchingen Anlage zum Be- bzw. Weiterverarbeiten von Leiterplatten
WO2002005313A2 (en) * 2000-07-07 2002-01-17 Semitool, Inc. Automated processing system
JP4033689B2 (ja) * 2002-03-01 2008-01-16 東京エレクトロン株式会社 液処理装置および液処理方法
EP1535143A4 (en) 2002-06-19 2010-05-05 Brooks Automation Inc AUTOMATED MATERIAL HANDLING SYSTEM FOR SEMICONDUCTOR MANUFACTURING BASED ON A COMBINATION OF VERTICAL CAROUSELS AND OVERHEAD HOISTS
US7930061B2 (en) * 2002-08-31 2011-04-19 Applied Materials, Inc. Methods and apparatus for loading and unloading substrate carriers on moving conveyors using feedback
US7258520B2 (en) * 2002-08-31 2007-08-21 Applied Materials, Inc. Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing
US7234584B2 (en) * 2002-08-31 2007-06-26 Applied Materials, Inc. System for transporting substrate carriers
CN100397558C (zh) * 2002-08-31 2008-06-25 应用材料有限公司 向处理工具提供衬底的方法和设备
US7684895B2 (en) 2002-08-31 2010-03-23 Applied Materials, Inc. Wafer loading station that automatically retracts from a moving conveyor in response to an unscheduled event
US7243003B2 (en) 2002-08-31 2007-07-10 Applied Materials, Inc. Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
US20040081546A1 (en) 2002-08-31 2004-04-29 Applied Materials, Inc. Method and apparatus for supplying substrates to a processing tool
US6955197B2 (en) * 2002-08-31 2005-10-18 Applied Materials, Inc. Substrate carrier having door latching and substrate clamping mechanisms
US7506746B2 (en) 2002-08-31 2009-03-24 Applied Materials, Inc. System for transporting substrate carriers
US20050095110A1 (en) * 2002-08-31 2005-05-05 Lowrance Robert B. Method and apparatus for unloading substrate carriers from substrate carrier transport system
KR101323337B1 (ko) 2002-10-11 2013-10-30 무라타 기카이 가부시키가이샤 자동 재료 핸들링 시스템
US20090308030A1 (en) * 2003-01-27 2009-12-17 Applied Materials, Inc. Load port configurations for small lot size substrate carriers
US7221993B2 (en) * 2003-01-27 2007-05-22 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
US7778721B2 (en) * 2003-01-27 2010-08-17 Applied Materials, Inc. Small lot size lithography bays
US7611318B2 (en) 2003-01-27 2009-11-03 Applied Materials, Inc. Overhead transfer flange and support for suspending a substrate carrier
US7077264B2 (en) 2003-01-27 2006-07-18 Applied Material, Inc. Methods and apparatus for transporting substrate carriers
US7578647B2 (en) * 2003-01-27 2009-08-25 Applied Materials, Inc. Load port configurations for small lot size substrate carriers
US20050095087A1 (en) * 2003-10-30 2005-05-05 Sullivan Robert P. Automated material handling system
JP4566574B2 (ja) * 2004-02-13 2010-10-20 大日本スクリーン製造株式会社 基板処理装置
CZ296459B6 (cs) * 2004-09-14 2006-03-15 Pliva-Lachema A. S. Perorální farmaceutická kompozice pro cílený transport komplexu platiny do kolorektální oblasti, zpusob její prípravy a tato kompozice pro pouzití jako lécivo
US20070258796A1 (en) * 2006-04-26 2007-11-08 Englhardt Eric A Methods and apparatus for transporting substrate carriers
JP5504164B2 (ja) 2007-10-22 2014-05-28 アプライド マテリアルズ インコーポレイテッド 基板キャリアを移送するための方法および装置
US8919756B2 (en) * 2008-08-28 2014-12-30 Tokyo Ohka Kogyo Co., Ltd. Substrate processing system, carrying device, and coating device
JP5227701B2 (ja) * 2008-08-28 2013-07-03 東京応化工業株式会社 基板処理システム
US9214372B2 (en) * 2008-08-28 2015-12-15 Tokyo Ohka Kogyo Co., Ltd. Substrate processing system, carrying device and coating device
JP5449876B2 (ja) * 2008-08-28 2014-03-19 東京応化工業株式会社 搬送装置
EP2346073B1 (en) * 2008-10-22 2017-05-24 Kawasaki Jukogyo Kabushiki Kaisha Prealigner
DE102009040555B4 (de) * 2009-09-08 2013-11-21 Grenzebach Maschinenbau Gmbh Verfahren und Vorrichtung zum Archivieren und /oder Zwischenlagern von Glasscheiben in Reinräumen
JP5450562B2 (ja) * 2011-10-20 2014-03-26 株式会社日本製鋼所 薄膜を有する成形品の製造方法および製造装置
WO2014080067A1 (en) * 2012-11-23 2014-05-30 Picosun Oy Substrate loading in an ald reactor
KR101992660B1 (ko) 2012-11-28 2019-09-30 에이씨엠 리서치 (상하이) 인코포레이티드 반도체 웨이퍼의 세정 방법 및 장치
JP6156513B2 (ja) * 2013-11-22 2017-07-05 株式会社島津製作所 基板処理システム
CN106128989B (zh) * 2016-08-25 2022-11-11 麦斯克电子材料股份有限公司 一种用于硅片片盒间错位倒片的倒片器
JP6445603B2 (ja) * 2017-03-07 2018-12-26 ピコサン オーワイPicosun Oy Ald反応炉における基板の装填
CN113394145B (zh) * 2021-05-07 2022-08-19 拉普拉斯(无锡)半导体科技有限公司 一种硅片的导片系统
JP2023142095A (ja) * 2022-03-24 2023-10-05 株式会社Screenホールディングス 基板処理装置
JP2023142093A (ja) * 2022-03-24 2023-10-05 株式会社Screenホールディングス 基板処理装置
JP2023142023A (ja) * 2022-03-24 2023-10-05 株式会社Screenホールディングス 基板処理装置
JP2023142094A (ja) * 2022-03-24 2023-10-05 株式会社Screenホールディングス 基板処理装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4715392A (en) * 1983-11-10 1987-12-29 Nippon Kogaku K. K. Automatic photomask or reticle washing and cleaning system
JPS605530A (ja) * 1984-04-25 1985-01-12 Hitachi Ltd 半導体ウエハ洗浄装置
US4924890A (en) * 1986-05-16 1990-05-15 Eastman Kodak Company Method and apparatus for cleaning semiconductor wafers
JPS6480934A (en) * 1987-09-24 1989-03-27 Fujitsu General Ltd Automatic controller for light quantity of television camera
US5072011A (en) * 1988-02-02 1991-12-10 Johnson Matthey, Inc. Pt(IV) complexes
US5177514A (en) * 1988-02-12 1993-01-05 Tokyo Electron Limited Apparatus for coating a photo-resist film and/or developing it after being exposed
JP2915458B2 (ja) * 1989-12-26 1999-07-05 東芝セラミックス株式会社 半導体ウェーハ洗浄装置
JP2644912B2 (ja) * 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
JP3162704B2 (ja) * 1990-11-28 2001-05-08 東京エレクトロン株式会社 処理装置
JPH05182941A (ja) * 1991-12-27 1993-07-23 Nippon Steel Corp ウエハ洗浄方法及び装置
US5301700A (en) * 1992-03-05 1994-04-12 Tokyo Electron Limited Washing system
JPH05259136A (ja) * 1992-03-12 1993-10-08 Tokyo Electron Ltd 洗浄処理装置
US5404894A (en) * 1992-05-20 1995-04-11 Tokyo Electron Kabushiki Kaisha Conveyor apparatus
JP2791251B2 (ja) * 1992-07-30 1998-08-27 三菱電機株式会社 半導体処理装置及び方法並びに半導体処理装置モジュール
JP3110218B2 (ja) * 1992-09-25 2000-11-20 三菱電機株式会社 半導体洗浄装置及び方法、ウエハカセット、専用グローブ並びにウエハ受け治具
US5485644A (en) * 1993-03-18 1996-01-23 Dainippon Screen Mfg. Co., Ltd. Substrate treating apparatus

Also Published As

Publication number Publication date
JPH0817894A (ja) 1996-01-19
US5603777A (en) 1997-02-18
KR0168192B1 (ko) 1999-02-01

Similar Documents

Publication Publication Date Title
KR960002616A (ko) 기판표면 처리장치 및 기판표면 처리방법
TW346414B (en) Method and apparatus for creating a gelatin coating on a tablet (1)
DE3378575D1 (en) A method and apparatus for loading a storage and transport rack
WO2004036628A3 (en) Device and method for transporting wafer-shaped articles
TW563184B (en) Method and apparatus for processing substrates and method for manufacturing a semiconductor device
WO2004075285A1 (ja) 基板処理装置
KR970023653A (ko) 인라인처리시스템 및 이를 이용한 디바이스생산방법
ATE362196T1 (de) Vorrichtung zum be- und entladen von substraten
KR960015693A (ko) 기판처리장치
JP7399552B2 (ja) 収納体搬送装置及びレーザ加工装置
JPH11233590A (ja) 基板処理装置
JPH0532315A (ja) 先入れ先出しバツフア装置
JPH06163673A (ja) 基板処理装置
JP2541887Y2 (ja) ウエハの表面処理装置
JP3954664B2 (ja) 洗浄装置
KR920000110A (ko) 종형 열처리 장치에 있어서 웨이퍼 및 웨이퍼 보우트의 로우드 및 언 로우드 방법
KR940008022A (ko) 기판처리장치
KR100730735B1 (ko) 기판 처리장치 및 그 처리방법
KR200159654Y1 (ko) 반도체 이송장치
JPH0590388A (ja) 移替装置
JP2505263Y2 (ja) ウエハの表面処理装置のウエハ移送装置
JPH06275594A (ja) 自動処理装置
JPH04249320A (ja) 自動洗浄装置における輸送方式
JPH0897176A (ja) 基板処理装置
JP2864376B2 (ja) 基板処理装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20120924

Year of fee payment: 15

FPAY Annual fee payment

Payment date: 20130924

Year of fee payment: 16

FPAY Annual fee payment

Payment date: 20140923

Year of fee payment: 17

EXPY Expiration of term