KR970023653A - 인라인처리시스템 및 이를 이용한 디바이스생산방법 - Google Patents

인라인처리시스템 및 이를 이용한 디바이스생산방법 Download PDF

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KR970023653A
KR970023653A KR1019960047852A KR19960047852A KR970023653A KR 970023653 A KR970023653 A KR 970023653A KR 1019960047852 A KR1019960047852 A KR 1019960047852A KR 19960047852 A KR19960047852 A KR 19960047852A KR 970023653 A KR970023653 A KR 970023653A
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processing
inline
workpiece
processing system
processing unit
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KR1019960047852A
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KR100210568B1 (ko
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히로유키 이토
신지 쯔쯔이
마사히데 사토
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미타라이 후지오
캐논 가부시기가이샤
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Priority claimed from JP7275557A external-priority patent/JPH09115983A/ja
Priority claimed from JP11060196A external-priority patent/JP3450583B2/ja
Priority claimed from JP8258741A external-priority patent/JPH10107119A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138—Wafers positioned vertically within cassette

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

노광처리유닛과 도포ㆍ현상처리유닛을 지닌 인라인처리시스템에 있어서, 이들 유닛사이에서 워크피스를 수수하는 반송아암을 설치하고, 이 반송아암은 이들 양 유닛의 각각에 액세스가능하며, 이들 유닛은 대략 높이가 동일한 수평방향의 워크피스유지면을 지닌다. 또, 워크피스는 수평방향으로 유지된채로 이들 유닛사이에서 반송될 수 있다.

Description

인라인처리시스템 및 이를 이용한 디바이스생산방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도5는 본 발명의 제2 실시예에 의한 인라인처리시스템의 전체구성의 개략도.

Claims (18)

  1. 워크피스에 노광처리를 행하는 제 1처리유닛과; 상기 워크피스에 상기 노광처리와는 다른 제 2처리를 행하는 제 2처리유닛과; 상기 제 1 및 제 2처리유닛사이에서 워크피스를 반송하기 위한, 상기 각 제 1 및 제 2처리유닛에 액세스가능한 반송아암기구를 구비하고, 상기 제 1 및 제 2처리유닛은 대략 높이가 동일한 수평방향의 워크피스유지면을 지니고, 상기 반송아암기구는 워크피스를 수평방향으로 유지한 채로 상기 제 1 및 제 2처리유닛사이에서 반송하는 것을 특징으로 하는 인라인처리시스템.
  2. 제1항에 있어서, 상기 제 2처리유닛은 레지스트도포장치와 현상장치중의 적어도 1개의 장치를 포함하는 것을 특징으로 하는 인라인처리시스템.
  3. 제1항에 있어서, 상기 제 1 및 제 2처리유닛은 모두 클린룸내에 배치되는 것을 특징으로 하는 인라인처리시스템.
  4. 청구항 제1항에 기재된 인라인처리시스템을 이용해서 디바이스를 생산하는 것을 특징으로 하는 디바이스생산방법.
  5. 복수의 워크피스에 사용가능한 인라인처리시스템에 있어서, 워크피스에 노광처리를 행하는 제 1처리유닛과; 상기 워크피스에 상기 노광처리와는 다른 제 2처리를 행하는 제 2처리유닛과; 상기 제 1 및 제 2처리유닛사이에서 워크피스를 반송하기 위한, 상기 각 제 1 및 제 2처리유닛에 액세스가능한 반송아암기구와; 해당 반송중인 워크피스를 복수매 일시적으로 수납하는 수납기구를 구비한 것을 특징으로 하는 인라인처리시스템.
  6. 제5항에 있어서, 상기 제 2처리유닛은 레지스트도포장치와 현상장치중의 적어도 1개의 장치를 포함하는 것을 특징으로 하는 인라인처리시스템.
  7. 제5항에 있어서, 상기 제 1 및 제 2처리유닛은 모두 클린룸내에 배치되는 것을 특징으로 하는 인라인처리시스템.
  8. 청구항 제5항에 기재된 인라인처리시스템을 이용해서 디바이스를 생산하는 것을 특징으로 하는 디바이스생산방법.
  9. 복수의 워크피스에 사용가능한 인라인처리시스템에 있어서, 워크피스에 노광처리를 행하는 제 1처리유닛과; 상기 워크피스에 상기 노광처리와는 다른 제 2처리를 행하는 제 2처리유닛과; 상기 제 1 및 제 2처리유닛사이에서 워크피스를 반송하기 위한 반송아암기구와; 해당 반송중인 워크피스를 복수매 일시적으로 수납하는 쓰루카세트를 구비하고, 상기 카세트의 앞면 또는 뒷면을 통해 해당카세트에 워크피스를 인입ㆍ인출할 수 있는 것을 특징으로 하는 인라인처리시스템.
  10. 제9항에 있어서, 상기 제2처리유닛은 레지스트도포장치와 현상장치중의 적어도 1개의 장치를 포함하는 것을 특징으로 하는 인라인처리시스템.
  11. 제9항에 있어서, 상기 제1 및 제2처리유닛은 모두 클린룸내에 배치되는 것을 특징으로 하는 인라인처리시스템.
  12. 청구항 제9항에 기재된 인라인처리시스템을 이용해서 디바이스를 생산하는 것을 특징으로 하는 디바이스생산방법.
  13. 제1라인과; 제2라인을 구비한 인라인처리시스템에 있어서, 상기 제1 및 제2라인은 각각, 워크피스에 노광처리를 행하는 노광처리를 지닌 제1처리유닛과, 상기 제1처리유닛에 접속되어, 상기 워크피스에 상기 노광처리와는 다른 제2처리를 행하는 제2처리유닛을 구비하고, 상기 제1 및 제2라인은, 해당 제1 및 제2라인의 상기 제1 처리유닛의 노광장치의 앞면이 서로 대향함과 동시에, 해당 대향하는 노광장치사이에 작업자의 작업공간을 형성하도록 배치된 것을 특징으로 하는 인라인시스템.
  14. 제13항에 있어서, 상기 제2처리유닛은 레지스트도포장치와 현상장치중의 적어도 1개의 장치를 포함하는 것을 특징으로 하는 인라인처리시스템.
  15. 제13항에 있어서, 상기 제1 및 제2처리유닛은 모두 클린룸내에 배치되는 것을 특징으로 하는 인라인처리시스템.
  16. 청구항 제13항에 기재된 인라인처리시스템을 이용해서 디바이스를 생산하는 것을 특징으로 하는 디바이스생산방법.
  17. 복수의 워크피스에 사용가능한 인라인처리시스템에 있어서, 워크피스에 제1처리를 행하는 제1처리유닛과; 상기 워크피스에 상기 제1처리와는 다른 제2처리를 행하는 제2처리유닛과; 상기 제1 및 제2처리유닛사이의 반송로의 일부에 설치되어, 내부에 복수의 워크피스를 수납하는 수납기구를 구비한 것을 특징으로 하는 인라인처리시스템.
  18. 제17항에 있어서, 상기 수납기구는 쓰루카세트를 지니고, 상기 카세트의 앞면과 뒷면을 통해 해당 카세트에 워크피스를 인입ㆍ인출할 수 있는 것을 특징으로 하는 인라인처리시스템.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960047852A 1995-10-24 1996-10-24 인라인처리시스템 및 이를 이용한 디바이스생산방법 KR100210568B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP7275557A JPH09115983A (ja) 1995-10-24 1995-10-24 生産システム及びデバイス生産方法
JP95-275557 1995-10-24
JP11060196A JP3450583B2 (ja) 1996-04-08 1996-04-08 インライン処理システムおよび方法
JP96-110601 1996-04-08
JP8258741A JPH10107119A (ja) 1996-09-30 1996-09-30 インライン処理システムおよびデバイス生産方法
JP96-258741 1996-09-30

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Publication Number Publication Date
KR970023653A true KR970023653A (ko) 1997-05-30
KR100210568B1 KR100210568B1 (ko) 1999-07-15

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JP2001325016A (ja) * 2000-05-15 2001-11-22 Denso Corp 生産方法及び生産システム
JP4118592B2 (ja) * 2002-04-22 2008-07-16 富士通株式会社 ロードポート及び半導体製造装置
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JP4315420B2 (ja) * 2003-04-18 2009-08-19 キヤノン株式会社 露光装置及び露光方法
KR100999104B1 (ko) * 2003-10-01 2010-12-07 삼성전자주식회사 기판의 반송장치
KR20050038134A (ko) * 2003-10-21 2005-04-27 삼성전자주식회사 기판 스토킹 시스템
WO2009028595A1 (ja) * 2007-08-31 2009-03-05 Canon Anelva Corporation 基板処理装置
US8228088B1 (en) 2009-08-07 2012-07-24 Brett Hinze Automated solar module testing
JP5392190B2 (ja) * 2010-06-01 2014-01-22 東京エレクトロン株式会社 基板処理システム及び基板処理方法
JP7115823B2 (ja) * 2017-05-16 2022-08-09 トヨタ自動車株式会社 生産管理システム、生産管理プログラムおよび生産管理方法

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