KR940006242A - 클린룸내 반송 시스템 - Google Patents

클린룸내 반송 시스템 Download PDF

Info

Publication number
KR940006242A
KR940006242A KR1019930012015A KR930012015A KR940006242A KR 940006242 A KR940006242 A KR 940006242A KR 1019930012015 A KR1019930012015 A KR 1019930012015A KR 930012015 A KR930012015 A KR 930012015A KR 940006242 A KR940006242 A KR 940006242A
Authority
KR
South Korea
Prior art keywords
wafer
transfer
conveyance
inter
clean room
Prior art date
Application number
KR1019930012015A
Other languages
English (en)
Inventor
마사나오 마나따
뎃베이 야마시따
쓰요시 다나까
다까히데 호시꼬
미쓰지 가리따
히또시 가와노
쓰또무 신야
Original Assignee
스즈끼 아끼오
신꼬덴끼 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스즈끼 아끼오, 신꼬덴끼 가부시끼가이샤 filed Critical 스즈끼 아끼오
Publication of KR940006242A publication Critical patent/KR940006242A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

웨이퍼 반송효과를 향상하는 것이 가능하고, 효율이 좋은 다종처리를 쉽게 가능하게 하는 클린룸내 반송시스템을 제공하는 것을 목적으로 한다.
공정간 반송용의 반송장치와의 사이에서 웨이퍼를 주고 받는 인터페이스 장치, 이 인터페이스 장치에서 뻗어나온 반송로, 이 반송로상을 주행하는 장치간 반송장치, 전기 반송로를 따리서 배선된 하나의 라인을 구성하는 하나 또는 복수의 웨이퍼처리장치를 구비하고, 상기 공정간 반송용의 반송장치는 웨이퍼를 수납한 카세트를 반송하여, 상기 인터페이스 장치(47)는 당해 인터페이스 장치에 반송된 하나 또는 복수의 상기 카세트에서 지정된 매수의 웨이퍼를 추출하고 상긴 라인에 전용의 카세트(101)로 옮겨 바꾸고, 상기 장치간 반송장치는 상기 전용의 카세트를 이재하고 지정된 상기 웨이퍼 처리장치까지 주행하고, 당해 웨이퍼처리장치와의 사이에서 웨이퍼를 판장으로 주고받는 것을 특징으로 한다.

Description

클린룸내 반송 시스템
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예의 구성을 나타낸 배치도,
제2도는 상기 실시예에서의 장치간의 반송장치도,
제3도는 상기 실시예의 장치간 반송장치의 다른 예.

Claims (7)

  1. 공정간 반송용의 반송장치와의 사이에서 웨이퍼를 주고 받는 인터페이스 장치, 이 인터페이스장치에서 뻗어지는 반송로, 이 반송로 상을 주행하는 장치간 반송장치, 전기 반송로를 따라서 배설된 하나의 라인을 구성하는 한개 또는 복수의 웨이퍼 처리장치를 구비하고, 상기 공정간 반송용의 반송장치는 웨이퍼를 수납한 카세트를 반송하고, 상기 인터페이스장치는 당해 인터페이스장치에 반송된 하나 또는 복수의 상기 카세트에서 지정된 수매의 웨이퍼를 추출하고 상기 라인에 적용의 카세트 혹은 소정의 웨이퍼 수납개소에 옮겨 바꾸고, 상기 장치간 반송장치는 상기 전용의 카세트 혹은 상기 옮겨 바꾸어진 웨이퍼/웨이퍼군을 이재하여 지정된 상기 웨이퍼처리장치까지 주행하고, 당해 웨이퍼처리장치와의 사이에서 웨이퍼를 판장으로 주고받는 것을 특징으로하는 클린룸내 반송시스템.
  2. 공정간 반송용의 반송장치와의 사이애서 웨이퍼를 주고받는 인터페이스장치, 이 인터페이스장치에서 뻗어 나온 반송로, 이 반송로상을 주행하는 장치간 반송장치, 전기 반송로를 따라서 하나의 라인을 구성하는 하나 또는 복수의 웨이퍼 처리장치를 구비하고, 상기 인터페이스장치는 공정간 반송용의 반송장치와의 사이에서 웨이퍼를 직접 판장으로서 판장형의 카세트에 수납하고 주고 받고하여, 상기 장치간 반송장치는 상기 인터페이스 장치와의 사이에서 상기 웨이퍼 혹은 카세트를 이재하여 지정된 상기 웨이퍼 처리장치까지 주행하여, 당해 웨이퍼처리장치와의 사이에서 웨이퍼를 판장으로 주고 받는 것을 특징으로 하는 클린룸내 반송시스템.
  3. 제1항 또는 제2항에 어느 한 항에 있어서, 장치간 반송장치의 반송대차는 웨이퍼 판장이재형의 이재로보트를 탑재하고, 웨이퍼 처리장치는 웨이퍼판장수수구를 구비하는 것을 특징으로 하는 클린룸내 반송시스템.
  4. 제2항에 있어서 장치간 반송장치는 웨이퍼판장반송형의 소형 반송장치인 것을 특징으로하는 클린룸내 반송시스템.
  5. 제4항에 있어서 웨이퍼처리장치는 웨이퍼판장수수구를 통하여 소형반송장치와 웨이퍼를 주고받는 이재장치를 내장하고 있는 것을 특징으로 하는 클린룸내 반송시스템.
  6. 제1항 내지 제5항의 어느 한 항에 있어서, 장치간 반송장치를 자기부상형의 리니어모터식 반송장치인 것을 특징으로 하는 클린룸내 반송시스템.
  7. 제1항 내지 제5항의 어느 한 항에 있어서 장치간 반송장치의 반송대차는 웨이퍼 낙하방지장치를 구비하고 있는 것을 특징으로하는 클린룸내 반송시스템.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930012015A 1992-07-03 1993-06-30 클린룸내 반송 시스템 KR940006242A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4177218A JPH0616206A (ja) 1992-07-03 1992-07-03 クリーンルーム内搬送システム
JP92-177218 1992-07-03

Publications (1)

Publication Number Publication Date
KR940006242A true KR940006242A (ko) 1994-03-23

Family

ID=16027229

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930012015A KR940006242A (ko) 1992-07-03 1993-06-30 클린룸내 반송 시스템

Country Status (4)

Country Link
US (1) US5443346A (ko)
JP (1) JPH0616206A (ko)
KR (1) KR940006242A (ko)
TW (1) TW257878B (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100331966B1 (ko) * 1999-10-23 2002-04-10 윤기룡 염색된 직물의 직물권취장치
KR100568910B1 (ko) * 2002-08-16 2006-04-10 이재구 검단 및 로울링 작업용 유압식 직물송출장치

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3654597B2 (ja) * 1993-07-15 2005-06-02 株式会社ルネサステクノロジ 製造システムおよび製造方法
JPH08222619A (ja) * 1995-02-14 1996-08-30 Toshiba Corp 半導体製造装置
JPH08335539A (ja) * 1995-06-06 1996-12-17 Sony Corp 生産管理装置および生産管理方法
US5615988A (en) * 1995-07-07 1997-04-01 Pri Automation, Inc. Wafer transfer system having rotational capability
US5741109A (en) * 1995-07-07 1998-04-21 Pri Automation, Inc. Wafer transfer system having vertical lifting capability
US5647718A (en) * 1995-07-07 1997-07-15 Pri Automation, Inc. Straight line wafer transfer system
US6672819B1 (en) * 1995-07-19 2004-01-06 Hitachi, Ltd. Vacuum processing apparatus and semiconductor manufacturing line using the same
US5841661A (en) * 1996-08-26 1998-11-24 Seh America, Inc. Wafer image (ADS) vision system to automated dimensioning equipment (ADE) communication interface system
US6540466B2 (en) * 1996-12-11 2003-04-01 Applied Materials, Inc. Compact apparatus and method for storing and loading semiconductor wafer carriers
JP2968742B2 (ja) 1997-01-24 1999-11-02 山形日本電気株式会社 自動保管棚及び自動保管方法
US6432203B1 (en) * 1997-03-17 2002-08-13 Applied Komatsu Technology, Inc. Heated and cooled vacuum chamber shield
JPH10270535A (ja) 1997-03-25 1998-10-09 Nikon Corp 移動ステージ装置、及び該ステージ装置を用いた回路デバイス製造方法
US5980183A (en) * 1997-04-14 1999-11-09 Asyst Technologies, Inc. Integrated intrabay buffer, delivery, and stocker system
US6280134B1 (en) * 1997-06-17 2001-08-28 Applied Materials, Inc. Apparatus and method for automated cassette handling
US6034000A (en) 1997-07-28 2000-03-07 Applied Materials, Inc. Multiple loadlock system
JPH1159829A (ja) * 1997-08-08 1999-03-02 Mitsubishi Electric Corp 半導体ウェハカセット搬送装置、半導体ウェハカセット搬送装置で用いられるストッカ、ならびに半導体ウェハカセット搬送装置で用いられるストッカ入庫作業制御方法、ストッカ出庫作業制御方法、自動搬送車制御方法、およびストッカ在庫照合方法
US6053687A (en) 1997-09-05 2000-04-25 Applied Materials, Inc. Cost effective modular-linear wafer processing
JPH11222122A (ja) * 1998-02-03 1999-08-17 Shinko Electric Co Ltd 分岐軌道を備えた搬送設備
US6145444A (en) * 1998-12-16 2000-11-14 Wilkinson; Kerry E. Micro clean sealed tubular transporter apparatus
US6481558B1 (en) 1998-12-18 2002-11-19 Asyst Technologies, Inc. Integrated load port-conveyor transfer system
DE19900804C2 (de) * 1999-01-12 2000-10-19 Siemens Ag Fördersystem
US7278812B2 (en) 1999-01-27 2007-10-09 Shinko Electric Co., Ltd. Conveyance system
TW469483B (en) * 1999-04-19 2001-12-21 Applied Materials Inc Method and apparatus for aligning a cassette
US6763281B2 (en) 1999-04-19 2004-07-13 Applied Materials, Inc Apparatus for alignment of automated workpiece handling systems
DE19921246C2 (de) * 1999-05-07 2003-06-12 Infineon Technologies Ag Anlage zur Fertigung von Halbleiterprodukten
DE19921245C2 (de) * 1999-05-07 2003-04-30 Infineon Technologies Ag Anlage zur Bearbeitung von Wafern
US6949143B1 (en) 1999-12-15 2005-09-27 Applied Materials, Inc. Dual substrate loadlock process equipment
US6303398B1 (en) 2000-05-04 2001-10-16 Advanced Micro Devices, Inc. Method and system of managing wafers in a semiconductor device production facility
EP1319243A2 (en) * 2000-09-15 2003-06-18 Applied Materials, Inc. Double dual slot load lock for process equipment
JP2002231594A (ja) * 2001-01-31 2002-08-16 Mitsubishi Electric Corp 半導体装置の生産管理システム、半導体装置の生産管理方法、および半導体装置の製造方法
US7316966B2 (en) * 2001-09-21 2008-01-08 Applied Materials, Inc. Method for transferring substrates in a load lock chamber
JP3760437B2 (ja) * 2001-10-16 2006-03-29 旭精工株式会社 紙葉類の重ね出し防止装置
JP2003188229A (ja) * 2001-12-18 2003-07-04 Hitachi Kasado Eng Co Ltd ウエハ製造システムおよびウエハ製造方法
JP4025069B2 (ja) * 2001-12-28 2007-12-19 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
US6729836B2 (en) * 2002-03-13 2004-05-04 Stingel, Iii Frederick J. Automated container storage and delivery system
US7184855B2 (en) 2002-03-13 2007-02-27 Stingel Iii Frederick J Automated container storage and delivery system
JP4220173B2 (ja) * 2002-03-26 2009-02-04 株式会社日立ハイテクノロジーズ 基板の搬送方法
US20050158152A1 (en) * 2002-06-07 2005-07-21 Tetsunori Otaguro Container conveying system
US6871116B2 (en) * 2002-10-17 2005-03-22 Vertique, Inc. Determining pallet case configurations for placement by a robot
US6990721B2 (en) * 2003-03-21 2006-01-31 Brooks Automation, Inc. Growth model automated material handling system
JP2004303916A (ja) * 2003-03-31 2004-10-28 Seiko Epson Corp 製造対象物の搬送装置および製造対象物の搬送方法
US7207766B2 (en) * 2003-10-20 2007-04-24 Applied Materials, Inc. Load lock chamber for large area substrate processing system
US20050095087A1 (en) * 2003-10-30 2005-05-05 Sullivan Robert P. Automated material handling system
US7497414B2 (en) * 2004-06-14 2009-03-03 Applied Materials, Inc. Curved slit valve door with flexible coupling
WO2006004718A1 (en) * 2004-06-28 2006-01-12 Brooks Automation, Inc. Non productive wafer buffer module for substrate processing apparatus
US8025473B2 (en) 2004-10-25 2011-09-27 Tokyo Electron Limited Carrying system, substrate treating device, and carrying method
US20070006936A1 (en) * 2005-07-07 2007-01-11 Applied Materials, Inc. Load lock chamber with substrate temperature regulation
DE112005003685B4 (de) * 2005-08-31 2015-09-03 Hirata Corp. Vorrichtung zum Handhaben von Werkstücken
US7577487B2 (en) * 2005-09-14 2009-08-18 Applied Materials, Inc. Methods and apparatus for a band to band transfer module
US8267634B2 (en) 2005-11-07 2012-09-18 Brooks Automation, Inc. Reduced capacity carrier, transport, load port, buffer system
US20080107507A1 (en) * 2005-11-07 2008-05-08 Bufano Michael L Reduced capacity carrier, transport, load port, buffer system
EP1945541B1 (en) * 2005-11-07 2013-04-10 Brooks Automation, Inc. Transport system
US7637708B2 (en) * 2006-01-09 2009-12-29 Sumco Corporation Production system for wafer
US7845891B2 (en) * 2006-01-13 2010-12-07 Applied Materials, Inc. Decoupled chamber body
US7665951B2 (en) 2006-06-02 2010-02-23 Applied Materials, Inc. Multiple slot load lock chamber and method of operation
US7845618B2 (en) 2006-06-28 2010-12-07 Applied Materials, Inc. Valve door with ball coupling
US8124907B2 (en) * 2006-08-04 2012-02-28 Applied Materials, Inc. Load lock chamber with decoupled slit valve door seal compartment
KR101841753B1 (ko) * 2006-08-18 2018-03-23 브룩스 오토메이션 인코퍼레이티드 용량이 축소된 캐리어, 이송, 로드 포트, 버퍼 시스템
US9048274B2 (en) * 2008-12-08 2015-06-02 Taiwan Semiconductor Manufacturing Co., Ltd. Portable stocker and method of using same
JP2010184760A (ja) * 2009-02-10 2010-08-26 Muratec Automation Co Ltd 移載システム
JP5212165B2 (ja) 2009-02-20 2013-06-19 東京エレクトロン株式会社 基板処理装置
WO2017037785A1 (ja) * 2015-08-28 2017-03-09 株式会社日立国際電気 基板処理装置および半導体装置の製造方法
JP2023140142A (ja) 2022-03-22 2023-10-04 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法及びプログラム

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58191446A (ja) * 1982-05-04 1983-11-08 Nec Corp 半導体基板搬送装置
JPS61105853A (ja) * 1984-10-30 1986-05-23 Anelva Corp オ−トロ−ダ−
JPH0641322B2 (ja) * 1985-11-19 1994-06-01 日本ファイリング株式会社 保管管理装置
JPH0638427Y2 (ja) * 1987-06-16 1994-10-05 東京エレクトロン東北株式会社 磁気浮上型ウエハ搬送装置
JPS6449237A (en) * 1987-08-20 1989-02-23 Tokyo Electron Ltd Method of conveying by robot
US4955775A (en) * 1987-12-12 1990-09-11 Tel Sagami Limited Semiconductor wafer treating apparatus
US5177514A (en) * 1988-02-12 1993-01-05 Tokyo Electron Limited Apparatus for coating a photo-resist film and/or developing it after being exposed
JPH01217938A (ja) * 1988-02-26 1989-08-31 Oki Electric Ind Co Ltd ウエハキャリアの自動搬送スシテム
ES2163388T3 (es) * 1988-05-24 2002-02-01 Unaxis Balzers Ag Instalacion de vacio.
US5024570A (en) * 1988-09-14 1991-06-18 Fujitsu Limited Continuous semiconductor substrate processing system
JP3212087B2 (ja) * 1988-10-21 2001-09-25 株式会社日立製作所 多品種搬送方法及び装置
US5061144A (en) * 1988-11-30 1991-10-29 Tokyo Electron Limited Resist process apparatus
US5110248A (en) * 1989-07-17 1992-05-05 Tokyo Electron Sagami Limited Vertical heat-treatment apparatus having a wafer transfer mechanism
FR2656599B1 (fr) * 1989-12-29 1992-03-27 Commissariat Energie Atomique Dispositif de rangement d'objets plats dans une cassette avec rayonnages intermediaires.
JP2913510B2 (ja) * 1990-05-15 1999-06-28 東京エレクトロン株式会社 搬送装置
JPH04267538A (ja) * 1991-02-22 1992-09-24 Kokusai Electric Co Ltd 多連半導体製造装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100331966B1 (ko) * 1999-10-23 2002-04-10 윤기룡 염색된 직물의 직물권취장치
KR100568910B1 (ko) * 2002-08-16 2006-04-10 이재구 검단 및 로울링 작업용 유압식 직물송출장치

Also Published As

Publication number Publication date
US5443346A (en) 1995-08-22
TW257878B (ko) 1995-09-21
JPH0616206A (ja) 1994-01-25

Similar Documents

Publication Publication Date Title
KR940006242A (ko) 클린룸내 반송 시스템
KR960002495A (ko) 기판처리장치
KR960032578A (ko) 기판처리장치 및 방법
ES2115912T3 (es) Sistema de fabricacion automatica.
IT1206086B (it) Sistema per il rivestimento di substrati sottili (wafer) a semiconduttori.
NL194455B (nl) Inrichting voor het uitwisselen van warmte met een halfgeleiderschijf.
DE69535487D1 (de) Vorrichtung zum Entgasen von entionisiertem Wasser
KR920001623A (ko) 종형열처리 장치
KR940009035A (ko) 단일 상자내에 가두어진 납작한 물체를 취급하기 위한 시스템
KR860003495A (ko) 반도체 웨이퍼 표면 검사장치의 이송기구
KR920005399A (ko) 캐리어 스토커
DE69033412T2 (de) Datenübertragungssteuervorrichtung für Parallelverarbeitungssysteme
KR970023653A (ko) 인라인처리시스템 및 이를 이용한 디바이스생산방법
KR960019593A (ko) 열처리 장치
WO2015137072A1 (ja) モジュール式処理ユニット及びそれを用いたグラビアシリンダーの全自動製造システム
DE69422897T2 (de) Handhabungsvorrichtung für Halbleiterplatten
KR960013626B1 (ko) 캐리어 수납용 스토커(Stocker)
KR890011020A (ko) 실리콘 웨이퍼의 수평 이송장치
JPS60107451A (ja) 移送装置
KR980005333A (ko) 기판처리장치 및 기판처리시스템
EP0626724A4 (en) DISC TRANSPORT SYSTEM.
JPS6467932A (en) Semiconductor wafer cassette conveyor
KR970077455A (ko) 반도체 모듈 제조 시스템
JP2001031212A (ja) 自動倉庫
KR102031807B1 (ko) 소형 제조 장치 및 생산 라인에서의 장치간 반송 시스템

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E601 Decision to refuse application
J201 Request for trial against refusal decision
J301 Trial decision

Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20010904

Effective date: 20030731