ES2163388T3 - Instalacion de vacio. - Google Patents

Instalacion de vacio.

Info

Publication number
ES2163388T3
ES2163388T3 ES89109054T ES89109054T ES2163388T3 ES 2163388 T3 ES2163388 T3 ES 2163388T3 ES 89109054 T ES89109054 T ES 89109054T ES 89109054 T ES89109054 T ES 89109054T ES 2163388 T3 ES2163388 T3 ES 2163388T3
Authority
ES
Spain
Prior art keywords
chamber
workpieces
chambers
transfer mechanism
distributor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES89109054T
Other languages
English (en)
Inventor
Rudolf Wagner
Martin Dr Bader
Eberhard Dr Moll
Renzo Zanardo
Agtmaal J G Van
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OC Oerlikon Balzers AG
Original Assignee
Unaxis Balzers AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25689081&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2163388(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Unaxis Balzers AG filed Critical Unaxis Balzers AG
Application granted granted Critical
Publication of ES2163388T3 publication Critical patent/ES2163388T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Applications Or Details Of Rotary Compressors (AREA)
  • Manipulator (AREA)
  • Fluid-Driven Valves (AREA)
  • Electron Tubes For Measurement (AREA)

Abstract

LA INSTALACION DE VACIO PARA TRATAMIENTO DE PIEZAS DE TRABAJO EN FORMA DE DISCO MUESTRA UNA CAMARA DE DISTRIBUCION CENTRAL (7), EN LA QUE SE INTRODUCEN LAS PIEZAS DE TRABAJO DESDE UNA ESCLUSA POR UNA ABERTURA DE CONEXION QUE SE CIERRA MEDIANTE UN ELEMENTO DE CIERRE (8) CON AYUDA DE UN MECANISMO DE TRANSPORTE (10, 11, 12) COLOCADO EN LA CAMARA DE DISTRIBUCION, PRINCIPALAMENTE EN FORMA DE UN BRAZIO DE ROBOT. EN LA CAMARA DE DISTRIBUCION (7) SE ENCIERRAN ADEMAS POR EL PERIMETRO DE LA MISMA CAMARA INTERMEDIA DISTRIBUIDA (15) COMO MODULO INTERCAMBIABLE, CON LO QUE LA CONEXION ENTRE ESTOS SE PUEDE CERRAR CADA POSICION DE CIERRE POR UN ELEMENTO DE CIERRE (4). UNA CAMARA INTERMEDIA (15) ESTA EN CONEXION CON AL MENOS UNA CAMARA DE PROCESO (24, 25) POR UNA ABERTURA DE CONEXION (22, 23), QUE CON OBJETO DE LA SEPARACION DE LA CAMARA DEPROCESO DE LA CAMARA INTERMEDIA SE CIERRA. EN LA CAMARA INTERMEDIA (15) ESTA COLOCADO OTRO MECANISMO DE TRANSPORTE (20, 21) CON OBJETO DE SOBRETOMA DE LAS PIEZAS DE TRABAJO DEL PRIMER MECANISMO DE TRANSPORTE (10, 11, 12), QUE SITUA LAS PIEZAS DE TRABAJO EN UNA MESA ELEVADORA (26, 27) COLOCADA EN LA PARTE INFERIOR DE UNA CAMARA DE PROCESO (24, 25). ESTA LLEVA LA PIEZA DE TRABAJO EN LA CAMARA DE PROCESO CORRESPONDIENTE Y SEPARA SIMULTANEAMENTE ESTA DE LA CAMARA INTERMEDIA VARIAS CAMARAS DE PROCESO (24, 25). LOS ELEMENTOS DE CIERRA (8, 14, 26, 27) EN LAS ABERTURAS DE CONEXION ENTRE LAS CAMARAS (7, 15, 24, 25) SE GOBIERNAN AL LLEVAR A CABO EL PROCESO DE TAL MODO QUE NO PUEDE TENER LUGAR NINGUN EXCESO NO DESEADO DE GASES O PARTICULAS DE UNAS CAMARA DE PROCESO EN LAS OTRAS.
ES89109054T 1988-05-24 1989-05-19 Instalacion de vacio. Expired - Lifetime ES2163388T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH195188 1988-05-24
CH272288 1988-07-15

Publications (1)

Publication Number Publication Date
ES2163388T3 true ES2163388T3 (es) 2002-02-01

Family

ID=25689081

Family Applications (1)

Application Number Title Priority Date Filing Date
ES89109054T Expired - Lifetime ES2163388T3 (es) 1988-05-24 1989-05-19 Instalacion de vacio.

Country Status (6)

Country Link
US (2) US4990047A (es)
EP (1) EP0343530B1 (es)
JP (4) JP3121602B2 (es)
AT (1) ATE208961T1 (es)
DE (1) DE58909880D1 (es)
ES (1) ES2163388T3 (es)

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US5090900A (en) 1992-02-25
US4990047A (en) 1991-02-05
DE58909880D1 (de) 2001-12-20
JPH11145252A (ja) 1999-05-28
EP0343530A2 (de) 1989-11-29
JP3121602B2 (ja) 2001-01-09
EP0343530B1 (de) 2001-11-14
JPH0297035A (ja) 1990-04-09
JP2005167270A (ja) 2005-06-23
JP4012941B2 (ja) 2007-11-28
EP0343530A3 (de) 1990-12-27
ATE208961T1 (de) 2001-11-15
JPH11345860A (ja) 1999-12-14
JP3455468B2 (ja) 2003-10-14

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