DE69422897T2 - Handhabungsvorrichtung für Halbleiterplatten - Google Patents

Handhabungsvorrichtung für Halbleiterplatten

Info

Publication number
DE69422897T2
DE69422897T2 DE69422897T DE69422897T DE69422897T2 DE 69422897 T2 DE69422897 T2 DE 69422897T2 DE 69422897 T DE69422897 T DE 69422897T DE 69422897 T DE69422897 T DE 69422897T DE 69422897 T2 DE69422897 T2 DE 69422897T2
Authority
DE
Germany
Prior art keywords
handling device
semiconductor plates
semiconductor
plates
handling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69422897T
Other languages
English (en)
Other versions
DE69422897D1 (de
Inventor
Hideo Kudo
Isao Uchiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Application granted granted Critical
Publication of DE69422897D1 publication Critical patent/DE69422897D1/de
Publication of DE69422897T2 publication Critical patent/DE69422897T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S294/00—Handling: hand and hoist-line implements
    • Y10S294/907—Sensor controlled device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
DE69422897T 1993-12-10 1994-11-29 Handhabungsvorrichtung für Halbleiterplatten Expired - Fee Related DE69422897T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5310299A JP2758558B2 (ja) 1993-12-10 1993-12-10 ウェーハハンドリング装置

Publications (2)

Publication Number Publication Date
DE69422897D1 DE69422897D1 (de) 2000-03-09
DE69422897T2 true DE69422897T2 (de) 2000-10-05

Family

ID=18003556

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69422897T Expired - Fee Related DE69422897T2 (de) 1993-12-10 1994-11-29 Handhabungsvorrichtung für Halbleiterplatten

Country Status (4)

Country Link
US (1) US5595412A (de)
EP (1) EP0657919B1 (de)
JP (1) JP2758558B2 (de)
DE (1) DE69422897T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6743723B2 (en) * 1995-09-14 2004-06-01 Canon Kabushiki Kaisha Method for fabricating semiconductor device
US20030051974A1 (en) * 1997-05-05 2003-03-20 Semitool, Inc. Automated semiconductor processing system
US20050106714A1 (en) * 2002-06-05 2005-05-19 Zarur Andrey J. Rotatable reactor systems and methods
JP6275155B2 (ja) 2012-11-28 2018-02-07 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 半導体ウェハ洗浄方法及び半導体ウェハ洗浄装置
CN104226659B (zh) * 2013-06-11 2017-09-22 富泰华工业（深圳）有限公司 分离机构
CN104934359B (zh) * 2015-06-08 2017-11-14 高佳太阳能股份有限公司 一种插片机花篮夹具
JP6539199B2 (ja) * 2015-12-18 2019-07-03 株式会社荏原製作所 基板搬送用移載機及び基板移載方法
CN106623237B (zh) * 2016-11-17 2022-04-22 天津滨海光热反射技术有限公司 应用于厚度1-4mm的薄玻璃基板的转举式连续清洗系统及清洗方法
CN106670180B (zh) * 2016-11-17 2022-04-22 天津滨海光热反射技术有限公司 应用于厚度1-4mm的薄玻璃基板的清洗装置及清洗方法
CN106623238B (zh) * 2016-11-17 2022-04-22 天津滨海光热反射技术有限公司 应用于厚度1-4mm的薄玻璃基板吸取转移式连续清洗系统及清洗方法
CN109127587B (zh) * 2018-10-22 2021-03-19 安徽深泽电子股份有限公司 一种pcb板的清洗工装

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1590880A (en) * 1977-05-18 1981-06-10 Busch G Method of and apparatus for building up turning and aligning a pile of sheets
JPS61244040A (ja) * 1985-04-22 1986-10-30 Sony Corp ウエハ移載具
US5030057A (en) * 1987-11-06 1991-07-09 Tel Sagami Limited Semiconductor wafer transferring method and apparatus and boat for thermal treatment of a semiconductor wafer
KR0129405B1 (ko) * 1988-04-25 1998-04-07 하자마 겐쥬 배열된 판형상체의 상호 피치간격을 변환하는 피치변환장치 및 피치변환방법
JP2919054B2 (ja) * 1990-11-17 1999-07-12 東京エレクトロン株式会社 移載装置および移載方法
US5188499A (en) * 1990-12-14 1993-02-23 Mactronix Method and apparatus for varying wafer spacing
JP2767165B2 (ja) * 1991-07-31 1998-06-18 信越半導体株式会社 ウエーハ洗浄槽
JP2640698B2 (ja) * 1991-07-31 1997-08-13 信越半導体株式会社 ウエーハの自動洗浄装置
JPH0547729A (ja) * 1991-08-13 1993-02-26 Shin Etsu Handotai Co Ltd ウエーハハンドリング装置
US5317778A (en) * 1991-07-31 1994-06-07 Shin-Etsu Handotai Co., Ltd. Automatic cleaning apparatus for wafers
JP2803449B2 (ja) * 1992-04-02 1998-09-24 株式会社デンソー 物体の保持装置
JP3131750B2 (ja) * 1992-10-20 2001-02-05 東京エレクトロン株式会社 被処理体検出装置及び方法

Also Published As

Publication number Publication date
JPH07161670A (ja) 1995-06-23
US5595412A (en) 1997-01-21
JP2758558B2 (ja) 1998-05-28
EP0657919B1 (de) 2000-02-02
DE69422897D1 (de) 2000-03-09
EP0657919A1 (de) 1995-06-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee