WO2009028595A1 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
- Publication number
- WO2009028595A1 WO2009028595A1 PCT/JP2008/065378 JP2008065378W WO2009028595A1 WO 2009028595 A1 WO2009028595 A1 WO 2009028595A1 JP 2008065378 W JP2008065378 W JP 2008065378W WO 2009028595 A1 WO2009028595 A1 WO 2009028595A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ports
- substrate
- unload
- processing apparatus
- load
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 9
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009530173A JPWO2009028595A1 (ja) | 2007-08-31 | 2008-08-28 | 基板処理装置 |
CN200880104374A CN101785094A (zh) | 2007-08-31 | 2008-08-28 | 基板处理设备 |
US12/706,991 US20100168909A1 (en) | 2007-08-31 | 2010-02-17 | Substrate Processing Apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-226146 | 2007-08-31 | ||
JP2007226146 | 2007-08-31 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/706,991 Continuation US20100168909A1 (en) | 2007-08-31 | 2010-02-17 | Substrate Processing Apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009028595A1 true WO2009028595A1 (ja) | 2009-03-05 |
Family
ID=40387309
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/065378 WO2009028595A1 (ja) | 2007-08-31 | 2008-08-28 | 基板処理装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20100168909A1 (ja) |
JP (1) | JPWO2009028595A1 (ja) |
CN (1) | CN101785094A (ja) |
WO (1) | WO2009028595A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019183209A (ja) * | 2018-04-05 | 2019-10-24 | 株式会社アルバック | スパッタ装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11823932B2 (en) * | 2020-08-26 | 2023-11-21 | Samsung Electronics Co., Ltd. | Substrate processing system and substrate processing apparatus |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0737907A (ja) * | 1993-07-22 | 1995-02-07 | Toshiba Corp | 半導体処理装置およびその処理方法 |
JPH0846013A (ja) * | 1994-05-23 | 1996-02-16 | Tokyo Electron Ltd | マルチチャンバ処理システム用搬送装置 |
JP2003179120A (ja) * | 1994-08-19 | 2003-06-27 | Tokyo Electron Ltd | 処理装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5565034A (en) * | 1993-10-29 | 1996-10-15 | Tokyo Electron Limited | Apparatus for processing substrates having a film formed on a surface of the substrate |
US5934856A (en) * | 1994-05-23 | 1999-08-10 | Tokyo Electron Limited | Multi-chamber treatment system |
KR960002534A (ko) * | 1994-06-07 | 1996-01-26 | 이노우에 아키라 | 감압·상압 처리장치 |
TW295677B (ja) * | 1994-08-19 | 1997-01-11 | Tokyo Electron Co Ltd | |
US5993081A (en) * | 1995-10-24 | 1999-11-30 | Canon Kabushiki Kaisha | In-line processing system |
US5944857A (en) * | 1997-05-08 | 1999-08-31 | Tokyo Electron Limited | Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor |
JP3862438B2 (ja) * | 1998-12-28 | 2006-12-27 | キヤノン株式会社 | 走査露光装置、走査露光方法およびデバイス製造方法 |
US20020023715A1 (en) * | 2000-05-26 | 2002-02-28 | Norio Kimura | Substrate polishing apparatus and substrate polishing mehod |
JP3880343B2 (ja) * | 2001-08-01 | 2007-02-14 | 株式会社ルネサステクノロジ | ロードポート、基板処理装置および雰囲気置換方法 |
JP4319434B2 (ja) * | 2003-03-11 | 2009-08-26 | 東京エレクトロン株式会社 | ゲートバルブ及び真空容器 |
JP4860167B2 (ja) * | 2005-03-30 | 2012-01-25 | 東京エレクトロン株式会社 | ロードロック装置,処理システム及び処理方法 |
WO2006137287A1 (ja) * | 2005-06-22 | 2006-12-28 | Hitachi Kokusai Electric Inc. | 半導体装置の製造方法および基板処理装置 |
JPWO2007018139A1 (ja) * | 2005-08-10 | 2009-02-19 | 株式会社日立国際電気 | 半導体装置の製造方法および基板処理装置 |
-
2008
- 2008-08-28 JP JP2009530173A patent/JPWO2009028595A1/ja not_active Withdrawn
- 2008-08-28 CN CN200880104374A patent/CN101785094A/zh active Pending
- 2008-08-28 WO PCT/JP2008/065378 patent/WO2009028595A1/ja active Application Filing
-
2010
- 2010-02-17 US US12/706,991 patent/US20100168909A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0737907A (ja) * | 1993-07-22 | 1995-02-07 | Toshiba Corp | 半導体処理装置およびその処理方法 |
JPH0846013A (ja) * | 1994-05-23 | 1996-02-16 | Tokyo Electron Ltd | マルチチャンバ処理システム用搬送装置 |
JP2003179120A (ja) * | 1994-08-19 | 2003-06-27 | Tokyo Electron Ltd | 処理装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019183209A (ja) * | 2018-04-05 | 2019-10-24 | 株式会社アルバック | スパッタ装置 |
Also Published As
Publication number | Publication date |
---|---|
US20100168909A1 (en) | 2010-07-01 |
JPWO2009028595A1 (ja) | 2010-12-02 |
CN101785094A (zh) | 2010-07-21 |
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