TW480589B - Equipment for processing wafers - Google Patents

Equipment for processing wafers Download PDF

Info

Publication number
TW480589B
TW480589B TW089108702A TW89108702A TW480589B TW 480589 B TW480589 B TW 480589B TW 089108702 A TW089108702 A TW 089108702A TW 89108702 A TW89108702 A TW 89108702A TW 480589 B TW480589 B TW 480589B
Authority
TW
Taiwan
Prior art keywords
unit
scope
patent application
equipment
manufacturing
Prior art date
Application number
TW089108702A
Other languages
Chinese (zh)
Inventor
Rolf-Arno Dr Klaebsch
Ronald Dr Huber
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Application granted granted Critical
Publication of TW480589B publication Critical patent/TW480589B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67276Production flow monitoring, e.g. for increasing throughput
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41815Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
    • G05B19/41825Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell machine tools and manipulators only, machining centre
    • GPHYSICS
    • G07CHECKING-DEVICES
    • G07CTIME OR ATTENDANCE REGISTERS; REGISTERING OR INDICATING THE WORKING OF MACHINES; GENERATING RANDOM NUMBERS; VOTING OR LOTTERY APPARATUS; ARRANGEMENTS, SYSTEMS OR APPARATUS FOR CHECKING NOT PROVIDED FOR ELSEWHERE
    • G07C3/00Registering or indicating the condition or the working of machines or other apparatus, other than vehicles
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)

Abstract

This invention relates to an equipment for processing wafers in at least one clean-room (1) with an arrangement of manufacturing-units (2) to carry out each manufacturing step, and with a transport-system to transport the wafers between different manufacturing-units (2). In addition, at least one control-station (7) is provided to automatically track and control the material-flow of the wafers, wherein the process-data are read into the control-station (7) by the manufacturing-units (2) and/or the transport-system.

Description

480589 A7 _B7_ 五、發明說明(1 ) 本發明係關於一種依據申請專利範圍第1項前言之晶 圓加工用之設備。 此種設備包括許多製造單元,其可用來進行不同之製 程。此種製程特別是蝕刻過程,濕式化學方法,擴散過 程以及各種不同之淨化方法(例如,CMP (Chemical Mechanical Polishing)方法)。就每一此種方法而言須 設有一個或多個製造單元。此外,在此種製造單元或各 別之製造單元中亦可進行各種測量-和控制過程。 整個製程需要很高之潔淨度,製造單元因此須配置在 無塵室中或配置在一種由無塵室所組成之条統中。 此種晶圓在小箱中以預定之鬆緊度經由一種輸送条統 而傳送至各別之製造單元〇在晶圓加工後這些小箱之輸 送是經由輸送条統來達成。 此種輸送条統典型上具有一種傳送条統,其例如是由 管筒傳送器之形式所構成。具有晶圓之這些小箱因此是 以平放方式在管筒傳送器上傳送。另一方式是此種傳送 条統可由架空傳送器或類似物所構成。 為了儲存這些小箱,此輸送条統具有多個貯箱。此處 這些小箱可暫時儲存晶圓。 各小箱之材料流是以非集中(d e - c e n t r a 1 1 y )方式由製 造單元所控制。各別之製造單元具有一些操作單元。這 些操作單元典型上具有計算單元,其由操作人員所操作 。操作單元因此分別安裝在其所屬之製造單元。 製造單元用之晶圓之配置通常是由操作人員來安排。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注音?事項再填寫本頁) ----:----訂---------線·. 經濟部智慧財產局員工消費合作社印製 480589 A7 B7 五、發明說明( 經濟部智慧財產局員工消費合作社印製 圓處 之元元 之操之 , 發範 之条資 :載步圓 晶之. 霈單單 C 圓之 <鋰: 備 本利 圓送序 括滿一晶 有式 所造造長晶同 bI 設 。專 晶輸程 包之進些 裝形 言製製較有不和 之。成請 對或之 是元須這 之種 C 而它各間具由誤 藝性達申 便 \ 有 別單訊供 目此間元其使時此可錯 技産來在 以及特 特造資提 數。時單以可之或元置 逑生徼逑 台元之 料製下來 定元多造需整備蹤單配 所之特描 引單統 資此以用 指單很製不調設追造有 頭高之式.導造条序關是待 ,造要之而之此之製會 開能項方 種製送 程有別等 況製需應,點過圓之此 文可 1 它 一 由輸 之,特否 情至言對理缺穿晶別因 本儘第其 有藉或 用外。是 定送而相處有圓別各箱 種有圍之 具。\ 所此台元 預輸員對來替晶各於小 一具範當 備制及。徽。引單 及且人:員此使:由之 供時利適 設控元中特能導造 求出作是人。且是 C別 提工專和 種和單之之功該製 需取操點作整間點的各 是加請式 此蹤造台元有至此 之中之缺操調時缺貴, 的圓申形 C ,迫製引單否送: 員箱元它由來止它!IS 作 c目晶以施中明動',導造是傳台 人貯單其可求中其別操在之在是實項發自圓該製元須引 作由造,目需之,特所存明備的之颶本作晶入此單訊導 操箱製外數之大外是員性發設目利附據流使讀示造資至 據小對此箱需較此箱人險本此此有各依料可被表製之送 依之理 小所有 小作危 使 明圍 材統料 此度傳 -----^----^---------画 * · (請先閱讀背面之注意事項再填寫本頁> 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 480589 A7 __B7_ 五、發明說明(3 ) 而瞬間呈現靜止狀態。 此外,許多具有晶圓之小箱須告知各導引台,這些導 引台在整個設備中是在蓮轉的。這些小箱是由製造單元 告知導引台且以直線方式而在製造單元中處理,這些小 箱供應至製造單元且被處理。 另外,具有晶圓之這些小箱由輸送条統告知導引台, 這些小箱在各別之時間點輸送至傳送条統暫時儲存在貯 箱中或其它儲存条統中。 為了獲得這些存在此設備中之具有晶圓之小箱,則例 如可設置一些光學拾取(Pick up)条統,其可在此設備 之預定位置上測得各別之小箱。這些拾取糸統例如可以 讀碼裝置構成,這些讀碼裝置可讀取此種施加在小箱上 之碼且進行辨認。依據這些碼,則可明確地配置這些小 箱。 最後,有關晶圓加工狀態之資訊特別是由製造單元傳 送至該導引台,特別是以下之資訊會傳送至導引台:小 箱中之晶圓之加工是否無缺點地進行,或晶圓之一部份 是否須再處理或甚至須由製程中作為廢棄物而排除。 依據此種謓入該導引台中之程序資料來追蹤整個設備 中之晶圓之材料流。此外,在計算這些程序資料之後經 由導引台以集中方式(c e n t r a 1 1 y )來控制此製程。特別 是須對此種由輸送条統至製造單元之材料流進行控制。 此外,亦可藉由導引台來預設此製造單元之製造參數。 本發明之設備之主要優點是:此設備之控制是經由導 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注咅?事項再填寫本頁) ----:----訂---------線— . 經濟部智慧財產局員工消費合作社印製 480589 A7 _B7___ 五、發明說明(4 ) 引台以集中方式依據晶圓,製造單元和輸送条統之主要 之整體製程資料來進行〇此材料流因此不是在此設備之 很小之各別區中被最佳化而是在整個設備中被最佳化。 以此種方式可避免各製造單元中不霈要之中止時間,這 些可使各製造單元之滿載度大大地增加。此外,以最少 之人員來對該導引台作集中式之控制。 導引台較佳是具有一種電腦單元,其自動地處理此材 料流之最佳化之大部份工作製造單元所在處之操作人 員不霈要對材料流進行控制〇 最後,有利的是能以簡易之方式藉由導引台以集中式 來進行此製程之改變,這可大大地提高此設備之彈性。 本發明以下將依據圖式來詳逑。圖式簡單說明如下: 第1圖一種由導引台所控制之晶圓加工用之設備之 空間配置圖。 第2圖 連接至第1圖之導引台之各單元之接線圖。 第1圖所示的是晶圓加工用之設備之圖解。為了進行 晶圓加工所需之製程以及為了控制此製程之加工品質, 須在無塵室1中配置許多製造單元2。另一方式是製造 單元2可分佈在多個無塵室1中。 製程包括特殊之蝕刻過程,濕式化學方法。擴散過程 以及淨化方法。 每一製造單元2都具有一個操作單元3,其可由此設 備之操作人員所操作。在本實施例中這些操作單元3直 接配置在各別之製造單元2。另一方式是操作單元3配 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) - I I I I I I I 訂·1111111 I · 經濟部智慧財產局員工消費合作社印製 480589 A7 _B7 _ 五、發明說明(5 ) 置在一種與無塵室1相隔開之空間中,其中不必具備無 塵室之條件。 待處理之晶圓在小箱4中傳送至各別之製造單元2。 典型之鬆緊度是25個晶圖安裝在一個小箱4中。設置一 種輸送条統以便使小箱4傳送至製造單元2且由製造單 元2往外輸送,此輸送条統具有一個傳送条統和一個貯 存条統〇在第1圖所示之實施例中設有一種管筒傳送器 5以作為傳送条統。小箱4平放在管筒傳送器5之管筒 上而被輸送,貯存条統可暫時儲存這些小箱4,其中可 使用貯箱6作為貯存条統。這些貯箱6中之一顯示在第 1圖中。 小箱4由管筒傳送器5取出以及輸送至製造單元2或 至貯箱6可藉由人工來達成或經由一些未顯示之操縱条 統來進行。 設有一種導引台7以便在此種設備中對此晶圓之材料 流進行追蹤及控制。可表示晶圓,製造單元2及/或輸 送条統特徼之這些程序資料由製造單元2及/或輸送条 統讀入該導引台7中。 導引台7本身在原理上可位於無塵室1中。在第1圖 所示之實施例中導引台7位於一個由無塵室1所隔開之 室8中。這樣是有利的,因為此室8中不必存在任何有 關無塵室之條件,使操作人員可簡易且快速地進出此室 8而不需準備無塵室所需之衣服。原則上製造單元2之 操作單元3可配置在和導引台7所在之同一室8中。 一 7 - 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 0 _ 、, _ ^1 ^1 ^1 ^1 I ^1 ϋ 一-0、 1 n I ϋ ϋ I ϋ ϋ ϋ n ϋ ϋ ^1 ^1 ^1 ϋ I ^1 ϋ I I I . 480589 A7 _B7_ 五、發明說明(6 ) 導引台7具有一個或多個未顯示之電腦單元,其可控 制此設備。導引台7之電腦單元連接至此設備之各單元 (特別是製造單元2)。 此種連接方式之一種例子如第2圖所示。第2圖之連 接方式是一種網路,其是由導引台7所控制。 首先,此設備之所有之製造單元2連接至此網路。此 種連接可適當地經由製造單元2之操作單元3來達成。 此外,一些未顯示之操作資料拾取器可配置於各製造單 元2中,這些拾取器同樣連接至導引台7。 此外,在此輸送糸統上可設置多個非集中式(decent r a 1 1 y ) 電 腦單元 9 , 其 同樣是 連接至 導引台 7 。 在 這些非集中式電腦單元9上可分別連接各拾取条統,其 可測得晶圓之材料流。這些拾取条統例如可由讀碼機所 構成,其可讀出這些施加在小箱4上之碼以便對晶圓作 分類。 依據這些以拾取条統所測得之程序資料,則在導引台 7中可測得此設備中有多少個具有晶圓之小箱4在蓮行 此外,亦可對這些具有晶圓之小箱4作準確的迫蹤。 依據這些由操作單元3和操作資料拾取器而讀入至導 引台7中之程序資料,則可測得各製造單元2之主要之 整體程序資料(例如,中止時間,操作上之干擾以及負 載度)且在導引台7中進行計算。此外,亦可獲得一些 有關晶圓處理狀態之資訊。例如,在導引台7中因此可 測得此製造單元2中那些晶圓和多少晶圓必須往外送出 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) - 經濟部智慧財產局員工消費合作社印製480589 A7 _B7_ V. Description of the Invention (1) The present invention relates to a device for processing wafers in accordance with the foreword of the first preamble of the scope of patent application. Such equipment includes many manufacturing units, which can be used for different processes. This process is especially an etching process, a wet chemical method, a diffusion process, and various purification methods (for example, CMP (Chemical Mechanical Polishing) method). For each such method, one or more manufacturing units shall be provided. In addition, various measurement and control processes can be performed in such manufacturing units or in individual manufacturing units. The entire process requires a high degree of cleanliness, so the manufacturing unit must be arranged in a clean room or in a system consisting of clean rooms. Such wafers are conveyed to the respective manufacturing units in a small box with a predetermined tightness through a conveyance system. After the wafer is processed, the conveyance of these small boxes is achieved through the conveyance system. Such a conveying system typically has a conveying system which is, for example, in the form of a tube conveyor. These small boxes with wafers are therefore transported flat on a tube conveyor. Alternatively, such conveyors may be composed of overhead conveyors or the like. To store these small boxes, the conveyor system has multiple storage boxes. Here these small boxes can temporarily store wafers. The material flow of each small box is controlled by the manufacturing unit in a decentralized (d e-c en t r a 1 1 y) manner. Each manufacturing unit has some operating units. These operating units typically have a computing unit, which is operated by an operator. The operating units are therefore installed separately in their respective manufacturing units. The configuration of the wafers used in the manufacturing unit is usually arranged by the operator. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the phonetic on the back? Matters before filling out this page) ----: ---- Order ------- --Line ·. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed 480589 A7 B7 V. Description of the Invention Crystal. 霈 Single C. Round < Lithium: Prepared for the benefit of roundness. Includes crystals made of full crystals with the same bI design. Special crystal transmission packages are more discreet and the system is more discordant. Yes, please be right, or be the kind of Yuan Xu C, and each of them has a misleading artistry. There is a separate message for the sake of the Yuan, and it is possible that the wrong technology can be used in the special capital. The timetable is made of materials that can be used or set up for health, and the Taiwan dollar is used to set the yuan. It needs to be prepared. The special descriptive documents of the tracking office are required to use the index. The style of the head is high. The guidance and order are waiting. The system that is required will open the energy system. The delivery process will be different according to the situation. The article that passes the circle can be 1 As soon as it is lost, it is particularly unreasonable to be reasonable and to pass through the crystal. It is due to borrow or use it. It is a fixed delivery and there are different types of boxes and enclosures. \ So this Taiwan dollar is pre-input Each member of the team has a small fan and a badge. The emblem. The single and the person: the member makes it: from the time to the right to set the control element in the control can be directed to find a person. And C. Do n’t mention the work of the vocational school and the kind of order. The system needs to take the operating point as the whole point. Each of them is a plus request. This traces the lack of manipulation when the Taiwan dollar is here. Compulsory citations are not sent: the member box element stops its origin! IS is the c-eye crystal to implement the move in the Ming ', the guide is the passer of the Taiwan depository, which can be found in the other operation is the actual item from the right. The manufacturing system must be introduced, and for the purpose, the specially-prepared hurricane book is incorporated into this single-media guidance box. The largest number of foreigners is to send instructions and attach funds to read instructions. According to the small box, this box needs to be compared with this box. The risk of this box is different. All the small pieces can be used to make the table. -^ --------- Draw * * (Please read the notes on the back first Fill out this page > This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 480589 A7 __B7_ V. Description of the invention (3) and it appears momentarily stationary. In addition, many small boxes with wafers must be Inform each of the guides that these guides are rotated in the entire equipment. The small boxes are informed by the manufacturing unit and processed in a straight line in the manufacturing unit. These small boxes are supplied to the manufacturing unit and In addition, the small boxes with wafers are informed to the guide table by the conveying bar, and these small boxes are conveyed to the conveying bar at various points in time to be temporarily stored in the bin or other storage bar. In order to obtain these small boxes with wafers stored in the device, for example, some optical pick-up strips can be provided, which can measure the respective small boxes at predetermined positions on the device. These pickup systems may be constituted by, for example, a code reading device that can read and recognize such codes applied to a small box. Based on these codes, these boxes can be explicitly configured. Finally, the information about the wafer processing status is transmitted from the manufacturing unit to the guide, especially the following information will be transmitted to the guide: whether the processing of the wafers in the small box is performed without defects, or the wafers Whether a part must be reprocessed or even excluded as waste in the process. The material flow of the wafers in the entire equipment is tracked based on such procedural data inserted into the guide. In addition, after calculating these program data, the process is controlled in a centralized manner (ce n t r a 1 1 y) by the guide. In particular, this material flow from the conveyor to the manufacturing unit must be controlled. In addition, the manufacturing parameters of this manufacturing unit can also be preset by the guide. The main advantage of the device of the present invention is: the control of this device is through the paper size of the guide to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the note on the back? Matters before filling out this page) ---- : ---- Order --------- Line —. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 480589 A7 _B7___ 5. Description of the invention (4) The introduction platform is based on the wafer in a centralized manner The main overall process data of the manufacturing unit and the conveying system are used to carry out this material flow. Therefore, this material flow is not optimized in the small individual areas of the equipment but in the entire equipment. In this way, unnecessary stoppage time can be avoided in each manufacturing unit, which can greatly increase the full load of each manufacturing unit. In addition, centralized control of the guidance platform is achieved with a minimum of personnel. The guide table preferably has a computer unit that automatically handles most of the optimization of the material flow. The operator where the manufacturing unit is located does not have to control the material flow. Finally, it is advantageous to be able to The simple way to change this process by the guide table in a centralized way can greatly improve the flexibility of this equipment. The present invention will be described in detail below with reference to the drawings. The diagram is briefly explained as follows: Figure 1 is a layout diagram of the equipment for wafer processing controlled by the guide table. Figure 2 Wiring diagram of each unit connected to the guide table in Figure 1. Figure 1 shows a diagram of the equipment used for wafer processing. In order to perform the processes required for wafer processing and to control the processing quality of this process, many manufacturing units 2 must be arranged in the clean room 1. Another way is that the manufacturing units 2 may be distributed in a plurality of clean rooms 1. The manufacturing process includes a special etching process and a wet chemical method. Diffusion process and purification method. Each manufacturing unit 2 has an operating unit 3 which can be operated by the operator of the equipment. In this embodiment, these operation units 3 are directly arranged in the respective manufacturing units 2. Another way is to use the paper size of the operating unit 3 with the Chinese National Standard (CNS) A4 (210 X 297 mm) (please read the precautions on the back before filling this page)-IIIIIII · 1111111 I · Ministry of Economic Affairs Intellectual Property Printed by the Bureau ’s Consumer Cooperatives 480589 A7 _B7 _ V. Description of the Invention (5) It is placed in a space separated from the clean room 1, which does not need to have the conditions of a clean room. The wafers to be processed are transferred in a small box 4 to respective manufacturing units 2. Typical tightness is 25 crystal patterns installed in a small box 4. A conveying system is provided for conveying the small box 4 to and from the manufacturing unit 2. The conveying system has a conveying system and a storage system. In the embodiment shown in FIG. 1, a conveying system is provided. A tube conveyor 5 is used as a conveying system. The small box 4 is transported on the tube of the tube conveyer 5, and the storage box can temporarily store these small boxes 4, and the storage box 6 can be used as the storage box. One of these tanks 6 is shown in FIG. The small box 4 is taken out by the tube conveyor 5 and conveyed to the manufacturing unit 2 or to the storage box 6 either manually or through some operating system not shown. A guide table 7 is provided to track and control the material flow of this wafer in such equipment. These program data, which can represent wafers, manufacturing units 2 and / or transport bars, are read into the guide table 7 by the manufacturing unit 2 and / or transport bars. The guide table 7 itself can be located in the clean room 1 in principle. In the embodiment shown in Fig. 1, the guide table 7 is located in a room 8 separated by a clean room 1. This is advantageous because it is not necessary to have any conditions related to the clean room in the room 8, so that the operator can easily and quickly enter and exit the room 8 without having to prepare the clothes required for the clean room. In principle, the operation unit 3 of the manufacturing unit 2 can be arranged in the same room 8 as the guide table 7. 7-This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 0 _ ,, _ ^ 1 ^ 1 ^ 1 ^ 1 I ^ 1 ϋ one -0, 1 n I ϋ ϋ I ϋ ϋ ϋ n ϋ ϋ ^ 1 ^ 1 ^ 1 ϋ I ^ 1 ϋ III. 480589 A7 _B7_ V. Description of the invention (6 The guide table 7 has one or more computer units (not shown) which can control the device. The computer unit of the guide table 7 is connected to each unit of the apparatus (especially the manufacturing unit 2). An example of this type of connection is shown in Figure 2. The connection method in FIG. 2 is a network, which is controlled by the guidance station 7. First, all manufacturing units 2 of this device are connected to this network. Such a connection can be suitably achieved via the operation unit 3 of the manufacturing unit 2. In addition, some not-shown operating data pickups may be arranged in each manufacturing unit 2, and these pickups are also connected to the guide table 7. In addition, a plurality of non-centralized (decent r a 1 1 y) computer units 9 may be provided on the transport system, which are also connected to the guide table 7. Each of these decentralized computer units 9 can be individually connected with each picking bar, which can measure the material flow of the wafer. These pick-up bars can be constituted, for example, by a code reader, which can read the codes applied to the small box 4 to sort the wafers. According to the program data measured by the pickup system, the number of small boxes 4 with wafers in the equipment can be measured in the guide table 7. In addition, these small boxes with wafers can also be measured. Box 4 made an accurate forcing. According to the program data read into the guide table 7 by the operation unit 3 and the operation data picker, the main overall program data of each manufacturing unit 2 can be measured (for example, suspension time, operation interference and load). Degrees) and calculated in the guide 7. In addition, some information about wafer processing status is also available. For example, in the guide table 7, it can be measured which wafers and how many wafers in this manufacturing unit 2 must be sent out. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read first (Notes on the back, please fill out this page)-Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs

-1 ϋ ϋ 一: 口、 ϋ i-i i-i I ϋ I ϋ ϋ ϋ l ϋ ϋ ϋ ϋ ^1 .1 Βϋ ^1 ^1 I 480589 A7 _B7_ 五、發明說明(7 ) 以作再加或成為次等品。 依據這些程序資料,材料流是經由導引台7而以集中 方式受到控制。特別是控制指令可經由導引台7而發 送至輸送条統上之非集中式電腦單元9,藉此指令使經 由管筒傳送器5之晶圓轉向或使具有晶圓之指定之小箱 4存放至貯存条統中或由貯存条統中取出。 此外,控制命令或製造參數亦可由導引台7直接傳送 至製造單元2之操作單元3。特別是相關製造單元2之 操作參數須以適當之方式來調整以便適應此材料流。另 一方式是操作人員所需之操作指示可由導引台7發送至 製造單元2之製造單元3。 此外,在導引台7上連接此設備之維修裝置所霈之電 腦單元1 〇。 又,此設備之備用組件貯存器之管理用至少一個電腦 單元11是連接至導引台7。 若這些連接至導引台7之各單元中之一(特別是製造 單元2)錯誤地工作著或若此單元由於缺陷而失效,則干 擾訊息即由此單元傳送至該導引台7。 在導引台7中計算該干擾訊息。適當之方式是依據此 干擾訊息而使一種控制命令傳送至相對應之單元以消除 此種干擾(若此單元仍然是有功能時)。此種干擾是與製 造單元2之功能上之干擾有關,因此導引台7 —種相對 應之控制命令可顯示在操作單元3上。在最簡單之情況 中此操作人員可依據此種顯示在操作單元3上之控制命 -9 - 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) . —線· 經濟部智慧財產局員工消費合作社印製 480589 經濟部智慧財產局員工消費合作社印製 A7 _B7_五、發明說明(8 ) 令立刻在某位置之前消除此干擾。 若製造單元2之干擾較大時,例如,製造單元2之一 部份有缺陷時,則在測得此干擾訊息之後一控制命令由 導引台7發送至此設備之維修裝置之電腦單元10。操作 人員因此可以很短之反應時間對此製造單元2上之缺陷 進行定位且將此缺陷消除。 在製造單元2之一部份有缺陷時,則另外亦由導引台 7發出一種控制命令至此設備之備用組件貯存器之電腦 單元1 1以作為對相關製造單元2之干擾訊息之響應。這 樣可很快地製備一些備用組件,使製造單元2可在很短 時間内又可蓮轉。 適當之方式是所有連接至導引台7之單元之操作狀態 須持續地顯示在導引台7之至少一個電腦單元上。持別 有利之方式是這些操作狀態以圖形方式顯示在電腦單元 上。導引台7之操作人員因此可持績地控制:此設備是 否完美地操作,或操作期間是否出現一些危險狀態。 原則上此設備中若不用一種集中式之導引台7 ,則亦 可設置許多以非集中方式操作之導引台7 ,這些導引台 7上可分別連接一些預數目之單元。 符號之說明 (請先閱讀背面之注意事項再填寫本頁) -----K---- 1 .......無塵室 2 .......製造單元 3 .......操作單元 4 .......小箱 -10--1 ϋ ϋ One: 口, ϋ ii ii I ϋ I ϋ ϋ ϋ l ϋ ϋ ϋ ϋ ^ 1 .1 Βϋ ^ 1 ^ 1 I 480589 A7 _B7_ V. Description of the invention (7) for addition or to become inferior Product. According to these program data, the material flow is controlled in a centralized manner via the guide table 7. In particular, control instructions can be sent to the non-centralized computer unit 9 on the conveyor system via the guide table 7, thereby instructing the turning of the wafer via the tube conveyor 5 or the designated small box 4 with the wafer Stored in or removed from the storage system. In addition, control commands or manufacturing parameters can also be transmitted directly from the guide table 7 to the operation unit 3 of the manufacturing unit 2. In particular, the operating parameters of the relevant manufacturing unit 2 must be adjusted in an appropriate manner in order to adapt to this material flow. Alternatively, an operation instruction required by the operator can be transmitted from the guide table 7 to the manufacturing unit 3 of the manufacturing unit 2. In addition, a computer unit 10 for the maintenance device of this equipment is connected to the guide table 7. In addition, at least one computer unit 11 for managing the spare component storage of this equipment is connected to the guide table 7. If one of these units (especially the manufacturing unit 2) connected to the guide table 7 works incorrectly or if this unit fails due to a defect, an interference message is transmitted from this unit to the guide table 7. The interference message is calculated in the guidance station 7. The appropriate method is to send a control command to the corresponding unit based on the interference message to eliminate such interference (if the unit is still functional). This kind of interference is related to the functional interference of the manufacturing unit 2. Therefore, the corresponding control command of the guide table 7 can be displayed on the operating unit 3. In the simplest case, the operator can follow this control command displayed on the operating unit -9-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the Note: Please fill in this page again). —Line · Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 480589 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _B7_ V. Invention Description (8) Order to eliminate this immediately before a location interference. If the interference from the manufacturing unit 2 is large, for example, when a part of the manufacturing unit 2 is defective, a control command is sent from the guide 7 to the computer unit 10 of the maintenance device of the equipment after the interference message is measured. The operator can therefore locate and eliminate the defect on this manufacturing unit 2 with a short reaction time. When a part of the manufacturing unit 2 is defective, a control command is also issued from the guide unit 7 to the computer unit 11 of the spare component storage of the equipment as a response to the interference message of the relevant manufacturing unit 2. In this way, spare parts can be prepared quickly, so that the manufacturing unit 2 can be turned back again in a short time. It is appropriate that the operating status of all units connected to the guide table 7 must be continuously displayed on at least one computer unit of the guide table 7. It is advantageous if these operating states are displayed graphically on the computer unit. The operator of the guide table 7 can thus keep track of whether the equipment is operating perfectly, or whether some dangerous situation occurs during operation. In principle, if a centralized guidance platform 7 is not used in this equipment, many guidance platforms 7 that are operated in a non-centralized manner can also be provided. These guidance platforms 7 can be respectively connected to some pre-numbered units. Explanation of symbols (please read the precautions on the back before filling this page) ----- K ---- 1 ....... clean room 2 ....... manufacturing unit 3 .. ..... Operating unit 4 .... Small box-10-

一一OJ ϋβ ϋ ϋ I -1 ϋ ϋ 11 ϋ·- ϋ ^1 ϋ ·ϋ ϋ ϋ .^1 ^1 ϋ ϋ- ^1 ϋ ·ϋ ϋ ^1 ϋ I 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 480589 A7B7 明說 明發 5 6 7 8 9 器 送 傳 台 筒箱引 管貯導室 元 單 腦 電 (請先閱讀背面之注意事項再填寫本頁> - 經濟部智慧財產局員工消費合作社印製 I ^1 ϋ —^1 ϋ ϋ ϋ 一一I i^i ϋ ϋ i^i ·ϋ ϋ n I 線—赡---------in.---------- 本紙張尺度適用中國國家標準(CNS)A4規格(210 χ 297公釐)一一 OJ ϋβ ϋ ϋ I -1 ϋ ϋ 11 ϋ ·-ϋ ^ 1 ϋ · ϋ ϋ ϋ. ^ 1 ^ 1 ϋ ϋ- ^ 1 ϋ · ϋ ϋ ^ 1 ϋ I This paper size applies the Chinese National Standard (CNS ) A4 size (210 X 297 mm) 480589 A7B7 clearly stated 5 6 7 8 9 sender tube box guide tube storage guide unit single EEG (Please read the precautions on the back before filling this page >- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs I ^ 1 ϋ — ^ 1 ϋ ϋ ϋ 一 I I i ^ i ϋ ϋ i ^ i · ϋ ϋ n I line— 赡 --------- in. ---------- This paper size applies to China National Standard (CNS) A4 (210 x 297 mm)

Claims (1)

480589 六、申請專利範圍 第89108702號「晶圓加工用之設備㈠」專利案 修正) 六申請專利範圍 1. 一種晶圓加工用之設備,其是放在至少一個無麈室中, 無塵室中之配置包括:一些製造單元,用來進行各別之 製造步驟;一種輸送系統,用來在各種不同之製造單元 之間輸送晶.圓,此種設備之特徵爲:設有至少一個導引 台(7)以便自動地追蹤且控制晶圓之材料流,由各製造單 元(2)及/或輸送系統使這些可表示各晶圓,製造單元(2) 及/或輸送系統等之特徵之程序資料讀入導引台之中。 2·如申請專利範圍第1項之設備,其中導引台(7)配置在無 塵室(1)外部。 3·如申請專利範圍第1或第2項之設備,其中導引台(7) 具有至少一個電腦單元,其連接至製造單元(2)及/或連 接至輸送系統之非集中式電腦單元(9)。 4·如申請專利範圍第i或第2項之設備,其中導引台(7) 連接至操作資料拾取器。 5·如申請專利範圍第4項之設備,其中此設備之維修裝置 用之至少一個電腦單元(10)連接至導引台(7)。 6·如申請專利範圍第4項之設備,其中此設備之備用組件 貯存器之管理用之至少一個電腦單元(11)連接至導引台 (7) 〇 7.如申請專利範圍第1項之設備,其中由這些連接至導引 台(7)之單元使干擾資訊傳送至導引台(7)。 480589 六、申請專利範圍 8. 如申請專利範圍第7項之設備,其中依據一種連接至導 引台(7)之單元之干擾資訊而由導引台(7)發出一種控制命 令以便消除此干擾。 9. 如申請專利範圍第8項之設備,其中依據一種連接至導 引台(7)之單元之干擾資訊而由導引台(7)發出一種控制命 令至維修裝置之電腦單元。 10·如申請專利範圍第8或第9項之設備,其中依據一種連 接至導引台(7)之單元之干擾資訊而由導引台(7)發出一種 控制命令至備用組件貯存器之電腦單元(11)以便對備用組 件下命令。 工1·如冲請專利範圍第1項之設備,其中由導引台(7)傳送一 些控制命令至製造單元(2)以作爲其控制用。 12·如申請專利範圍第u項之設備,其中藉由導引台(7)而使 製造參數傳送至製造單元(2)。 13·如申請專利範圍第12項之設備,其中藉由導引台(7)使操 作人員所需之操作指示發送至製造單元(2)。 14.如申請專利範圍第1,11或12項之設備,其中每一製造 單元(2)都具有一種操作單元(3),控制命令是由導引台(7) 讀入此操作單元(3)中。 15·如申請專利範圍第14項之設備,其中此操作單元(3)配置 於製造單元(2)。 16.如申請專利範圍第14項之設備,其中此操作單元(3)配置 在一種配置於無塵室(1)外部之操作室中。 17·如申請專利範圍第16項之設備,其中在操作室中配置多 480589 六、申請專利範圍 個操作單元(3)以及配置上述之導引台(7)。 18·如申請專利範圍第12或13項之設備,其中由導引台(7) 依據這些製造單元(2)所用之製造參數來控制該輸送系 統。 19. 如申請專利範圍第7,8或9項之設備,其中這些連接 至導引台(7)之單元之操作狀態顯示在導引台(7)上。 20. 如申請專利範圍第〗,2, 7, 8或9項之設備,其中此設備 具有多個以非集中式操作之導引台(7),在每一個導引台(7) 上連接一預定數目之單元。480589 VI. Application for Patent Scope No. 89108702 (Amendment of Patent for “Equipment for Wafer Processing Equipment”) 6. Application for Patent Scope 1. A device for wafer processing, which is placed in at least one clean room, clean room The configuration includes: some manufacturing units for carrying out the respective manufacturing steps; a conveying system for conveying crystals and rounds between various different manufacturing units; the feature of this equipment is that it is provided with at least one guide Table (7) in order to automatically track and control the material flow of the wafer, and each manufacturing unit (2) and / or transportation system enables these to represent the characteristics of each wafer, manufacturing unit (2) and / or transportation system The program information is read into the guide. 2. The device according to item 1 of the scope of patent application, wherein the guide table (7) is arranged outside the clean room (1). 3. The equipment according to item 1 or 2 of the patent application scope, wherein the guide table (7) has at least one computer unit connected to the manufacturing unit (2) and / or a non-centralized computer unit connected to the conveying system ( 9). 4. The device according to item i or item 2 of the patent application scope, wherein the guide table (7) is connected to the operation data pickup. 5. The device according to item 4 of the scope of patent application, wherein at least one computer unit (10) for the maintenance device of the device is connected to the guide table (7). 6. If the equipment in the scope of the patent application, the at least one computer unit (11) for the management of the spare component storage of the equipment is connected to the guide table (7). Equipment in which interference information is transmitted to the guidance station (7) by these units connected to the guidance station (7). 480589 6. Scope of patent application 8. For the equipment of scope 7 of patent application, according to the interference information of a unit connected to the guidance station (7), a control command is issued by the guidance station (7) in order to eliminate this interference. . 9. For the device in the scope of patent application No. 8, in which the control unit (7) issues a control command to the computer unit of the maintenance device based on the interference information of a unit connected to the guidance unit (7). 10. If the equipment in the scope of patent application No. 8 or 9 is used, a control command is sent from the guide (7) to the computer of the spare component storage according to the interference information of a unit connected to the guide (7) A unit (11) for ordering a spare component. Worker 1. If the equipment of item 1 of the patent scope is requested, the control table (7) sends some control commands to the manufacturing unit (2) for its control. 12. The device according to item u of the patent application scope, wherein the manufacturing parameters are transmitted to the manufacturing unit (2) by means of the guide (7). 13. The device according to item 12 of the scope of patent application, wherein the operation instructions required by the operator are sent to the manufacturing unit (2) by the guide table (7). 14. As for the equipment in the scope of patent application 1, 11 or 12, each manufacturing unit (2) has an operation unit (3), and the control command is read into the operation unit (3) by the guide (7) )in. 15. The device according to item 14 of the patent application scope, wherein the operation unit (3) is arranged in the manufacturing unit (2). 16. The device according to item 14 of the scope of patent application, wherein the operation unit (3) is arranged in an operation room arranged outside the clean room (1). 17. If the equipment in the scope of the patent application is No. 16, there are 480589 more in the operation room. 6. The scope of the patent application is in the operation unit (3) and the above-mentioned guide (7). 18. The device according to item 12 or 13 of the scope of patent application, wherein the guide system (7) controls the conveying system according to the manufacturing parameters used by these manufacturing units (2). 19. For the equipment in the scope of patent application No. 7, 8 or 9, the operation status of the units connected to the guide table (7) is displayed on the guide table (7). 20. The equipment according to the scope of patent application No. 2, 7, 8 or 9, wherein the equipment has a plurality of guide tables (7) operating in a non-centralized manner, and is connected to each guide table (7) A predetermined number of units.
TW089108702A 1999-05-07 2000-12-18 Equipment for processing wafers TW480589B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19921244A DE19921244A1 (en) 1999-05-07 1999-05-07 Plant for processing wafers

Publications (1)

Publication Number Publication Date
TW480589B true TW480589B (en) 2002-03-21

Family

ID=7907410

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089108702A TW480589B (en) 1999-05-07 2000-12-18 Equipment for processing wafers

Country Status (4)

Country Link
EP (1) EP1183715A2 (en)
DE (1) DE19921244A1 (en)
TW (1) TW480589B (en)
WO (1) WO2000068974A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10064030A1 (en) * 2000-12-21 2002-07-18 Infineon Technologies Ag Method and device for processing a physical object, computer program element and computer-readable storage medium
JP4712379B2 (en) 2002-07-22 2011-06-29 ブルックス オートメーション インコーポレイテッド Substrate processing equipment
US7988398B2 (en) 2002-07-22 2011-08-02 Brooks Automation, Inc. Linear substrate transport apparatus
US8960099B2 (en) 2002-07-22 2015-02-24 Brooks Automation, Inc Substrate processing apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0616475B2 (en) * 1987-04-03 1994-03-02 三菱電機株式会社 Article manufacturing system and article manufacturing method
US5474647A (en) * 1993-11-15 1995-12-12 Hughes Aircraft Company Wafer flow architecture for production wafer processing
KR960043307A (en) * 1995-05-11 1996-12-23 김광호 Chemical processing device central management system
TW309503B (en) * 1995-06-27 1997-07-01 Tokyo Electron Co Ltd
US5751581A (en) * 1995-11-13 1998-05-12 Advanced Micro Devices Material movement server
US6282457B1 (en) * 1996-06-07 2001-08-28 Tokyo Electron Limited Device for controlling treating station
JPH118170A (en) * 1997-06-13 1999-01-12 Canon Inc Semiconductor processing system and manufacture of device
JPH1159829A (en) * 1997-08-08 1999-03-02 Mitsubishi Electric Corp Semiconductor wafer cassette conveyer, stocker used in semiconductor wafer cassette conveyer, and stocker in/out stock work control method/device used in semiconductor wafer cassette conveyer

Also Published As

Publication number Publication date
DE19921244A1 (en) 2000-11-16
WO2000068974A2 (en) 2000-11-16
WO2000068974A3 (en) 2001-04-05
EP1183715A2 (en) 2002-03-06

Similar Documents

Publication Publication Date Title
TW517283B (en) Equipment to process wafers
US5321885A (en) Method and apparatus for manufacturing printed wiring boards
TW553877B (en) Equipment to process wafers
JPH0326450A (en) Production control system
JP2511166B2 (en) Transport system
JP2012183633A (en) Spectacle lens supply system
JP4346849B2 (en) Electronic component mounting apparatus and electronic component mounting method
TW480589B (en) Equipment for processing wafers
JPH0278243A (en) Continuous processing system for semiconductor substrate
JP3774836B2 (en) Lot transportation system and lot transportation method
JP2008077559A (en) Tracking system and method
JP3612609B2 (en) Delivery management sorting system
JP2006179561A (en) Tray conveyance system
JP2012104683A (en) Manufacturing line of semiconductor device, and manufacturing method of semiconductor device
JPH11254639A (en) Method and device for assorting and transferring press plate
JP2001031219A (en) Tire temporary storage method and temporary storage system
JP5527137B2 (en) Work transfer system
JPS6357158A (en) Flexible transporting system
JPH09255114A (en) Conveyance route setting method and device in physical distribution system
JP2007034912A (en) Working line management system
JP2011191831A (en) Method for managing material to-be-cut and mill ends
JP2005280911A (en) Article handling facility
JP2005169586A (en) Tool change method and its device
JPWO2007004347A1 (en) Processing system and processing method
JPS62157115A (en) Controller for transport system

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees