JP3141562B2
(ja)
*
|
1992-05-27 |
2001-03-05 |
富士電機株式会社 |
薄膜トランス装置
|
US5450755A
(en)
*
|
1992-10-21 |
1995-09-19 |
Matsushita Electric Industrial Co., Ltd. |
Mechanical sensor having a U-shaped planar coil and a magnetic layer
|
US6911887B1
(en)
|
1994-09-12 |
2005-06-28 |
Matsushita Electric Industrial Co., Ltd. |
Inductor and method for producing the same
|
KR100231356B1
(ko)
*
|
1994-09-12 |
1999-11-15 |
모리시타요이찌 |
적층형 세라믹칩 인덕터 및 그 제조방법
|
US5621594A
(en)
*
|
1995-02-17 |
1997-04-15 |
Aiwa Research And Development, Inc. |
Electroplated thin film conductor coil assembly
|
JPH0936312A
(ja)
*
|
1995-07-18 |
1997-02-07 |
Nec Corp |
インダクタンス素子およびその製造方法
|
US5781091A
(en)
*
|
1995-07-24 |
1998-07-14 |
Autosplice Systems Inc. |
Electronic inductive device and method for manufacturing
|
JP3725599B2
(ja)
*
|
1995-09-07 |
2005-12-14 |
株式会社東芝 |
平面型磁気素子
|
JPH0983104A
(ja)
*
|
1995-09-12 |
1997-03-28 |
Murata Mfg Co Ltd |
コイル内蔵回路基板
|
US5751528A
(en)
*
|
1996-04-15 |
1998-05-12 |
Read-Rite Corporation |
Multilayer exchange coupled magnetic poles with approximate zero magnetostriction
|
WO1998005048A1
(en)
*
|
1996-07-29 |
1998-02-05 |
Motorola Inc. |
Low radiation planar inductor/transformer and method
|
JPH1055916A
(ja)
|
1996-08-08 |
1998-02-24 |
Kiyoto Yamazawa |
薄型磁気素子およびトランス
|
DE19639881C2
(de)
*
|
1996-09-27 |
1999-05-20 |
Siemens Matsushita Components |
Verfahren zum Herstellen eines induktiven Bauelements
|
US6025725A
(en)
*
|
1996-12-05 |
2000-02-15 |
Massachusetts Institute Of Technology |
Electrically active resonant structures for wireless monitoring and control
|
US6896826B2
(en)
*
|
1997-01-09 |
2005-05-24 |
Advanced Technology Materials, Inc. |
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
|
JP3441328B2
(ja)
*
|
1997-02-04 |
2003-09-02 |
株式会社東芝 |
平面型インダクタンス素子
|
US6088471A
(en)
*
|
1997-05-16 |
2000-07-11 |
Authentec, Inc. |
Fingerprint sensor including an anisotropic dielectric coating and associated methods
|
JP3600415B2
(ja)
|
1997-07-15 |
2004-12-15 |
株式会社東芝 |
分布定数素子
|
US6160303A
(en)
*
|
1997-08-29 |
2000-12-12 |
Texas Instruments Incorporated |
Monolithic inductor with guard rings
|
US6201387B1
(en)
*
|
1997-10-07 |
2001-03-13 |
Biosense, Inc. |
Miniaturized position sensor having photolithographic coils for tracking a medical probe
|
US6124778A
(en)
*
|
1997-10-14 |
2000-09-26 |
Sun Microsystems, Inc. |
Magnetic component assembly
|
US6013939A
(en)
*
|
1997-10-31 |
2000-01-11 |
National Scientific Corp. |
Monolithic inductor with magnetic flux lines guided away from substrate
|
JP3683398B2
(ja)
*
|
1997-12-22 |
2005-08-17 |
株式会社ルネサステクノロジ |
半導体集積回路及びその製造方法
|
US5835367A
(en)
*
|
1998-01-20 |
1998-11-10 |
Industrial Technology Research Institute |
Distributed plannar-type high voltage transformer
|
US5847947A
(en)
*
|
1998-01-29 |
1998-12-08 |
Industrial Technology Research Institute |
High voltage transformer
|
US5959522A
(en)
*
|
1998-02-03 |
1999-09-28 |
Motorola, Inc. |
Integrated electromagnetic device and method
|
US7768371B2
(en)
*
|
1998-02-05 |
2010-08-03 |
City University Of Hong Kong |
Coreless printed-circuit-board (PCB) transformers and operating techniques therefor
|
FI103919B
(fi)
*
|
1998-02-26 |
1999-10-15 |
Metso Paper Automation Oy |
Laite liikkuvan paperi- tai kartonkirainan ominaisuuksien mittaamiseksi
|
ATE338313T1
(de)
*
|
1998-06-23 |
2006-09-15 |
Meto International Gmbh |
Identifizierungselement
|
US6054914A
(en)
*
|
1998-07-06 |
2000-04-25 |
Midcom, Inc. |
Multi-layer transformer having electrical connection in a magnetic core
|
US7107666B2
(en)
*
|
1998-07-23 |
2006-09-19 |
Bh Electronics |
Method of manufacturing an ultra-miniature magnetic device
|
US6420952B1
(en)
|
1998-09-30 |
2002-07-16 |
Core Technology Inc. |
Faraday shield and method
|
US6392525B1
(en)
*
|
1998-12-28 |
2002-05-21 |
Matsushita Electric Industrial Co., Ltd. |
Magnetic element and method of manufacturing the same
|
US6566731B2
(en)
|
1999-02-26 |
2003-05-20 |
Micron Technology, Inc. |
Open pattern inductor
|
US6570994B1
(en)
*
|
1999-03-25 |
2003-05-27 |
Agere Systems Inc. |
Field layer speaker for consumer products
|
US6198374B1
(en)
|
1999-04-01 |
2001-03-06 |
Midcom, Inc. |
Multi-layer transformer apparatus and method
|
JP3776281B2
(ja)
*
|
1999-04-13 |
2006-05-17 |
アルプス電気株式会社 |
インダクティブ素子
|
JP3255151B2
(ja)
*
|
1999-05-11 |
2002-02-12 |
日本電気株式会社 |
多層プリント回路基板
|
US6588090B1
(en)
*
|
1999-06-03 |
2003-07-08 |
Nikon Corporation |
Fabrication method of high precision, thermally stable electromagnetic coil vanes
|
JP2001023821A
(ja)
*
|
1999-07-07 |
2001-01-26 |
Tif:Kk |
インダクタ素子
|
US6240622B1
(en)
|
1999-07-09 |
2001-06-05 |
Micron Technology, Inc. |
Integrated circuit inductors
|
US6097273A
(en)
*
|
1999-08-04 |
2000-08-01 |
Lucent Technologies Inc. |
Thin-film monolithic coupled spiral balun transformer
|
US6376909B1
(en)
|
1999-09-02 |
2002-04-23 |
Micron Technology, Inc. |
Mixed-mode stacked integrated circuit with power supply circuit part of the stack
|
DE19944741C2
(de)
|
1999-09-17 |
2001-09-13 |
Siemens Ag |
Monolitisch integrierter Transformator
|
US6856228B2
(en)
*
|
1999-11-23 |
2005-02-15 |
Intel Corporation |
Integrated inductor
|
US6870456B2
(en)
|
1999-11-23 |
2005-03-22 |
Intel Corporation |
Integrated transformer
|
US6891461B2
(en)
|
1999-11-23 |
2005-05-10 |
Intel Corporation |
Integrated transformer
|
US6815220B2
(en)
*
|
1999-11-23 |
2004-11-09 |
Intel Corporation |
Magnetic layer processing
|
US6452247B1
(en)
|
1999-11-23 |
2002-09-17 |
Intel Corporation |
Inductor for integrated circuit
|
US6420954B1
(en)
|
1999-12-10 |
2002-07-16 |
Micron Technology, Inc. |
Coupled multilayer soft magnetic films for high frequency microtransformer for system-on-chip power supply
|
US6738240B1
(en)
*
|
1999-12-10 |
2004-05-18 |
Micron Technology, Inc. |
Microtransformer for system-on-chip power supply
|
US6835576B2
(en)
*
|
2000-05-02 |
2004-12-28 |
Fuji Electric Co., Ltd. |
Magnetic thin film, a magnetic component that uses this magnetic thin film, manufacturing methods for the same, and a power conversion device
|
CN1383569A
(zh)
|
2000-04-06 |
2002-12-04 |
埃利亚股份有限公司 |
小型化ac/dc电源及电池充电器
|
DE10047214A1
(de)
*
|
2000-09-23 |
2002-04-11 |
Philips Corp Intellectual Pty |
Schaltungsanordnung
|
US6420773B1
(en)
*
|
2000-10-04 |
2002-07-16 |
Winbond Electronics Corp. |
Multi-level spiral inductor structure having high inductance (L) and high quality factor (Q)
|
US6890829B2
(en)
*
|
2000-10-24 |
2005-05-10 |
Intel Corporation |
Fabrication of on-package and on-chip structure using build-up layer process
|
US6567703B1
(en)
*
|
2000-11-08 |
2003-05-20 |
Medtronic, Inc. |
Implantable medical device incorporating miniaturized circuit module
|
CN1230840C
(zh)
*
|
2000-11-21 |
2005-12-07 |
皇家菲利浦电子有限公司 |
系统、印刷电路板、充电器装置、用户装置及设备
|
DE10100282B4
(de)
*
|
2001-01-04 |
2005-10-13 |
Infineon Technologies Ag |
Elektrischer Transformator
|
JP4343448B2
(ja)
*
|
2001-01-26 |
2009-10-14 |
株式会社日立産機システム |
変圧器の製造方法
|
FR2820548A1
(fr)
*
|
2001-02-02 |
2002-08-09 |
Schlumberger Systems & Service |
Objet portatif a puce et a antenne, module destine a former un objet portatif a puce et a antenne et leurs procedes de fabrication
|
US6660412B2
(en)
*
|
2001-03-15 |
2003-12-09 |
Waseem A. Roshen |
Low loss, high frequency composite magnetic material and methods of making the same
|
US6653885B2
(en)
*
|
2001-05-03 |
2003-11-25 |
Peregrine Semiconductor Corporation |
On-chip integrated mixer with balun circuit and method of making the same
|
US6577219B2
(en)
*
|
2001-06-29 |
2003-06-10 |
Koninklijke Philips Electronics N.V. |
Multiple-interleaved integrated circuit transformer
|
US20040113737A1
(en)
*
|
2001-09-05 |
2004-06-17 |
Minghao (Mary) Zhang |
Inductors and transformers in integrated circuits
|
JP4695325B2
(ja)
*
|
2001-09-17 |
2011-06-08 |
キヤノン電子株式会社 |
磁気検出素子とその製造方法及び該素子を用いた携帯機器
|
US20030112110A1
(en)
*
|
2001-09-19 |
2003-06-19 |
Mark Pavier |
Embedded inductor for semiconductor device circuit
|
US7005323B2
(en)
*
|
2001-09-27 |
2006-02-28 |
Rfstream Corporation |
Method and apparatus for shielding integrated circuits
|
JP3724405B2
(ja)
*
|
2001-10-23 |
2005-12-07 |
株式会社村田製作所 |
コモンモードチョークコイル
|
JP3835354B2
(ja)
|
2001-10-29 |
2006-10-18 |
ヤマハ株式会社 |
磁気センサ
|
KR100416264B1
(ko)
*
|
2001-12-06 |
2004-01-24 |
삼성전자주식회사 |
저손실 인덕터소자
|
US6700472B2
(en)
*
|
2001-12-11 |
2004-03-02 |
Intersil Americas Inc. |
Magnetic thin film inductors
|
US7699059B2
(en)
|
2002-01-22 |
2010-04-20 |
Cardiomems, Inc. |
Implantable wireless sensor
|
US6855115B2
(en)
|
2002-01-22 |
2005-02-15 |
Cardiomems, Inc. |
Implantable wireless sensor for pressure measurement within the heart
|
US6960911B2
(en)
*
|
2002-01-29 |
2005-11-01 |
Kabushiki Kaisha Toshiba |
Strain sensor
|
US6946096B2
(en)
*
|
2002-05-03 |
2005-09-20 |
Honeywell International, Inc. |
Use of powder metal sintering/diffusion bonding to enable applying silicon carbide or rhenium alloys to face seal rotors
|
DE20307682U1
(de)
|
2002-05-31 |
2003-09-18 |
Technische Universität Ilmenau Abteilung Forschungsförderung und Technologietransfer, 98693 Ilmenau |
Parameteridealisierte Doppelinduktivität
|
US7042325B2
(en)
*
|
2002-05-31 |
2006-05-09 |
International Rectifier Corporation |
Planar transformer arrangement
|
US7147604B1
(en)
*
|
2002-08-07 |
2006-12-12 |
Cardiomems, Inc. |
High Q factor sensor
|
DE10243197B4
(de)
*
|
2002-09-18 |
2011-05-05 |
Infineon Technologies Ag |
Digitales Signalübertragungsverfahren
|
JP3975918B2
(ja)
*
|
2002-09-27 |
2007-09-12 |
ソニー株式会社 |
アンテナ装置
|
KR100480253B1
(ko)
*
|
2002-12-27 |
2005-04-07 |
삼성전자주식회사 |
광모듈
|
US7056595B2
(en)
*
|
2003-01-30 |
2006-06-06 |
Metglas, Inc. |
Magnetic implement using magnetic metal ribbon coated with insulator
|
US6894593B2
(en)
*
|
2003-02-12 |
2005-05-17 |
Moog Inc. |
Torque motor
|
JP4191506B2
(ja)
|
2003-02-21 |
2008-12-03 |
Tdk株式会社 |
高密度インダクタおよびその製造方法
|
JP2004303947A
(ja)
*
|
2003-03-31 |
2004-10-28 |
Matsushita Electric Ind Co Ltd |
複合電子部品
|
KR20050123174A
(ko)
*
|
2003-04-21 |
2005-12-29 |
심볼테크놀로지스,인코포레이티드 |
Rfid 태그들의 디자인 및 구현을 최적화하는 방법
|
US7852185B2
(en)
|
2003-05-05 |
2010-12-14 |
Intel Corporation |
On-die micro-transformer structures with magnetic materials
|
US7359693B2
(en)
*
|
2003-05-23 |
2008-04-15 |
Rfstream Corporation |
Enclosure and substrate structure for a tuner module
|
KR100503455B1
(ko)
*
|
2003-06-04 |
2005-07-25 |
삼성전자주식회사 |
아몰포스 자성코어를 사용하여 제조된 마이크로플럭스게이트 센서 및 그 제조 방법
|
JP2005033500A
(ja)
*
|
2003-07-14 |
2005-02-03 |
Hitachi Ltd |
アンテナコイルの設計装置および設計方法
|
US7145427B2
(en)
*
|
2003-07-28 |
2006-12-05 |
Tdk Corporation |
Coil component and method of manufacturing the same
|
US6992871B2
(en)
*
|
2003-08-06 |
2006-01-31 |
Micron Technology, Inc. |
Microtransformer for system-on-chip power supply
|
US7152317B2
(en)
*
|
2003-08-08 |
2006-12-26 |
Shmuel Shapira |
Circuit forming method
|
TWI227502B
(en)
*
|
2003-09-02 |
2005-02-01 |
Ind Tech Res Inst |
Precise multi-pole magnetic components and manufacturing method thereof
|
EP1536433A1
(en)
*
|
2003-11-28 |
2005-06-01 |
Freescale Semiconductor, Inc. |
High frequency thin film electrical circuit element
|
GB2409935B
(en)
*
|
2004-01-09 |
2007-02-28 |
Zarlink Semiconductor Ltd |
Electronic assembly
|
JP4293603B2
(ja)
*
|
2004-02-25 |
2009-07-08 |
Tdk株式会社 |
コイル部品及びその製造方法
|
US20050231752A1
(en)
*
|
2004-04-16 |
2005-10-20 |
Nokia Corporation |
Image data transfer system and method
|
US7280313B2
(en)
*
|
2004-04-30 |
2007-10-09 |
Hitachi Global Storage Technologies Netherlands B.V. |
High aspect ratio co-planar structure fabrication consisting of different materials
|
US7436281B2
(en)
*
|
2004-07-30 |
2008-10-14 |
Texas Instruments Incorporated |
Method to improve inductance with a high-permeability slotted plate core in an integrated circuit
|
JP2006050265A
(ja)
*
|
2004-08-04 |
2006-02-16 |
Sony Corp |
アンテナモジュール用磁芯部材、アンテナモジュールおよびこれを備えた携帯情報端末
|
CN101061556B
(zh)
*
|
2004-11-25 |
2012-05-09 |
株式会社村田制作所 |
线圈部件
|
KR100768919B1
(ko)
*
|
2004-12-23 |
2007-10-19 |
삼성전자주식회사 |
전원 생성 장치
|
US7714688B2
(en)
*
|
2005-01-20 |
2010-05-11 |
Avx Corporation |
High Q planar inductors and IPD applications
|
US20060223481A1
(en)
*
|
2005-03-11 |
2006-10-05 |
Takatsugu Kamata |
Integrated circuit layout for a television tuner
|
US6996892B1
(en)
*
|
2005-03-24 |
2006-02-14 |
Rf Micro Devices, Inc. |
Circuit board embedded inductor
|
US8134548B2
(en)
|
2005-06-30 |
2012-03-13 |
Micron Technology, Inc. |
DC-DC converter switching transistor current measurement technique
|
US7786836B2
(en)
*
|
2005-07-19 |
2010-08-31 |
Lctank Llc |
Fabrication of inductors in transformer based tank circuitry
|
US7399696B2
(en)
*
|
2005-08-02 |
2008-07-15 |
International Business Machines Corporation |
Method for high performance inductor fabrication using a triple damascene process with copper BEOL
|
JP4844045B2
(ja)
*
|
2005-08-18 |
2011-12-21 |
Tdk株式会社 |
電子部品及びその製造方法
|
US7323948B2
(en)
*
|
2005-08-23 |
2008-01-29 |
International Business Machines Corporation |
Vertical LC tank device
|
JP4480645B2
(ja)
*
|
2005-08-24 |
2010-06-16 |
財団法人電力中央研究所 |
圧力測定装置
|
US7256676B2
(en)
*
|
2005-09-16 |
2007-08-14 |
Artesyn Technologies, Inc. |
Printed circuit board and device including same
|
US20070065131A1
(en)
*
|
2005-09-20 |
2007-03-22 |
Chengping Wei |
Auto-focusing and Zooming Systems and Method of Operating Same
|
EP1949527A2
(en)
*
|
2005-10-10 |
2008-07-30 |
Commergy Technologies Limited |
A power converter
|
CN101341646B
(zh)
*
|
2005-10-28 |
2011-06-08 |
日立金属株式会社 |
Dc-dc转换器
|
US7417524B2
(en)
*
|
2006-02-13 |
2008-08-26 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Magnetic-bias ferromagnetic spiral inductor
|
KR101052961B1
(ko)
*
|
2006-03-24 |
2011-07-29 |
도시바 마테리알 가부시키가이샤 |
수전 장치와 그것을 이용한 전자 기기 및 비접촉 충전 장치
|
WO2007122788A1
(ja)
*
|
2006-03-24 |
2007-11-01 |
Kabushiki Kaisha Toshiba |
受電装置とそれを用いた電子機器および非接触充電装置
|
US8248200B2
(en)
*
|
2006-03-24 |
2012-08-21 |
Panasonic Corporation |
Inductance component
|
US7791836B2
(en)
*
|
2006-03-31 |
2010-09-07 |
Tdk Corporation |
Thin film magnetic device having strip-shaped magnetic films with their magnetization easy axes arranged orthogonal to a thin film coil and method of manufacturing the same
|
US7829425B1
(en)
*
|
2006-08-15 |
2010-11-09 |
National Semiconductor Corporation |
Apparatus and method for wafer level fabrication of high value inductors on semiconductor integrated circuits
|
US8093983B2
(en)
*
|
2006-08-28 |
2012-01-10 |
Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. |
Narrowbody coil isolator
|
US8061017B2
(en)
*
|
2006-08-28 |
2011-11-22 |
Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. |
Methods of making coil transducers
|
US8385043B2
(en)
*
|
2006-08-28 |
2013-02-26 |
Avago Technologies ECBU IP (Singapoare) Pte. Ltd. |
Galvanic isolator
|
US9019057B2
(en)
*
|
2006-08-28 |
2015-04-28 |
Avago Technologies General Ip (Singapore) Pte. Ltd. |
Galvanic isolators and coil transducers
|
US20080278275A1
(en)
*
|
2007-05-10 |
2008-11-13 |
Fouquet Julie E |
Miniature Transformers Adapted for use in Galvanic Isolators and the Like
|
US8427844B2
(en)
*
|
2006-08-28 |
2013-04-23 |
Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. |
Widebody coil isolators
|
US7948067B2
(en)
*
|
2009-06-30 |
2011-05-24 |
Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. |
Coil transducer isolator packages
|
US9105391B2
(en)
*
|
2006-08-28 |
2015-08-11 |
Avago Technologies General Ip (Singapore) Pte. Ltd. |
High voltage hold-off coil transducer
|
US7791900B2
(en)
|
2006-08-28 |
2010-09-07 |
Avago Technologies General Ip (Singapore) Pte. Ltd. |
Galvanic isolator
|
US7852186B2
(en)
*
|
2006-08-28 |
2010-12-14 |
Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. |
Coil transducer with reduced arcing and improved high voltage breakdown performance characteristics
|
US9589716B2
(en)
|
2006-09-12 |
2017-03-07 |
Cooper Technologies Company |
Laminated magnetic component and manufacture with soft magnetic powder polymer composite sheets
|
US8941457B2
(en)
*
|
2006-09-12 |
2015-01-27 |
Cooper Technologies Company |
Miniature power inductor and methods of manufacture
|
US8378777B2
(en)
*
|
2008-07-29 |
2013-02-19 |
Cooper Technologies Company |
Magnetic electrical device
|
JP2008135589A
(ja)
*
|
2006-11-29 |
2008-06-12 |
Asuka Electron Kk |
電力伝送用コイル
|
TWI303957B
(en)
*
|
2006-12-11 |
2008-12-01 |
Ind Tech Res Inst |
Embedded inductor devices and fabrication methods thereof
|
TWI317954B
(en)
*
|
2006-12-22 |
2009-12-01 |
Ind Tech Res Inst |
Soft magnetism thin film inductor and magnetic multi-element alloy film
|
US20080157910A1
(en)
*
|
2006-12-29 |
2008-07-03 |
Park Chang-Min |
Amorphous soft magnetic layer for on-die inductively coupled wires
|
US20080157911A1
(en)
*
|
2006-12-29 |
2008-07-03 |
Fajardo Arnel M |
Soft magnetic layer for on-die inductively coupled wires with high electrical resistance
|
CN101211689B
(zh)
*
|
2006-12-29 |
2011-04-20 |
财团法人工业技术研究院 |
内藏电感组件及其制造方法
|
JP2008192645A
(ja)
*
|
2007-01-31 |
2008-08-21 |
Tdk Corp |
薄膜磁気デバイスおよびその製造方法
|
US8022801B2
(en)
*
|
2007-02-20 |
2011-09-20 |
Seiko Epson Corporation |
Coil unit and electronic instrument
|
JP4859700B2
(ja)
*
|
2007-02-20 |
2012-01-25 |
セイコーエプソン株式会社 |
コイルユニットおよび電子機器
|
US8004792B2
(en)
*
|
2007-04-12 |
2011-08-23 |
International Business Machines Corporation |
Magnetic write transducer
|
US8338920B2
(en)
*
|
2007-05-08 |
2012-12-25 |
International Business Machines Corporation |
Package integrated soft magnetic film for improvement in on-chip inductor performance
|
US8120445B2
(en)
*
|
2007-06-15 |
2012-02-21 |
City University Of Hong Kong |
Planar EMI filter comprising coreless spiral planar windings
|
US20080309431A1
(en)
*
|
2007-06-15 |
2008-12-18 |
City University Of Hong Kong |
Planar emi filter
|
US7605580B2
(en)
*
|
2007-06-29 |
2009-10-20 |
Infineon Technologies Austria Ag |
Integrated hybrid current sensor
|
JP4605192B2
(ja)
*
|
2007-07-20 |
2011-01-05 |
セイコーエプソン株式会社 |
コイルユニット及び電子機器
|
US8922160B2
(en)
*
|
2007-08-21 |
2014-12-30 |
Kabushiki Kaisha Toshiba |
Non-contact type power receiving apparatus, electronic equipment and charging system using the power receiving apparatus
|
US8149080B2
(en)
*
|
2007-09-25 |
2012-04-03 |
Infineon Technologies Ag |
Integrated circuit including inductive device and ferromagnetic material
|
JP2009088161A
(ja)
*
|
2007-09-28 |
2009-04-23 |
Fujitsu Media Device Kk |
電子部品
|
US20090200890A1
(en)
*
|
2008-02-10 |
2009-08-13 |
Empire Magnetics Inc. |
Winding For An Axial Gap Electric Dynamo Machine
|
US8824165B2
(en)
*
|
2008-02-18 |
2014-09-02 |
Cyntec Co. Ltd |
Electronic package structure
|
TWI355068B
(en)
*
|
2008-02-18 |
2011-12-21 |
Cyntec Co Ltd |
Electronic package structure
|
US9001527B2
(en)
*
|
2008-02-18 |
2015-04-07 |
Cyntec Co., Ltd. |
Electronic package structure
|
US8258911B2
(en)
|
2008-03-31 |
2012-09-04 |
Avago Technologies ECBU IP (Singapor) Pte. Ltd. |
Compact power transformer components, devices, systems and methods
|
US7911313B2
(en)
*
|
2008-07-02 |
2011-03-22 |
Intel Corporation |
Inductors for integrated circuit packages
|
US8884438B2
(en)
*
|
2008-07-02 |
2014-11-11 |
Intel Corporation |
Magnetic microinductors for integrated circuit packaging
|
JP2010021208A
(ja)
*
|
2008-07-08 |
2010-01-28 |
Mitsumi Electric Co Ltd |
半導体装置及びその配置方法
|
US8659379B2
(en)
*
|
2008-07-11 |
2014-02-25 |
Cooper Technologies Company |
Magnetic components and methods of manufacturing the same
|
US9859043B2
(en)
*
|
2008-07-11 |
2018-01-02 |
Cooper Technologies Company |
Magnetic components and methods of manufacturing the same
|
US9558881B2
(en)
|
2008-07-11 |
2017-01-31 |
Cooper Technologies Company |
High current power inductor
|
US20100071197A1
(en)
*
|
2008-09-22 |
2010-03-25 |
Fridy Joseph M |
Integral antennas in metal laminates
|
DE102008057833B4
(de)
*
|
2008-11-19 |
2011-12-22 |
Semikron Elektronik Gmbh & Co. Kg |
Leistungshalbleitermodul mit Steuerfunktionalität und integriertem Übertrager
|
US7786839B2
(en)
*
|
2008-12-28 |
2010-08-31 |
Pratt & Whitney Rocketdyne, Inc. |
Passive electrical components with inorganic dielectric coating layer
|
JP5339974B2
(ja)
*
|
2009-03-11 |
2013-11-13 |
新光電気工業株式会社 |
インダクタ装置及びその製造方法
|
TWI436382B
(zh)
*
|
2009-04-02 |
2014-05-01 |
Nat Univ Tsing Hua |
應用磁力控制可活動式電感器的方法及其裝置
|
EP2242066A1
(en)
*
|
2009-04-17 |
2010-10-20 |
Nxp B.V. |
Inductive components for dc/dc converters and methods of manufacture thereof
|
US20100277267A1
(en)
*
|
2009-05-04 |
2010-11-04 |
Robert James Bogert |
Magnetic components and methods of manufacturing the same
|
WO2011033496A1
(en)
*
|
2009-09-16 |
2011-03-24 |
Maradin Technologies Ltd. |
Micro coil apparatus and manufacturing methods therefor
|
US20110064545A1
(en)
*
|
2009-09-16 |
2011-03-17 |
Applied Materials, Inc. |
Substrate transfer mechanism with preheating features
|
US8697574B2
(en)
|
2009-09-25 |
2014-04-15 |
Infineon Technologies Ag |
Through substrate features in semiconductor substrates
|
KR100982037B1
(ko)
*
|
2009-12-14 |
2010-09-13 |
주식회사 아나패스 |
신호 생성 장치
|
JP2011159953A
(ja)
*
|
2010-01-05 |
2011-08-18 |
Fujitsu Ltd |
電子回路及び電子機器
|
US9330826B1
(en)
|
2010-02-12 |
2016-05-03 |
The Board Of Trustees Of The University Of Alabama For And On Behalf Of The University Of Alabama |
Integrated architecture for power converters
|
JP5527400B2
(ja)
*
|
2010-03-16 |
2014-06-18 |
株式会社村田製作所 |
積層セラミック電子部品
|
JP5551480B2
(ja)
*
|
2010-03-24 |
2014-07-16 |
ルネサスエレクトロニクス株式会社 |
半導体装置および半導体装置の製造方法
|
US9263950B2
(en)
*
|
2010-04-30 |
2016-02-16 |
The Board Of Trustees Of The University Of Alabama |
Coupled inductors for improved power converter
|
US20120002377A1
(en)
*
|
2010-06-30 |
2012-01-05 |
William French |
Galvanic isolation transformer
|
US8551163B2
(en)
|
2010-10-07 |
2013-10-08 |
Everheart Systems Inc. |
Cardiac support systems and methods for chronic use
|
US8505192B2
(en)
*
|
2010-10-08 |
2013-08-13 |
Advance Furnace Systems Corp. |
Manufacturing method of common mode filter
|
US9496924B2
(en)
|
2010-12-10 |
2016-11-15 |
Everheart Systems, Inc. |
Mobile wireless power system
|
JP5641230B2
(ja)
*
|
2011-01-28 |
2014-12-17 |
株式会社豊田自動織機 |
電子機器
|
US8558344B2
(en)
|
2011-09-06 |
2013-10-15 |
Analog Devices, Inc. |
Small size and fully integrated power converter with magnetics on chip
|
US9141157B2
(en)
*
|
2011-10-13 |
2015-09-22 |
Texas Instruments Incorporated |
Molded power supply system having a thermally insulated component
|
DE102011119358A1
(de)
|
2011-11-23 |
2013-05-23 |
Tobias Volk |
Anordnung zur Erfassung von physiologischen Vitalparametern in Versuchstieren und anderen Lebewesen mit Hilfe der RFID Übertragungstechnik
|
KR20130066174A
(ko)
*
|
2011-12-12 |
2013-06-20 |
삼성전기주식회사 |
코일 부품
|
KR101548777B1
(ko)
*
|
2011-12-19 |
2015-09-01 |
삼성전기주식회사 |
노이즈 제거 필터
|
EP2817809A1
(de)
|
2012-02-22 |
2014-12-31 |
Phoenix Contact GmbH & Co. KG |
Planarer übertrager mit schichtaufbau
|
DE102012003365B4
(de)
*
|
2012-02-22 |
2014-12-18 |
Phoenix Contact Gmbh & Co. Kg |
Planarer eigensicherer Übertrager mit Schichtaufbau
|
CN102592817A
(zh)
*
|
2012-03-14 |
2012-07-18 |
深圳顺络电子股份有限公司 |
一种叠层线圈类器件的制造方法
|
JP6283158B2
(ja)
*
|
2012-04-12 |
2018-02-21 |
新光電気工業株式会社 |
配線基板、及び、配線基板の製造方法
|
US9372242B2
(en)
*
|
2012-05-11 |
2016-06-21 |
Memsic, Inc. |
Magnetometer with angled set/reset coil
|
US8824161B2
(en)
*
|
2012-06-15 |
2014-09-02 |
Medtronic, Inc. |
Integrated circuit packaging for implantable medical devices
|
US9325388B2
(en)
*
|
2012-06-21 |
2016-04-26 |
Siemens Energy, Inc. |
Wireless telemetry system including an induction power system
|
JP2014032978A
(ja)
*
|
2012-07-31 |
2014-02-20 |
Ibiden Co Ltd |
インダクタ部品、インダクタ部品の製造方法及び配線板
|
KR101792274B1
(ko)
*
|
2012-08-08 |
2017-11-01 |
삼성전기주식회사 |
노이즈 제거 필터
|
US9484136B2
(en)
*
|
2012-09-04 |
2016-11-01 |
Analog Devices Global |
Magnetic core for use in an integrated circuit, an integrated circuit including such a magnetic core, a transformer and an inductor fabricated as part of an integrated circuit
|
US11197374B2
(en)
|
2012-09-11 |
2021-12-07 |
Ferric Inc. |
Integrated switched inductor power converter having first and second powertrain phases
|
US10893609B2
(en)
|
2012-09-11 |
2021-01-12 |
Ferric Inc. |
Integrated circuit with laminated magnetic core inductor including a ferromagnetic alloy
|
US10244633B2
(en)
|
2012-09-11 |
2019-03-26 |
Ferric Inc. |
Integrated switched inductor power converter
|
US11058001B2
(en)
|
2012-09-11 |
2021-07-06 |
Ferric Inc. |
Integrated circuit with laminated magnetic core inductor and magnetic flux closure layer
|
US9844141B2
(en)
|
2012-09-11 |
2017-12-12 |
Ferric, Inc. |
Magnetic core inductor integrated with multilevel wiring network
|
US11064610B2
(en)
|
2012-09-11 |
2021-07-13 |
Ferric Inc. |
Laminated magnetic core inductor with insulating and interface layers
|
US11116081B2
(en)
|
2012-09-11 |
2021-09-07 |
Ferric Inc. |
Laminated magnetic core inductor with magnetic flux closure path parallel to easy axes of magnetization of magnetic layers
|
KR101444552B1
(ko)
*
|
2012-12-21 |
2014-10-30 |
삼성전기주식회사 |
자성체 시트, 자성체 시트의 제조방법 및 자성체 시트를 포함하는 무접점 전력 충전 장치
|
DE102013100622B4
(de)
*
|
2013-01-22 |
2018-03-01 |
Phoenix Contact Gmbh & Co. Kg |
Leiterplatte im Lagenaufbau
|
US9337251B2
(en)
|
2013-01-22 |
2016-05-10 |
Ferric, Inc. |
Integrated magnetic core inductors with interleaved windings
|
US8786393B1
(en)
|
2013-02-05 |
2014-07-22 |
Analog Devices, Inc. |
Step up or step down micro-transformer with tight magnetic coupling
|
CN104064336B
(zh)
*
|
2013-03-22 |
2018-08-21 |
高屋科技(深圳)有限公司 |
石墨线圈平面脉冲变压器
|
KR101442402B1
(ko)
*
|
2013-03-25 |
2014-09-17 |
삼성전기주식회사 |
인덕터 및 그 제조 방법
|
WO2015020945A2
(en)
|
2013-08-04 |
2015-02-12 |
President And Fellows Of Harvard College |
Percutaneous deployable electrode array
|
US9420356B2
(en)
*
|
2013-08-27 |
2016-08-16 |
Siemens Energy, Inc. |
Wireless power-receiving assembly for a telemetry system in a high-temperature environment of a combustion turbine engine
|
KR101983152B1
(ko)
*
|
2013-10-16 |
2019-05-28 |
삼성전기주식회사 |
공통 모드 필터
|
KR101520467B1
(ko)
*
|
2013-12-11 |
2015-05-14 |
한국기계연구원 |
공심형 전자석 및 공심형 전자석을 갖는 자기부상 시스템
|
US9647053B2
(en)
|
2013-12-16 |
2017-05-09 |
Ferric Inc. |
Systems and methods for integrated multi-layer magnetic films
|
KR101762778B1
(ko)
|
2014-03-04 |
2017-07-28 |
엘지이노텍 주식회사 |
무선 충전 및 통신 기판 그리고 무선 충전 및 통신 장치
|
US9159778B2
(en)
|
2014-03-07 |
2015-10-13 |
International Business Machines Corporation |
Silicon process compatible trench magnetic device
|
JP6283558B2
(ja)
*
|
2014-04-22 |
2018-02-21 |
新光電気工業株式会社 |
受動素子基板
|
US10629357B2
(en)
|
2014-06-23 |
2020-04-21 |
Ferric Inc. |
Apparatus and methods for magnetic core inductors with biased permeability
|
US9991040B2
(en)
|
2014-06-23 |
2018-06-05 |
Ferric, Inc. |
Apparatus and methods for magnetic core inductors with biased permeability
|
US11302469B2
(en)
|
2014-06-23 |
2022-04-12 |
Ferric Inc. |
Method for fabricating inductors with deposition-induced magnetically-anisotropic cores
|
JP6421484B2
(ja)
|
2014-07-28 |
2018-11-14 |
Tdk株式会社 |
コイル部品、コイル部品複合体およびトランス、ならびに電源装置
|
KR101588969B1
(ko)
*
|
2014-08-25 |
2016-01-26 |
삼성전기주식회사 |
공통 모드 필터 및 그 제조 방법
|
KR20160037652A
(ko)
*
|
2014-09-29 |
2016-04-06 |
엘지이노텍 주식회사 |
무선 전력 송신 장치 및 무선 전력 수신 장치
|
DE102014221568A1
(de)
*
|
2014-10-23 |
2016-04-28 |
Siemens Aktiengesellschaft |
Transformator und Verfahren zum Betrieb eines Transformators
|
CN207098945U
(zh)
*
|
2014-11-12 |
2018-03-13 |
株式会社村田制作所 |
电源模块及其安装结构
|
JP6589277B2
(ja)
|
2015-01-14 |
2019-10-16 |
富士電機株式会社 |
高耐圧受動素子および高耐圧受動素子の製造方法
|
KR102145314B1
(ko)
*
|
2015-07-31 |
2020-08-18 |
삼성전기주식회사 |
코일 부품 및 그 제조 방법
|
KR101900879B1
(ko)
*
|
2015-10-16 |
2018-09-21 |
주식회사 모다이노칩 |
파워 인덕터
|
US10163561B1
(en)
|
2015-12-11 |
2018-12-25 |
Bel Power Solutions Inc. |
Distributed planar inductor with multi-2D geometry for energy storage
|
US10354950B2
(en)
|
2016-02-25 |
2019-07-16 |
Ferric Inc. |
Systems and methods for microelectronics fabrication and packaging using a magnetic polymer
|
JP6520875B2
(ja)
*
|
2016-09-12 |
2019-05-29 |
株式会社村田製作所 |
インダクタ部品およびインダクタ部品内蔵基板
|
DE102016219309B4
(de)
*
|
2016-10-05 |
2024-05-02 |
Vitesco Technologies GmbH |
Vibrationsfeste Schaltungsanordnung zum elektrischen Verbinden zweier Anschlussbereiche sowie Kraftfahrzeug und Verfahren zum Herstellen der Schaltungsanordnung
|
CN110235361B
(zh)
|
2017-01-31 |
2022-12-30 |
株式会社村田制作所 |
Lc谐振器
|
US11239019B2
(en)
|
2017-03-23 |
2022-02-01 |
Tdk Corporation |
Coil component and method of manufacturing coil component
|
US10446639B2
(en)
|
2017-03-29 |
2019-10-15 |
Globalfoundries Singapore Pte. Ltd. |
3-dimensional printing process for integrated magnetics
|
EP3631822A4
(en)
*
|
2017-05-29 |
2021-03-10 |
Thin Energy Ltd. |
THIN TRANSFORMER AND METHOD OF MANUFACTURING THEREOF
|
JP6724866B2
(ja)
*
|
2017-06-05 |
2020-07-15 |
株式会社村田製作所 |
コイル部品およびその周波数特性の変更方法
|
US11404197B2
(en)
|
2017-06-09 |
2022-08-02 |
Analog Devices Global Unlimited Company |
Via for magnetic core of inductive component
|
US11005167B2
(en)
*
|
2017-11-03 |
2021-05-11 |
Antenum Llc |
Low profile antenna-conformal one dimensional
|
US10714412B2
(en)
*
|
2017-11-22 |
2020-07-14 |
Texas Instruments Incorporated |
Semiconductor package with integrated passive electrical component
|
CN108565102B
(zh)
*
|
2018-03-28 |
2020-08-14 |
华为技术有限公司 |
线圈模组、无线充电发射装置、接收装置、系统和终端
|
DE102019102576A1
(de)
*
|
2019-02-01 |
2020-08-06 |
RF360 Europe GmbH |
HF-Filter mit planarer HF-Spule
|
US11953567B2
(en)
|
2020-09-08 |
2024-04-09 |
Analog Devices International Unlimited Company |
Magnetic multi-turn sensor and method of manufacture
|
TWI767445B
(zh)
*
|
2020-12-11 |
2022-06-11 |
聖德斯貴股份有限公司 |
微線圈元件、陣列式微線圈元件與裝置
|
WO2022120798A1
(zh)
*
|
2020-12-11 |
2022-06-16 |
厦门圣德斯贵电子科技有限公司 |
微线圈元件、阵列式微线圈元件与装置
|
CN113630697B
(zh)
*
|
2021-06-17 |
2023-05-12 |
汉得利(常州)电子股份有限公司 |
一种汽车仪表用讯响器及其制作方法
|
AT524691B1
(de)
*
|
2021-07-16 |
2023-03-15 |
|
G leichspannungswandler
|
DE102021124243A1
(de)
*
|
2021-09-20 |
2023-03-23 |
OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung |
Wandlervorrichtung
|
US11749455B2
(en)
|
2022-01-10 |
2023-09-05 |
Bh Electronics, Inc. |
Methods of fabricating ultra-miniature laminated magnetic cores and devices
|