JPS5752114A - Fine coil - Google Patents

Fine coil

Info

Publication number
JPS5752114A
JPS5752114A JP12713680A JP12713680A JPS5752114A JP S5752114 A JPS5752114 A JP S5752114A JP 12713680 A JP12713680 A JP 12713680A JP 12713680 A JP12713680 A JP 12713680A JP S5752114 A JPS5752114 A JP S5752114A
Authority
JP
Japan
Prior art keywords
conductor
patterns
200mum
aligned
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12713680A
Other languages
Japanese (ja)
Inventor
Kaoru Omura
Ryohei Koyama
Takeo Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Asahi Kasei Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd, Asahi Kasei Kogyo KK filed Critical Asahi Chemical Industry Co Ltd
Priority to JP12713680A priority Critical patent/JPS5752114A/en
Priority to KR1019810003292A priority patent/KR890004585B1/en
Priority to GB8127246A priority patent/GB2083952B/en
Priority to NLAANVRAGE8104176,A priority patent/NL185747C/en
Priority to DE19813135962 priority patent/DE3135962A1/en
Publication of JPS5752114A publication Critical patent/JPS5752114A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • H01F2017/006Printed inductances flexible printed inductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To obtain a small coil having high performance and high reliability by laminating two or more of spiral conductor patterns of thick film fine lines of specific size on an insulating substrate so that the direction of the current of the spiral conductor pattern is aligned in the same direction. CONSTITUTION:Spiral conductor patterns 2 having 20-200mum of conductor width, 0.5-100mum of conductor interval and 15-200mum of conductor thickness made of conductor, e.g., copper or the like are formed on an insulating substrate 1 made, for example, of polyimide film or the like having excellent flexibility and heat resistance, more than two patterns are laminated and are bonded with adhesive 4, e.g., epoxy-nitrile rubber having excellent heat resistance, insulation and adherence. The patterns are so connected via through hole or stepwisely with connecting conductor 5 so that the direction of the currents of the patterns is aligned in the same direction. In this manner, a small coil having large inductance and small DC resistance value can be formed.
JP12713680A 1980-09-11 1980-09-16 Fine coil Pending JPS5752114A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP12713680A JPS5752114A (en) 1980-09-16 1980-09-16 Fine coil
KR1019810003292A KR890004585B1 (en) 1980-09-11 1981-09-04 Microcoil assembly
GB8127246A GB2083952B (en) 1980-09-11 1981-09-09 Microcoil assembly
NLAANVRAGE8104176,A NL185747C (en) 1980-09-11 1981-09-09 MICRO-RINSE.
DE19813135962 DE3135962A1 (en) 1980-09-11 1981-09-10 MICRO COIL ARRANGEMENT

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12713680A JPS5752114A (en) 1980-09-16 1980-09-16 Fine coil

Publications (1)

Publication Number Publication Date
JPS5752114A true JPS5752114A (en) 1982-03-27

Family

ID=14952500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12713680A Pending JPS5752114A (en) 1980-09-11 1980-09-16 Fine coil

Country Status (1)

Country Link
JP (1) JPS5752114A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6280304U (en) * 1985-11-09 1987-05-22
JPH01238102A (en) * 1988-03-18 1989-09-22 Canon Inc Thick-film fine patterned coil
JPH0645307U (en) * 1992-11-20 1994-06-14 太陽誘電株式会社 Multilayer chip inductor
US6593841B1 (en) 1990-05-31 2003-07-15 Kabushiki Kaisha Toshiba Planar magnetic element
JP2008053447A (en) * 2006-08-24 2008-03-06 Tdk Corp Coil component and manufacturing method thereof
US7453343B2 (en) * 2003-02-26 2008-11-18 Tdk Corporation Thin-film type common-mode choke coil
JP2009016504A (en) * 2007-07-03 2009-01-22 Shinko Electric Ind Co Ltd Multilayer wiring board with built-in inductor
JP2010283289A (en) * 2009-06-08 2010-12-16 Kaho Kagi Kofun Yugenkoshi Thin film type common mode noise filter and method of manufacturing the same
JP2011035364A (en) * 2009-08-03 2011-02-17 Inpaq Technology Co Ltd Common mode filter, and method for manufacturing the same
JP2013102127A (en) * 2011-11-07 2013-05-23 Samsung Electro-Mechanics Co Ltd Lamination type inductor and manufacturing method of the same
JP2013236046A (en) * 2012-04-12 2013-11-21 Shinko Electric Ind Co Ltd Circuit board and process of manufacturing the same
JP2015185589A (en) * 2014-03-20 2015-10-22 新光電気工業株式会社 Inductor, coil substrate, and method for fabricating coil substrate
JP2016001715A (en) * 2014-05-22 2016-01-07 新光電気工業株式会社 Inductor, coil substrate and method for manufacturing coil substrate
JP2019003993A (en) * 2017-06-13 2019-01-10 Tdk株式会社 Coil component
WO2022224474A1 (en) * 2021-04-21 2022-10-27 昭和電工マテリアルズ株式会社 Manufacturing method for wiring board, and laminate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5228044B2 (en) * 1971-12-14 1977-07-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5228044B2 (en) * 1971-12-14 1977-07-23

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6280304U (en) * 1985-11-09 1987-05-22
JPH0429526Y2 (en) * 1985-11-09 1992-07-17
JPH01238102A (en) * 1988-03-18 1989-09-22 Canon Inc Thick-film fine patterned coil
US6593841B1 (en) 1990-05-31 2003-07-15 Kabushiki Kaisha Toshiba Planar magnetic element
JPH0645307U (en) * 1992-11-20 1994-06-14 太陽誘電株式会社 Multilayer chip inductor
US7453343B2 (en) * 2003-02-26 2008-11-18 Tdk Corporation Thin-film type common-mode choke coil
JP2008053447A (en) * 2006-08-24 2008-03-06 Tdk Corp Coil component and manufacturing method thereof
JP2009016504A (en) * 2007-07-03 2009-01-22 Shinko Electric Ind Co Ltd Multilayer wiring board with built-in inductor
JP2010283289A (en) * 2009-06-08 2010-12-16 Kaho Kagi Kofun Yugenkoshi Thin film type common mode noise filter and method of manufacturing the same
JP2011035364A (en) * 2009-08-03 2011-02-17 Inpaq Technology Co Ltd Common mode filter, and method for manufacturing the same
JP2013102127A (en) * 2011-11-07 2013-05-23 Samsung Electro-Mechanics Co Ltd Lamination type inductor and manufacturing method of the same
JP2013236046A (en) * 2012-04-12 2013-11-21 Shinko Electric Ind Co Ltd Circuit board and process of manufacturing the same
JP2015185589A (en) * 2014-03-20 2015-10-22 新光電気工業株式会社 Inductor, coil substrate, and method for fabricating coil substrate
JP2016001715A (en) * 2014-05-22 2016-01-07 新光電気工業株式会社 Inductor, coil substrate and method for manufacturing coil substrate
JP2019003993A (en) * 2017-06-13 2019-01-10 Tdk株式会社 Coil component
WO2022224474A1 (en) * 2021-04-21 2022-10-27 昭和電工マテリアルズ株式会社 Manufacturing method for wiring board, and laminate

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