JPH01238102A - Thick-film fine patterned coil - Google Patents

Abstract

PURPOSE:To obtain a thick-film fine patterned coil, the thickness of a conductor of which is thickened, width thereof is narrowed and formed accurately, having no leakage and width high reliability, by shaping a conductor pattern with specific thickness, width and space onto an insulating base body. CONSTITUTION:Conductor patterns having thickness of 50-150mum, width of 10-70mum and spaces of 10-150mum are formed onto an insulating base body 1. Copper, gold, silver, a nickel alloy, nickel and tin are cited as conductors 5. A film or a board composed of the thermoplastic resin of an acrylic group, a polyamide group, a polyester group, etc., or the thermosetting resin, etc., of a phenol group, an epoxy group, a polyimide group, etc., into which an ultraviolet screening material is mixed can be quoted as the insulating base body 1. The carbon black of an inorganic pigment, zinc white, Hansa yellow, etc., are preferable from the efficiency of light shielding to ultraviolet rays and profitability as the ultraviolet screening material mixed into such as insulating base body 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thick film fine turn coil that is flat, has a thick conductor, is narrow, precise, and highly reliable.

[Conventional technology]

Conventional coils include wire-wound coils obtained by winding methods, as well as patterned coils obtained by coating a photosensitive resin layer on copper foil and photo-etching (Japanese Patent Laid-Open No. 58-2
No. 04176), a photosensitive resin layer of approximately 3 to 5 μm is coated on a thin metal plate and υ is formed using a photoelectroforming method.
Thick film fine pattern coil obtained by plating after forming desired resist mother turns (Japanese Patent Laid-Open No. 57-915
No. 90) etc. In recent years, there has been a strong demand for thin and small precision coils that can be used in motors with particularly high rotational accuracy.

[Problems to be Solved by the Invention] However, since the wire-wound coil has a low conductor occupation rate in the coil, it has not been possible to obtain a sufficiently thin, small, and precise coil.

Furthermore, due to the side etching phenomenon during etching, the pattern coil disclosed in JP-A No. 58-204176 has a low multi-conductor occupancy rate, with the conductor spacing of the coil being more than twice the conductor thickness, so it is sufficiently thin, compact and precise. I couldn't get anything.

In addition, the thick film fine no-turn coil disclosed in JP-A No. 57-91590 has low resolution during photoelectroforming, so if the opening width of the resulting resist pattern is kept to about 30 μm, the thickness will be less than 10 μm. , an over-puncture phenomenon occurs during the subsequent plating deposition process, and leakage between conductors is likely to occur. Furthermore, since the adhesion between the photosensitive resin and other substrates with low resolution is low, the thickness of 50μ
To obtain a resist pattern of m or more, the opening width must be 170μ.
m or more, and a sufficiently thin, small, and precise coil with a narrow conductor width could not be obtained.

Therefore, an object of the present invention is to provide a thick film fine film with a conductor that is thick, narrow, precise, leak-free, and highly reliable. Our goal is to provide turn coils.

[Means for solving problems]

The problem is that when the thickness is 50 to 150 μm on the insulating substrate,
The problem was solved by a thick film fine pattern coil having conductor patterns with a bias of 10 to 70 μm and an interval of 10 to 150 μm.

Examples of the conductor of the thick film fine no-turn coil of the present invention include steel, gold, silver, nickel alloy, nickel, and tin.

The insulating substrate of the thick-film fine pattern coil of the present invention is not particularly limited as long as it has ultraviolet ray blocking properties; for example, thermoplastics such as acrylic, polyamide, polyester, etc. mixed with an ultraviolet ray blocking material may be used. Examples include films or plates made of resins or thermosetting resins such as phenolic, epoxy, and polyimide resins.

Various organic and inorganic pigments and dyes can be used as the ultraviolet light blocking material mixed into such an insulating substrate.
Inorganic pigments such as carmen black, zinc white, and hump yellow are good in terms of their UV blocking efficiency and economic efficiency.

Next, a method for manufacturing the thick film fine pattern coil of the present invention will be described.

First, an insulating substrate having a light-shielding property against ultraviolet rays is prepared, and both surfaces thereof are subjected to catalyst treatment for electroless plating.

A known method may be used for the catalyst treatment for electroless plating. Prior to this catalytic treatment, it is desirable to carry out an appropriate treatment in order to ensure the adhesion of the plating to the insulating substrate. There are various methods for this, such as treatment with caustic soda, a mixture of chromic acid and sulfuric acid, an organic solvent, or honing treatment.

Next, a photosensitive resin is coated on both sides of the catalyst-treated insulating substrate having a light-shielding property against ultraviolet rays, and then independent pattern exposure is simultaneously performed on both sides.

The coating with the photosensitive resin is carried out using a dry film, liquid resist, etc. made of a known photosensitive resin, preferably a photosensitive resin with an aspect ratio of 1.5 or more, and the thickness of the coating layer is as follows:
It is appropriately selected according to the required circuit density and circuit conductor thickness.

Pattern exposure can typically be performed using a glass mask or a film mask.

Next, after developing with a solution depending on the photosensitive resin, a conductor circuit is formed by electroless plating or a combination of electroless plating and electroplating.

Reference photo-1 shows an example of the resist pattern obtained by development.
FIG. 1 shows a cross-sectional view after electroless plating when electroless plating and electroplating are used together, and FIG. 2 shows a cross-sectional view of the thick film fine pattern coil of the present invention obtained after electroplating. .

〔Example〕

The present invention will be explained in more detail with reference to Examples below.
The present invention is not limited to these embodiments.

Example-1 A 50 μm thick PET (polyethylene terephthalate) film containing and dispersed carbine black was prepared as an insulating substrate, and 0.8% holes were drilled at predetermined positions using an NC lathe. 50f! /l of caustic soda at 60°C for 5 minutes. Next, after treating with a mixture of 30 E/l of chromic anhydride and 1001/l of sulfuric acid at 50°C for 5 minutes, electroless plating catalyst (trade name H8-101B) was used.
, manufactured by Hitachi Chemical Co., Ltd.), and then JP-A-61-2
Photosensitive dry fill F 0μm described in 91619 publication
A photosensitive layer with a thickness of 70 μm was formed using a 70 μm thick photosensitive layer, and then exposed using an f-turn mask at an exposure dose of 200 μm and 371 M, and spray developed with triethane to form a 40 μm exposed portion of the substrate.
m, and a quarter turn of 50 μm was formed in the photosensitive layer coating portion.

Next, 1 μm of electroless steel plating was deposited on the exposed portion of the substrate, and then 2OA//drn2.
Plating was performed for 5 minutes to deposit 70 μm of copper, resulting in a thickness of 70 μm.
A thick film fine mother turn coil with a width of 40 μm and an interval of 50 μm was manufactured. The characteristics of the thus obtained thick film fine/4' turn coil were evaluated, and all of the current value and magnetomotive force were satisfied.

Example 2 A 50 μm thick PET film containing 5% zinc white dispersed therein was prepared as an insulating substrate, 0.8X holes were drilled at predetermined positions using an NC lathe, and roughened by sandblasting. After planarizing, it was treated with a catalyst in the same manner as in Example-1, and then a commercially available photosensitive dry film (trade name T
650, Hoechst M) to form a 50 μm thick photosensitive layer, then exposed using a two-turn mask at an exposure dose of 100 rnJ/cm, and spray developed with a 1% sodium carbonate solution. The exposed part of the substrate is 30μm,
A pattern with a photosensitive layer coating portion of 50 μm was formed.

Next, electroless gold plating (trade name: Daigor, manufactured by Daido Chemical Industry Co., Ltd.) was applied to the exposed parts of the substrate at -4, 2, and 90°C for 5 minutes.
．． After depositing 1μ, an electrolytic steel plating solution (trade name: Lucina 81, manufactured by Okuno Pharmaceutical Co., Ltd.) using a forced jet with a bonder was used to deposit 1μ.
A/dm, plating for 5 minutes to deposit 50 μm thick copper, thickness 50 μrn, @ 30 μm, interval 5
A 0 μm thick film fine turn coil was manufactured. The characteristics of the thick film fine pattern coil obtained in this way were evaluated, and the current value and magnetomotive force were all satisfied.

〔Effect of the invention〕

According to the present invention, a precise thick film fine pattern coil can be obtained in which the conductor is thick, 50 to 150 μm, and the conductors are densely arranged, with a width of 10 to 70 μm and an interval of 10 to 150 μm. The thick-film phisono 4-turn coil of the present invention is thin and compact, so it is suitably used as a coil for an f[motor].

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of an insulating substrate in which a pattern made of photosensitive resin is formed after the entire surface is roughened and treated with a catalyst, and then made conductive by electroless plating. FIG. 2 is a cross-sectional view of a conductor formed by depositing electrolytic plating on the electroless plating layer shown in FIG. 1. FIG. Reference photograph 1 shows the resolving power and renost formation state of the photosensitive resin used in the present invention. DESCRIPTION OF SYMBOLS 1... Insulating substrate (film), 2... Catalyst treatment layer, 3... Electroless plating layer, 4... Photosensitive resin layer, 5
...Conductor (electrolytic plating layer). Figure 1 Figure 2 Procedural amendment (method) % formula % 1. Indication of the incident Japanese Patent Application No. 63-65298 2. Name of the invention Thick film fine pattern coil 3. Relationship with the case of the person making the amendment Patent applicant name (100) Canon Co., Ltd. 4, Agent address 40 Toranomon Mori Building, 5-13-1 Toranomon, Minato-ku, Tokyo June 28, 1988 7, Contents of the amendment (1) ``Example of resist pattern obtained by development'' on page 6, line 8 of the specification'' is changed to ``Example of resist pattern obtained by Z development with reference to the resolution of the photosensitive +'l resin used in the present invention and the state of resist formation. 3. Correct "Example of resist pattern". (2) Delete "Reference photograph -- the one shown" in lines 4-5 of page 10 of the same book.

Claims (1)

[Claims] Thickness 50-150μm, width 10-70μm on insulating substrate
A thick film fine pattern coil having conductor patterns with a pitch of 10 to 150 μm.