JPS60257191A - Printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a printed wiring board, and particularly to a printed wiring board suitable for the configuration of a circuit that handles a relatively large current.

[Background of invention]

Electrical circuit construction techniques using printed layouts have been widely used to construct circuits that handle relatively small currents, such as electronic circuits, because high reliability and excellent productivity can be easily achieved.

By the way, conventional printed wiring boards use a copper laminated laminate in which a thin plate of copper foil or an electrical conductor is pasted onto the surface of an insulating board such as a glass or epoxy plate, and this is coated with etching, electrolytic plating, or electroless plating. For this reason, the thickness of the sleeve is 18 mm.
It is limited to a range of about 70 micrometers.

Therefore, when passing a large current through such a printed self-wiring board, since the thickness of the conductor layer is limited as mentioned above, it is necessary to widen the width of the pattern (copper foil) that makes up the circuit. We have no choice but to respond.

In general, the relationship between the pattern width of a printed wiring board and its allowable current varies depending on the material of the printed wiring board, the equipment to which it is applied, usage taxation, and other conditions such as the length of the pattern. However, it is usually said to be 1 ampere per millimeter of pattern width.

Therefore, when trying to apply such a printed wiring board to a conventional circuit, there is a need to make the circuit pattern considerably wider, and as a result, the area occupied by the circuit pattern increases and the density of component packaging increases. This results in an increase in the size of the printed wiring board.

Therefore, the conventional printed wiring board has the disadvantage that it is difficult to apply it to power equipment having a large relative electrical capacity, and its advantages cannot be fully utilized.

[Purpose of the invention]

An object of the present invention is to overcome the drawbacks of the prior art as described above, to provide a power device that handles relatively large currents and can provide a sufficient current of #L''6 without widening the width of the circuit pattern. It is an object of the present invention to provide a printed wiring board which can be applied to VC, etc. and fully utilize the advantages of printed wiring techniques.

[The genius of invention]

In order to achieve this purpose, the present invention is similar in that it is formed to match the shape of a predetermined part of an electric conductor such as a copper plate and a whole circuit pattern, and is bonded by bonding it to the circuit pattern. shall be.

[Practical implementation of the invention]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A printed wiring board according to the present invention will be explained in detail below with reference to an embodiment shown in the drawings.

Figure 5pJ1 shows one embodiment of the present invention. In the figure, 1 is a printed wiring board, 2 is insulation, 4 boards, 3.4 is a circuit pattern, 5 is a conductor board, 6 and 7 are terminal holes, and 8 is a solder board. moon hole,
9 is a hole for degassing.

FIG.
This is an example of application to a device in which a circuit that handles current and a circuit that handles relatively large current, such as a power circuit, coexists. Relatively wide circuit pattern 3 is for a large current circuit, and is relatively narrow. The circuit pattern 4 is for conductive circuit 01.

The conductor plate 5 is made of a conductive material such as copper, and is formed by punching or the like to have the same planar shape as the circuit pattern 3 for a large current circuit, and is then bonded to the surface of the circuit pattern 30. The circuit pattern 3 and the conductive plate 5 may be joined by soldering, fastening by screws or rivets, or a combination of these.

In addition, at this time, when the size of the circuit pattern 5 is made slightly smaller (for example, 0.5 to 1.0 mm) than the planar shape of the circuit pattern 3, and the two parts are pasted together, the conductor plate 5
The surface of the circuit pattern 3 may remain exposed around the periphery. In this way, it is possible to absorb the deviation of the bonding position, and it is possible to suppress a decrease in yield.

In addition, several holes 8 are provided in the conductor &5 outside the terminal hole 6, and as shown in Figure 2, holes 9 are provided in the circuit pattern 3 and the insulating substrate 2 in accordance with these holes 8. It is. Therefore, these holes 8.9 act as waste removal passages during soldering when circuit equipment or parts are attached, allowing reliable soldering. Furthermore, as shown in FIG.
Also, the hole 9 is made thicker than the hole 9 of the electrode substrate 2, so that soldering is also performed between the inner surface of the hole 8 and the surface of the circuit pattern 30, and the bonding can be further improved.

Therefore, according to the printed wiring board M&1 according to this embodiment, connections between circuit devices and components that operate with a relatively large electric current IMt are made by the circuit pattern 3 and the conductor plate 5, while a relatively small For current devices, the connection is made only by circuit pattern 4, which causes a large
For current, both the circuit pattern 3 and the conductor &5 act as a warm current path, so it is possible to obtain a printed wiring board that can handle currents ranging from small currents to 11Lm without increasing the width of the 1gJW& pattern.

Note that the thickness of the conductor plate 5 should be appropriately selected depending on the magnitude of the current to be handled and the width of the circuit pattern 3.
The material is limited to copper, which has excellent conductivity and IP3
The substrate 2 may be made of any material as long as it has a reasonable coefficient of thermal expansion and can be soldered by just one inch.

〔Effect of the invention〕

As explained above, according to the present invention, the WK can be applied to light components without significantly increasing the width of the 5-circuit pattern even in circuits that handle currents of several tens of amperes or more. Even for flexible high-power devices, it is possible to create printed circuits that take advantage of the basics of printed wiring technology in light, and easily provide printed wiring boards that are useful for improving reliability, downsizing, and lowering costs. be able to. .

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of a printed wiring board according to the present invention, and FIG. 2 is a sectional view of a part thereof. 1...Printed wiring board, 2...Insulating board, 3゜4...Circuit pattern, 5...
Conductor plate, 6.7... Terminal hole, 8... Hole for soldering, 9... Hole for gas venting.

Claims (1)

[Claims] 1. In a printed wiring board in which a circuit pattern of an electrically conductive layer is formed on the surface of an insulating substrate, an electrically conductive plate having approximately the same shape as the pattern is attached to at least a part of the circuit pattern. Printed self-wired board whose tP1 characteristic is that it is joined together. 2. In claim 1, the width of the electrically conductive plate at the portion bonded to the circuit pattern is:
A printed wiring board characterized in that the width of the circuit pattern in this part is also narrow. 3.% Permissible Claims In claim 1, the circuit pattern portion to which the electrically conductive plate is laminated and joined is provided with a through hole that passes through the electrically conductive plate, the circuit pattern, and the insulating substrate. A printed wiring board characterized by: 4. Claim 3 states that the diameter of the through hole is larger in the portion that penetrates the electrically conductive plate than in the portion that penetrates the circuit pattern.
Characteristic print arrangement jl.