KR910008835A - 바이폴라형 반도체장치 - Google Patents

바이폴라형 반도체장치 Download PDF

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Publication number
KR910008835A
KR910008835A KR1019900017526A KR900017526A KR910008835A KR 910008835 A KR910008835 A KR 910008835A KR 1019900017526 A KR1019900017526 A KR 1019900017526A KR 900017526 A KR900017526 A KR 900017526A KR 910008835 A KR910008835 A KR 910008835A
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KR
South Korea
Prior art keywords
semiconductor device
wiring
layers
semiconductor substrate
layer
Prior art date
Application number
KR1019900017526A
Other languages
English (en)
Other versions
KR940002757B1 (ko
Inventor
야스카즈 마세
마사히로 아베
도시히코 가츠라
Original Assignee
아오이 죠이치
가부시키가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아오이 죠이치, 가부시키가이샤 도시바 filed Critical 아오이 죠이치
Publication of KR910008835A publication Critical patent/KR910008835A/ko
Application granted granted Critical
Publication of KR940002757B1 publication Critical patent/KR940002757B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5226—Via connections in a multilevel interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)

Abstract

내용 없음

Description

바이폴라형 반도체장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (1)

  1. 제 1 도전형을 나타내는 반도체기판(11)과, 상기 반도체기판(11)에 제 2도전형의 불순물을 도입·확산하여 형성하는 능동영역 및 수동영역의 한쪽 혹은 양쪽과, 상기 반도체기판(11) 표면에 피착되는 절연물층(10), 상기 절연물층(10)에 겹쳐지게 형성되는 배선층(12), 이 배선층(12)을 덮으면서 형성되는 단일 또는 복수의 층간절연물층(13,16) 및, 상기 층간절연물층(13,16)을 덮으면서 설치되는 다른 배선층(15,18)을 구비하되, 상기 절연물층(10) 및 배선층(12)으로부터 상층의 층간절연물층(13,16) 및 다른 배선층(15,18)의 한쪽 또는 양쪽으로 갈수록 여유를 갖도록 적층하는 것을 특징으로 하는 바이폴라형 반도체장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900017526A 1989-10-31 1990-10-31 바이폴라형 반도체장치 KR940002757B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1283942A JP2515408B2 (ja) 1989-10-31 1989-10-31 バイポ−ラ型半導体装置
JP1-283942 1989-10-31

Publications (2)

Publication Number Publication Date
KR910008835A true KR910008835A (ko) 1991-05-31
KR940002757B1 KR940002757B1 (ko) 1994-04-02

Family

ID=17672217

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900017526A KR940002757B1 (ko) 1989-10-31 1990-10-31 바이폴라형 반도체장치

Country Status (5)

Country Link
US (1) US5103287A (ko)
EP (1) EP0426151B1 (ko)
JP (1) JP2515408B2 (ko)
KR (1) KR940002757B1 (ko)
DE (1) DE69027508T2 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2555964B2 (ja) * 1993-12-10 1996-11-20 日本電気株式会社 アライメント精度調査パターン
US5596226A (en) * 1994-09-06 1997-01-21 International Business Machines Corporation Semiconductor chip having a chip metal layer and a transfer metal and corresponding electronic module
US6255226B1 (en) * 1998-12-01 2001-07-03 Philips Semiconductor, Inc. Optimized metal etch process to enable the use of aluminum plugs
TW200603287A (en) * 2004-03-26 2006-01-16 Ulvac Inc Unit layer posttreating catalytic chemical vapor deposition apparatus and method of film formation therewith
JP2006339343A (ja) 2005-06-01 2006-12-14 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4656732A (en) * 1984-09-26 1987-04-14 Texas Instruments Incorporated Integrated circuit fabrication process
US4676867A (en) * 1986-06-06 1987-06-30 Rockwell International Corporation Planarization process for double metal MOS using spin-on glass as a sacrificial layer
JPH02100341A (ja) * 1988-10-06 1990-04-12 Toshiba Corp 半導体装置のパターン形成方法
JP2508831B2 (ja) * 1989-01-09 1996-06-19 日本電気株式会社 半導体装置

Also Published As

Publication number Publication date
EP0426151A3 (en) 1993-08-11
EP0426151A2 (en) 1991-05-08
EP0426151B1 (en) 1996-06-19
KR940002757B1 (ko) 1994-04-02
US5103287A (en) 1992-04-07
DE69027508D1 (de) 1996-07-25
JP2515408B2 (ja) 1996-07-10
DE69027508T2 (de) 1996-12-12
JPH03145734A (ja) 1991-06-20

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