KR890004429A - 면실장형 반도체 패키지 포장체 및 반도체 메모리 장치의 제조방법 - Google Patents

면실장형 반도체 패키지 포장체 및 반도체 메모리 장치의 제조방법 Download PDF

Info

Publication number
KR890004429A
KR890004429A KR870013166A KR870013166A KR890004429A KR 890004429 A KR890004429 A KR 890004429A KR 870013166 A KR870013166 A KR 870013166A KR 870013166 A KR870013166 A KR 870013166A KR 890004429 A KR890004429 A KR 890004429A
Authority
KR
South Korea
Prior art keywords
resin molded
package according
packaging bag
molded semiconductor
bag
Prior art date
Application number
KR870013166A
Other languages
English (en)
Other versions
KR960015106B1 (ko
Inventor
와헤이 기다무라
겐 무라가미
구니히꼬 니시
Original Assignee
미다 가쓰시게
가부시기가이샤 히다찌세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP61278610A external-priority patent/JPS63138986A/ja
Priority claimed from JP62206290A external-priority patent/JPS6458670A/ja
Application filed by 미다 가쓰시게, 가부시기가이샤 히다찌세이사꾸쇼 filed Critical 미다 가쓰시게
Publication of KR890004429A publication Critical patent/KR890004429A/ko
Priority to KR1019920012565A priority Critical patent/KR960016323B1/ko
Priority to KR1019920012564A priority patent/KR960014474B1/ko
Priority to KR1019920012563A priority patent/KR970007120B1/ko
Application granted granted Critical
Publication of KR960015106B1 publication Critical patent/KR960015106B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D79/00—Kinds or details of packages, not otherwise provided for
    • B65D79/02—Arrangements or devices for indicating incorrect storage or transport
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
    • B65D81/26—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
    • B65D81/266—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/49506—Lead-frames or other flat leads characterised by the die pad an insulative substrate being used as a diepad, e.g. ceramic, plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/724—Permeability to gases, adsorption
    • B32B2307/7242—Non-permeable
    • B32B2307/7246—Water vapor barrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/24—Aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B32B2323/04—Polyethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2327/00—Polyvinylhalogenides
    • B32B2327/06—PVC, i.e. polyvinylchloride
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00—Containers; Receptacles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/485—Material
    • H01L2224/48505—Material at the bonding interface
    • H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/485—Material
    • H01L2224/48505—Material at the bonding interface
    • H01L2224/48699—Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01007—Nitrogen [N]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01018—Argon [Ar]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20753—Diameter ranges larger or equal to 30 microns less than 40 microns
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S174/00—Electricity: conductors and insulators
    • Y10S174/08—Shrinkable tubes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Food Science & Technology (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

내용 없음.

Description

면실장형 반도체 패키지 포장체 및 반도체 메모리 장치의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1의 실시예를 도시한 포장체의 사시도.
제2도는 본 발명의 실시예를 도시한 안쪽 상자의 사시도.
제3도는 매거어진의 일예를 도시한 사시도.

Claims (82)

  1. 다음의 사항으로 구성되는 포장체, (a)적어도 1개의 전자소자가 형성된 반도체 칩, (b)상기 반도체칩의 적어도 주면의 일부를 피복하여 되는 레진 성형체, (c)상기 반도체 칩과상기 레진 성형체를 외부에서 차단하기 위한 적어도 12kd의 금속 이이트를 포함하는 다층 필름으로 되는 방습 백.
  2. 특허청구의 범위 제1항에 있어서, 또 (d) 상기 백내에 수납된 건조제를 포함하는 포장체.
  3. 특허청구의 범위 제2항에 있어서, 여러개의 상기 레진 성형체는 일렬로 튜브 형상의 매거어진내에 수용되어 있는 포장체.
  4. 여러개의(10개 이상) 레진 성형 반도체 소자를 플라스틱 매거어진내에 수용하고, 그 매거어진의 바깥측을 내습 필름으로 기밀 밀폐한 레진 성형 반도체 소자의 포장체.
  5. 특허청구의 범위 제4항에 있어서, 상기 포장체는 그 내부에 건조제가 봉입되는 포장체.
  6. 여러개의(10개 이상)레진 성형 반도체 소자를 적어도 1장의 금속 시이트를 포함하는 다층 필름으로 되는 내습필름으로 기밀 성형한 레진 성형 반도체 소자의 포장체.
  7. 특허청구의 범위 제6항에 있어서, 상기 포장체는 상기 레진 성형체 및 건조제 이외의 흡습성 부재를 포함하는 않는 포장체.
  8. 특허청구의 범위 제7항에 있어서, 상기 포장체는 그 내부에 건조제를 포함하는 포함하는 포장체.
  9. 다음의 사항으로 구성되는 내습성 필름으로 되는 기밀 포장체, (a) 여러개의 레진 성형 반도체 소자, (b) 상기 여러개의 레진 성형 반도체 소자를 그 내부에 일렬로 수용한 여러개의 소자 수납 매거어진. (c)상기 여러개의 매거어진을 정렬시켜서 서로 밀착하도록 하여 수납하기 위한 안쪽 상자, (d) 상기 안쪽 상자를 내부에포함하도록 한 방습 시이트 재로되어 기밀 성형된 포장체, (e) 상기 포장체내에 수용된 건조제.
  10. 특허청구의 범위 제9항에 있어서, 상기 포장체 내부는 상기 포장체가 상기 안쪽 상자의 바깥측에 밀착하는 정도로 공기가 빠져 있는 기밀 포장체.
  11. 다음 사항으로 구성되는 여러개의 면실장용 레진성형 반도체 집접회로 장치를 위한 기밀 포장체, (a) 판지로 된 바깥 상자, (b) 상기 바깥 상자내에 수납된 여러개의 (5∼6개 이상) 내습성 필름으로된 기밀 성형된 포장 백, (c) 상기 포장 백내에 수용된 여러개의 종이제의 안쪽 상자, (d) 상기 안쪽 상자의 각각에 수납된 반도체 소자 반송용의 여러개의 튜브 형성 매거어진, (e) 상기 여러개의 매거어진의 각각에 일렬로 수납 된 여러개의 면실장용 레진 성형 반도체 집적회로 장치, (f) 상기 안쪽 상자내에 수납된 건조제.
  12. 특허청구의 범위 제11항에 있어서, 상기 포장체는 안쪽 상지 바깥면에 밀착하도록 내부에 있는 공기를 빼고 있어서, 그것에 의해서 바깥쪽 상자로의 수납을 용이하게 하고 있는 기밀 포장체.
  13. 특허청구의 범위 제11항에 있어서, 상기 포장 백내의 가스는 건조 가스로 치환되어 있는 기밀 포장체.
  14. 특허청구의 범위 제13항에 있어서, 상기 봉입된 가스는 상기 포장백의 핀 홀의 존재를 그 팽창 정도에 의해 판별할 수 있도록 가압되어 있는 기밀 포장체.
  15. 특허청구의 범위 제11항에 있어서, 상기 여러개의 매거어진은 그들의 끝부분이 일치하도록, 또한 서로 밀착하도록 하여 상기 각각의 안쪽 상자에 수납되어 있는 기밀 포장체.
  16. 다음 사항으로 구성되는 여러개의 면실장용 레진 성형 반도체 직접회로 장치를 위한 기밀 포장체, (a) 바깥상자, (b) 상기 바깥 상자내에 수??된 여러개의 기밀 성형된 내습성 필름으로 된 포장 백, (c) 상기 포장 백내에 수납된 여러개의 (5∼6이상) 레진 성형 반도체 장치를 보호하기 위한 적어도 1개의반송용 보조 부재, (d) 상기 보조 부재내에 또는 그 위에 수용된 여러개의 레진 성형 반도체 집적회로 장치, (e) 상기 포장 백내에 수납된 건조제.
  17. 특허청구의 범위 제16항에 있어서, 상기 보조부재는 상기 여러개의 레진 성형 반도체 장치를 일렬로 수용하는 튜브 형성의 매거어진인 기밀 포장체.
  18. 특허청구의 범위 제16항에 있어서, 상기 보조 부재는 상기 여러개의 레진 성형 반도체 장치를 그위에 어레이 형으로 수용하는 트레이인 기밀 포장체.
  19. 특허청구의 범위 제16항에 있어서, 상기 보조 부재는 상기 여러개의 레진 성형 반도체 장치를 그위 또는 그 속에 수용하는 테이프 형상 유지 부재인 기밀 포장체.
  20. 특허청구의 범위 제19항에 있어서, 상기 테이프 형상의 유지 부재는 릴에 감겨진 상태에서 상기 포장백내에 수납되어 있는 기밀 포장체.
  21. 특허청구의 범위 제20항에 있어서, 상기 여러개의 레진 성형 반도체 장치는 소정의 간격을 두고 상기 테이프상에 접착되어 있는 기밀 포장체.
  22. 다음 사항으로 구성되는 1개의 레진 성형 반도체 장치를 위한 기밀 포장체, (a) 내습성 필름으로된 기밀 성형된 포장 백, (b) 상기 포장 백내에 수납된 적어도 1개의 반송용 보조 부재, (c) 상기 포장 백내에 수용되고, 또한 상기 보조 부재내 또는 그위에 수용된 적어도 1개의 레진 성형 반도체 장치. (d)상기 포장백내에 수납된 건조제.
  23. 특허청구의 범위 제22항에 있어서, 상기 보조 부재는 상기 적어도 1개의 레진 성형 반도체 장치를 일렬로 수용하는 튜브 형상의 매거어진인 기밀 포장체.
  24. 특허청구의 범위 제22항에 있어서, 상기 보조 부재는 상기 적어도 1개의 레진 성형 반도체 장치를 그위에 어레이형으로 수용하는 트레인인 기밀 포장체.
  25. 특허청구의 범위 제22항에 있어서, 상기 보조 부재는 여러개의 레진, 성형 반도체 장치를 그위 또는 그 속에 테이프 형상 유지 부재인 기밀 포장체.
  26. 특허청구의 범위 제25항에 있어서, 상기 테이프 형상의 유지 부재는 릴에 감겨진 상태로 상기 포장 백내에 수납되어 있는 기밀 포장체.
  27. 특허청구의 범위 제26항에 있어서, 상기 적어도 1개의 레진 성형 반도체 장치는 소정의 간격을 두고 상기 테이프 상에 접착되어 있는 기밀 포장체.
  28. 다음 사항으로 구성되는 1개의 레진 성형 반도체 장치를 위한 기밀 포장체, (a) 내습성 필름으로 된 기밀 성형된 포장 백, (b) 상기 포장 백내에 수용된 적어도 1개의 레진 성형 반도체 장치, (c) 상기 포장 백내에 수납된 건조제.
  29. 특허청구의 범위 제28항에 있어서, 상기 포장 백은 초음파 또는 열을 인가하여 압착하고 밀봉되어 있는 기밀 포장체.
  30. 다음 사항으로 구성되는 1개의 레진 성형 반체체 장치를 위한 기밀 포장체, (a) 내습성 필름으로 된 기밀 성형된 포장 백, (b) 상기 포장 백내에 수용된 적어도 1개의 레진 성형 반도체 장치, (c) 상기 포장 백내에 수용 또는 그 안쪽에 형성된 건조제로 되는 부재.
  31. 특허청구의 범위 제30항에 있어서, 상기 포장 백은 포장 초음파 또는 열을 인가하여 압착하고 밀봉되어 있는 기밀 포장체.
  32. 특허청구의 범위 제30항에 있어서, 상기 포장 백이 내부 가스에 압력에 의해 부풀어지도록 가압 가스가 봉입되어 있는 기밀 포장체.
  33. 다음 사항으로 구성되는 포장체, (a) 적어도 1개의 전자 소자가 형성된 반도체 칩, (b) 상기 반도체 칩을 외부에서 차단하기 위한 방습 백, (c) 상기 방습 백내에 마련되어 내부에서 인식가능하게 된 습도 표시수단.
  34. 특허청구의 범위 제33항에 있어서,또 (d) 상기 백내에 수납된 건조제를 포함하고 있는 포장체.
  35. 특허청구의 범위 제34항에 있어서, 또 (e) 상기 반도체 칩의 적어도 주면 일부를 피복해서 되는 레진 성형체로 포함하는 포장체.
  36. 다음 사항으로 구성되는 포장체, (a), 여러개(5∼6개 이상)의 레진 성형 반도체 장치를 일렬로 수용하기 위한 튜브 형상의 반송용 매거어진, (b) 상기 매거어진내에 수용된 여러개의 레진 성형 반도체 장치, (c) 상기 매거어진내에 외부에서 볼 수 있도록 마련된 상기 매거어진내의 습도 표시수단.
  37. 특허청구의 범위 제36항에 있어서, 또 (d) 상기 매거어진내에 수용된 건조제를 포함하고 있는 포장체.
  38. 특허청구의 범위 제36항에 있어서, 또 (e) 상기 매거어진의 바깥측을 내포하고 기밀 성형된 방습 백으로 구성되는 포장체.
  39. 여러개의 (10개이상) 레진 성형 반도체 소자를 내습 필름으로 기밀 성형한 레진 성형 반도체 소자의 포장체에 있어서, 상기 포장체내에는 외부에서 볼 수 있도록 습도 표시수단이 마련되어 있는 포장체.
  40. 특허청구의 범위 제39항에 있어서, 상기 포장체는 상기 레진 성형체 및 건조제 이외의 흡습성 부재를 포함하지 않는 포장체.
  41. 특허청구의 범위 제40항에 있어서, 상기 포장체는 그 내부에 건조제를 포함하는 포장체.
  42. 다음 사항으로 구성되는 내습성 필름으로 되는 기밀 포장체,(a) 여러개의 레진 성형 반도체 소자, (b) 상기 여러개의 레진 성형 반도체 소자를 그 내부에 일렬로 수용한 여러개의 수자 수납 매거어진, (c) 상기 여러개의 매거어진을 정렬시켜서 서로 밀착 하도록 하여 수납하기 위한 안쪽 상자, (d) 상기 안쪽 상자를 내부에 포함하도록 한 방습 시이트 재로 되는 기밀 성헝된 포장 백, (e) 상기 포장 백내에 외부에서 볼 수 있도록 마련된 습도 표시수단.
  43. 특허청구의 범위 제42항에 있어서, 또(f) 상기 포장체내에 수용된 건조제를 포함하는 기밀 포장체.
  44. 다음 사항으로 구성되는 여러개의 면실장용 레진 성형 반도체 집적회로 장치를 위한 기밀 포장체, (a) 판지로 된 바깥쪽 상자, (b) 상기 바깥쪽 상자내에 수납된 여러개의 (5∼6개 이상) 내습성 필름으로된 기밀 성형된 포장 백, (c) 상기 포장 백내에 수용된 여러개의 종이제의 안쪽 상자, (d) 상기 안쪽 상자의 각각에 수납된 반도체 장치 반송용의 여러개의 튜브 형상의 매거어진, (e) 상기 여러개의 매거어진의 각각에 일렬로 수납된 여러개의 면실장용 레진 성형 반도체 집적회로 장치, (f) 상기 포장 백내에 그 포장 백의 외부에서 볼 수 있도록 마련된 그 포장 백내의 습도 표시장치.
  45. 특허청구의 범위 제44항에 있어서, 또(g) 상기 안쪽 상자내에 수납된 건조제를 포함하는 기밀 포장체.
  46. 특허청구의 범위 제44항에 있어서, 상기 포장 백은 안쪽 상자 바깥면에 밀착하도록 내부에 있는 공기를 빼고 있으며, 그것에 의해서 바깥쪽 상자로의 수납을 용이하게 하고 있는 기밀 포장체.
  47. 특허청구의 범위 제44항에 있어서, 상기 포장 백내의 가스는 건조 가스로 치환되어 있는 기밀 포장체.
  48. 특허청구의 범위 제47항에 있어서, 상기 봉입된 가스는 상기 포장 백의 핀 홀의 존재를 그 팽창 정도에 의해 판별할 수 있도록 가압되어 있는 기밀 포장체.
  49. 특허청구의 범위 제45항에 있어서, 상기 여러개의 매거어진은 그들의 끝부분이 일치하도록, 또한 서로 밀착하도록 하여 상기 각각의 안쪽 장치에 수납되어 있는 기밀 포장체.
  50. 다음 사항으로 구성되는 여러개의 면실장용 레진 성형 반도체 장치를 위한 기밀 포장체, (a) 바깥쪽 상자, (b) 상기 바깥쪽 상자내에 수용된 여러개의 기밀 성형된 내습성 필름으로된 포장백, (c) 상기 포장백내에 수납된 여러개의 (5∼6개 이상) 레진 성형 반도체 장치를 보호하기 위한 적어도 1개의 반송용 보조 부재, (d) 상기 보조 부재내에 또는 그위에 수용된 여러개의 레진 성형 반도체 집적회로 장치, (e) 상기 포장백내에 그 포장백의 외부에서 볼 수 있도록 마련된 그 포장 백내의 습도를 표시하는 장치.
  51. 특허청구의 범위 제50항에 있어서, 또 (f) 상기 포장백내에 수납된 건조제를 포함하는 기밀 포장체.
  52. 특허청구의 범위 제50항에 있어서, 상기 보조 부재는 상기 여러개의 레진 성형 반도체 장치를 일렬로 수용하는 튜브 형상의 매거어진의 기밀 포장체.
  53. 특허청구의 범위 제50항에 있어서, 상기 보조 부재는 상기 여러개의 레진 성형 반도체 장치를 그위에 어레이형으로 수용하는 트레이인 기밀 포장체.
  54. 특허청구의 범위 제50항에 있어서, 상기 보조 부재는 상기 여러개의 레진 성형 반도체 장치를 그위 또는 그속에 수용하는 테이프 형상 유지 부재인 트레이인 기밀 포장체.
  55. 특허청구의 범위 제54항에 있어서, 상기 테이프 형상의 유지 부재는 릴에 감겨진 상태로 상기 포장백내에 수납되어 있는 기밀 포장체.
  56. 특허청구의 범위 제55항에 있어서, 상기 여러개의 레진 성형 반도체 장치는 소정의 간격을 두고 상기 테이프 상에 접착되어 있는 기밀 포장체.
  57. 다음 사항으로 구성되는 1개의 레진 성형 반도체 장치를 위한 기밀 포장체, (a) 내습성 필름으로된 기밀 성형된 포장백, (b) 상기 포장백내에 수납된 적어도 1개의 반송용 보조 부재, (c) 상기 포장백내에 수용되고, 또한 상기 보조 부재내 또는 그 위에 수용된 적어도 1개의 레진 성형 반도체 장치, (??) 상기 포장백내에 외부에서 볼 수 있도록 마련된 습도 표시장치.
  58. 특허청구의 범위 제57항에 있어서, 또 (e) 상기 포장백내에 수납된 건조제를 포함하는 기밀 포장체.
  59. 특허청구의 범위 제57항에 있어서, 상기 보조 부재는 상기 적어도 1개의 레진 성형 반도체 장치를 일렬로 수용하는 튜븐 형상의 매거어진인 기밀 포장체.
  60. 특허청구의 범위 제57항에 있어서, 상기 보조 부재는 상기 적어도 1개의 레진 성형 반도체 장치를 그위에 어레이형으로 수용하는 트레이인 기밀 포장체.
  61. 특허청구의 범위 제57항에 있어서, 상기 보조 부재는 상기 적어도 1개의 레진 성형 반도체 장치를 그위 또는 그속에 수용하는 테이프 형상 유지 부재인 기밀 포장체.
  62. 특허청구의 범위 제61항에 있어서, 상기 테이프 형상의 유지 부재는 릴에감겨진 상태로 상기 포장 백내에 수납되어 있는 기밀 포장체.
  63. 특허청구의 범위 제62항에 있어서, 상길 적어도 1개의 레진 성형 반도체 장치는 소정의 간격을 두고 상기 테이프 상에 접착되어 있는 기밀 포장체.
  64. 다음 사항으로 구성되는 1개의 레진 성형 반도체 장치를 위한 기밀 포장체, (a) 내습성 필름으로 기밀 성형된 포장 백, (d) 상기 포장 백내에 수납된 적어도 1개의 레진 성형 반도체 장치, (c) 상기 포장 백내에 외부에서 볼 수 있도록 마련된 습도 표시장치.
  65. 특허청구의 범위 제64항에 있어서, 또(d) 상기 포장백내에 수납된 건조제로 되는 적어도 1개의 레진 성형 반도체 장치를 위한 기밀 포장체.
  66. 특허청구의 범위 제64항에 있어서, 상기 포장백은 초음파 또는 열을 인가하여 압착하고 밀봉되어 있는 기밀 포장체.
  67. 다음 사항으로 구성되는 1개의 레진 성형 반도체 장치를 위한 기밀 포장체, (a) 내습성 필름으로된 기밀 성형된 포장백, (b) 상기 포장백내에 수용된 적어도 1개의 레진 성형 반도체 장치, (c) 상기 포장백내에 수용 또는 그 내면에 외부에서 볼 수 있도록 형성된 건조 부재
  68. 특허청구의 범위 제67항에 있어서, 또 (d) 상기포장백내에 수용 또는 그 내면에 형성된 건조제로 되는 부재로 구성되는 기밀 포장체.
  69. 특허청구의 범위 제67항에 있어서, 상기 포장백은 초음파 또는 열을 인가하여 압착하고 밀봉되어 있는 기밀 포장체.
  70. 특허청구의 범위 제69항에 있어서, 상기 포장백이 내부 가스의 압력에 의해 부풀어지도록 가압 가스가 봉입되어 있는 기밀 포장체.
  71. 다음 사항으로 구성되는 여러개의 레진 성형 반도체 장치의 기밀 포장체, (a) 내습성을 갖는 제1의 레진 시이트로 형성된 소자 수납용 오목부를 갖는 캐리어 테이프, (b) 상기 여러개의 오목부에 수용된 레진 성형 반도체 장치, (c) 상기 오목부의 상면을 덮고 오목부의 내부를 기밀하게 보호하도록 성형된 내습성을 갖는 제2의 레진 시이트.
  72. 특허청구의 범위 제71항에 있어서, 또 (d) 상기 각 오목부내에 수용 또는 마련된 건조부재를 포함하는 기밀 포장체.
  73. 특허청구의 범위 제71항에 있어서, 또 (e) 상기 오목부의 적어도 1개의 내부에 외부에서 볼 수 있도록 마련된 습도 표시장치로 구성되는 기밀 포장체.
  74. 특허청구의 범위 제72항에 있어서, 또 (f) 상기 오목부의 각각에 외부에서 볼 수 있도록 마련된 습도 표시장치로 구성되는 기밀 포장체.
  75. 다음 사항의 공정으로 되는 레진 성형 반도체 장치의 실장 방법, (a) 레진 성형 장치를 흡습하지 않도록 방습백내에 보관하는 공정, (b) 상기 레진 성형장치를 장기 방습백에서 꺼내는 공정, (c) 상기 레진 성형 장치를 배선 기판상에 얹어 놓고, 레진 성형 부분이 열충격을 받는 것과 같은 조건에 있어서 상기 기판상에 배선에 상기 레진 성형장치의 리드를 납땜하는 공정.
  76. 특허청구의 범위 제75항의 시장 방법에 있어서, 또 (d) 상기 (a)와 (b) 사이에 방습백내의 습도 상태를 확인하는 공정을 포함하는 레진 형성 반도체 장치의 실장방법.
  77. 특허청구의 범위 제76항의 실장 방법에 있어서, 상기 방습백내에 건조제를 봉입하는 레진 성형 반도체 장치의 실장방법.
  78. 여러개의 레진 성형 반도체 장치를 항공기에 의해서 수송하는 방법에 있어서, 수송하는 동안 상기 여러개의 레진 성형 반도체 소자를 건조제와 함께 방습백내에 기밀 성형해 두는 것을 특징으로 하는 레진 성형 반도체 장치의 실장방법.
  79. 다음 사항의 공정으로 되는 레진 성형 반도체 장치의 제조방법, (a) 레진에 의해 반도체 칩 및 안쪽의 리드를 성형하는 공정, (b) 상기 레진 성형체에 잉크에 의해 마크 찍기를 행하는 공정, (c) 상기 마크를 찍은 후, 잉크의 베이크를 위해 상기 레진 성형체 전체를 고온에 쬐이는 공정, (d) 상기 베이크가 완료한 장치를 흡습하기 전에 방습백내에 기밀 성형하는 공정.
  80. 특허청구의 범위 제79항에 있어서, 상기 방습백내에는 건조제가 봉입되는 레진 성형 반도체 장치의 제조방법.
  81. 다음 사항의 공정으로 되는 반도체 메모리 장치의 제조방법, (a) 리드와 동일의 금속 시트로 형성된 반도체 칩 유지부에 그 칩의 한쪽에 주면을 거쳐서 고착하는 공정, (b) 상기 칩의 다른쪽의 주면상의 본딩패드와 안쪽 리드를 본딩와이어에 의해 본딩하는 공정, (c) 상기 칩의 다른쪽의 주면의 적어도 메모리 셀이 형성된 영역상에 α선의 발생이 적은 유기 레진에 의해 코팅하는 공정, (d) 상기 칩, 와이어, 칩 유지부 및 안쪽 리드를 레진에 의해 성형하여 그 성형체에서 여러개의 리드가 돌출한 레진 성형체를 형성하는 공정, (e) 상기 레진 성형체를 흡습하지 않도록 방습 포장하는 공정.
  82. 특허청구의 범위 제81항에 있어서, 상기 포장백내에 건조제를 봉입하는 레진 성형 반도체.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870013166A 1986-11-25 1987-11-23 면실장형 반도체패키지 포장체 KR960015106B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019920012565A KR960016323B1 (ko) 1986-11-25 1992-07-15 면실장형 반도체패키지 포장체의 제조방법
KR1019920012564A KR960014474B1 (ko) 1986-11-25 1992-07-15 면실장형 반도체패키지의 실장방법
KR1019920012563A KR970007120B1 (ko) 1986-11-25 1992-07-15 면실장형 반도체패키지 포장체

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP61278610A JPS63138986A (ja) 1986-11-25 1986-11-25 面実装型半導体パツケ−ジ包装体
JP61-278610 1986-11-25
JP62-206290 1987-08-21
JP62206290A JPS6458670A (en) 1987-08-21 1987-08-21 Moistureproof packaging bag of electronic part

Related Child Applications (2)

Application Number Title Priority Date Filing Date
KR1019920012565A Division KR960016323B1 (ko) 1986-11-25 1992-07-15 면실장형 반도체패키지 포장체의 제조방법
KR1019920012563A Division KR970007120B1 (ko) 1986-11-25 1992-07-15 면실장형 반도체패키지 포장체

Publications (2)

Publication Number Publication Date
KR890004429A true KR890004429A (ko) 1989-04-22
KR960015106B1 KR960015106B1 (ko) 1996-10-28

Family

ID=26515558

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1019870013166A KR960015106B1 (ko) 1986-11-25 1987-11-23 면실장형 반도체패키지 포장체
KR1019920012563A KR970007120B1 (ko) 1986-11-25 1992-07-15 면실장형 반도체패키지 포장체

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1019920012563A KR970007120B1 (ko) 1986-11-25 1992-07-15 면실장형 반도체패키지 포장체

Country Status (5)

Country Link
US (10) US5095626A (ko)
EP (3) EP0458423B1 (ko)
KR (2) KR960015106B1 (ko)
DE (3) DE3751687T2 (ko)
HK (3) HK59394A (ko)

Families Citing this family (135)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2196601A (en) * 1986-07-23 1988-05-05 Motorola Inc Method of packaging, material for use in packaging and package
KR960015106B1 (ko) * 1986-11-25 1996-10-28 가부시기가이샤 히다찌세이사꾸쇼 면실장형 반도체패키지 포장체
US4934524A (en) * 1988-09-19 1990-06-19 Brown & Williamson Tobacco Corporation Package for storing moisture laden articles
DE69018312T2 (de) * 1989-05-23 1995-12-14 Sasaki Chemicals Co Ltd Feuchtigkeitssorbentmittelzusammenstellungen.
CA2027534C (en) * 1989-10-23 1999-10-12 Yoshiaki Inoue Inhibitor parcel and method for preserving electronic devices or electronic parts
US5304419A (en) * 1990-07-06 1994-04-19 Alpha Fry Ltd Moisture and particle getter for enclosures
US5064063A (en) * 1990-08-08 1991-11-12 International Business Machines Corporation Tube assembly for pin grid array modules
US5318181A (en) * 1992-03-31 1994-06-07 Motorola, Inc. Compartmentalized humidity sensing indicator
US5293996A (en) * 1992-05-14 1994-03-15 Motorola, Inc. Container having an observation window
DE69320112T2 (de) * 1992-06-02 1999-03-11 Mitsubishi Gas Chemical Co Verfahren zum Verbinden von Metallen durch Weichlöten
US5287962A (en) * 1992-08-24 1994-02-22 Motorola, Inc. Vacuum seal indicator for flexible packaging material
US5322161A (en) * 1992-11-30 1994-06-21 United States Surgical Corporation Clear package for bioabsorbable articles
GB9301947D0 (en) * 1993-02-01 1993-03-17 Int Rectifier Co Ltd Semi-conductor device tubes
US5346518A (en) * 1993-03-23 1994-09-13 International Business Machines Corporation Vapor drain system
TW268913B (ko) * 1993-08-30 1996-01-21 Mitsubishi Gas Chemical Co
US5441809A (en) * 1993-10-28 1995-08-15 Brady U.S.A., Inc. Dissipative cover tape surface mount device packaging
US5920984A (en) * 1993-12-10 1999-07-13 Ericsson Ge Mobile Communications Inc. Method for the suppression of electromagnetic interference in an electronic system
US5473814A (en) * 1994-01-07 1995-12-12 International Business Machines Corporation Process for surface mounting flip chip carrier modules
US5403973A (en) * 1994-01-18 1995-04-04 Santilli; Michael A. Custom conformal heat sinking device for electronic circuit cards and methods of making the same
TW353854B (en) * 1994-03-14 1999-03-01 Minnesota Mining & Mfg Component tray with removable insert
TW311267B (ko) * 1994-04-11 1997-07-21 Raychem Ltd
JPH0846104A (ja) * 1994-05-31 1996-02-16 Motorola Inc 表面実装電子素子およびその製造方法
US5551557A (en) * 1994-10-25 1996-09-03 Convey, Inc. Efficient method and apparatus for establishing shelf-life of getters utilized within sealed enclosures
US5651171A (en) * 1995-02-22 1997-07-29 Carbon & Polymer Research, Inc. Method of making a shielded magnetic storage system
US5590778A (en) * 1995-06-06 1997-01-07 Baxter International Inc. Double-sterile package for medical apparatus and method of making
US5670254A (en) * 1995-09-29 1997-09-23 Brady Precision Tape Co. Cover tape for surface mount device packaging
US5644899A (en) * 1995-12-26 1997-07-08 Motorola, Inc. Method for packaging semiconductor components for shipment
US6026963A (en) * 1996-02-23 2000-02-22 Memc Electronic Materials, Inc. Moisture barrier bag having window
SG79938A1 (en) * 1996-04-16 2001-04-17 Mitsubishi Gas Chemical Co Noble metal-plated article, ornamental jewellery and methods for storage thereof
JP3026549B2 (ja) * 1996-05-02 2000-03-27 ダイナボット株式会社 クロマトグラフィ免疫分析装置の製造方法
US5709065A (en) * 1996-07-31 1998-01-20 Empak, Inc. Desiccant substrate package
FR2752661B1 (fr) * 1996-08-23 1998-10-30 Giat Ind Sa Procede de fabrication d'un dispositif de dissipation de l'energie thermique produite par des composants electroniques implantes sur une carte a circuits imprimes, et dispositif ainsi obtenu
US5875892A (en) * 1997-01-10 1999-03-02 Humidial Corporation Packaging container with humidity indicator
US6560839B1 (en) 1997-04-28 2003-05-13 Integrated Device Technology, Inc. Method for using a moisture-protective container
DE19734418A1 (de) * 1997-08-08 1999-02-11 Wuerth Adolf Gmbh & Co Kg Behälter für Montageschaum
JPH1167809A (ja) * 1997-08-26 1999-03-09 Sanyo Electric Co Ltd 半導体装置
JP3037229B2 (ja) * 1997-10-23 2000-04-24 新潟日本電気株式会社 ベアチップ実装方法及び実装装置
JPH11322125A (ja) * 1998-03-10 1999-11-24 Fuji Photo Film Co Ltd 補正データ表示カード、記録紙パッケージ、記録紙残量表示装置、及び感熱プリンタ
US6353326B2 (en) 1998-08-28 2002-03-05 Micron Technology, Inc. Test carrier with molded interconnect for testing semiconductor components
JP3046010B2 (ja) * 1998-11-12 2000-05-29 沖電気工業株式会社 収納容器および収納方法
US6536370B2 (en) * 1998-11-25 2003-03-25 Advanced Micro Devices, Inc. Elapsed time indicator for controlled environments and method of use
FR2787093B1 (fr) * 1998-12-15 2001-07-06 Robert Gilles Kelifa Dispositif regulateur d'humidite relative
US6531197B2 (en) 1999-04-26 2003-03-11 Illinois Tool Works Desiccant barrier container
US6933059B1 (en) 1999-05-07 2005-08-23 Scc Products, Inc. Electrostatic shielding, low charging-retaining moisture barrier film
GB2350347B (en) * 1999-05-24 2001-11-14 Mohammed Iftkhar Bag for mitigating damage of items following contamination by smoke or water
SE9902207L (sv) * 1999-06-11 2000-12-12 Sca Hygiene Prod Ab Användning av fukttät förpackning för absorberande alster innehållande fuktkänsliga tillsatser
US20100044080A1 (en) * 1999-08-27 2010-02-25 Lex Kosowsky Metal Deposition
US20080035370A1 (en) * 1999-08-27 2008-02-14 Lex Kosowsky Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material
US7695644B2 (en) * 1999-08-27 2010-04-13 Shocking Technologies, Inc. Device applications for voltage switchable dielectric material having high aspect ratio particles
US20100044079A1 (en) * 1999-08-27 2010-02-25 Lex Kosowsky Metal Deposition
US7825491B2 (en) * 2005-11-22 2010-11-02 Shocking Technologies, Inc. Light-emitting device using voltage switchable dielectric material
AU6531600A (en) * 1999-08-27 2001-03-26 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
US7446030B2 (en) * 1999-08-27 2008-11-04 Shocking Technologies, Inc. Methods for fabricating current-carrying structures using voltage switchable dielectric materials
US20020185409A1 (en) * 2000-04-05 2002-12-12 Morrow Anthony B. Desiccant containing product carrier
KR20010111798A (ko) * 2000-06-13 2001-12-20 마이클 디. 오브라이언 습도지시계를 구비한 건조제
US6573200B2 (en) * 2001-01-18 2003-06-03 Advanced Micro Devices, Inc. Automatic printing of caution labels for moisture-sensitive devices
US7389877B2 (en) * 2000-08-28 2008-06-24 Sud-Chemie Inc. Apparatus for packaging electronic components including a reel entrained with desiccating material
US6827218B1 (en) 2000-08-28 2004-12-07 Sud-Chemie Inc. Packaging container for electronic components
SG92784A1 (en) * 2001-03-14 2002-11-19 Micron Technology Inc Underfill applications using film technology
US6514797B2 (en) 2001-03-15 2003-02-04 Micron Technology, Inc. Underfill applications using film technology
US6564742B2 (en) * 2001-08-03 2003-05-20 Hewlett-Packard Development Company, Llp Over-temperature warning device
DE60122023T2 (de) * 2001-10-19 2007-03-08 Infineon Technologies Ag Beutel
NZ532673A (en) * 2001-11-17 2008-07-31 Aventis Pharma Ltd Package comprising a medicament, a component that gradually releases a gaseous substance and an adsorbent material
JP2003163459A (ja) * 2001-11-26 2003-06-06 Sony Corp 高周波回路ブロック体及びその製造方法、高周波モジュール装置及びその製造方法。
CN1633466A (zh) * 2002-02-20 2005-06-29 电气化学工业株式会社 防静电方法以及采用该方法的构件
JP4209387B2 (ja) * 2002-06-14 2009-01-14 電気化学工業株式会社 電子部品包装容器用積層シート及び電子部品包装容器
US7025205B2 (en) * 2002-06-26 2006-04-11 Aventis Pharma Limited Method and packaging for pressurized containers
US6861289B2 (en) * 2002-07-25 2005-03-01 Delphi Technologies, Inc. Moisture-sensitive device protection system
JP4064203B2 (ja) * 2002-10-18 2008-03-19 川崎マイクロエレクトロニクス株式会社 半導体装置梱包方法
DE10253567A1 (de) * 2002-11-15 2004-05-27 Linpac Plastics Gmbh Lagerungsmittel, insbesondere Schale
US20040178514A1 (en) * 2003-03-12 2004-09-16 Lee Sang-Hyeop Method of encapsulating semiconductor devices on a printed circuit board, and a printed circuit board for use in the method
US7533514B2 (en) * 2003-04-25 2009-05-19 Boston Scientific Scimed, Inc. Method and apparatus for automated handling of medical devices during manufacture
JP2005191342A (ja) * 2003-12-26 2005-07-14 Renesas Technology Corp 半導体装置およびその製造方法
US7265995B2 (en) * 2003-12-29 2007-09-04 Intel Corporation Array capacitors with voids to enable a full-grid socket
JP2005239236A (ja) * 2004-02-27 2005-09-08 Renesas Technology Corp 半導体装置の製造方法およびそれに用いられる包装体
US7067332B1 (en) * 2004-03-16 2006-06-27 Altera Corporation Method for die removal from plastic packages
KR101238509B1 (ko) * 2004-04-30 2013-03-04 가부시끼가이샤 구레하 밀봉용 수지 조성물 및 수지 밀봉된 반도체 장치
JP2008502551A (ja) * 2004-06-14 2008-01-31 スポーツ メディア インコーポレイテッド 容器および容器の製造方法
WO2006018671A1 (en) * 2004-08-19 2006-02-23 Infineon Technologies Ag Mixed wire semiconductor lead frame package
DE102004041598A1 (de) * 2004-08-26 2006-03-16 Infineon Technologies Ag Verfahren und Vorrichtung zur Reduzierung der Krümmung von Halbleiteranordnungen
US8698262B2 (en) * 2004-09-14 2014-04-15 Semiconductor Energy Laboratory Co., Ltd. Wireless chip and manufacturing method of the same
KR20060030356A (ko) * 2004-10-05 2006-04-10 삼성테크윈 주식회사 반도체 리이드 프레임과, 이를 포함하는 반도체 패키지와,이를 도금하는 방법
CN101052569B (zh) * 2004-11-01 2011-01-12 旭化成化学株式会社 易开封袋
US20060109602A1 (en) * 2004-11-24 2006-05-25 Vermillion Robert J Electrostatic shielding packaging composition and methods for producing and using the same
JP2006158712A (ja) * 2004-12-08 2006-06-22 Seiko Instruments Inc 心拍計測装置
ITMI20042478A1 (it) * 2004-12-23 2005-03-23 Levosil S P A Dispositivi disidratanti antistatici
WO2007062122A2 (en) 2005-11-22 2007-05-31 Shocking Technologies, Inc. Semiconductor devices including voltage switchable materials for over-voltage protection
US20100263200A1 (en) * 2005-11-22 2010-10-21 Lex Kosowsky Wireless communication device using voltage switchable dielectric material
IL172146A0 (en) * 2005-11-23 2006-04-10 Cellergy Ltd Thermal barrier for surface mounting
FR2896235B1 (fr) * 2006-01-18 2010-04-23 Airsec Conteneur deshydratant comportant un indicateur de l'etat d'humidite
US20070210171A1 (en) * 2006-03-07 2007-09-13 Aaron Spitz Privacy sack for purchasing items and system therefor
DE102006020619B4 (de) * 2006-05-02 2012-11-15 Fritz Egger Gmbh & Co. Paneelverpackung mit Indikator
US20080029405A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having conductive or semi-conductive organic material
US7968014B2 (en) * 2006-07-29 2011-06-28 Shocking Technologies, Inc. Device applications for voltage switchable dielectric material having high aspect ratio particles
US20080032049A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having high aspect ratio particles
RU2436717C2 (ru) * 2006-08-25 2011-12-20 Интерпрайз Брюссель С.А. Способ и комплект для контролируемого изменения содержания газа внутри упаковки
EP2084748A4 (en) * 2006-09-24 2011-09-28 Shocking Technologies Inc FORMULATIONS FOR A VOLTAGE-SWITCHABLE DIELECTRIC MATERIAL WITH A DEVICED VOLTAGE CONTACT BEHAVIOR AND METHOD OF MANUFACTURING THEREOF
US20120119168A9 (en) * 2006-11-21 2012-05-17 Robert Fleming Voltage switchable dielectric materials with low band gap polymer binder or composite
JP2008167853A (ja) * 2007-01-10 2008-07-24 Fujifilm Corp 試験シート、物体診断装置および方法並びにプログラム
US7793236B2 (en) * 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
US20090145802A1 (en) * 2007-12-11 2009-06-11 Apple Inc. Storage system for components incorporating a liquid-metal thermal interface
US8206614B2 (en) * 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
JP4466756B2 (ja) * 2008-04-02 2010-05-26 住友電気工業株式会社 化合物半導体基板の包装方法
US8203421B2 (en) * 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
US20100047535A1 (en) * 2008-08-22 2010-02-25 Lex Kosowsky Core layer structure having voltage switchable dielectric material
WO2010033635A1 (en) * 2008-09-17 2010-03-25 Shocking Technologies, Inc. Voltage switchable dielectric material containing boron compound
US9208931B2 (en) * 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
EP2342722A2 (en) * 2008-09-30 2011-07-13 Shocking Technologies Inc Voltage switchable dielectric material containing conductive core shelled particles
US8362871B2 (en) * 2008-11-05 2013-01-29 Shocking Technologies, Inc. Geometric and electric field considerations for including transient protective material in substrate devices
WO2010064385A1 (ja) * 2008-12-01 2010-06-10 千住金属工業株式会社 微小はんだボールの保存用パッケージ体および保存方法
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8399773B2 (en) 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US9226391B2 (en) 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
US8829634B2 (en) * 2009-03-23 2014-09-09 Dow Global Technologies Llc Optoelectronic device
WO2010110909A1 (en) 2009-03-26 2010-09-30 Shocking Technologies, Inc. Components having voltage switchable dielectric materials
US9053844B2 (en) * 2009-09-09 2015-06-09 Littelfuse, Inc. Geometric configuration or alignment of protective material in a gap structure for electrical devices
US20110139650A1 (en) * 2009-12-15 2011-06-16 Amcor Flexibles, Inc. Sterilizable Package Having Breathable Membrane for the Packaging of Medical Devices
US20110198544A1 (en) * 2010-02-18 2011-08-18 Lex Kosowsky EMI Voltage Switchable Dielectric Materials Having Nanophase Materials
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
US9224728B2 (en) * 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
US9320135B2 (en) * 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
DE102010019448A1 (de) 2010-05-05 2011-11-10 Peter Roider Rückverfolgungsverfahren sowie Rückverfolgungssystem für die Herstellung von Halbleiterprodukten
US20120061261A1 (en) * 2010-09-15 2012-03-15 Tsang-Hung Hsu Regeneratable dehumidifying bag having doubly-protected humidity indicator
WO2012040294A1 (en) * 2010-09-21 2012-03-29 Avery Dennison Corporation Reclosable vacuum storage bag having as sorted monitoring means
KR101383207B1 (ko) * 2011-05-02 2014-04-10 엘지디스플레이 주식회사 디스플레이 장치
US8925290B2 (en) 2011-09-08 2015-01-06 Taiwan Semiconductor Manufacturing Company, Ltd. Mask storage device for mask haze prevention and methods thereof
TWI479627B (zh) 2011-12-14 2015-04-01 Novatek Microelectronics Corp 導線架封裝結構
WO2015110835A2 (en) 2014-01-23 2015-07-30 Stasis Lmps Limited Flexible panel and sealable bag with sorbant
US20160137396A1 (en) * 2014-11-13 2016-05-19 Avery Dennison Retail Information Services, Llc Commercial transportation garment bag and methods
US9917000B2 (en) * 2015-10-01 2018-03-13 Infineon Technologies Ag Wafer carrier, method for manufacturing the same and method for carrying a wafer
US10699934B2 (en) 2015-10-01 2020-06-30 Infineon Technologies Ag Substrate carrier, a processing arrangement and a method
KR102671467B1 (ko) * 2016-09-28 2024-06-03 삼성전자주식회사 반도체 패키지를 포함하는 반도체 모듈 및 반도체 패키지
US20210043466A1 (en) 2019-08-06 2021-02-11 Texas Instruments Incorporated Universal semiconductor package molds
CN113071738B (zh) * 2021-04-06 2022-11-29 迅得机械（东莞）有限公司 一种硬板产品辅材的全自动包装设备
CN113800098A (zh) * 2021-09-16 2021-12-17 广东电网有限责任公司 一种运输设备

Family Cites Families (110)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US598838A (en) * 1898-02-08 William b
US2251609A (en) * 1936-07-18 1941-08-05 Allen Bradley Co Packaging means for small resistor units
US2283867A (en) * 1939-12-19 1942-05-19 Stokes Machine Co Packaging and preserving dried biologicals, pharmaceuticals, and the like
US2446361A (en) * 1945-07-09 1948-08-03 Herbert B Clibbon Moisture vapor indicator for packaged goods
US2674509A (en) * 1949-04-15 1954-04-06 Fulton Bag & Cotton Mills Means for protecting food commodities
US2611481A (en) * 1950-06-09 1952-09-23 James A Sargeant Inspection means for sealed packages
DE894074C (de) * 1951-03-31 1953-10-22 Chem Fab Dr Fritz Voigt Verpackung fuer Elektroden
US2814382A (en) * 1955-09-21 1957-11-26 Frederic H Lassiter Cellophane packaging and method
FR1140952A (fr) * 1956-01-04 1957-08-22 Emballage protecteur contre l'humidité
US3041796A (en) 1960-01-26 1962-07-03 Roy J Walters Waffle back abrasive disc
US3042796A (en) * 1960-06-29 1962-07-03 Forest Taber De Flashlight assembly for underwater use
US3286430A (en) * 1963-02-11 1966-11-22 Joseph J Esty Method of sealing and packaging
US3301468A (en) * 1964-12-11 1967-01-31 Philip Morris Inc Package for tobacco products
US3399763A (en) 1966-05-04 1968-09-03 Developak Inc Blister pack and method of forming the same
US3572499A (en) * 1967-01-19 1971-03-30 Custom Materials Inc Conductive packaging material and container for explosives
US3399762A (en) * 1967-05-31 1968-09-03 Finch Pruyn & Company Inc Typewriter paper carton with lift strip
US3405796A (en) * 1967-06-29 1968-10-15 Belco Engineering Inc Packaged newspaper
US3454154A (en) * 1968-05-07 1969-07-08 Us Air Force Integrated circuit carrier
US3625931A (en) * 1969-05-06 1971-12-07 Masatomo Ito Antistatic thermoplastic resin
US3660799A (en) * 1969-06-17 1972-05-02 Honeywell Inf Systems Connector device
US3673758A (en) * 1970-12-21 1972-07-04 Joseph J Esty Method of packaging and preserving perishable products
US3704806A (en) * 1971-01-06 1972-12-05 Le T Im Lensoveta Dehumidifying composition and a method for preparing the same
US4091165A (en) * 1971-07-01 1978-05-23 Mitsubishi Petrochemical Co., Ltd. Surface processing copolymer for synthetic papers
JPS5144143B2 (ko) * 1972-06-27 1976-11-26
US4026008A (en) * 1972-10-02 1977-05-31 Signetics Corporation Semiconductor lead structure and assembly and method for fabricating same
US3909504A (en) * 1973-11-05 1975-09-30 Carrier Tel Corp America Inc Ruggedized package for electronic components and the like
US4011798A (en) * 1973-11-29 1977-03-15 Packaging Industries, Inc. Method of making shipping bag
US4084241A (en) * 1974-10-19 1978-04-11 Toshihiro Tsumura System for processing movement information of vehicle
US3959526A (en) * 1974-12-20 1976-05-25 E. I. Du Pont De Nemours And Company Process for preparing high barrier, heat-sealable packaging film
FR2326347A1 (fr) * 1975-10-03 1977-04-29 Scholle Corp Materiau d'emballage a impermeabilite aux gaz amelioree
JPS5254583A (en) * 1975-10-29 1977-05-04 Hitachi Ltd Method of encasing electronic parts in magazine
US4049121A (en) * 1976-07-14 1977-09-20 Baxter Travenol Laboratories, Inc. Moisture detection system for a sterile package
JPS5644080Y2 (ko) * 1976-07-16 1981-10-15
DE2636421A1 (de) * 1976-08-13 1978-02-16 Basf Ag Elektrisch leitfaehige perylenderivate
US4154344A (en) * 1976-11-09 1979-05-15 Minnesota Mining And Manufacturing Company Material for forming envelopes used to protect electronic components
US4206844A (en) * 1977-01-04 1980-06-10 Toppan Printing Co., Ltd. Package for a sterilized material
NL7705365A (nl) * 1977-05-16 1978-11-20 Philips Nv Elektrische lamp.
US4121956A (en) * 1977-07-15 1978-10-24 E. I. Du Pont De Nemours And Company Method for labelling a package
US4203127A (en) * 1977-07-18 1980-05-13 Motorola, Inc. Package and method of packaging semiconductor wafers
US4208696A (en) * 1977-09-06 1980-06-17 Minnesota Mining And Manufacturing Company Electrically conductive web
DE2821182A1 (de) * 1978-05-13 1979-11-15 Willi Doering Verpackungsbeutel fuer elektronik- leiterplatten
US4160503A (en) * 1978-08-07 1979-07-10 Ohlbach Ralph C Shipping container for printed circuit boards and other items
JPS5536238A (en) * 1978-09-06 1980-03-13 Kureha Chem Ind Co Ltd Antistatic resin composition
US4223368A (en) * 1978-09-14 1980-09-16 Dattilo Donald P Electrostatic discharge protection device
US4164503A (en) * 1978-10-10 1979-08-14 Research Corporation Quinonoid intermediates from chloroprene
JPS6040480B2 (ja) * 1978-11-16 1985-09-11 株式会社エンパイア−化学研究所 革靴類のクリ−ニング方法
DE3004325A1 (de) * 1979-02-08 1980-08-14 Mitsubishi Gas Chemical Co Sauerstoffabsorptionsmittel enthaltender beutel und damit versehener behaelterverschluss
US4293070A (en) * 1979-03-30 1981-10-06 Ohlbach Ralph C For protecting printed circuit boards and other items against the ravages of a discharge of static electricity
JPS5848425B2 (ja) * 1980-04-10 1983-10-28 富士通株式会社 電子部品の包装方法
US4327832A (en) * 1980-06-26 1982-05-04 Thielex Plastics Corporation Container for packaging semiconductor components
JPS57149770A (en) * 1981-03-11 1982-09-16 Mitsubishi Electric Corp Manufacture of semiconductor device
US4528222A (en) * 1981-04-24 1985-07-09 Pervel Industries, Inc. Conductively printed flexible sheet material
US4407872A (en) * 1981-06-02 1983-10-04 Ricoh Co. Ltd. Sheet material and envelope for packaging electronic parts
US4478858A (en) * 1982-02-08 1984-10-23 The Procter & Gamble Company Instant coffee containing packet and method of forming
US4681218A (en) * 1982-03-15 1987-07-21 Becton, Dickinson And Company Moisture-controlled glass microscope slide package
US4496406A (en) * 1982-09-30 1985-01-29 General Dynamics, Pomona Division Method of making a conductive resealable pouch
US4471872A (en) * 1982-09-30 1984-09-18 General Dynamics, Pomona Division Conductive resealable pouch
US4424900A (en) * 1982-11-08 1984-01-10 Petcavich Robert J Anti-static packages and packaging material
US4494406A (en) * 1982-12-23 1985-01-22 Ebtron, Inc. Means for measuring large area mass flow
CA1233444A (en) * 1983-06-15 1988-03-01 Yozo Araki Apparatus for filling bags
US4480747A (en) * 1983-06-30 1984-11-06 Motorola, Inc. Static shielded shipping container
EP0130489B1 (de) 1983-06-30 1990-09-19 Siemens Aktiengesellschaft Rohrförmiger Behälter zur Aufnahme von Halbleiterbauelementen
JPS6036105A (ja) * 1983-08-08 1985-02-25 積水化学工業株式会社 硬質木片セメント板に略ｖ字溝を形成する方法
JPS6036165A (ja) * 1983-08-09 1985-02-25 Nec Corp 半導体装置の捺印方法
NZ209507A (en) * 1983-10-06 1986-07-11 Canadian Ind Thermoplastic valve bag:perforated outer wall with mesh inner liner
GB2149220A (en) * 1983-10-21 1985-06-05 Sinclair Res Ltd Protection of electronic circuit components from static electricity
US4529087A (en) * 1983-10-21 1985-07-16 Maine Poly, Inc. Printed antistatic plastic bag
GB8405607D0 (en) * 1984-03-02 1984-04-04 Camvac Holdings Ltd Plastics film laminate
US4522302A (en) * 1984-03-05 1985-06-11 Sterling Drug Inc. Pre-sterilized medical procedure kit packages
JPS60208846A (ja) 1984-04-02 1985-10-21 Oki Electric Ind Co Ltd 耐熱プラスチツクｉｃ
JPS60208847A (ja) 1984-04-02 1985-10-21 Oki Electric Ind Co Ltd 表面実装型ｉｃに内在する水分の排出方法
JPS60226145A (ja) 1984-04-25 1985-11-11 Hitachi Ltd 半導体装置の実装方法
US4565228A (en) * 1984-05-16 1986-01-21 Ponce Felix C Strike template for a portable router
JPS6133444A (ja) 1984-07-20 1986-02-17 Toshiba Corp 記録用紙台
JPS6144897U (ja) * 1984-08-27 1986-03-25 藤森工業株式会社 Ｉｃ用チユ−ブ
JPS61178877A (ja) * 1985-01-23 1986-08-11 株式会社日立製作所 樹脂封止型半導体装置の輸送・保管方法
JPS61184856A (ja) 1985-02-13 1986-08-18 Oki Electric Ind Co Ltd 樹脂封止形半導体装置
JPS61184854A (ja) 1985-02-13 1986-08-18 Oki Electric Ind Co Ltd 樹脂封止形半導体装置
US4875581A (en) * 1985-03-19 1989-10-24 Robert B. Ray Static dissipative elastomeric coating for electronic packaging components
JPS61249341A (ja) * 1985-04-27 1986-11-06 Showa Denko Kk 脱水用具
JPH0356548Y2 (ko) * 1985-05-08 1991-12-19
US4648508A (en) * 1985-06-19 1987-03-10 Robert A. Neal Flexible envelope for electronic component packaging
JPS6213457A (ja) * 1985-07-10 1987-01-22 Kohjin Co Ltd 熱可塑性樹脂組成物の製造方法
DE3524846A1 (de) * 1985-07-12 1987-01-15 Hoechst Ag Verpackung fuer trockenresistmaterial
JPS6218548A (ja) * 1985-07-17 1987-01-27 Fuji Photo Film Co Ltd 写真感光材料用包装材料
US4684020A (en) * 1985-09-20 1987-08-04 Conductive Container, Inc. Conductive container
US4790433A (en) * 1985-10-04 1988-12-13 The Crowell Corporation Packaging combination
US4906494A (en) * 1985-10-09 1990-03-06 The Dow Chemical Company Antistatic sheet material, package and method of making
US4756414A (en) * 1985-10-09 1988-07-12 The Dow Chemical Company Antistatic sheet material and package
US4658958A (en) * 1985-10-30 1987-04-21 Robert A. Neal Transparent article
GB8527050D0 (en) * 1985-11-02 1985-12-04 Fgl Products Ltd Vacuum packing process
US4661376A (en) * 1985-12-27 1987-04-28 Liang Paul M Method of producing electrically conductive fibers
US4721207A (en) * 1986-04-28 1988-01-26 Tensho Electric Industrial Co., Ltd. Hard disk container
US4823538A (en) * 1986-05-30 1989-04-25 Fuji Pack System Ltd. Bagging machine
US4699830A (en) * 1986-06-30 1987-10-13 Baxter Travenol Laboratories, Inc. Laminated sheet material for packaging electronic components
US4695926A (en) * 1986-07-01 1987-09-22 Bell Of Pennsylvania Encapsulation and insulation of electronic circuit board structures
US4757964A (en) * 1986-07-17 1988-07-19 Hughes Aircraft Company Method for controlling the attitude of a spinning body in orbit
GB2196601A (en) * 1986-07-23 1988-05-05 Motorola Inc Method of packaging, material for use in packaging and package
US4756964A (en) * 1986-09-29 1988-07-12 The Dow Chemical Company Barrier films having an amorphous carbon coating and methods of making
US4800115A (en) * 1986-10-14 1989-01-24 W. R. Grace & Co. Agent for imparting antistatic characteristics to a thermoplastic polymer and a thermoplastic polymer composition containing the agent
KR960015106B1 (ko) * 1986-11-25 1996-10-28 가부시기가이샤 히다찌세이사꾸쇼 면실장형 반도체패키지 포장체
US4804852A (en) * 1987-01-29 1989-02-14 Eaton Corporation Treating work pieces with electro-magnetically scanned ion beams
US4804582A (en) * 1987-06-01 1989-02-14 The Dow Chemical Company Static dissipative thermoplastic laminate film
US4919955A (en) * 1987-09-08 1990-04-24 Mitchell Jerry L Method for packaging perishable products
US4804580A (en) 1988-07-07 1989-02-14 International Fuel Cells Corporation Catalytic reformer housing insulation and method of making same
US4949529A (en) * 1988-09-07 1990-08-21 Paramount Packaging Corporation Vacuum package with smooth surface and method of making same
JPH0317238A (ja) * 1989-06-14 1991-01-25 Shigeaki Sugino Ｃｕ―Ａｌ―Ｍｎ系形状記憶合金、および、その製造方法
US5287962A (en) * 1992-08-24 1994-02-22 Motorola, Inc. Vacuum seal indicator for flexible packaging material
US5644899A (en) * 1995-12-26 1997-07-08 Motorola, Inc. Method for packaging semiconductor components for shipment
US5988308A (en) * 1996-09-06 1999-11-23 Freightliner Corporation Flexible articulated coupling that minimizes leakage

Also Published As

Publication number Publication date
US20010015327A1 (en) 2001-08-23
US4971196A (en) 1990-11-20
EP0269410B1 (en) 1992-04-22
US6981585B2 (en) 2006-01-03
KR960015106B1 (ko) 1996-10-28
EP0458423A2 (en) 1991-11-27
US6443298B2 (en) 2002-09-03
EP0512579B1 (en) 1996-01-24
DE3778499D1 (de) 1992-05-27
EP0512579A1 (en) 1992-11-11
HK28496A (en) 1996-02-23
US6223893B1 (en) 2001-05-01
DE3751687D1 (de) 1996-03-07
US5095626A (en) 1992-03-17
DE3751687T2 (de) 1996-08-14
US5607059A (en) 1997-03-04
EP0269410A3 (en) 1989-02-08
EP0458423B1 (en) 1994-09-21
US20030057113A1 (en) 2003-03-27
DE3750589D1 (de) 1994-10-27
DE3750589T2 (de) 1995-01-19
HK59394A (en) 1994-07-08
KR930005175A (ko) 1993-03-23
EP0458423A3 (en) 1991-12-11
US5988368A (en) 1999-11-23
US20020179460A1 (en) 2002-12-05
US20020174627A1 (en) 2002-11-28
US5803246A (en) 1998-09-08
HK214096A (en) 1996-12-13
KR970007120B1 (ko) 1997-05-02
EP0269410A2 (en) 1988-06-01

Similar Documents

Publication Publication Date Title
KR890004429A (ko) 면실장형 반도체 패키지 포장체 및 반도체 메모리 장치의 제조방법
US5136827A (en) Wrapping member for semiconductor device and method for manufacturing the wrapping member
US5274914A (en) Method of producing surface package type semiconductor package
JPH0648463A (ja) 集積回路出荷媒体
US20060011509A1 (en) Packaging system and method for storing electronic components
JP3115566B2 (ja) 面実装型半導体パッケージ包装体の製造方法
JP2006306403A (ja) 半導体装置の製造方法
JPH0219292A (ja) 面実装型半導体パッケージ包装体
JP2665181B2 (ja) 面実装型半導体パッケージ包装体
JP3187399B2 (ja) 袋体に封入された面実装型樹脂封止半導体装置
JP2665182B2 (ja) 面実装型半導体パッケージ包装体の製造方法
JP4026450B2 (ja) 半導体装置用テープキャリアの梱包方法
JP2609516B2 (ja) 面実装型半導体パッケージの実装方法
KR940008293Y1 (ko) 반도체 패키지의 방습포장백
JP3115565B2 (ja) 面実装型樹脂封止半導体パッケージ包装体
JPH052475Y2 (ko)
KR960016323B1 (ko) 면실장형 반도체패키지 포장체의 제조방법
JPH0415672Y2 (ko)
BE1022155B1 (nl) Stijve esd verpakking voor elektronische componenten
KR19990070617A (ko) 캐리어 테이프 봉입 장치
JP2004161352A (ja) 防湿袋および半導体装置梱包方法
JPH07267281A (ja) 面実装型半導体パッケージの包装体

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20101027

Year of fee payment: 15

EXPY Expiration of term