SG92784A1 - Underfill applications using film technology - Google Patents

Underfill applications using film technology

Info

Publication number
SG92784A1
SG92784A1 SG200101535A SG200101535A SG92784A1 SG 92784 A1 SG92784 A1 SG 92784A1 SG 200101535 A SG200101535 A SG 200101535A SG 200101535 A SG200101535 A SG 200101535A SG 92784 A1 SG92784 A1 SG 92784A1
Authority
SG
Singapore
Prior art keywords
film technology
underfill applications
underfill
applications
film
Prior art date
Application number
SG200101535A
Inventor
Tay Liang Chee
Toh Kok Seng
Tan Kok Chua
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to SG200101535A priority Critical patent/SG92784A1/en
Publication of SG92784A1 publication Critical patent/SG92784A1/en

Links

SG200101535A 2001-03-14 2001-03-14 Underfill applications using film technology SG92784A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200101535A SG92784A1 (en) 2001-03-14 2001-03-14 Underfill applications using film technology

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200101535A SG92784A1 (en) 2001-03-14 2001-03-14 Underfill applications using film technology

Publications (1)

Publication Number Publication Date
SG92784A1 true SG92784A1 (en) 2002-11-19

Family

ID=28036745

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200101535A SG92784A1 (en) 2001-03-14 2001-03-14 Underfill applications using film technology

Country Status (1)

Country Link
SG (1) SG92784A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0458423A2 (en) * 1986-11-25 1991-11-27 Hitachi, Ltd. Packaging of semiconductor elements
US6101790A (en) * 1997-07-23 2000-08-15 Matsushita Electric Industrial Co., Ltd Packing band, packing method and packing apparatus, of little parts, and mounting method of electronic parts
US6149010A (en) * 1998-10-12 2000-11-21 Fujitsu Takamisa Component Limited Carrier for electronic parts

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0458423A2 (en) * 1986-11-25 1991-11-27 Hitachi, Ltd. Packaging of semiconductor elements
US6101790A (en) * 1997-07-23 2000-08-15 Matsushita Electric Industrial Co., Ltd Packing band, packing method and packing apparatus, of little parts, and mounting method of electronic parts
US6149010A (en) * 1998-10-12 2000-11-21 Fujitsu Takamisa Component Limited Carrier for electronic parts

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