IL172146A0 - Thermal barrier for surface mounting - Google Patents

Thermal barrier for surface mounting

Info

Publication number
IL172146A0
IL172146A0 IL172146A IL17214605A IL172146A0 IL 172146 A0 IL172146 A0 IL 172146A0 IL 172146 A IL172146 A IL 172146A IL 17214605 A IL17214605 A IL 17214605A IL 172146 A0 IL172146 A0 IL 172146A0
Authority
IL
Israel
Prior art keywords
surface mounting
thermal barrier
barrier
thermal
mounting
Prior art date
Application number
IL172146A
Original Assignee
Cellergy Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cellergy Ltd filed Critical Cellergy Ltd
Priority to IL172146A priority Critical patent/IL172146A0/en
Publication of IL172146A0 publication Critical patent/IL172146A0/en
Priority to PCT/IL2006/001347 priority patent/WO2007060661A2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
IL172146A 2005-11-23 2005-11-23 Thermal barrier for surface mounting IL172146A0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IL172146A IL172146A0 (en) 2005-11-23 2005-11-23 Thermal barrier for surface mounting
PCT/IL2006/001347 WO2007060661A2 (en) 2005-11-23 2006-11-23 Method and devices for surface mounting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL172146A IL172146A0 (en) 2005-11-23 2005-11-23 Thermal barrier for surface mounting

Publications (1)

Publication Number Publication Date
IL172146A0 true IL172146A0 (en) 2006-04-10

Family

ID=38067628

Family Applications (1)

Application Number Title Priority Date Filing Date
IL172146A IL172146A0 (en) 2005-11-23 2005-11-23 Thermal barrier for surface mounting

Country Status (2)

Country Link
IL (1) IL172146A0 (en)
WO (1) WO2007060661A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10827626B2 (en) * 2016-11-08 2020-11-03 Flex Ltd Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3396894A (en) * 1965-05-11 1968-08-13 Raychem Corp Solder device
US3548265A (en) * 1968-06-11 1970-12-15 Gen Electric Porous anode capacitor
US3616533A (en) * 1969-10-28 1971-11-02 North American Rockwell Method of protecting articles in high temperature environment
US3624458A (en) * 1969-11-26 1971-11-30 Mallory & Co Inc P R Capacitor having a glass-to-metal seal and an elastomeric seal
US4581479A (en) * 1984-11-16 1986-04-08 Moore Theodore W Dimensionally precise electronic component mount
KR960015106B1 (en) * 1986-11-25 1996-10-28 가부시기가이샤 히다찌세이사꾸쇼 Surface package type semiconductor package
US6145280A (en) * 1998-03-18 2000-11-14 Ntk Powerdex, Inc. Flexible packaging for polymer electrolytic cell and method of forming same
AUPR194400A0 (en) * 2000-12-06 2001-01-04 Energy Storage Systems Pty Ltd An energy storage device

Also Published As

Publication number Publication date
WO2007060661A2 (en) 2007-05-31
WO2007060661A3 (en) 2009-04-09

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