DE3751687D1 - Verpackung für Halbleiterelemente - Google Patents
Verpackung für HalbleiterelementeInfo
- Publication number
- DE3751687D1 DE3751687D1 DE3751687T DE3751687T DE3751687D1 DE 3751687 D1 DE3751687 D1 DE 3751687D1 DE 3751687 T DE3751687 T DE 3751687T DE 3751687 T DE3751687 T DE 3751687T DE 3751687 D1 DE3751687 D1 DE 3751687D1
- Authority
- DE
- Germany
- Prior art keywords
- packaging
- semiconductor elements
- semiconductor
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D73/00—Packages comprising articles attached to cards, sheets or webs
- B65D73/02—Articles, e.g. small electrical components, attached to webs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D79/00—Kinds or details of packages, not otherwise provided for
- B65D79/02—Arrangements or devices for indicating incorrect storage or transport
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
- B65D81/26—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
- B65D81/266—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
- H01L23/49506—Lead-frames or other flat leads characterised by the die pad an insulative substrate being used as a diepad, e.g. ceramic, plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
- B32B2307/7246—Water vapor barrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/24—Aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2323/00—Polyalkenes
- B32B2323/04—Polyethylene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2327/00—Polyvinylhalogenides
- B32B2327/06—PVC, i.e. polyvinylchloride
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2439/00—Containers; Receptacles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/485—Material
- H01L2224/48505—Material at the bonding interface
- H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/485—Material
- H01L2224/48505—Material at the bonding interface
- H01L2224/48699—Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01007—Nitrogen [N]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01018—Argon [Ar]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20753—Diameter ranges larger or equal to 30 microns less than 40 microns
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S174/00—Electricity: conductors and insulators
- Y10S174/08—Shrinkable tubes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Food Science & Technology (AREA)
- Ceramic Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Packages (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61278610A JPS63138986A (ja) | 1986-11-25 | 1986-11-25 | 面実装型半導体パツケ−ジ包装体 |
JP62206290A JPS6458670A (en) | 1987-08-21 | 1987-08-21 | Moistureproof packaging bag of electronic part |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3751687D1 true DE3751687D1 (de) | 1996-03-07 |
DE3751687T2 DE3751687T2 (de) | 1996-08-14 |
Family
ID=26515558
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787310344T Expired - Lifetime DE3778499D1 (de) | 1986-11-25 | 1987-11-24 | Verpackung fuer halbleiterelemente. |
DE3750589T Expired - Fee Related DE3750589T2 (de) | 1986-11-25 | 1987-11-24 | Verpackung für Halbleiterelemente. |
DE3751687T Expired - Fee Related DE3751687T2 (de) | 1986-11-25 | 1987-11-24 | Verpackung für Halbleiterelemente |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787310344T Expired - Lifetime DE3778499D1 (de) | 1986-11-25 | 1987-11-24 | Verpackung fuer halbleiterelemente. |
DE3750589T Expired - Fee Related DE3750589T2 (de) | 1986-11-25 | 1987-11-24 | Verpackung für Halbleiterelemente. |
Country Status (5)
Country | Link |
---|---|
US (10) | US5095626A (de) |
EP (3) | EP0269410B1 (de) |
KR (2) | KR960015106B1 (de) |
DE (3) | DE3778499D1 (de) |
HK (3) | HK59394A (de) |
Families Citing this family (135)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2196601A (en) * | 1986-07-23 | 1988-05-05 | Motorola Inc | Method of packaging, material for use in packaging and package |
KR960015106B1 (ko) * | 1986-11-25 | 1996-10-28 | 가부시기가이샤 히다찌세이사꾸쇼 | 면실장형 반도체패키지 포장체 |
US4934524A (en) * | 1988-09-19 | 1990-06-19 | Brown & Williamson Tobacco Corporation | Package for storing moisture laden articles |
DE69018312T2 (de) * | 1989-05-23 | 1995-12-14 | Sasaki Chemicals Co Ltd | Feuchtigkeitssorbentmittelzusammenstellungen. |
MY106642A (en) * | 1989-10-23 | 1995-07-31 | Mitsubishi Gas Chemical Co | Inhibitor parcel and method for preserving electronic devices or electronic parts. |
US5304419A (en) * | 1990-07-06 | 1994-04-19 | Alpha Fry Ltd | Moisture and particle getter for enclosures |
US5064063A (en) * | 1990-08-08 | 1991-11-12 | International Business Machines Corporation | Tube assembly for pin grid array modules |
US5318181A (en) * | 1992-03-31 | 1994-06-07 | Motorola, Inc. | Compartmentalized humidity sensing indicator |
US5293996A (en) * | 1992-05-14 | 1994-03-15 | Motorola, Inc. | Container having an observation window |
EP0574161B1 (de) * | 1992-06-02 | 1998-08-05 | Mitsubishi Gas Chemical Company, Inc. | Verfahren zum Verbinden von Metallen durch Weichlöten |
US5287962A (en) * | 1992-08-24 | 1994-02-22 | Motorola, Inc. | Vacuum seal indicator for flexible packaging material |
US5322161A (en) * | 1992-11-30 | 1994-06-21 | United States Surgical Corporation | Clear package for bioabsorbable articles |
GB9301947D0 (en) * | 1993-02-01 | 1993-03-17 | Int Rectifier Co Ltd | Semi-conductor device tubes |
US5346518A (en) * | 1993-03-23 | 1994-09-13 | International Business Machines Corporation | Vapor drain system |
TW268913B (de) * | 1993-08-30 | 1996-01-21 | Mitsubishi Gas Chemical Co | |
US5441809A (en) * | 1993-10-28 | 1995-08-15 | Brady U.S.A., Inc. | Dissipative cover tape surface mount device packaging |
US5920984A (en) * | 1993-12-10 | 1999-07-13 | Ericsson Ge Mobile Communications Inc. | Method for the suppression of electromagnetic interference in an electronic system |
US5473814A (en) * | 1994-01-07 | 1995-12-12 | International Business Machines Corporation | Process for surface mounting flip chip carrier modules |
US5403973A (en) * | 1994-01-18 | 1995-04-04 | Santilli; Michael A. | Custom conformal heat sinking device for electronic circuit cards and methods of making the same |
TW353854B (en) * | 1994-03-14 | 1999-03-01 | Minnesota Mining & Mfg | Component tray with removable insert |
TW311267B (de) * | 1994-04-11 | 1997-07-21 | Raychem Ltd | |
JPH0846104A (ja) * | 1994-05-31 | 1996-02-16 | Motorola Inc | 表面実装電子素子およびその製造方法 |
US5551557A (en) * | 1994-10-25 | 1996-09-03 | Convey, Inc. | Efficient method and apparatus for establishing shelf-life of getters utilized within sealed enclosures |
US5651171A (en) * | 1995-02-22 | 1997-07-29 | Carbon & Polymer Research, Inc. | Method of making a shielded magnetic storage system |
US5590778A (en) * | 1995-06-06 | 1997-01-07 | Baxter International Inc. | Double-sterile package for medical apparatus and method of making |
US5670254A (en) * | 1995-09-29 | 1997-09-23 | Brady Precision Tape Co. | Cover tape for surface mount device packaging |
US5644899A (en) * | 1995-12-26 | 1997-07-08 | Motorola, Inc. | Method for packaging semiconductor components for shipment |
US6026963A (en) * | 1996-02-23 | 2000-02-22 | Memc Electronic Materials, Inc. | Moisture barrier bag having window |
SG79938A1 (en) * | 1996-04-16 | 2001-04-17 | Mitsubishi Gas Chemical Co | Noble metal-plated article, ornamental jewellery and methods for storage thereof |
JP3026549B2 (ja) * | 1996-05-02 | 2000-03-27 | ダイナボット株式会社 | クロマトグラフィ免疫分析装置の製造方法 |
US5709065A (en) * | 1996-07-31 | 1998-01-20 | Empak, Inc. | Desiccant substrate package |
FR2752661B1 (fr) * | 1996-08-23 | 1998-10-30 | Giat Ind Sa | Procede de fabrication d'un dispositif de dissipation de l'energie thermique produite par des composants electroniques implantes sur une carte a circuits imprimes, et dispositif ainsi obtenu |
US5875892A (en) * | 1997-01-10 | 1999-03-02 | Humidial Corporation | Packaging container with humidity indicator |
US6560839B1 (en) | 1997-04-28 | 2003-05-13 | Integrated Device Technology, Inc. | Method for using a moisture-protective container |
DE19734418A1 (de) * | 1997-08-08 | 1999-02-11 | Adolf Wuerth Gmbh & Co Kg | Behälter für Montageschaum |
JPH1167809A (ja) * | 1997-08-26 | 1999-03-09 | Sanyo Electric Co Ltd | 半導体装置 |
JP3037229B2 (ja) * | 1997-10-23 | 2000-04-24 | 新潟日本電気株式会社 | ベアチップ実装方法及び実装装置 |
JPH11322125A (ja) * | 1998-03-10 | 1999-11-24 | Fuji Photo Film Co Ltd | 補正データ表示カード、記録紙パッケージ、記録紙残量表示装置、及び感熱プリンタ |
US6353326B2 (en) | 1998-08-28 | 2002-03-05 | Micron Technology, Inc. | Test carrier with molded interconnect for testing semiconductor components |
JP3046010B2 (ja) * | 1998-11-12 | 2000-05-29 | 沖電気工業株式会社 | 収納容器および収納方法 |
US6536370B2 (en) * | 1998-11-25 | 2003-03-25 | Advanced Micro Devices, Inc. | Elapsed time indicator for controlled environments and method of use |
FR2787093B1 (fr) * | 1998-12-15 | 2001-07-06 | Robert Gilles Kelifa | Dispositif regulateur d'humidite relative |
US6531197B2 (en) | 1999-04-26 | 2003-03-11 | Illinois Tool Works | Desiccant barrier container |
US6933059B1 (en) | 1999-05-07 | 2005-08-23 | Scc Products, Inc. | Electrostatic shielding, low charging-retaining moisture barrier film |
GB2350347B (en) * | 1999-05-24 | 2001-11-14 | Mohammed Iftkhar | Bag for mitigating damage of items following contamination by smoke or water |
SE9902207L (sv) * | 1999-06-11 | 2000-12-12 | Sca Hygiene Prod Ab | Användning av fukttät förpackning för absorberande alster innehållande fuktkänsliga tillsatser |
US7446030B2 (en) * | 1999-08-27 | 2008-11-04 | Shocking Technologies, Inc. | Methods for fabricating current-carrying structures using voltage switchable dielectric materials |
AU6531600A (en) * | 1999-08-27 | 2001-03-26 | Lex Kosowsky | Current carrying structure using voltage switchable dielectric material |
US20100044079A1 (en) * | 1999-08-27 | 2010-02-25 | Lex Kosowsky | Metal Deposition |
US7695644B2 (en) * | 1999-08-27 | 2010-04-13 | Shocking Technologies, Inc. | Device applications for voltage switchable dielectric material having high aspect ratio particles |
US7825491B2 (en) * | 2005-11-22 | 2010-11-02 | Shocking Technologies, Inc. | Light-emitting device using voltage switchable dielectric material |
US20080035370A1 (en) * | 1999-08-27 | 2008-02-14 | Lex Kosowsky | Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material |
US20100044080A1 (en) * | 1999-08-27 | 2010-02-25 | Lex Kosowsky | Metal Deposition |
US20020185409A1 (en) * | 2000-04-05 | 2002-12-12 | Morrow Anthony B. | Desiccant containing product carrier |
KR20010111798A (ko) * | 2000-06-13 | 2001-12-20 | 마이클 디. 오브라이언 | 습도지시계를 구비한 건조제 |
US6573200B2 (en) * | 2001-01-18 | 2003-06-03 | Advanced Micro Devices, Inc. | Automatic printing of caution labels for moisture-sensitive devices |
US7389877B2 (en) * | 2000-08-28 | 2008-06-24 | Sud-Chemie Inc. | Apparatus for packaging electronic components including a reel entrained with desiccating material |
US6827218B1 (en) | 2000-08-28 | 2004-12-07 | Sud-Chemie Inc. | Packaging container for electronic components |
SG92784A1 (en) * | 2001-03-14 | 2002-11-19 | Micron Technology Inc | Underfill applications using film technology |
US6514797B2 (en) | 2001-03-15 | 2003-02-04 | Micron Technology, Inc. | Underfill applications using film technology |
US6564742B2 (en) * | 2001-08-03 | 2003-05-20 | Hewlett-Packard Development Company, Llp | Over-temperature warning device |
JP2005508815A (ja) * | 2001-10-19 | 2005-04-07 | インフィネオン テクノロジーズ アクチエンゲゼルシャフト | 袋 |
KR20050044503A (ko) * | 2001-11-17 | 2005-05-12 | 아벤티스 파마 리미티드 | 흡착제 및 이의 용도 |
JP2003163459A (ja) * | 2001-11-26 | 2003-06-06 | Sony Corp | 高周波回路ブロック体及びその製造方法、高周波モジュール装置及びその製造方法。 |
WO2003070812A1 (fr) * | 2002-02-20 | 2003-08-28 | Denki Kagaku Kogyo Kabushiki Kaisha | Procede de prevention d'electricite statique et son procede d'utilisation |
US7097900B2 (en) * | 2002-06-14 | 2006-08-29 | Denki Kagaku Kogyo Kabushiki Kaisha | Sheet and electronic component packaging container |
US7025205B2 (en) * | 2002-06-26 | 2006-04-11 | Aventis Pharma Limited | Method and packaging for pressurized containers |
US6861289B2 (en) * | 2002-07-25 | 2005-03-01 | Delphi Technologies, Inc. | Moisture-sensitive device protection system |
JP4064203B2 (ja) * | 2002-10-18 | 2008-03-19 | 川崎マイクロエレクトロニクス株式会社 | 半導体装置梱包方法 |
DE10253567A1 (de) * | 2002-11-15 | 2004-05-27 | Linpac Plastics Gmbh | Lagerungsmittel, insbesondere Schale |
US20040178514A1 (en) * | 2003-03-12 | 2004-09-16 | Lee Sang-Hyeop | Method of encapsulating semiconductor devices on a printed circuit board, and a printed circuit board for use in the method |
US7533514B2 (en) * | 2003-04-25 | 2009-05-19 | Boston Scientific Scimed, Inc. | Method and apparatus for automated handling of medical devices during manufacture |
JP2005191342A (ja) * | 2003-12-26 | 2005-07-14 | Renesas Technology Corp | 半導体装置およびその製造方法 |
US7265995B2 (en) * | 2003-12-29 | 2007-09-04 | Intel Corporation | Array capacitors with voids to enable a full-grid socket |
US8642682B2 (en) * | 2004-04-30 | 2014-02-04 | Kureha Corporation | Resin composition for encapsulation and semiconductor unit encapsulated with resin |
JP2005239236A (ja) * | 2004-02-27 | 2005-09-08 | Renesas Technology Corp | 半導体装置の製造方法およびそれに用いられる包装体 |
US7067332B1 (en) * | 2004-03-16 | 2006-06-27 | Altera Corporation | Method for die removal from plastic packages |
WO2005123516A2 (en) * | 2004-06-14 | 2005-12-29 | Sports Media, Inc. | Container and method of making a container |
WO2006018671A1 (en) * | 2004-08-19 | 2006-02-23 | Infineon Technologies Ag | Mixed wire semiconductor lead frame package |
DE102004041598A1 (de) * | 2004-08-26 | 2006-03-16 | Infineon Technologies Ag | Verfahren und Vorrichtung zur Reduzierung der Krümmung von Halbleiteranordnungen |
US8698262B2 (en) * | 2004-09-14 | 2014-04-15 | Semiconductor Energy Laboratory Co., Ltd. | Wireless chip and manufacturing method of the same |
KR20060030356A (ko) * | 2004-10-05 | 2006-04-10 | 삼성테크윈 주식회사 | 반도체 리이드 프레임과, 이를 포함하는 반도체 패키지와,이를 도금하는 방법 |
US20080113135A1 (en) * | 2004-11-01 | 2008-05-15 | Asahi Kasei Chemicals Corporation | Easy Opening Bag |
US20060109602A1 (en) * | 2004-11-24 | 2006-05-25 | Vermillion Robert J | Electrostatic shielding packaging composition and methods for producing and using the same |
JP2006158712A (ja) * | 2004-12-08 | 2006-06-22 | Seiko Instruments Inc | 心拍計測装置 |
ITMI20042478A1 (it) * | 2004-12-23 | 2005-03-23 | Levosil S P A | Dispositivi disidratanti antistatici |
WO2007062122A2 (en) | 2005-11-22 | 2007-05-31 | Shocking Technologies, Inc. | Semiconductor devices including voltage switchable materials for over-voltage protection |
US20100264225A1 (en) * | 2005-11-22 | 2010-10-21 | Lex Kosowsky | Wireless communication device using voltage switchable dielectric material |
IL172146A0 (en) * | 2005-11-23 | 2006-04-10 | Cellergy Ltd | Thermal barrier for surface mounting |
FR2896235B1 (fr) * | 2006-01-18 | 2010-04-23 | Airsec | Conteneur deshydratant comportant un indicateur de l'etat d'humidite |
US20070210171A1 (en) * | 2006-03-07 | 2007-09-13 | Aaron Spitz | Privacy sack for purchasing items and system therefor |
DE102006020619B4 (de) * | 2006-05-02 | 2012-11-15 | Fritz Egger Gmbh & Co. | Paneelverpackung mit Indikator |
US7968014B2 (en) * | 2006-07-29 | 2011-06-28 | Shocking Technologies, Inc. | Device applications for voltage switchable dielectric material having high aspect ratio particles |
US20080032049A1 (en) * | 2006-07-29 | 2008-02-07 | Lex Kosowsky | Voltage switchable dielectric material having high aspect ratio particles |
US20080029405A1 (en) * | 2006-07-29 | 2008-02-07 | Lex Kosowsky | Voltage switchable dielectric material having conductive or semi-conductive organic material |
ATE529341T1 (de) * | 2006-08-25 | 2011-11-15 | Interprise Brussels S A | Verpackung mit einem element zur gesteuerten änderung des gasgehalts in der verpackung |
KR20090055017A (ko) * | 2006-09-24 | 2009-06-01 | 쇼킹 테크놀로지스 인코포레이티드 | 스탭 전압 응답을 가진 전압 가변 유전 재료를 위한 조성물및 그 제조 방법 |
US20120119168A9 (en) * | 2006-11-21 | 2012-05-17 | Robert Fleming | Voltage switchable dielectric materials with low band gap polymer binder or composite |
JP2008167853A (ja) * | 2007-01-10 | 2008-07-24 | Fujifilm Corp | 試験シート、物体診断装置および方法並びにプログラム |
US7793236B2 (en) * | 2007-06-13 | 2010-09-07 | Shocking Technologies, Inc. | System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices |
US20090145802A1 (en) * | 2007-12-11 | 2009-06-11 | Apple Inc. | Storage system for components incorporating a liquid-metal thermal interface |
US8206614B2 (en) * | 2008-01-18 | 2012-06-26 | Shocking Technologies, Inc. | Voltage switchable dielectric material having bonded particle constituents |
JP4466756B2 (ja) * | 2008-04-02 | 2010-05-26 | 住友電気工業株式会社 | 化合物半導体基板の包装方法 |
US8203421B2 (en) * | 2008-04-14 | 2012-06-19 | Shocking Technologies, Inc. | Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration |
US20100047535A1 (en) * | 2008-08-22 | 2010-02-25 | Lex Kosowsky | Core layer structure having voltage switchable dielectric material |
WO2010033635A1 (en) * | 2008-09-17 | 2010-03-25 | Shocking Technologies, Inc. | Voltage switchable dielectric material containing boron compound |
US9208931B2 (en) * | 2008-09-30 | 2015-12-08 | Littelfuse, Inc. | Voltage switchable dielectric material containing conductor-on-conductor core shelled particles |
WO2010039902A2 (en) * | 2008-09-30 | 2010-04-08 | Shocking Technologies, Inc. | Voltage switchable dielectric material containing conductive core shelled particles |
US8362871B2 (en) * | 2008-11-05 | 2013-01-29 | Shocking Technologies, Inc. | Geometric and electric field considerations for including transient protective material in substrate devices |
US8434614B2 (en) * | 2008-12-01 | 2013-05-07 | Senju Metal Industry Co., Ltd. | Storing package unit and a storing method for micro solder spheres |
US8399773B2 (en) | 2009-01-27 | 2013-03-19 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
US9226391B2 (en) | 2009-01-27 | 2015-12-29 | Littelfuse, Inc. | Substrates having voltage switchable dielectric materials |
US8272123B2 (en) | 2009-01-27 | 2012-09-25 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
EP2417631B1 (de) * | 2009-03-23 | 2013-07-17 | Dow Global Technologies LLC | Optoelektronische anordnung |
US8968606B2 (en) | 2009-03-26 | 2015-03-03 | Littelfuse, Inc. | Components having voltage switchable dielectric materials |
US9053844B2 (en) * | 2009-09-09 | 2015-06-09 | Littelfuse, Inc. | Geometric configuration or alignment of protective material in a gap structure for electrical devices |
US20110139650A1 (en) * | 2009-12-15 | 2011-06-16 | Amcor Flexibles, Inc. | Sterilizable Package Having Breathable Membrane for the Packaging of Medical Devices |
US20110198544A1 (en) * | 2010-02-18 | 2011-08-18 | Lex Kosowsky | EMI Voltage Switchable Dielectric Materials Having Nanophase Materials |
US9224728B2 (en) * | 2010-02-26 | 2015-12-29 | Littelfuse, Inc. | Embedded protection against spurious electrical events |
US9082622B2 (en) | 2010-02-26 | 2015-07-14 | Littelfuse, Inc. | Circuit elements comprising ferroic materials |
US9320135B2 (en) * | 2010-02-26 | 2016-04-19 | Littelfuse, Inc. | Electric discharge protection for surface mounted and embedded components |
DE102010019448A1 (de) | 2010-05-05 | 2011-11-10 | Peter Roider | Rückverfolgungsverfahren sowie Rückverfolgungssystem für die Herstellung von Halbleiterprodukten |
US20120061261A1 (en) * | 2010-09-15 | 2012-03-15 | Tsang-Hung Hsu | Regeneratable dehumidifying bag having doubly-protected humidity indicator |
CN103153803B (zh) * | 2010-09-21 | 2015-11-25 | 艾利丹尼森公司 | 具有配套监控装置的可再封闭真空储物袋及其使用方法 |
KR101383207B1 (ko) * | 2011-05-02 | 2014-04-10 | 엘지디스플레이 주식회사 | 디스플레이 장치 |
US8925290B2 (en) | 2011-09-08 | 2015-01-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mask storage device for mask haze prevention and methods thereof |
TWI479627B (zh) | 2011-12-14 | 2015-04-01 | Novatek Microelectronics Corp | 導線架封裝結構 |
DK3105521T3 (da) | 2014-01-23 | 2020-04-06 | Stasis Lmps Ltd | Fleksibelt panel og forseglelig pose med sorptionsmiddel |
US20160137396A1 (en) * | 2014-11-13 | 2016-05-19 | Avery Dennison Retail Information Services, Llc | Commercial transportation garment bag and methods |
US10699934B2 (en) | 2015-10-01 | 2020-06-30 | Infineon Technologies Ag | Substrate carrier, a processing arrangement and a method |
US9917000B2 (en) * | 2015-10-01 | 2018-03-13 | Infineon Technologies Ag | Wafer carrier, method for manufacturing the same and method for carrying a wafer |
KR102671467B1 (ko) * | 2016-09-28 | 2024-06-03 | 삼성전자주식회사 | 반도체 패키지를 포함하는 반도체 모듈 및 반도체 패키지 |
US20210043466A1 (en) * | 2019-08-06 | 2021-02-11 | Texas Instruments Incorporated | Universal semiconductor package molds |
CN113071738B (zh) * | 2021-04-06 | 2022-11-29 | 迅得机械(东莞)有限公司 | 一种硬板产品辅材的全自动包装设备 |
CN113800098A (zh) * | 2021-09-16 | 2021-12-17 | 广东电网有限责任公司 | 一种运输设备 |
Family Cites Families (110)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US598838A (en) * | 1898-02-08 | William b | ||
US2251609A (en) * | 1936-07-18 | 1941-08-05 | Allen Bradley Co | Packaging means for small resistor units |
US2283867A (en) * | 1939-12-19 | 1942-05-19 | Stokes Machine Co | Packaging and preserving dried biologicals, pharmaceuticals, and the like |
US2446361A (en) * | 1945-07-09 | 1948-08-03 | Herbert B Clibbon | Moisture vapor indicator for packaged goods |
US2674509A (en) * | 1949-04-15 | 1954-04-06 | Fulton Bag & Cotton Mills | Means for protecting food commodities |
US2611481A (en) * | 1950-06-09 | 1952-09-23 | James A Sargeant | Inspection means for sealed packages |
DE894074C (de) * | 1951-03-31 | 1953-10-22 | Chem Fab Dr Fritz Voigt | Verpackung fuer Elektroden |
US2814382A (en) * | 1955-09-21 | 1957-11-26 | Frederic H Lassiter | Cellophane packaging and method |
FR1140952A (fr) * | 1956-01-04 | 1957-08-22 | Emballage protecteur contre l'humidité | |
US3041796A (en) | 1960-01-26 | 1962-07-03 | Roy J Walters | Waffle back abrasive disc |
US3042796A (en) * | 1960-06-29 | 1962-07-03 | Forest Taber De | Flashlight assembly for underwater use |
US3286430A (en) * | 1963-02-11 | 1966-11-22 | Joseph J Esty | Method of sealing and packaging |
US3301468A (en) * | 1964-12-11 | 1967-01-31 | Philip Morris Inc | Package for tobacco products |
US3399763A (en) | 1966-05-04 | 1968-09-03 | Developak Inc | Blister pack and method of forming the same |
US3572499A (en) * | 1967-01-19 | 1971-03-30 | Custom Materials Inc | Conductive packaging material and container for explosives |
US3399762A (en) * | 1967-05-31 | 1968-09-03 | Finch Pruyn & Company Inc | Typewriter paper carton with lift strip |
US3405796A (en) * | 1967-06-29 | 1968-10-15 | Belco Engineering Inc | Packaged newspaper |
US3454154A (en) * | 1968-05-07 | 1969-07-08 | Us Air Force | Integrated circuit carrier |
US3625931A (en) * | 1969-05-06 | 1971-12-07 | Masatomo Ito | Antistatic thermoplastic resin |
US3660799A (en) * | 1969-06-17 | 1972-05-02 | Honeywell Inf Systems | Connector device |
US3673758A (en) * | 1970-12-21 | 1972-07-04 | Joseph J Esty | Method of packaging and preserving perishable products |
US3704806A (en) * | 1971-01-06 | 1972-12-05 | Le T Im Lensoveta | Dehumidifying composition and a method for preparing the same |
US4091165A (en) * | 1971-07-01 | 1978-05-23 | Mitsubishi Petrochemical Co., Ltd. | Surface processing copolymer for synthetic papers |
JPS5144143B2 (de) * | 1972-06-27 | 1976-11-26 | ||
US4026008A (en) * | 1972-10-02 | 1977-05-31 | Signetics Corporation | Semiconductor lead structure and assembly and method for fabricating same |
US3909504A (en) * | 1973-11-05 | 1975-09-30 | Carrier Tel Corp America Inc | Ruggedized package for electronic components and the like |
US4011798A (en) * | 1973-11-29 | 1977-03-15 | Packaging Industries, Inc. | Method of making shipping bag |
US4084241A (en) * | 1974-10-19 | 1978-04-11 | Toshihiro Tsumura | System for processing movement information of vehicle |
US3959526A (en) * | 1974-12-20 | 1976-05-25 | E. I. Du Pont De Nemours And Company | Process for preparing high barrier, heat-sealable packaging film |
FR2326347A1 (fr) * | 1975-10-03 | 1977-04-29 | Scholle Corp | Materiau d'emballage a impermeabilite aux gaz amelioree |
JPS5254583A (en) * | 1975-10-29 | 1977-05-04 | Hitachi Ltd | Method of encasing electronic parts in magazine |
US4049121A (en) * | 1976-07-14 | 1977-09-20 | Baxter Travenol Laboratories, Inc. | Moisture detection system for a sterile package |
JPS5644080Y2 (de) * | 1976-07-16 | 1981-10-15 | ||
DE2636421A1 (de) * | 1976-08-13 | 1978-02-16 | Basf Ag | Elektrisch leitfaehige perylenderivate |
US4154344A (en) * | 1976-11-09 | 1979-05-15 | Minnesota Mining And Manufacturing Company | Material for forming envelopes used to protect electronic components |
US4206844A (en) * | 1977-01-04 | 1980-06-10 | Toppan Printing Co., Ltd. | Package for a sterilized material |
NL7705365A (nl) * | 1977-05-16 | 1978-11-20 | Philips Nv | Elektrische lamp. |
US4121956A (en) * | 1977-07-15 | 1978-10-24 | E. I. Du Pont De Nemours And Company | Method for labelling a package |
US4203127A (en) * | 1977-07-18 | 1980-05-13 | Motorola, Inc. | Package and method of packaging semiconductor wafers |
US4208696A (en) * | 1977-09-06 | 1980-06-17 | Minnesota Mining And Manufacturing Company | Electrically conductive web |
DE2821182A1 (de) * | 1978-05-13 | 1979-11-15 | Willi Doering | Verpackungsbeutel fuer elektronik- leiterplatten |
US4160503A (en) * | 1978-08-07 | 1979-07-10 | Ohlbach Ralph C | Shipping container for printed circuit boards and other items |
JPS5536238A (en) * | 1978-09-06 | 1980-03-13 | Kureha Chem Ind Co Ltd | Antistatic resin composition |
US4223368A (en) * | 1978-09-14 | 1980-09-16 | Dattilo Donald P | Electrostatic discharge protection device |
US4164503A (en) * | 1978-10-10 | 1979-08-14 | Research Corporation | Quinonoid intermediates from chloroprene |
JPS6040480B2 (ja) * | 1978-11-16 | 1985-09-11 | 株式会社エンパイア−化学研究所 | 革靴類のクリ−ニング方法 |
DE3004325A1 (de) * | 1979-02-08 | 1980-08-14 | Mitsubishi Gas Chemical Co | Sauerstoffabsorptionsmittel enthaltender beutel und damit versehener behaelterverschluss |
US4293070A (en) * | 1979-03-30 | 1981-10-06 | Ohlbach Ralph C | For protecting printed circuit boards and other items against the ravages of a discharge of static electricity |
JPS5848425B2 (ja) * | 1980-04-10 | 1983-10-28 | 富士通株式会社 | 電子部品の包装方法 |
US4327832A (en) * | 1980-06-26 | 1982-05-04 | Thielex Plastics Corporation | Container for packaging semiconductor components |
JPS57149770A (en) * | 1981-03-11 | 1982-09-16 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
US4528222A (en) * | 1981-04-24 | 1985-07-09 | Pervel Industries, Inc. | Conductively printed flexible sheet material |
US4407872A (en) * | 1981-06-02 | 1983-10-04 | Ricoh Co. Ltd. | Sheet material and envelope for packaging electronic parts |
US4478858A (en) * | 1982-02-08 | 1984-10-23 | The Procter & Gamble Company | Instant coffee containing packet and method of forming |
US4681218A (en) * | 1982-03-15 | 1987-07-21 | Becton, Dickinson And Company | Moisture-controlled glass microscope slide package |
US4496406A (en) * | 1982-09-30 | 1985-01-29 | General Dynamics, Pomona Division | Method of making a conductive resealable pouch |
US4471872A (en) * | 1982-09-30 | 1984-09-18 | General Dynamics, Pomona Division | Conductive resealable pouch |
US4424900A (en) * | 1982-11-08 | 1984-01-10 | Petcavich Robert J | Anti-static packages and packaging material |
US4494406A (en) * | 1982-12-23 | 1985-01-22 | Ebtron, Inc. | Means for measuring large area mass flow |
EP0242567B1 (de) * | 1983-06-15 | 1989-10-18 | Mitsubishi Jukogyo Kabushiki Kaisha | Vorrichtung zum Füllen von Beuteln |
US4480747A (en) * | 1983-06-30 | 1984-11-06 | Motorola, Inc. | Static shielded shipping container |
EP0130489B1 (de) | 1983-06-30 | 1990-09-19 | Siemens Aktiengesellschaft | Rohrförmiger Behälter zur Aufnahme von Halbleiterbauelementen |
JPS6036105A (ja) * | 1983-08-08 | 1985-02-25 | 積水化学工業株式会社 | 硬質木片セメント板に略v字溝を形成する方法 |
JPS6036165A (ja) * | 1983-08-09 | 1985-02-25 | Nec Corp | 半導体装置の捺印方法 |
NZ209507A (en) * | 1983-10-06 | 1986-07-11 | Canadian Ind | Thermoplastic valve bag:perforated outer wall with mesh inner liner |
US4529087A (en) * | 1983-10-21 | 1985-07-16 | Maine Poly, Inc. | Printed antistatic plastic bag |
GB2149220A (en) * | 1983-10-21 | 1985-06-05 | Sinclair Res Ltd | Protection of electronic circuit components from static electricity |
GB8405607D0 (en) * | 1984-03-02 | 1984-04-04 | Camvac Holdings Ltd | Plastics film laminate |
US4522302A (en) * | 1984-03-05 | 1985-06-11 | Sterling Drug Inc. | Pre-sterilized medical procedure kit packages |
JPS60208846A (ja) | 1984-04-02 | 1985-10-21 | Oki Electric Ind Co Ltd | 耐熱プラスチツクic |
JPS60208847A (ja) | 1984-04-02 | 1985-10-21 | Oki Electric Ind Co Ltd | 表面実装型icに内在する水分の排出方法 |
JPS60226145A (ja) | 1984-04-25 | 1985-11-11 | Hitachi Ltd | 半導体装置の実装方法 |
US4565228A (en) * | 1984-05-16 | 1986-01-21 | Ponce Felix C | Strike template for a portable router |
JPS6133444A (ja) | 1984-07-20 | 1986-02-17 | Toshiba Corp | 記録用紙台 |
JPS6144897U (ja) * | 1984-08-27 | 1986-03-25 | 藤森工業株式会社 | Ic用チユ−ブ |
JPS61178877A (ja) * | 1985-01-23 | 1986-08-11 | 株式会社日立製作所 | 樹脂封止型半導体装置の輸送・保管方法 |
JPS61184854A (ja) | 1985-02-13 | 1986-08-18 | Oki Electric Ind Co Ltd | 樹脂封止形半導体装置 |
JPS61184856A (ja) | 1985-02-13 | 1986-08-18 | Oki Electric Ind Co Ltd | 樹脂封止形半導体装置 |
US4875581A (en) * | 1985-03-19 | 1989-10-24 | Robert B. Ray | Static dissipative elastomeric coating for electronic packaging components |
JPS61249341A (ja) * | 1985-04-27 | 1986-11-06 | Showa Denko Kk | 脱水用具 |
JPH0356548Y2 (de) * | 1985-05-08 | 1991-12-19 | ||
US4648508A (en) * | 1985-06-19 | 1987-03-10 | Robert A. Neal | Flexible envelope for electronic component packaging |
JPS6213457A (ja) * | 1985-07-10 | 1987-01-22 | Kohjin Co Ltd | 熱可塑性樹脂組成物の製造方法 |
DE3524846A1 (de) * | 1985-07-12 | 1987-01-15 | Hoechst Ag | Verpackung fuer trockenresistmaterial |
JPS6218548A (ja) * | 1985-07-17 | 1987-01-27 | Fuji Photo Film Co Ltd | 写真感光材料用包装材料 |
US4684020A (en) * | 1985-09-20 | 1987-08-04 | Conductive Container, Inc. | Conductive container |
US4790433A (en) * | 1985-10-04 | 1988-12-13 | The Crowell Corporation | Packaging combination |
US4756414A (en) * | 1985-10-09 | 1988-07-12 | The Dow Chemical Company | Antistatic sheet material and package |
US4906494A (en) * | 1985-10-09 | 1990-03-06 | The Dow Chemical Company | Antistatic sheet material, package and method of making |
US4658958A (en) * | 1985-10-30 | 1987-04-21 | Robert A. Neal | Transparent article |
GB8527050D0 (en) * | 1985-11-02 | 1985-12-04 | Fgl Products Ltd | Vacuum packing process |
US4661376A (en) * | 1985-12-27 | 1987-04-28 | Liang Paul M | Method of producing electrically conductive fibers |
US4721207A (en) * | 1986-04-28 | 1988-01-26 | Tensho Electric Industrial Co., Ltd. | Hard disk container |
US4823538A (en) * | 1986-05-30 | 1989-04-25 | Fuji Pack System Ltd. | Bagging machine |
US4699830A (en) * | 1986-06-30 | 1987-10-13 | Baxter Travenol Laboratories, Inc. | Laminated sheet material for packaging electronic components |
US4695926A (en) * | 1986-07-01 | 1987-09-22 | Bell Of Pennsylvania | Encapsulation and insulation of electronic circuit board structures |
US4757964A (en) * | 1986-07-17 | 1988-07-19 | Hughes Aircraft Company | Method for controlling the attitude of a spinning body in orbit |
GB2196601A (en) * | 1986-07-23 | 1988-05-05 | Motorola Inc | Method of packaging, material for use in packaging and package |
US4756964A (en) * | 1986-09-29 | 1988-07-12 | The Dow Chemical Company | Barrier films having an amorphous carbon coating and methods of making |
US4800115A (en) * | 1986-10-14 | 1989-01-24 | W. R. Grace & Co. | Agent for imparting antistatic characteristics to a thermoplastic polymer and a thermoplastic polymer composition containing the agent |
KR960015106B1 (ko) * | 1986-11-25 | 1996-10-28 | 가부시기가이샤 히다찌세이사꾸쇼 | 면실장형 반도체패키지 포장체 |
US4804852A (en) * | 1987-01-29 | 1989-02-14 | Eaton Corporation | Treating work pieces with electro-magnetically scanned ion beams |
US4804582A (en) * | 1987-06-01 | 1989-02-14 | The Dow Chemical Company | Static dissipative thermoplastic laminate film |
US4919955A (en) * | 1987-09-08 | 1990-04-24 | Mitchell Jerry L | Method for packaging perishable products |
US4804580A (en) | 1988-07-07 | 1989-02-14 | International Fuel Cells Corporation | Catalytic reformer housing insulation and method of making same |
US4949529A (en) * | 1988-09-07 | 1990-08-21 | Paramount Packaging Corporation | Vacuum package with smooth surface and method of making same |
JPH0317238A (ja) * | 1989-06-14 | 1991-01-25 | Shigeaki Sugino | Cu―Al―Mn系形状記憶合金、および、その製造方法 |
US5287962A (en) * | 1992-08-24 | 1994-02-22 | Motorola, Inc. | Vacuum seal indicator for flexible packaging material |
US5644899A (en) * | 1995-12-26 | 1997-07-08 | Motorola, Inc. | Method for packaging semiconductor components for shipment |
US5988308A (en) * | 1996-09-06 | 1999-11-23 | Freightliner Corporation | Flexible articulated coupling that minimizes leakage |
-
1987
- 1987-11-23 KR KR1019870013166A patent/KR960015106B1/ko not_active IP Right Cessation
- 1987-11-24 EP EP87310344A patent/EP0269410B1/de not_active Expired - Lifetime
- 1987-11-24 DE DE8787310344T patent/DE3778499D1/de not_active Expired - Lifetime
- 1987-11-24 EP EP92110466A patent/EP0512579B1/de not_active Expired - Lifetime
- 1987-11-24 EP EP91202052A patent/EP0458423B1/de not_active Expired - Lifetime
- 1987-11-24 DE DE3750589T patent/DE3750589T2/de not_active Expired - Fee Related
- 1987-11-24 DE DE3751687T patent/DE3751687T2/de not_active Expired - Fee Related
-
1989
- 1989-08-10 US US07/392,029 patent/US5095626A/en not_active Expired - Lifetime
- 1989-08-10 US US07/393,120 patent/US4971196A/en not_active Expired - Lifetime
-
1992
- 1992-07-15 KR KR1019920012563A patent/KR970007120B1/ko not_active IP Right Cessation
-
1994
- 1994-06-23 US US08/264,745 patent/US5607059A/en not_active Expired - Fee Related
- 1994-06-23 HK HK59394A patent/HK59394A/xx not_active IP Right Cessation
-
1996
- 1996-02-15 HK HK28496A patent/HK28496A/xx not_active IP Right Cessation
- 1996-09-13 US US08/712,559 patent/US5803246A/en not_active Expired - Fee Related
- 1996-12-12 HK HK214096A patent/HK214096A/xx not_active IP Right Cessation
-
1998
- 1998-06-10 US US09/094,490 patent/US5988368A/en not_active Expired - Fee Related
-
1999
- 1999-08-31 US US09/387,049 patent/US6223893B1/en not_active Expired - Fee Related
-
2001
- 2001-04-30 US US09/843,937 patent/US6443298B2/en not_active Expired - Fee Related
-
2002
- 2002-07-30 US US10/207,052 patent/US6981585B2/en not_active Expired - Fee Related
- 2002-07-30 US US10/207,086 patent/US20030057113A1/en not_active Abandoned
- 2002-07-30 US US10/207,059 patent/US20020174627A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP0458423A2 (de) | 1991-11-27 |
US6443298B2 (en) | 2002-09-03 |
US6223893B1 (en) | 2001-05-01 |
EP0458423B1 (de) | 1994-09-21 |
HK59394A (en) | 1994-07-08 |
EP0269410B1 (de) | 1992-04-22 |
US6981585B2 (en) | 2006-01-03 |
US20020174627A1 (en) | 2002-11-28 |
US5803246A (en) | 1998-09-08 |
HK28496A (en) | 1996-02-23 |
DE3750589D1 (de) | 1994-10-27 |
EP0269410A2 (de) | 1988-06-01 |
HK214096A (en) | 1996-12-13 |
EP0269410A3 (en) | 1989-02-08 |
DE3750589T2 (de) | 1995-01-19 |
EP0458423A3 (de) | 1991-12-11 |
KR960015106B1 (ko) | 1996-10-28 |
US20010015327A1 (en) | 2001-08-23 |
DE3751687T2 (de) | 1996-08-14 |
US5988368A (en) | 1999-11-23 |
US4971196A (en) | 1990-11-20 |
KR970007120B1 (ko) | 1997-05-02 |
US5095626A (en) | 1992-03-17 |
US5607059A (en) | 1997-03-04 |
US20020179460A1 (en) | 2002-12-05 |
KR890004429A (ko) | 1989-04-22 |
KR930005175A (ko) | 1993-03-23 |
EP0512579B1 (de) | 1996-01-24 |
EP0512579A1 (de) | 1992-11-11 |
DE3778499D1 (de) | 1992-05-27 |
US20030057113A1 (en) | 2003-03-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3751687D1 (de) | Verpackung für Halbleiterelemente | |
KR860002903A (ko) | 프로그램가능한 반도체 구조 | |
DE3650613D1 (de) | Halbleiteranordnung | |
KR880701462A (ko) | 반전 칩 캐리어 | |
NO175484C (no) | Silisiumkarbid - slipemiddel | |
KR850006779A (ko) | 반도체 장치 | |
DE3684184D1 (de) | Verkapselte halbleiteranordnung. | |
DE3752234D1 (de) | Transfersystem für Halbleiterscheibe | |
KR870010545A (ko) | 반도체 기억 장치 | |
KR860004470A (ko) | 반도체 장치 | |
KR870018356U (ko) | 테이프분배용 패키지 | |
KR880701017A (ko) | 반도체 장치 | |
DK172784D0 (da) | Engangsemballage | |
KR870008317A (ko) | 반도체 기억장치 | |
DE68926211D1 (de) | Träger für eine Halbleiteranordnung | |
DE3787763D1 (de) | Zusammengesetzte Halbleiteranordnung. | |
KR900014991U (ko) | 반도체 패키지(package) | |
DE3856168D1 (de) | Halbleiterchippackung | |
KR880701456A (ko) | 반도체 소자 | |
DE3784777D1 (de) | Halbleiteranordnung. | |
KR860005452A (ko) | 반도체장치 | |
KR860005449A (ko) | 반도체장치 | |
DE3885363D1 (de) | Packungsstruktur für Halbleiteranordnung. | |
KR880001342U (ko) | 집적회로용 패키지 | |
KR880003791U (ko) | 반도체장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |