KR870006649A - 와이어본딩방법 및 그 와이어본딩장치 그리고, 그 와이어본딩 장치를 사용한 반도체장치의 제조방법 - Google Patents

와이어본딩방법 및 그 와이어본딩장치 그리고, 그 와이어본딩 장치를 사용한 반도체장치의 제조방법 Download PDF

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KR870006649A
KR870006649A KR860010679A KR860010679A KR870006649A KR 870006649 A KR870006649 A KR 870006649A KR 860010679 A KR860010679 A KR 860010679A KR 860010679 A KR860010679 A KR 860010679A KR 870006649 A KR870006649 A KR 870006649A
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South Korea
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bonding
bonding tool
wire
detecting
signal
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KR860010679A
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KR950009619B1 (ko
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요시오 오우시마
야스시 이시이
히데기 히다가
구니히로 쯔지야
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미쓰다 가쓰시게
가부시기가이샤 히다찌세이사꾸쇼
도요구니 요시모리
히다찌도오교도 에루구트로닉스 가부시기가이샤
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Abstract

내용 없음.

Description

와이어본딩방법 및 그 와이어본딩장치 그리고, 그 와이어본딩 장치를 사용한 반도체장치의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1실시예인 와이어본딩공구의 착지검출을 행하는 위치검출장치를 갖춘 와이어본딩장치를 도시한 설명도.
제2도 A는 본딩공구에 대한 위치지령신호와 본딩공구의 실제의 위치를 도시한 위치신호를 비교하여 도시한 선도면.
제2도 B는 위치지령신호와 위치신호와의 차로서 얻어지는 차동신호의 변화를 도시한 선도면.

Claims (20)

  1. 제1와이어본딩부위와, 이에 대응하는 제2와이어본딩부위를 본딩와이어에 의해서 전기접속을 행하는 와이어본딩방법에 있어서, 본딩공구의 상하동 변위를 제어하는 위치지령 신호와, 본딩공구의 실제의 상하동변위를 전기적으로 검출하는 센서에서 출력되는 위치 신호와의 차신호를 검출하면서 본딩공구를 동작시켜, 와이어본딩을 행하는 것을 특징으로 하는 와이어본딩방법.
  2. 특허청구의 범위 제1항에 있어서, 본딩공구는 초음파방식의 와이어본딩공구인 웨지이다.
  3. 특허청구의 범위 제1항에 있어서, 본딩공구는 볼 본딩방식의 와이어본딩공구인 캐피라리이다.
  4. 특허청구의 범위 제1항에 있어서, 본딩공구는 열압착력과 초음파진동이 인가되어 있는 캐피라리이다.
  5. 제1와이어본딩부위와 이에 대응하는 제2와이어본딩부위를 본딩와이어에 의해서 전기접속을 행하는 와이어본딩방법에 있어서, 본딩공구의 상하동변위를 제어한는 위치지령신호와 본딩공구의 실체의 상하동변위를 전기적으로 검출하는 센서에서 출력되는 위치신호와의 차신호를 검출하고, 이 차신호와 소정의 스레쉬홀드치(기준치)와 비교하는 것에 의해서, 본딩공구의 착지에 의한 정지를 검지하여, 착지신호를 얻고, 상기 차신호와 착지신호를 이용하면서 본딩공구를 동작시켜, 와이어본딩을 행하는 것을 특징으로 하는 와이어본딩방법.
  6. 턱허청구의 범위 제5항에 있어서, 본딩공구는 초음파방식의 와이어본딩공구인 웨지이다.
  7. 특허청구의 범위 제5항에 있어서, 본딩공구는 볼본딩방식의 와이어본딩공구인 캐피라리이다.
  8. 본딩공구와 본딩공구를 상하동시키는 구동원과, 지점을 가진 아암으로서, 그 아암의 왼쪽 끝에 본딩공구가 붙쳐져 있고, 상기 아암의 오른쪽 끝에 상기 구동원의 상하동변위부가 연결되어서 있는 아암과, 아암의 상하동변위를 검출하는 위치검출용 센서와, 아암의 상하동 변위속도를 검출하는 속도검출용 센서와, 상기 구동원의 상하동변위부를 전기적으로 제어하는 제어회로와, 제어회로 및 구동원 그리고, 아암을 통해서 본딩공구를 상하동변위시키는 신호인 위치지령신호와 상기 위치검출용 센서에서 얻어지는 위치신호와의 차를 소정의 스레쉬홀드치와 비교하는 것에 의해서 상기 본딩공구의 착지에 의한 정지를 검지하는 컴퍼레이터를 가진 것을 특징으로 하는 와이어본딩장치.
  9. 초음파방식의 와이어본딩공구인 웨지와, 웨지와 연결하고 있는 초음파호온과, 웨지를 초음파진동시키는 초음파진동원과, 웨지를 상하동변위시키는 구동원과, 지점을 가진 아암으로서, 그 아암의 왼쪽 끝에 초음파호온이 붙쳐저 있고 상기 아암의 오른쪽 끝에 상기 구동원의 상하동 변위부가 연격되어서 있는 아암과 아암의 상하동 변위를 검출하는 위치검출용 센서와, 아암의 상하동 변위속도를 검출하는 속도검출용 센서와, 상기 구동원의 상하동 변위부를 전기적으로 제어하는 제어회로와, 제어회로 및 구동원 그리고, 아암을 통해서 본딩공구를 상하동 변위시키는 신호인 위치지령신호와 상기 위치검출용 센서에서 얻어지는 위치신호와의 차를 소정의 스레쉬홀드치와 비교하는 것에 의해서 상기 본딩공구의 착지에 의한 정지를 검출하는 컴퍼레이터를 가진 것을 특징으로 하는 와이어본딩장치.
  10. 볼본딩방식의 와이어본딩공구인 캐파리라와, 캐파라리를 상하동시키는 구동원과, 지점을 가진 아암으로서 그 아암의 왼쪽 끝에 캐피라리가 붙쳐져 있고, 상기 아암의 오른쪽 끝에 상기 구동원의 상하동 변위부가 연결되어 있는 아암과, 아암의 상하동 변위를 검출하는 위치검출용 센서와, 아암의 상하동변위 속도를 검출하는 속도검출용 센서와, 상기 구동원의 상하동 변위부를 전기저으로 제어하는 제어회로와, 제어회로 및 구동원 그리고 아암을 통해서 본딩공구를 상하동 변위시키는 신호인 위치지령신호와 상기 위치검출용 센서에서 얻어지는 위치신호와의 차를 소정의 스레쉬홀드치와 비교하는 것에 의해서, 상기 본딩공구의 착지에 의한 정지를 검출하는 컴퍼레이터를 가진 것을 특징으로 하는 와이어본딩장치.
  11. 특허청구의 범위 제10항에 있어서, 캐피라리에는 열압착력과 초음파진동이 인가되어 있다.
  12. 특허청구의 범위 제10항에 있어서, 캐피라리에는 열압차력이 인가되어 있다.
  13. 반도체 소자가 형성되어 있는 페렛에 있어서의 본딩패드와, 상기 패드에 대응하는 외부 리드를 본딩와이어에 의해서 전기접속하는 공정을 가진 반도체장치의 제조방법에 있어서, 상기 본딩패드 또는 외부 리드의 피와이어본딩 영역에 본딩공구가 착지한 것을 본딩공구의 상하동 변위를 센서에 의해 전기적으로 검지하고, 그 검지정보에 따라서 본딩공구를 사용하여 본딩와이어를 상기 피와이어본딩 영역에 전기접속하는 공정을 가진 것을 특징으로 하는 반도체장치의 제조방법.
  14. 특허청구의 범위 제13항에 있어서, 본딩공구의 상하동 변위를 제어하는 위치지령신호와, 본딩공구의 실제의 상하동 변위를 전기적으로 검출하는 센서에서 출력되는 위치신호와의 차신호를 검출하고, 이 차신호와 소정의 스레쉬홀드치(기준치)와 비교하는 것에 의해서, 본딩공구의 착지에 의한 정지를 검지하여 착지신호를 얻고, 상기 차신호와 착지신호를 이용하면서 본딩공구를 동작시켜서 와이어본딩을 행한다.
  15. 특허청구의 범위 제13항에 있어서, 본딩공구는 초음파방식의 와이어본딩을 행하는 웨지이다.
  16. 특허청구의 범위 제13항에 있어서, 본딩공구는 초음파방식과 열압착방식을 병용한 와이어본딩을 행하는 캐피라리이다.
  17. 위치지령신호에 따라서 변위되는 가동부의 착지에 의한 정지를, 그 가동부의 위치검출용 센서에서 얻어지는 위치신호와, 상기 위치지령신호와의 차에 따라서 검지하는 것을 특징으로 하는 착지검출방법.
  18. 상기 가동부가 도체로 되는 본딩와이어에 의해서 제1 및 제2의 부위사이를 전기적으로 접속하는 본딩 공구이며, 상기 정지가 그 본딩공구의 상기 제1 및 제2의 부위에 대한 착지인 것을 특징으로 하는 특허청구의 범위 제17항 기재의 착지검출방법.
  19. 가동부를 변위시키는 위치지령신호와, 그 가동부의 위치검출용 센서에서 얻어지는 위치신호와 의차를, 소정의 스레쉬홀드치와 비교하는 것에 의해서, 상기 가동부의 착지에 의한 정지를 검지하는 컴퍼레이터를 가진 것을 특징으로 하는 착지검출장치.
  20. 상기 가동부가 도체로 되는 본딩와이어에 의해서, 제1 및 제2의 부위 사이를 전기적으로 접속하는 본딩공구이며, 상기 정지가 그 본딩공구의 상기 제1 및 제2의 부위에 대한 착지인 것을 특징으로 하는 특허청구의 범위 제19항 기재의 착지검출장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860010679A 1985-12-25 1986-12-13 반도체장치의 와이어 본딩방법 KR950009619B1 (ko)

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