JPS55124240A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS55124240A
JPS55124240A JP3245779A JP3245779A JPS55124240A JP S55124240 A JPS55124240 A JP S55124240A JP 3245779 A JP3245779 A JP 3245779A JP 3245779 A JP3245779 A JP 3245779A JP S55124240 A JPS55124240 A JP S55124240A
Authority
JP
Japan
Prior art keywords
coil
bonding
supporter
capillary
activating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3245779A
Other languages
Japanese (ja)
Inventor
Koji Aono
Tokuo Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3245779A priority Critical patent/JPS55124240A/en
Publication of JPS55124240A publication Critical patent/JPS55124240A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

PURPOSE:To suppress ageing degradation caused by wear by decreasing the number of components and to permit the multistage stitch-bonding at high speed, by controlling its complex mechanical alignment via electrical signals and by making the capillary performance linear. CONSTITUTION:Magnetic field generated in a coil 4 is focused by cores 4a and 4b. A supporter 5 is forced to move upward or downward by an activating coil 6 attached thereto, assuring the bonding performance. A control coil 7 controls the supporter 5 in relation to the height of the respective bonding faces so that the movement speed may be decreased on the bonding face. Further, adjustment of the pressure applied to the wire through a capillary 3 is controlled by the activating coil 6 and the control coil 7. The movement position of the capillary supporter 5 is detected by monitoring the amount of the current induced in a position-detecting coil 13.
JP3245779A 1979-03-20 1979-03-20 Wire bonding device Pending JPS55124240A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3245779A JPS55124240A (en) 1979-03-20 1979-03-20 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3245779A JPS55124240A (en) 1979-03-20 1979-03-20 Wire bonding device

Publications (1)

Publication Number Publication Date
JPS55124240A true JPS55124240A (en) 1980-09-25

Family

ID=12359493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3245779A Pending JPS55124240A (en) 1979-03-20 1979-03-20 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS55124240A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4603802A (en) * 1984-02-27 1986-08-05 Fairchild Camera & Instrument Corporation Variation and control of bond force
US4610387A (en) * 1983-12-19 1986-09-09 Robotica S.R.L. Device for bonding wire leads in electronic components
JPH01205542A (en) * 1988-02-12 1989-08-17 Pioneer Electron Corp Wire bonding apparatus
US4984730A (en) * 1988-11-11 1991-01-15 Emhart Inc. Quality control for wire bonding
US5060841A (en) * 1985-12-25 1991-10-29 Hitachi, Ltd. wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus
US5180094A (en) * 1991-02-27 1993-01-19 Kaijo Corporation Wire bonder with bonding arm angle sensor
JP2001126942A (en) * 1999-05-07 2001-05-11 Furukawa Electric Co Ltd:The Method and device for wiring

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4610387A (en) * 1983-12-19 1986-09-09 Robotica S.R.L. Device for bonding wire leads in electronic components
US4603802A (en) * 1984-02-27 1986-08-05 Fairchild Camera & Instrument Corporation Variation and control of bond force
US5060841A (en) * 1985-12-25 1991-10-29 Hitachi, Ltd. wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus
JPH01205542A (en) * 1988-02-12 1989-08-17 Pioneer Electron Corp Wire bonding apparatus
US4984730A (en) * 1988-11-11 1991-01-15 Emhart Inc. Quality control for wire bonding
US5180094A (en) * 1991-02-27 1993-01-19 Kaijo Corporation Wire bonder with bonding arm angle sensor
JP2001126942A (en) * 1999-05-07 2001-05-11 Furukawa Electric Co Ltd:The Method and device for wiring

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