JP2001126942A - Method and device for wiring - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring device, capable of producing a planer transformer or the like by easily and accurately wiring a lead wire into a desired pattern or of easily performing electric wiring to a circuit board or the like. SOLUTION: A wiring head 2, for sticking a linear conductor led out of the top of a substrate A, which has an adhesive layer on the surface, onto the surface of the substrate is provided, so as to enable point contact and reciprocating movement, this wiring head is provided so as to relatively move along with the surface movement of the substrate with the reciprocation of the wiring head (moving mechanism 3), and the movement of the wiring head is controlled by the wiring pattern of the conductor to the substrate. Then, the linear conductor is wired on the substrate according to the prescribed wiring pattern, while sticking the linear conductor on the surface of the substrate in the manner of pinpoint by reciprocating the wiring head.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring method and a wiring apparatus capable of easily and accurately manufacturing an electric wire loop forming a transformer or the like, and of easily performing electric wiring to a circuit board or the like.

[0002]

[Related Background Art] In recent years, there has been a strong demand for reducing the height of various components mounted on electronic equipment, and electric wires (coils) forming transformers, filters, and the like have also been realized as so-called planar coils. Have been. Conventionally, such a planar coil is generally formed by etching or mechanically punching a conductive plate (film) according to a predetermined coil pattern, or by winding an enameled wire (enamel-coated copper wire) in a plane. However, there are many problems in manufacturing a coil of desired quality (characteristics) at a low cost and with good yield.

Incidentally, for example, Japanese Patent Application Laid-Open No. 57-13639
No. 3 discloses an adhesive layer formed on the surface of an insulating substrate,
There is disclosed a technique of sequentially arranging a conductor in a desired pattern shape while pressing a conductor heated in advance using high-frequency vibration. Japanese Patent Application Laid-Open No. 8-294213 discloses a technique in which a conductor arranged in a predetermined pattern is transferred onto an insulating sheet, and then a heating unit having a plate shape is pressed from above to embed the conductor in the insulating sheet. Is disclosed. It is considered that such a technique makes it possible to relatively easily manufacture a coil having a desired quality (characteristic).

[0004]

However, in the former method, an expensive high-frequency vibrator or the like for heating the conductor immediately before the wiring is required, so that the structure of the wiring head becomes complicated, and There is a problem that the heating temperature management is complicated. In addition, if the heating temperature of the conductive wire varies, there is a problem that the adhesive force of the conductive wire to the adhesive layer becomes non-uniform, and the wiring pattern tends to shift. In addition, the latter method requires a large heating unit that covers the entire wiring pattern, and has a problem that it is difficult to uniformly heat the entire wiring pattern at once. For this reason, the conductor cannot be uniformly embedded in the insulating sheet. For example, a part of the conductor may be lifted or the like to cause deformation of the wiring pattern, or a problem such as breakage of the wiring pattern may easily occur. .

The present invention has been made in view of such circumstances, and has as its object to manufacture a flat transformer or the like by simply laying out wires in a desired pattern with a desired pattern, or to manufacture a circuit board or the like. It is an object of the present invention to provide a wiring method and a wiring device which can easily perform electric wiring for the wiring.

[0006]

In order to achieve the above object, a wiring method according to the present invention uses a substrate having an adhesive layer on its surface, as described in claim 1. The wiring head moving relatively along the surface is moved up and down, and the linear conductors drawn out from the wiring head are sequentially adhered to the surface of the base material while being in point contact with the surface of the base material. It is characterized by performing a line.

That is, the wiring method according to the present invention realizes the wiring of a linear conductor on a substrate having an adhesive layer on the surface without using a heating means. A linear conductor is intermittently point-contacted to the surface of the substrate by being fed out from the wiring head moving relatively along the wiring head, and the linear conductor is sequentially attached to the surface of the substrate, whereby the conductor is sequentially pinned along the wiring pattern. In terms of point, specifically, it is characterized in that the threads are sewn with a sewing machine and the wires are securely wired. In this case, as the adhesive layer provided on the surface of the base material, it is preferable to use an adhesive layer having an adhesive force at room temperature, or a pressure-sensitive adhesive layer exhibiting an adhesive force when pressed by a wiring head.

Further, after forming the first wiring pattern on the base material using the wiring head,
Another adhesive layer is provided on the first wiring pattern, and a second conductor pattern is formed on the adhesive layer by drawing out a linear conductor from the wiring head again. I have. At this time, as another adhesive layer provided on the first wiring pattern, it is preferable to use a sheet-like adhesive, specifically, a double-sided adhesive sheet or the like, as described in claim 3.

According to a preferred aspect of the present invention, an insulating coated conductor such as an enameled wire (enamel-coated copper wire having a circular or rectangular cross section) is used as the linear conductor. It is characterized in that a wiring pattern to be laid on the base material is appropriately crossed and its lead end is drawn out of the base material, so that external connection can be easily made without using a through hole or the like.

According to a fifth aspect of the present invention, there is provided a wiring device, comprising: a holding mechanism for holding a base material having an adhesive layer on a surface; A wiring head that is provided so as to be reciprocally movable, and affixes a linear conductor derived from the tip thereof while intermittently making point contact with the surface of the base material; and the cloth with the reciprocating movement of the wiring head. A moving mechanism that relatively moves the wire head along the surface of the substrate held by the holding mechanism; and a control unit that controls operation of the moving mechanism in accordance with a wiring pattern of the conductor with respect to the substrate. It is characterized by that.

[0011] Preferably, as described in claim 6, the wiring head is brought into point contact with a linear conductor derived from a tip of a nozzle for deriving the linear conductor to a surface of a base material, thereby forming the conductor. It is configured such that the linear conductors are sequentially fed out while being attached to the surface of the substrate while being moved relative to the substrate. Then, while the linear conductor is securely adhered to the surface of the substrate in a pinpoint manner by the reciprocating movement of the wiring head, the relative position of the wiring head to the substrate synchronized with the reciprocating movement of the wiring head. The linear conductor is extended on the base material in accordance with a predetermined wiring pattern by extending the linear conductor by movement.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A wiring method and a wiring device according to an embodiment of the present invention will be described below with reference to the drawings, taking the production of an electric wire (coil) as an example. FIG. 1 is a diagram showing a schematic configuration of a wiring device, and 1 is a table as a holding mechanism for holding a base material A having an adhesive layer on a surface. The table (holding mechanism) 1 places the base material 1 on its upper surface,
It plays a role in providing a planar coil with the linear conductor B on the base material 1. In some cases, the holding mechanism is realized as a conveyor mechanism or the like for providing a flat coil while placing and transporting the base material A at a constant speed.

The base material A is provided with an adhesive layer such as a thermosetting rubber-based adhesive layer or a silicone-based adhesive layer on its surface. It may be a flexible film (so-called adhesive tape) or a film having the above-mentioned adhesive layer formed on the surface of an insulating substrate or the like. That is, the substrate A may be any one provided with an adhesive layer having a constant adhesive strength at normal temperature on its surface.

A moving mechanism 3 composed of an XY table supporting a wiring head 2 is provided on a side of the table 1 holding the base material A. The wiring head 2 is formed by attaching a linear conductor B as a material for forming a planar coil to the surface of the base material A while drawing out a predetermined wiring pattern from the tip of the nozzle. It plays a role of forming a coil. The wiring head 2 is provided so as to be vertically movable (reciprocating) so that a linear conductor derived from the nozzle tip can intermittently come into point contact with the surface of the base material A as described later. The moving mechanism 3 supports the wiring head 2 movably two-dimensionally (in a plane) along the surface of the base material A. This moving mechanism 3
The horizontal movement of the wiring head 2 is controlled by a predetermined wiring pattern in accordance with a predetermined wiring pattern in association with the vertical movement of the wiring head 2 under the control of the control unit 5 including a microprocessor or the like. It is performed by moving by a distance.

In the apparatus, the wiring head 2 is moved up and down at a predetermined cycle while the wiring head 2 is horizontally moved in accordance with a preset wiring pattern, so that the conductor B is laid on the surface of the base material A. However, the wiring may be controlled while synchronizing the vertical movement of the wiring head 2 and the horizontal movement of the wiring head 2 with each other. In addition, the point of contact of the wiring head 2 with the base material A (the point at which the conductor B is laid) is programmed in advance in accordance with the wiring pattern.
The wiring head 2 may be moved up and down in accordance with the horizontal movement.

When the wiring head 2 is reciprocated up and down, the linear conductor B derived from the tip of the nozzle as the wiring head 2 descends instantaneously makes point contact with the surface of the substrate A. Then, the conductor B is stuck on the surface of the base material A (adhesive layer) in a pinpoint manner. After that, when the wiring head 2 rises, the conductor B attached to the surface of the base material A at the pinpoint is
The wiring head 2 is pulled out (extended) from the nozzle tip by the rising amount. During the period until the wiring head 2 descends again and comes into point contact with the surface of the substrate A, the moving mechanism 3 moves by a predetermined amount in the direction determined by the wiring pattern as the wiring head 2 rises. Driven.

After such a movement, when the linear conductor B led out from the wiring head 2 comes into point contact with the surface of the base material A again, the conductor B is affixed to the moving position in a pinpoint manner. The conductor B is continuously attached between the position where the conductor B is attached at the pinpoint before the process. In other words, the surface of the base material A (the adhesive layer) where the linear conductor B derived from the nozzle tip of the wiring head 2 intermittently makes point contact with the wiring head 2 by two vertical movements with horizontal movement. The conductor B is attached between the two points. Thereafter, the sticking of the conductors B at the pinpoints is sequentially and repeatedly performed by the vertical movement of the wiring head 2 and the horizontal movement of the wiring head 2 according to the wiring pattern by the moving mechanism 3, whereby the base material is repeated. A linear conductor B is sequentially attached to the surface of A in a predetermined wiring pattern.

That is, as shown schematically in FIG. 2, the wiring head 2 is reciprocated up and down and, for example, the wiring head 2 is moved in a plane along a wiring pattern in synchronization with the vertical movement. The wiring head 2 is placed on the surface of the base material A in FIG.
The conductors B are sequentially attached to the surface of the base material A in a pinpoint manner by sequentially and intermittently making point contact as shown as 2, P3,..., And the base material A is sewn with a sewing machine.
The conductor B is adhered on the upper side according to the wiring pattern.

The linear conductor B is provided by being wound on a bobbin C, and is continuously supplied to the wiring head 2 via a tensioner 6a, a guide sheep 6b and the like. The conductor B is not limited to a so-called bare copper wire, but may be an enameled wire obtained by insulating a copper wire with a synthetic resin (enameled wire having a circular or rectangular cross section), although it depends on the specifications of the planar coil and the wiring pattern. A copper wire), a litz wire obtained by twisting a plurality of enamel wires, or the like is appropriately used.

Here, the wiring head 2 will be described. The wiring head 2 is vertically movable via a thrust bearing 22 on a support arm 21 fixed to the moving mechanism 3 as shown in FIG. A shaft 23 is supported, and a nozzle (wiring nozzle) 24 for leading out the conductor B is attached to the lower end of the shaft 23. Here, two nozzles 24 corresponding to the wire diameter of the conductor B are provided.
For example, it is selectively used depending on the purpose of wiring. These nozzles 24 are provided so that they can be replaced as appropriate according to the type of the conductor B and the like.

At the upper end of the shaft 23, a cam follower 26 fitted to an eccentric cam 25 driven to rotate at a predetermined speed by a motor (not shown) is provided. Then, due to the vertical movement of the cam follower 26 accompanying the rotation of the eccentric cam 25, the nozzle 24 moves up and down via the shaft portion 23,
The nozzle tip is configured to intermittently contact the substrate A. The vertical movement width of the nozzle 24 (wiring head 2) is set to about 1 to 2 mm when, for example, a conductor B having a diameter of 0.3 mm is wired. Nozzle 2
The cycle of the vertical movement of the wiring head 4 (wiring head 2) is set to, for example, about 50 Hz, depending on the specifications such as the speed required for the wiring processing.

FIG. 4 shows another configuration example of the wiring head 2. In the wiring head 2 shown in FIG. 4, a nozzle 32 for wiring and a pressing nozzle 33 for preventing the conductor B wired on the base material A from rising are coaxially moved up and down inside the head body 31. The head body 3 is provided freely.
It has a structure in which ring-shaped permanent magnets 35 and 36 attached to the upper ends of the nozzles 32 and 33 are vertically arranged with an electromagnet 34 incorporated in the inside of the nozzle 1 interposed therebetween. The permanent magnets 35 and 36 are attracted / repelled by controlling the energization of the electromagnet 34 so that the nozzles 32 and 33 are vertically reciprocated in synchronization with each other.

Specifically, each of the nozzles 32 and 33 is attracted by the energization of the electromagnet 34 so that the holding nozzle 3
3 is pulled up into the head main body 31, and the wiring nozzle 32 is pushed down to project from the tip of the holding nozzle 33. The configuration is such that the wiring nozzle 32 is brought into contact with the surface of the substrate A, and the conductor B derived from the tip of the nozzle 32 is attached to the surface of the substrate A. Then, the permanent magnets 35 and 36 are displaced in a direction away from each other by energizing the electromagnet 34 in a reverse direction (reverse polarity), and the wiring nozzle 32 is drawn into the head main body 31. 33 is projected from the tip of the wiring nozzle 32. Then, the conductor B laid on the base material A is pressed by the tip of the holding nozzle 33 to prevent its lifting.

According to the wiring head 2 having the structure in which the nozzles 32 and 33 are reciprocally driven electromagnetically, the nozzle 24 is mechanically moved up and down using the eccentric cam 25 described above. The nozzles 32 and 33 can be moved up and down at a higher speed, and the wiring processing speed can be increased. Moreover, since the conductor B can be laid on the base material A while preventing the conductor B from being lifted up by the holding nozzle 33, the conductor B can be firmly and surely stuck. Becomes

Thus, using the wiring apparatus constructed as described above, a cloth in which linear conductors B are sequentially wired on a surface of a base material A having an adhesive layer on the surface in accordance with a predetermined wiring pattern. According to the wire method, the linear conductor B derived from the tip of the nozzle of the wire head 2 by the vertical movement of the wire head 2
Each time the conductor intermittently contacts the surface of the substrate A, the conductor B is attached to the contact portion. Then, the conductor B is attached to the next point with the horizontal movement of the wiring head 2 accompanied by the vertical movement of the wiring head 2, whereby the conductor B is firmly attached to the pasting point of the previous stroke. Passed. Therefore, by controlling the movement of the wiring head 2 according to a predetermined wiring pattern,
As the connection between the points at which the linear conductors B derived from the nozzle tip of the wiring head 2 intermittently come into point contact with each other as the wiring head 2 moves up and down, the conductor B is connected to the wiring. The pattern is drawn on the surface of the substrate A while drawing the pattern shape. As a result, a planar coil having a desired wiring pattern shape can be easily formed with high accuracy.

In particular, according to the wiring apparatus, the conductors B are sequentially adhered to the surface of the base material A at a predetermined interval in a pinpoint manner, for example, on an adhesive layer having a predetermined tackiness at room temperature. Since the wire is only advanced continuously, the conductor B
No processing such as pre-heating is required, and the apparatus configuration can be greatly simplified. Moreover, the conductor B is adhered to the surface of the substrate A in a pinpoint manner by the vertical movement of the wiring head 2, and the wiring head 2 moves horizontally when the wiring head 2 is separated from the surface of the substrate A. Therefore, the horizontal movement of the wiring head 2 is not hindered by the viscosity of the adhesive layer or the like. In other words, in the conventional one in which the conductor is wired on the substrate while heating the conductor, after the tip of the nozzle of the wiring head is brought into contact with the surface of the substrate A, the contact state is maintained. The wiring is continuously performed by horizontally moving the wiring head as in a so-called single-stroke writing. Therefore, when the adhesive layer exhibits tackiness at room temperature, the tackiness prevents horizontal movement of the nozzle tip. In this regard, in the present apparatus, since the wiring head 2 only makes intermittent point contact while reciprocating up and down, the wiring head 2 can move smoothly and horizontally, and thus the wiring pattern can be formed with high precision. It can be formed.

According to the experiment conducted by the present inventors, the wiring head 2 was driven up and down at 50 Hz while changing the base material A and the conductor B as follows, and the wiring was performed according to a predetermined wiring pattern. When the heads 2 were controlled for horizontal movement, good planar electric wires (planar coils) could be obtained in each case. That is, when the wiring head 2 is moved up and down at such a cycle, the time for attaching the conductor B to the base material A while pressing down the conductor B by the wiring head 2 is extremely short. It was confirmed that even if the line head 2 was moved horizontally, a good wiring could be formed without any problem.

[0028]

[Table 1]

Here, an example of manufacturing a flat transformer using the above-described wiring apparatus will be described with reference to FIGS. This planar transformer is realized on a glass epoxy substrate, for example.
First, as shown in FIG. 5 (a), a first ferrite core 51 made of, for example, a rectangular frame-shaped flat plate, which is a part of a core of a flat transformer, is formed on a glass epoxy substrate 40 as a base material A.
Provided as On the upper surface of the first ferrite core 51, for example, a double-sided adhesive tape [# 7021 manufactured by Teraoka Seisakusho]
Alternatively, # 769] is attached to the upper surface, and this is used as the adhesive layer 52 of the base material A. In the figure, reference numeral 41 denotes a plurality of connection terminals mounted on the side of the glass epoxy substrate 40 in advance.

Thereafter, as shown in FIG. 5 (b), for example, a 0.1 mm UE
A conductor B made of W is laid according to a preset coil pattern to form a primary coil 53. At this time, the wiring end of the conductor B after the coil pattern forming the primary coil 53 is laid is drawn out of the substrate A while crossing the coil pattern. By the way, the wiring start end and the wiring end end of the conductor B forming the primary coil 53 may be automatically wound around the connection terminal 41 and soldered, or may be separately manually connected to the connection terminal 41. Alternatively, it may be wound and connected by soldering or the like.

As the coil pattern, for example, FIG.
Not only the rectangular spiral pattern shown in FIG.
A circular spiral pattern as shown in FIG. 6B and an elliptical (elliptical) spiral pattern as shown in FIG. 6C may be used. Alternatively, as shown in FIG. 6D, a rectangular spiral pattern may be formed in parallel by inverting the winding direction and forming a pair of coils continuously.

Next, as shown in FIG. 5C, for example, a double-sided adhesive tape [# 7021 or # 769] made by Teraoka Seisakusho is applied on the primary coil 53 laid on the adhesive layer 52, and the base material A Is a new pressure-sensitive adhesive layer 54. Then, as shown in FIG. 5D, a conductor B made of, for example, 0.05 mm UEW, which is an insulated copper wire, is laid on the adhesive layer 54 in accordance with a preset coil pattern to form a secondary coil 55. The position at which the secondary coil 55 is formed is controlled in relation to the primary coil 53, and the secondary coil 55 is formed so as to have a predetermined facing relationship with the coil pattern of the primary coil 53. The wiring start end and the wiring end end of the conductor B forming the secondary coil 55 are also set in the primary coil 53.
In the same manner as described above, each is connected to a predetermined connection terminal 41.

When the secondary coil 55 is formed by using the conductor B having a wire diameter different from that of the conductor B forming the primary coil 53 in this way, a plurality of wires each having a wire attached thereto as a wiring device. It is preferable that the wiring heads 2 are prepared in advance, and the wiring work of the coils 53 and 55 is advanced by selectively using these wiring heads 2. According to the wiring apparatus including the plurality of wiring heads 2 and selectively using the wiring heads 2 as described above, each time the conductor B to be wired is replaced as described above, the wiring head Since there is no need to change the conductor attached to the nozzle 2, especially the nozzle 3 for the wiring
2 can save the troublesome work of inserting the conductor B every time, so that the wiring work efficiency can be improved.

Thereafter, as shown in FIG. 5E, a second ferrite core 56, for example, having an E-shaped cross section, which is a pair with the above-mentioned first ferrite core 51, covers the secondary coil 55 and is located thereabove. And the cores 51 and 56 are magnetically coupled. Then, for example, as shown in FIG. 5 (f), the adhesive tape 57 is attached to the back surface of the glass epoxy substrate 40 from the peripheral surface of the second core 56, and is made of an adhesive tape [# 760] manufactured by Teraoka Seisakusho. And cores 51, 56
Are joined and integrated.

According to the planar transformer manufactured in this manner, the primary coil 53 and the secondary coil are laid in a predetermined coil pattern on the adhesive layers 52 and 54 by the wiring head 2 respectively. Reference numerals 55 are positioned in a predetermined facing relationship via the adhesive layer 54 and are arranged close to each other. Moreover, each of the coils 53 and 55 is the first
And the second ferrite cores 51 and 56 are provided in close contact with each other.
A structure in which a magnetic path is formed surrounding the next coil 55 is obtained. Therefore, it is possible to easily realize a planar transformer in which the coils 53 and 55 are strongly connected magnetically. Further, since the pitch, the number of turns, and the like of the coil pattern can be arbitrarily set, coils of various specifications can be easily realized with high accuracy. Further, the distance between the plurality of coils can be made sufficiently small, and the effect of increasing the coupling efficiency can be obtained.

Although the primary coil 53 and the secondary coil 55 are provided in two layers here, another coil can be laminated. The first ferrite core 51
After the secondary coil is formed thereon, it is also possible to form the primary coil thereon with the adhesive layer 54 interposed therebetween. That is, 1
It goes without saying that the order of forming the secondary coil and the secondary coil may be reversed.

A coil 5 having an insulated copper wire laid thereon
3, 55 of each wiring start end and wiring end are crossed with the coil pattern and drawn out to the connection terminal 41.
Externally connected to the coils 53 and 55 without using advanced connection techniques such as through-holes, and without causing problems such as short circuits. It becomes possible.

At this time, if a three-layer insulated wire having a trade name of TEX-E or TEXE-LZ is used for at least one of the coils as a conductor forming the coils 53 and 55, IEC60950 or IEC60065, etc. According to the safety standard, it is recognized that the electric wire itself has the function of reinforced insulation, so that only one tape is used as a base material for adhering the coils 53 and 55, and the electric strength is sufficient. The coils 53, 55
It can be realized as a transformer having a function (structure) with reinforced insulation between them. Therefore, it can greatly contribute to downsizing of the transformer.

When a planar coil is formed by laying an insulated copper wire, another planar coil can be laid by utilizing the pattern of one planar coil as shown in FIG. 7, for example. Specifically, as shown in FIG. 7, another plane coil made of an enameled wire can be laid between the patterns of the plane coil formed using the litz wire. If a plurality of planar coils are laid on the same device A in such a manner by utilizing the pattern between them, it becomes possible to sufficiently enhance the magnetic coupling between these coils, and furthermore, It is possible to easily realize a transformer having a desired performance while reducing the height.

When a transformer conforming to the international standard for safety of information equipment (IEC 60950) is realized by using enameled wires, it is necessary to provide three or more insulating layers for reinforced insulation between the coils 53 and 55. And
When a single insulator is used, the thickness of the insulating layer is set to 0.
4 mm or more is required. In this regard, an adhesive insulating tape (adhesive layer 54) that satisfies a predetermined withstand voltage with any two insulating layers is used, and one further insulating tape is attached to these adhesive tapes to form a three-layer structure. By configuring the insulating layer of
It can be easily strengthened and insulated at the same time to meet the above safety standards. In particular, for example, a thickness 2 having a predetermined withstand voltage
Adhesive insulating tapes each having an adhesive layer provided on both sides of a 5 μm polyester tape are superimposed over three layers, and when these are used as the adhesive layers 51 and 54, the thickness of each of the adhesive layers 51 and 54 is reduced to about 0.1 mm. Therefore, it is possible to greatly contribute to the reduction in thickness of the planar coil while sufficiently satisfying the above safety standards.

It should be noted that two layers of adhesive insulating tapes are respectively attached to both sides of the planar coil laid as described above, and this is used as a unit of one planar coil, so that a plurality of planar coils are superposed. In this case, the above safety standard can be easily satisfied. That is, a laminate of two adhesive insulating tapes is used as a base material A having a two-layer structure, and a planar coil is formed on the upper surface thereof. Then, two more layers of adhesive insulating tape are superimposed on the planar coil, and two layers of adhesive insulating tape are provided above and below the planar coil to form a sandwich structure, which is used as a basic unit of the planar coil. . According to the planar coil having such a layer structure, when an arbitrary number of planar coils are superimposed to realize a transformer or the like, four insulating layers are necessarily formed between the planar coils. It is possible to easily realize a reinforced insulation structure that can sufficiently satisfy the above-mentioned safety standards.

The present invention is not limited to the above embodiment. Here, an example in which a planar coil is formed on an adhesive tape has been described. For example, a case in which a desired wiring pattern is formed on an insulated circuit board of paper, phenol, paper, epoxy, or glass / epoxy. The same can be applied to. In this case, a silicone-based adhesive, an acrylic-based adhesive, or a rubber-based adhesive is directly applied and formed on the insulated circuit board in advance, or a double-sided adhesive tape coated with these adhesives is attached. What should I do? The substrate is not limited to a rigid substrate, but may be a flexible substrate.

Further, instead of the adhesive layer having viscosity at room temperature, a pressure-sensitive adhesive layer which exhibits tackiness when a pressing force is applied by the wiring head 2 can be used.
Further, it is also possible to use a UV (ultraviolet) curable adhesive layer, form the planar coil and the like, and then cure the adhesive layer by irradiation with UV to firmly embed the planar coil and the like in the adhesive layer. Yes, and it is of course possible to use a thermosetting adhesive.

The wiring pattern and the wiring pitch are as follows.
This may be determined according to the specifications, and it is of course possible to form a multilayer (laminated) planar coil after wiring. Further, the frequency of the vertical reciprocating drive of the wiring head 2, the vertical movement width thereof, the horizontal moving speed of the wiring head 2, and the like are determined by the linear conductor B.
May be determined according to the wire diameter or the like. When it is necessary to establish synchronization between the vertical movement of the wiring head 2 and the horizontal movement of the wiring head 2, for example, a torque limiter may be incorporated in the drive mechanism of the XY table, and When pressed against the base material A, the horizontal movement may be prohibited. Further, it is of course possible to incorporate mechanical or electrical synchronization means which have been proposed variously in the past. However, in practice, if the vertical movement of the wiring head 2 is made sufficiently faster than the horizontal moving speed of the wiring head 2, the operation can be performed sufficiently without incorporating special synchronization means.

The frequency at which the wiring head 2 is reciprocated up and down is determined in consideration of the feeding speed of the conductor B and the like.
Practically, it is sufficient to set the range from about 1.5 Hz to about 500 Hz. For the driving means of the wiring head 2 and the like, reciprocating driving techniques of an object which have been conventionally proposed variously can be appropriately adopted. Instead of moving the wiring head 2 in the horizontal direction, the wiring head 2 may be configured to move horizontally on the substrate A side. In this case, the base material A may be held on the XY table. Furthermore, the pattern shape and layer configuration of the planar coil manufactured using the above-described wiring method may be determined according to the specifications.

As for the vertical movement of the wiring head 2, if the linear conductor B drawn out from the tip of the nozzle can be securely adhered to the surface of the base material A while making a point contact, the wiring head 2 It is not necessary to bring the tip of the nozzle No. 2 into contact with the surface of the substrate A, and it is not necessary to make the period of the vertical movement constant. That is, the wiring head 2 may be moved up and down according to the bending of the wiring pattern, the straight line distance, and the like. Further, it is of course possible to move the substrate A side up and down instead of the up and down movement of the wiring head 2. In addition, the present invention can be variously modified and implemented without departing from the gist thereof.

[0047]

As described above, according to the present invention, the wiring head for drawing out the linear conductor from the tip is driven back and forth to place the linear conductor on the base material having an adhesive layer on the surface. While intermittently making point contact, the wiring head is moved according to a predetermined wiring pattern along the surface of the substrate with the vertical movement of the wiring head. A conductor can be wired on the surface. In addition, the conductor can be efficiently wired in a desired wiring pattern without being limited by the type of the conductor, and a great effect in practical use, for example, a high-efficiency planar transformer can be easily manufactured. Is played.

[Brief description of the drawings]

FIG. 1 is a diagram showing a schematic configuration of a wiring device according to an embodiment of the present invention.

FIG. 2 is a view for explaining a method of laying conductors performed using the wiring apparatus shown in FIG. 1;

FIG. 3 is a schematic configuration diagram of a wiring head incorporated in the wiring device shown in FIG. 1;

FIG. 4 is a diagram showing another configuration example of the wiring head.

FIG. 5 is an exploded view showing an example of manufacturing a planar transformer.

FIG. 6 is a diagram showing an example of a planar coil pattern.

FIG. 7 is a diagram showing an example of two planar coils formed on the same base material.

[Explanation of symbols]

 A Base material having an adhesive layer on its surface B Linear conductor 1 Table (holding mechanism) 2 Wiring head 3 Moving mechanism (XY table) 5 Control unit (microprocessor) 22 Thrust bearing 24 Wiring nozzle 25 Eccentric cam 26 Cam follower 32 Wiring nozzle 33 Holding nozzle 34 Electromagnet 35 Permanent magnet 36 Permanent magnet 51 First ferrite core 52 Adhesive layer 53 Primary coil 54 Adhesive layer 55 Secondary coil 56 Second ferrite core

Claims (6)

[Claims] 1. A linear conductor that relatively moves along the surface of a base material having an adhesive layer on the surface and is fed out while intermittently making point contact with the base material, and A wiring method, wherein the linear conductors are sequentially attached to a surface. 2. A wire-like conductor that relatively moves along the surface of a substrate having an adhesive layer on its surface is fed out while making a linear conductor intermittently in point contact with said substrate. After the linear conductors are sequentially adhered to the surface to form a first wiring pattern, another adhesive layer is provided on the first wiring pattern, and the wiring head is provided on the adhesive layer. A wiring method, wherein a second wiring pattern is formed by drawing out a linear conductor. 3. The wiring method according to claim 2, wherein another adhesive layer provided on the first wiring pattern is made of a sheet-like adhesive. 4. The wiring method according to claim 1, wherein an insulating coated conductor is used as the linear conductor. 5. A holding mechanism for holding a base material having an adhesive layer on a surface, and a linear mechanism provided on the surface of the base material so as to be reciprocally movable toward a surface of the base material held by the holding mechanism. A wiring head that is attached while intermittently bringing the conductor into point contact,
A moving mechanism for relatively moving the wiring head along the surface of the base material held by the holding mechanism with the reciprocating movement of the wiring head, and the wiring pattern of the conductor with respect to the base material; Control means for controlling the operation of the movement mechanism. 6. The wiring head, wherein a linear conductor derived from a nozzle tip for deriving the linear conductor is brought into point contact with the surface of the substrate, and the linear conductor is attached to the surface of the substrate while attaching the conductor to the surface of the substrate. The wiring device according to claim 5, wherein the linear conductor is sequentially fed out with the relative movement with respect to the base material.