JP2006294689A - Planar coil and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To separate a wire for forming a lead from an adhesive sheet easily, and also to separate easily the wire without disconnecting the wire for forming a lead even if the wire for forming a lead is in a size or made of a material to be easily disconnected. <P>SOLUTION: The adhesive sheet 12 is used. In the adhesive sheet 12, an adhesive surface is divided into a wire fixing region 14A for coil formation and that 14B for lead formation, viscosity in the wire fixing region for lead formation is weaker than that in the wire fixing region for coil formation. The wire 11A for coil formation and that 11B for lead formation are wired in the wire fixing region for coil formation on the adhesive sheet and that for lead formation, respectively. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a wiring-type planar coil formed by fixing a wire made of a conductor on an adhesive sheet and a method for manufacturing the same. The planar coil according to the present invention can be applied as a coil for a micromotor, a general motor, a transformer, an antenna, or the like.

  2. Description of the Related Art Conventionally, as a micromotor coil, a wiring-type planar coil formed by fixing a wire made of a conductor on an adhesive sheet has been used (see, for example, Patent Document 1). An example is shown in the schematic perspective view of FIG. The wiring type planar coil 21 for the micromotor of this example is connected to the adhesive sheet 12, the coil forming wire 11A wired on the adhesive sheet 12, and the coil forming wire 11A. The lead forming wire 11B is wired. The adhesive sheet 12 includes a PET (polyethylene terephthalate) substrate and an adhesive 13 applied on the PET substrate. As the adhesive 13, one type of adhesive is applied on the entire surface of the substrate.

  When the above-described planar coil 21 is used, or when further processed into a final product, the coil-forming wire 11A is kept fixed to the adhesive sheet 12 to maintain the shape, and the lead-forming wire 11B is external. The adhesive sheet 12 is peeled off for connection. Then, if necessary, the pressure-sensitive adhesive sheet 12 is cut at, for example, a cut portion 22 indicated by a dotted line in the drawing, or the tip portion 11C of the lead forming wire 11B peeled off from the pressure-sensitive adhesive sheet 12 is cut at a cut portion 23 indicated by a dotted line in the drawing, Or cut.

JP 2001-126942 A

  As described above, the conventional planar coil shown in FIG. 3 is used by peeling the lead-forming wire from the pressure-sensitive adhesive sheet for connection to the outside, or processing it into a final product. However, the planar coil has a problem that when the lead forming wire is peeled from the pressure sensitive adhesive sheet, the lead forming wire is not easily peeled off from the pressure sensitive adhesive sheet due to the adhesive strength of the pressure sensitive adhesive sheet. In addition, as described above, the lead forming wire is difficult to peel off from the adhesive sheet due to the adhesive strength of the adhesive sheet, so depending on the size and material of the wire, There was a problem of disconnection. For example, in a planar coil for a micromotor, a wire having a diameter of 0.05 mm or less may be used. In such a planar coil using an extremely thin wire, the lead forming wire is easily disconnected when the lead forming wire is peeled from the adhesive sheet. Further, when the lead-forming wire of the planar coil shown in FIG. 3 is peeled from the adhesive sheet and processed into a final product, the process of peeling the lead-forming wire increases the manufacturing time due to the above reasons, and the yield deteriorates. It was the cause.

  The present invention has been made in view of the above-described circumstances, and in a wire-type planar coil formed by fixing a wire on an adhesive sheet, the lead forming wire can be easily peeled off from the adhesive sheet. It is an object of the present invention to make it possible to easily peel off a lead forming wire from an adhesive sheet without breaking the lead forming wire even if it is a size or material that is easily broken.

  In order to achieve the above object, the present invention provides (1) a coil-forming wire rod and a lead-forming wire rod connected to the coil-forming wire rod on a pressure-sensitive adhesive sheet. The planar coil is characterized in that the adhesive strength of the region and the adhesive strength of the lead forming wire fixing region are different from each other.

  In the planar coil (1), the adhesive strength of the coil forming wire fixing area of the adhesive sheet and the adhesive strength of the lead forming wire fixing area are different from each other. Therefore, when the adhesive strength of the lead forming wire fixing area of the adhesive sheet is weaker than the adhesive strength of the coil forming wire fixing area, the lead forming wire can be easily peeled off from the adhesive sheet.

The present invention further provides the following (2) to (7) planar coils and (8) to (14) planar coil manufacturing methods.
(2) The planar coil according to (1), wherein the adhesive strength of the lead forming wire fixing area of the adhesive sheet is weaker than the adhesive strength of the coil forming wire fixing area.
(3) The planar coil according to (2), wherein the adhesive in the lead forming wire fixing region of the adhesive sheet is an adhesive obtained by curing a radiation curable adhesive.
(4) The pressure-sensitive adhesive sheet is constituted by arranging in parallel a strong adhesive tape having a strong adhesive force and a weak adhesive tape having a weaker adhesive strength than the strong adhesive tape, and the adhesive surface of the strong adhesive tape is The planar coil according to (2), wherein the coil forming wire fixing area and the adhesive surface of the weak adhesive tape are used as lead forming wire fixing areas.
(5) A planar coil formed by fixing a wire on an adhesive sheet, wherein the lead forming wire is peeled from a lead forming wire fixing region of the planar coil of (1) to (4). Sheet coil.
(6) The planar coil according to (5), wherein the lead forming wire fixing region portion of the adhesive sheet is removed.
(7) The planar coil according to (5) or (6), wherein the tip of the lead forming wire is cut.
(8) A method of manufacturing a planar coil in which a wire is fixed on an adhesive sheet, wherein the adhesive surface is divided into a coil-forming wire fixing area and a lead-forming wire fixing area as a pressure-sensitive adhesive sheet to form a coil. The pressure-sensitive adhesive sheet has a different adhesive strength in the wire-fixing region and the adhesive strength in the lead-forming wire fixing region, and the coil-forming wire material in the coil-forming wire fixing region and the lead-forming wire fixing region in the adhesive sheet A method of manufacturing a planar coil, comprising a step of wiring a lead forming wire.
(9) The method for producing a planar il according to (8), wherein the adhesive strength of the lead forming wire fixing area of the adhesive sheet is weaker than the adhesive strength of the coil forming wire fixing area.
(10) The pressure-sensitive adhesive sheet is constituted by arranging in parallel a strong adhesive tape having a strong adhesive force and a weak adhesive tape having a weaker adhesive strength than the strong adhesive tape. (9) The method for manufacturing a planar coil according to (9), wherein the coil forming wire fixing region and the adhesive surface of the weak adhesive tape are used as lead forming wire fixing regions.
(11) A method for manufacturing a planar coil in which a wire is fixed on an adhesive sheet, wherein the adhesive surface is divided into a coil-forming wire fixing area and a lead-forming wire fixing area as a pressure-sensitive adhesive sheet. Using a pressure-sensitive adhesive sheet in which the pressure-sensitive adhesive in the wire fixing area is a radiation curable pressure-sensitive adhesive, the coil forming wire is fixed in the coil forming wire fixing area of the pressure-sensitive adhesive sheet, and the lead forming wire is wired in the lead forming wire fixing area. And a step of making the adhesive force of the lead forming wire fixing region of the adhesive sheet weaker than the adhesive force of the coil forming wire fixing region by curing the adhesive having the lead forming wire arranged by radiation irradiation. The manufacturing method of the planar coil characterized by these.
(12) The method for manufacturing a planar coil according to any one of (8) to (11), further comprising a step of peeling the lead forming wire from the lead forming wire fixing region where the lead forming wire is laid.
(13) The method for producing a planar coil according to (12), further comprising a step of removing the lead forming wire fixing region portion of the adhesive sheet.
(14) The method for producing a planar coil according to (12) or (13), further comprising a step of cutting the tip of the lead forming wire.

  In this case, in the present invention, the adhesive force means a peel strength when the adhesive tape is peeled off after the adhesive surface of a predetermined adhesive tape is bonded to the adhesive sheet.

  According to the present invention, the lead forming wire can be easily peeled off from the adhesive sheet, and even if the lead forming wire is of a size or material that is likely to break, the lead forming wire can be disconnected from the adhesive sheet without breaking. It can be easily peeled off. Therefore, when the lead forming wire is peeled from the adhesive sheet and processed into a final product, the manufacturing time can be shortened and the yield can be improved.

  Next, embodiments of the present invention will be described with reference to the accompanying drawings, but the present invention is not limited to the following examples. FIG. 1 is a schematic perspective view showing an embodiment of a planar coil according to the present invention. The planar coil 10 of this example is connected to the adhesive sheet 12, the coil forming wire 11 </ b> A wired on the adhesive sheet 12, and the lead forming wired on the adhesive sheet 12. It is comprised from the wire 11B. The pressure-sensitive adhesive sheet 12 is composed of a substrate made of PET or the like and a pressure-sensitive adhesive 13 applied on the substrate. The coil-forming wire fixing area 14A of the pressure-sensitive adhesive sheet 12 has a strong pressure-sensitive adhesive 13A as a pressure-sensitive adhesive. In the lead forming wire fixing region 14B, the adhesive 13B having a weak adhesive strength that is weaker than the adhesive 13A having a strong adhesive strength is used as the adhesive. The adhesive 13B having weak adhesive strength is specifically an adhesive obtained by curing an ultraviolet curable adhesive. In addition, a part of the lead forming wire 11B (a straight portion in the figure) is fixed to the lead forming wire fixing region 14B. In addition, as said adhesive with strong adhesive force, the composition etc. which consist of various synthetic rubber and natural rubber can be used, for example, As said ultraviolet curing adhesive, for example, a radiation curable carbon-carbon double bond is used. The thing etc. which mix | blended the photoinitiator with the acrylic base resin which has can be used.

  The planar coil 10 of this example is manufactured as follows. That is, as the pressure-sensitive adhesive sheet 12 for performing wiring, the adhesive 13A having a strong adhesive force is used as the pressure-sensitive adhesive for the coil-forming wire fixing region 14A, and the ultraviolet-curable pressure-sensitive adhesive is used as the pressure-sensitive adhesive for the lead-forming wire fixing region 14B. By using the one using 13B and fixing the coil-forming wire 11A and the lead-forming wire 11B on the pressure-sensitive adhesive sheet 12 by the wiring method, the ultraviolet-curable pressure-sensitive adhesive 13B is cured by ultraviolet irradiation. It is manufactured by making the adhesive strength of the lead forming wire fixing area 14B of the adhesive sheet 12 weaker than the adhesive strength of the coil forming wire fixing area 14A.

  Next, an embodiment in which the planar coil of the present invention is configured as a cylindrical micromotor coil will be described. First, in the same manner as described above, as the pressure-sensitive adhesive sheet 12 for performing wiring, the adhesive 13A for strong adhesive strength is used as the pressure-sensitive adhesive 14A for the coil-forming wire, and the UV-curable pressure-sensitive adhesive is used for the lead-forming wire fixing region 14B. A coil-forming wire 11 </ b> A and a lead-forming wire 11 </ b> B are fixed to the pressure-sensitive adhesive sheet 12 by a wiring method (see FIG. 1).

  Next, as shown in FIG. 2A, the pressure-sensitive adhesive sheet 12 is rolled into a cylindrical shape with the surface to which the coil forming wire 11A and the lead forming wire 11B are fixed facing inward. Next, the ultraviolet curable adhesive 13B is cured by ultraviolet irradiation.

  Subsequently, the lead forming wire 11B on the lead forming wire fixing area 14B is peeled off from the area 14B, and the adhesive sheet 12 is cut at the cutting location 30 to remove the adhesive sheet in the lead forming wire fixing area 14B. Further, as shown in FIG. 2B, the leading end portion 11C of the lead forming wire 11B peeled off from the lead forming wire fixing region 14B is cut together at a cutting location 31. Thereby, the cylindrical planar coil for micro motors which is one embodiment of the present invention is completed.

  The obtained micromotor coil is fixed to the inner wall of the micromotor housing, and the micromotor can be obtained through a process such as connecting the cut lead forming wire to another device.

Furthermore, other embodiment of this invention is shown.
1. First, a metal terminal is affixed so that an edge part may come out to an ultraviolet curing adhesive layer.
2. Next, the protruding metal terminal is placed on the lower side of the substrate and arranged so as to be attached to the substrate.
3. In this state, wiring is performed, and the metal terminal and the wire disposed on the ultraviolet curable adhesive are joined.
4). A sheet | seat is cut | disconnected by the end surface of the metal terminal arrange | positioned at a ultraviolet curing adhesive.
5. Bend at the edge of the substrate and the UV curable adhesive layer and bond the adhesive together. 6). Irradiate ultraviolet rays to cure the ultraviolet curable adhesive and peel off the part.

  By passing through the above process, the circuit by which the metal terminal and the wire joint part are arrange | positioned inside can be obtained.

The present invention is not limited to the above-described embodiment, and for example, the following modifications are possible.
1. In the embodiment, the pressure-sensitive adhesive sheet provided with two types of pressure-sensitive adhesives on one substrate is used, but the pressure-sensitive adhesive sheet may be configured by arranging two types of pressure-sensitive adhesive tapes in parallel. That is, with reference to FIG. 1, the coil-forming wire fixing area 14 </ b> A portion of the adhesive sheet has a strong adhesive tape having strong adhesive strength, and the lead-forming wire fixing area 14 </ b> B portion has an adhesive strength higher than the strong adhesive tape. The adhesive sheet is formed by arranging these two tapes in parallel, the adhesive surface of the strong adhesive tape is used as the coil forming wire fixing region 14A, and the adhesive surface of the weak adhesive tape is used as the adhesive sheet. The lead forming wire fixing area 14B can be used.
2. In the embodiment, an ultraviolet curable pressure sensitive adhesive is used as the pressure sensitive adhesive for the lead forming wire fixing region, but a radiation curable pressure sensitive adhesive or a visible light curable pressure sensitive adhesive can be used. In the present invention, both visible light and ultraviolet light are referred to as radiation. All of these adhesives, after fixing the lead forming wire, are irradiated and cured to make the adhesive strength of the lead forming wire fixing region weaker than the adhesive strength of the coil forming wire fixing region. It is possible. The pressure-sensitive adhesive that can be used is only required to have a property of being cured by radiation to form a three-dimensional network, for example, at least two photopolymerizable molecules in the molecule with respect to a normal rubber-based or acrylic pressure-sensitive base resin A compound comprising a low molecular weight compound having a carbon-carbon double bond (hereinafter referred to as a photopolymerizable compound) and a photopolymerization initiator is used.

The above rubber-based or acrylic base resins are natural rubber, rubber polymers such as various synthetic rubbers, or poly (meth) acrylic acid alkyl esters, (meth) acrylic acid alkyl esters, (meth) acrylic acid alkyl esters. And an acrylic polymer such as a copolymer of this and other unsaturated monomers copolymerizable therewith, and if necessary, a cross-linking agent such as a polyisocyanate compound or an alkyl etherified melamine compound is blended. Also good. Examples of the photopolymerizable compound include trimethylolpropane triacrylate, pentaerythritol triacrylate, polyethylene glycol diacrylate, and the like.
3. In the embodiment, a part of the lead forming wire is fixed in the lead forming wire fixing region, but the entire lead forming wire (portion other than the coil portion of the wire) may be fixed. The point is that at least the part of the lead forming wire rod peeled off from the adhesive sheet should be fixed to the lead forming wire rod fixing region.
4). In the embodiment, the coil forming wire fixing area and the lead forming wire fixing area are divided by a straight line, and both areas are quadrangular, but there is no limitation on the division mode and shape of both areas. In the present invention, the adhesive strength of the portion of the adhesive sheet to which the coil forming wire is fixed may be different from the adhesive strength of the portion to which the lead forming wire is fixed. For example, the coil forming wire fixing region is circular. The coil forming wire can be fixed in the coil forming wire fixing region, and the entire other region of the adhesive sheet can be configured as the lead forming wire fixing region.

It is a model perspective view which shows one Embodiment of the planar coil which concerns on this invention. It is a model perspective view which shows one Embodiment of the planar coil which concerns on this invention. It is a model perspective view which shows an example of the conventional planar coil.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Planar coil 11A Coil forming wire 11B Lead forming wire 12 Adhesive sheet 13 Adhesive 13A Strong adhesive 13B Weak adhesive 14A Coil forming wire fixing area 14B Lead forming wire fixing area

Claims (14)

  In a planar coil formed by fixing a coil forming wire and a lead forming wire connected thereto on an adhesive sheet, the adhesive strength of the coil forming wire fixing area of the adhesive sheet and the adhesion of the lead forming wire fixing area A planar coil characterized by different forces.   The planar coil according to claim 1, wherein the adhesive strength of the lead forming wire fixing area of the adhesive sheet is weaker than the adhesive strength of the coil forming wire fixing area.   The planar coil according to claim 2, wherein the adhesive in the lead forming wire fixing region of the adhesive sheet is an adhesive obtained by curing a radiation curable adhesive.   The pressure-sensitive adhesive sheet is composed by arranging in parallel a strong adhesive tape having a strong adhesive strength and a weak adhesive tape having a weaker adhesive strength than the strong adhesive tape, and the adhesive surface of the strong adhesive tape is used for forming a coil. The planar coil according to claim 2, wherein the wire fixing area and the adhesive surface of the weak adhesive tape are used as lead forming wire fixing areas.   It is a planar coil formed by fixing a wire on an adhesive sheet, and the lead forming wire is peeled off from the lead forming wire fixing region of the planar coil according to any one of claims 1 to 4. Characteristic planar coil.   6. The planar coil according to claim 5, wherein the lead forming wire rod fixing region portion of the adhesive sheet is removed.   The planar coil according to claim 5 or 6, wherein a tip portion of the lead forming wire is cut.   A method for producing a planar coil comprising a wire fixed on an adhesive sheet, wherein the adhesive surface is divided into a coil forming wire fixing region and a lead forming wire fixing region as the adhesive sheet, and the coil forming wire fixing Adhesive sheets having different adhesive strengths for the region and lead forming wire fixing regions are used for the coil forming wire fixing region and the lead forming wire fixing region for lead forming. The manufacturing method of the planar coil characterized by comprising the process of wiring a wire.   The method for producing a planar il according to claim 8, wherein the adhesive strength of the lead forming wire fixing area of the adhesive sheet is weaker than the adhesive strength of the coil forming wire fixing area.   The pressure-sensitive adhesive sheet is composed by arranging in parallel a strong adhesive tape having a strong adhesive strength and a weak adhesive tape having a weaker adhesive strength than the strong adhesive tape, and the adhesive surface of the strong adhesive tape is used for forming a coil. The method for manufacturing a planar coil according to claim 9, wherein the wire fixing region and the adhesive surface of the weak adhesive tape are used as lead forming wire fixing regions.   A method of manufacturing a planar coil comprising a wire rod fixed on an adhesive sheet, wherein the adhesive surface is divided into a coil forming wire fixing region and a lead forming wire fixing region as an adhesive sheet, and fixing the lead forming wire rod Using a pressure-sensitive adhesive sheet in which the pressure-sensitive adhesive in the region is a radiation curable pressure-sensitive adhesive, wiring the coil-forming wire in the coil-forming wire fixing region of the pressure-sensitive adhesive sheet, and wiring the lead-forming wire in the lead-forming wire fixing region; A step of making the adhesive force of the lead-forming wire fixing region of the pressure-sensitive adhesive sheet weaker than the adhesive force of the coil-forming wire fixing region by curing the pressure-sensitive adhesive with the lead-forming wire arranged by radiation. A method for producing a planar coil.   The method for producing a planar coil according to any one of claims 8 to 11, further comprising a step of peeling the lead forming wire from a lead forming wire fixing region where the lead forming wire is wired. .   13. The method for manufacturing a planar coil according to claim 12, further comprising a step of removing a lead forming wire fixing region portion of the adhesive sheet.   The method for producing a planar coil according to claim 12 or 13, further comprising a step of cutting a tip portion of the lead forming wire.

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