JP2013030658A - Method for manufacturing electronic device module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device module capable of simply performing formation and adhesion of a spacer for maintaining an interval between facing adherends and improving productivity.SOLUTION: An adhesive film laminate 1A comprises: an adhesive film laminate 1A including an adhesive film 2 consisting of a three layer system that adhesive layers 2b and 2c made of a thermosetting epoxy-system adhesive are formed on both surfaces of a base material 2a consisting of a heat resistant resin film; a release film 3 having an adhesive layer bonded to the adhesive layer 2b or a release agent layer 3b; and a carrier film 4 having an adhesive layer 4b bonded to the adhesive layer 2c. The adhesive film laminate 1A prepared by heat-treating the epoxy-system adhesive solid and flexible at 25°C into a semi-cured state and die-cutting the adhesive film 2 in accordance with a dimension pattern of an electronic device is two-dimensionally arranged on the carrier film 4. The peeling film 3 is peeled to fix the adhesive layer 2b to a substrate and the carrier film 4 is peeled to transfer the die-cut adhesive film 5 on a substrate.

Description

The present invention relates to a method for manufacturing an electronic device module using an adhesive film used for assembling an electronic device or an electronic component on a substrate such as a printed circuit board or an optical glass plate to assemble the electronic device module.
In particular, the present invention relates to a method for manufacturing an electronic device module using an adhesive film used for bonding to a substrate such as an optical glass plate for assembling a light emitting device such as an organic EL device or a display device into the electronic device module. About.

2. Description of the Related Art Conventionally, as an adhesive for bonding a substrate or a component when assembling a semiconductor device, an adhesive sheet formed into a sheet shape is known in addition to a liquid adhesive (for example, Patent Documents 1 and 2).
In paragraphs 0031 to 0034 of Patent Document 1, an adhesive comprising a flexible epoxy resin, a flexible curing agent, a silane coupling agent, and a latent catalyst is formed into three or multiple layers, and the central layer is a silane coupling. There is described a flexible adhesive having a structure that does not contain an agent and has an excellent function of relieving stress, and the outermost layer contains a silane coupling agent so that the adhesive force with an adherend is increased.
In paragraphs 0005 to 0011 of Patent Document 2, an adhesive composition containing an epoxy resin and a curing agent, a siloxane-modified polyamideimide, and a rubber component having a molecular weight of 50,000 or more is applied to a base film to be in a semi-cured state. A thermosetting heat-resistant adhesive film is described that is used after peeling from a base film after heat treatment.

  Conventionally, as a method for bonding the outer peripheral portion of an organic EL element or a semiconductor element to a surface protective layer such as an optical glass plate or a gas barrier film, a liquid sealant is dispensed to the surface protective layer such as an optical glass plate or a gas barrier film. A method of applying the coating on the outer peripheral portion of an organic EL element or a semiconductor element (for example, Patent Documents 3 and 4), or an adhesive film using a photocurable adhesive for a first plate member such as a glass plate After bonding, the second plate-shaped member is directly bonded to the rib material composed of the photocurable adhesive layer patterned by exposure / development and then patterned with a predetermined dimension ( For example, Patent Document 5) is known.

In paragraphs 0011 and FIGS. 1 and 2 of Patent Document 3, an ultraviolet curable or thermosetting liquid adhesive containing a filler to maintain the thickness surrounds the organic EL element on the substrate around the organic EL element. An organic EL panel is described which is applied and sealed with a flexible film having an inorganic barrier film attached thereto.
In paragraphs 0010 to 0011 of FIG. 4 and FIG. 4, spacers are formed on the glass layer, and the microlens array and the glass are sealed with an adhesive such as an epoxy on the top of the silicon substrate having the microlens array. A semiconductor module is described in which a space is formed between the layers.

In paragraphs 0016 to 0023 and FIG. 1 of Patent Document 5, patterning using a photolithography from a film-like photosensitive adhesive provided on the surface of a substrate such as a glass plate, and adhesion to the substrate, A method for manufacturing a display device is described in which an adhesive layer that functions as a spacer for securing a space surrounding an effective area is formed.
Further, in paragraphs 0053 to 0055, 0078 and FIG. 2 of Patent Document 6, an organic EL layer is formed on a supporting substrate such as a glass plate, and a sealing substrate having optical transparency is laminated via an adhesive. For the light emitting device, a sealing method using an adhesive is described.

Japanese Patent Laid-Open No. 11-124557 JP 2002-161261 A JP 2007-059311 A JP 2006-210888 A JP 2009-140666 A JP 2010-045011 A

  However, the adhesive sheet described in Patent Document 1 includes a flexible epoxy resin having rubber elasticity in order to relieve stress due to heat generated during assembly or use of the semiconductor device. In Example 1, a sheet having an inner thickness of 150 μm is punched into a 25 mm square and used. However, in the case where a space is formed between adherends and the periphery thereof is bonded as in the case of bonding a display element to a small optical glass plate, the thickness of the layer having rubber elasticity is increased. Even if it is advantageous to relieve stress due to heat, the thickness variation due to elastic deformation is large, and it is considered difficult to maintain the thickness from being deformed from a predetermined dimension like a spacer.

Moreover, the heat resistant adhesive film described in Patent Document 2 is obtained by adding a siloxane-modified polyamideimide and a rubber component to a solid epoxy resin at room temperature to improve the heat resistance and adhesion of a cured product. However, the thickness of the adhesive is not particularly described except that it is 25 μm in the embodiment, and a space having a predetermined thickness is formed between the adherends as in the case of bonding the display element to the optical glass plate. It is not intended to be used for applications in which it is formed and its periphery is adhered.
In addition, since the module described in Patent Document 3 needs to apply a liquid adhesive with a precise pattern, disposal of an expensive organic EL element becomes unusable if a defect occurs in the liquid adhesive application process. There is a problem of loss.

In the module described in Patent Document 4, it is necessary to form a support structure serving as a spacer in addition to the adhesive. Since the liquid adhesive application process is performed after the spacer formation process on the optical glass plate, the process becomes complicated, and if a defect occurs in the liquid adhesive application process, the expensive optical glass plate is made unusable. There is a problem of disposal loss.
In the manufacturing method of the display device described in Patent Document 5, in a lithography process for forming an adhesive pattern, if an exposure failure occurs during patterning, the glass plate becomes unusable (loss). There is a problem. In addition, as described in paragraphs 0105 to 0106 of Patent Document 5, when the thickness exceeds 100 μm, there is a problem that residual volatile matter in the photosensitive adhesive film is increased and moisture resistance reliability due to foaming is lowered. .

  In the method for sealing a light emitting device described in Patent Document 6, a photocurable adhesive such as an epoxy resin or a thermosetting adhesive can be used as the adhesive, and for example, a thermosetting adhesive sheet is used. It can also be done. Further, in paragraph 0078 of Patent Document 6, after applying a photosensitive epoxy resin adhesive in which a glass spacer (diameter: 300 μm) is dispersed around pixels on a support substrate of an organic EL element, the sealing substrate is pressed. , It is described that an epoxy resin adhesive is cured using a UV lamp to obtain an organic EL light emitting device. However, when the thickness of the adhesive layer is increased to about several hundred μm, the entire adhesive layer is made uniform. There is a problem that it is difficult to cure by UV.

  The present invention has been made in view of the above circumstances, and can easily form and bond a spacer that maintains a distance between opposing adherends, and can improve productivity. It is an issue to provide.

  In order to solve the above-described problems, the present invention is directed to bonding of adherends such as an optical glass plate and a semiconductor substrate having adhesive layers 2b and 2c of an adhesive film 2 having flexibility and different thermal expansion coefficients Even if it is used for, it follows the displacement due to the difference between the temperature change and the coefficient of thermal expansion from the time of bonding, and absorbs the shear stress to the base material 2a, thereby destroying the adhesion between both adherends. An electronic device module manufacturing method using an adhesive film laminate for suppression is provided.

In order to solve the above-described problems, the present invention is a method for manufacturing an electronic device module by bonding an electronic device and a substrate, and includes the following steps (1) to (4): An apparatus module manufacturing method is provided.
(1) Adhesive film having a three-layer structure in which a first adhesive layer and a second adhesive layer each made of a thermosetting epoxy adhesive are formed on both surfaces of a base material made of a heat-resistant resin film. And a release film having a pressure-sensitive adhesive layer or a release agent layer bonded to the first adhesive layer, and a carrier film having a pressure-sensitive adhesive layer bonded to the second adhesive layer, The base material of the adhesive film has a thickness of 20 to 500 μm, and the first adhesive layer and the second adhesive layer have a thickness of 5 to 50 μm and are flexible even in a completely cured state. The epoxy adhesive is heat-treated in a semi-cured state and is a solid having flexibility at 25 ° C., and the adhesive film is punched in accordance with a dimensional pattern of an electronic device, 2 on the carrier film Preparing an adhesive film laminate that is dimensionally arranged;
(2) After peeling off the release film from the adhesive film laminate, the die-cut adhesive film on the carrier film is superposed on a substrate, and the adhesive force of the first adhesive layer by heat treatment Expressing and fixing to the substrate and further peeling the carrier film to transfer the die-cut adhesive film onto the substrate,
(3) a step of dicing the substrate onto which the die-cut adhesive film has been transferred into small pieces in accordance with a dimensional pattern of an electronic device;
(4) An electronic device is overlaid on the second adhesive layer of the die-cut adhesive film transferred to the small piece, and the adhesive force of the second adhesive layer is expressed by heat treatment. Fixing to the electronic device, bonding the small piece of the substrate and the electronic device through the die-cut adhesive film, and assembling the electronic device module.

Moreover, this invention is a method of bonding an electronic device and a board | substrate, and manufacturing an electronic device module, Comprising: The manufacturing method of the electronic device module characterized by including the process of following (1)-(4) I will provide a.
(1) Adhesive film having a three-layer structure in which a first adhesive layer and a second adhesive layer each made of a thermosetting epoxy adhesive are formed on both surfaces of a base material made of a heat-resistant resin film. And a release film having a pressure-sensitive adhesive layer or a release agent layer bonded to the first adhesive layer, and a carrier film having a pressure-sensitive adhesive layer bonded to the second adhesive layer, The base material of the adhesive film has a thickness of 20 to 500 μm, the epoxy adhesive is heat-treated in a semi-cured state, is a solid having flexibility at 25 ° C., and the adhesive film is an electronic A step of preparing an adhesive film laminate that is die-cut according to the dimensional pattern of the device and arranged two-dimensionally on the carrier film;
(2) After peeling off the release film from the adhesive film laminate, the die-cut adhesive film on the carrier film is superposed on a substrate, and the adhesive force of the first adhesive layer by heat treatment Expressing and fixing to the substrate and further peeling the carrier film to transfer the die-cut adhesive film onto the substrate,
(3) An electronic device is overlaid on the second adhesive layer of the die-cut adhesive film transferred to the substrate, and the adhesive force of the second adhesive layer is expressed by heat treatment. Fixing to the electronic device, and bonding the substrate and the electronic device via the die-cut adhesive film,
(4) The process of dicing the board | substrate with which the said electronic device was adhere | attached through the said die-cut adhesive film according to the dimension pattern of an electronic device, and assembling it to an electronic device module.

  It is preferable that the electronic device is a light emitting element or a display element, and the substrate is an optical glass plate.

According to the present invention, patterning of an adhesive film is possible by punching before bonding to an adherend, and the adhesive film can be bonded by placing and bonding between two adherends. The patterning of the adhesive film on the adherend becomes unnecessary. Thereby, the loss of the adherend due to poor patterning does not occur, and a significant reduction in manufacturing cost can be expected. Further, the width of the adhesive is increased as in the case where the liquid adhesive is applied from the dispenser, and there is no possibility that the adhesive is applied to unnecessary portions.
Further, even when the interval between two adherends is large, the thickness of the adhesive film can be increased by increasing the thickness of the base material that is the intermediate layer of the adhesive film having the three-layer structure of the present invention. Therefore, it is possible to save an expensive adhesive and suppress an increase in cost.
Since the adhesive film is die-cut according to the dimensional pattern of the electronic device and is two-dimensionally arranged on the carrier film, a large number of adhesive films can be transferred to one substrate at a time. Can greatly improve the performance.

Further, when manufacturing an electronic device module, a resin for insulating sealing is molded (the operation temperature during processing is about 180 ° C., for example), or solder for connecting circuit wiring is reflowed (when processing is performed). However, since the adhesive film laminate according to the present invention is excellent in heat resistance, it is difficult to deteriorate due to the heat history in the manufacturing process of the electronic device module, and the adhesive performance changes. small.
In addition, since the epoxy adhesive of the adhesive film laminate according to the present invention is flexible even in a completely cured state, it adheres to adherends having different coefficients of thermal expansion, such as optical glass plates and semiconductor substrates. Even if it is used for, it follows the displacement due to the difference between the temperature change from the time of bonding and the coefficient of thermal expansion, and absorbs the shear stress to the base material which is the intermediate layer, and adheres to both adherends Can be prevented from breaking.

It is sectional drawing which shows the 1st example of an adhesive film laminated body used by this invention. It is a perspective view which shows an example of the adhesive film punched in frame shape in the adhesive film laminated body of this invention. It is sectional drawing which shows an example of the pattern of the adhesive film in the adhesive film laminated body of this invention. It is sectional drawing which shows an example of the adhesive film laminated body before an adhesive film is die-cut. It is sectional drawing which shows the 2nd example of an adhesive film laminated body of this invention. It is sectional drawing which shows an example of the state which peeled off the peeling film of the adhesive film laminated body shown in FIG. 5, and was bonded to the optical glass plate. It is sectional drawing which shows an example of the state which transcribe | transferred the adhesive film stamped on the optical glass plate. It is sectional drawing which shows an example of the small piece of the optical glass plate to which the die-cut adhesive film was temporarily fixed. It is sectional drawing which shows an example of the small piece of the optical glass plate to which the electronic device was adhere | attached through the adhesive film. It is sectional drawing which shows an example of the optical glass plate to which the electronic device was adhere | attached through the adhesive film. It is sectional drawing which shows an example of the small piece of the optical glass plate to which the electronic device was adhere | attached through the adhesive film.

Hereinafter, the present invention will be described based on preferred embodiments.
As shown in FIG. 1, an adhesive film laminate 1 </ b> A used in the method for manufacturing an electronic device module according to the present embodiment is formed from a thermosetting epoxy adhesive on both surfaces of a base material 2 a made of a heat resistant resin film. An adhesive film 2 having a three-layer structure in which a first adhesive layer 2b and a second adhesive layer 2c are formed, and a first pressure-sensitive adhesive layer or a release layer bonded to the first adhesive layer 2b. The peeling film 3 which has the agent layer 3b, and the carrier film 4 which has the 2nd adhesive layer 4b bonded by the 2nd adhesive layer 2c are provided.

The substrate 2a of the adhesive film 2 has a thickness of 20 to 500 μm, and the first adhesive layer 2b and the second adhesive layer 2c have a thickness of 5 to 50 μm and are completely cured, respectively. Also has a three-layer structure in which a flexible thermosetting epoxy adhesive layer is formed, and the epoxy adhesive layer is heat-treated in a semi-cured state and has flexibility at 25 ° C. It has a solid state.
In addition, the thermosetting epoxy adhesive layer according to the present invention has a storage elastic modulus (E ′) at 25 ° C. and 1 Hz of 1.0 to 1800 MPa in a completely cured state, and is a completely cured state. In the bending evaluation test at, it is flexible without being broken even by a plurality of bending operations.
As shown in FIGS. 1 to 3, the adhesive film 2 is die-cut according to the dimensional pattern of the electronic device, and a number of die-cut shapes 5 are two-dimensionally arranged on the carrier film 4.

As the base material 2a of the adhesive film 2, a heat resistant resin film is used. The heat resistance required for the substrate 2a means that the decomposition start temperature is at least 200 ° C., and is set according to the temperature of the heat treatment received during the process after the adhesive film is bonded to the adherend. The
As the heat resistant resin constituting the heat resistant resin film, one having a melting point of 180 ° C. or higher is selected. Specific examples of such heat resistant resins include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyether ether ketone (PEEK), polyphenylene sulfide (PPS), and the like.

The adhesive layers 2b and 2c provided on both surfaces of the substrate 2a of the adhesive film 2 add strain in the linear region in a semi-cured state (curing rate 50%), and the storage elastic modulus at a frequency of 1 Hz is 2.0 KPa. Thermosetting epoxy having a storage elastic modulus (E ′) in a linear region at 25 ° C. and 1 Hz at a temperature of 25 ° C. and 1 Hz when a strain dependency measurement is performed in a completely cured state. It consists of system adhesive layers 2b and 2c.
The adhesive layers 2b and 2c are formed by molding an insulating sealing resin (for example, at an operation temperature of about 180 ° C.) or reflowing solder for connecting circuit wiring when manufacturing an electronic device module. What consists of the thermosetting epoxy-type adhesive layers 3 and 4 which do not generate | occur | produce outgas at the temperature to make (for example, about 260 degreeC) is preferable.
Specific examples include Epicron EXA-4816 manufactured by DIC Corporation.

As the epoxy adhesive used for the adhesive layers 2b and 2c, an adhesive having excellent heat resistance and flexibility is used. Examples of such epoxy resins include aliphatic chain-modified epoxy resins, hydrocarbon-modified epoxy resins such as cyclopentadiene-modified epoxy resins and naphthalene-modified epoxy resins, elastomer-modified epoxy resins, and silicone-modified epoxy resins.
Among these resins, an epoxy resin having two or more epoxy groups in one molecule and capable of withstanding one or more bending operations in a bending evaluation test in a completely cured state is a point of flexibility. Is preferable.
As an epoxy resin having two or more epoxy groups in one molecule and having a flexibility capable of withstanding one or more bending operations in the bending evaluation test, DIC Corporation Epicron 860, Epicron 900-IM, Epicron EXA-4816, Epicron EXA-4822, Araldite AER280 manufactured by Asahi Ciba Co., Ltd., Epototo YD-134 manufactured by Tohto Kasei Co., Ltd. JER834 manufactured by Japan Epoxy Resin Co., Ltd., JER872, manufactured by Sumitomo Chemical Co., Ltd. Bisphenol A type epoxy resin such as 134; naphthalene type epoxy resin such as Epicron HP-4032 manufactured by DIC Corporation; and phenol novolac type epoxy resin such as Epicron N-740 manufactured by DIC Corporation. These epoxy resins can be used alone or in combination of two or more.
Among these resins, a particularly preferable specific example is a flexible epoxy resin (trade name EPICLON (registered trademark) EXA-4816) manufactured by DIC Corporation. In this flexible epoxy resin, a long-chain hydrocarbon chain and a bisphenol A skeleton are alternately formed via functional groups such as an acetal bond (divinyl ether having a long-chain hydrocarbon chain), an ether bond, an ester bond, and a carbonate bond. It is a bifunctional epoxy compound obtained by glycidylating OH groups at both ends of a bifunctional phenol compound that has been linked to a high molecular weight.

An appropriate additive can be added to the epoxy adhesive.
Curing agents include: cycloaliphatic acid anhydrides such as methyltetrahydrophthalic anhydride (MTHPA) and hexahydrophthalic anhydride, aromatic acid anhydrides such as trimellitic anhydride, pyromellitic anhydride, and benzophenonetetracarboxylic acid And aliphatic polyamines such as diethylenetriamine, triethylenetetramine and metaxylylenediamine, aromatic polyamines such as diaminodiphenylmethane, m-phenylenediamine and diaminodiphenylsulfone, dicyandiamide and polyphenol compounds.
Examples of the curing accelerator include tertiary amines such as benzyldimethylamine (BDMA), and imidazole compounds such as 2-methylimidazole and 2-ethyl-4-methylimidazole.

When the epoxy adhesive is applied to the base material 2a, it can be made solvent-free if it has sufficient fluidity, but an organic solvent can also be added. Examples of the organic solvent include alcohols such as methanol, ethanol and isopropyl alcohol, aromatic hydrocarbons such as toluene and xylene, ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone, and dimethylformamide.
When applying an epoxy adhesive on both sides of the substrate 2a, after applying the adhesive on one side, before applying the adhesive on the other side, either the release film 3 or the carrier film 4 has been applied. It may be pasted on the adhesive layer.
In FIG. 4, sectional drawing of the adhesive film laminated body 1 before the adhesive film 2 is die-cut is shown.

  In the adhesive film laminate 1A of the present embodiment and the adhesive film laminate 1 before being punched, the epoxy adhesive constituting the adhesive layers 2b and 2c is applied and dried on both surfaces of the substrate 2a of the adhesive film 2 It is heat-treated in a semi-cured state. As a result, since the adhesive layers 2b and 2c are in a solid state having flexibility at 25 ° C., the adhesive film 2 has a through-hole-like space 6 as shown in FIG. It becomes easy to process into a die-cut shape 5 having a desired shape such as a frame shape. Pattern formation defects are less likely to occur compared to application of a liquid material or exposure by photolithography. In addition, even if there is a defect, it is possible to avoid the loss of loss of the adherend by selecting and removing it.

The outer peripheral shape of the frame shape is not particularly limited, such as a circle (round frame) or a quadrangle (square frame). The die cutting method may be any method that removes unnecessary portions using a blade, such as punching or cutting. It is also possible to provide a plurality of through-hole-shaped spaces 6 in one die-cut adhesive film 5.
The size of the die-cut adhesive film (die-cut shape) 5 is preferably set according to the size pattern of the adherend such as the electronic device to be bonded.
The heat treatment for obtaining a semi-cured state suitable for blade processing is completed at a lower temperature and / or in a shorter time than normal curing conditions, and can be appropriately set according to the properties and performance of the epoxy adhesive. it can.

  As the epoxy adhesive constituting the epoxy adhesive layers 2b and 2c, one that can be temporarily fixed at a temperature of 90 to 110 ° C and finally fixed at a temperature of 140 to 160 ° C is selected. The curing temperature of the adhesive can also be controlled by blending a curing agent or a curing accelerator.

  The substrate 2a of the adhesive film 2 has a thickness of 20 to 500 [mu] m, and the epoxy adhesive layers 2b and 2c have a thickness of 5 to 50 [mu] m. The thickness of the base material 2a is preferably about 50 to 98% of the entire thickness of the adhesive film 2 (that is, the total thickness of the first adhesive layer 2b, the base material 2a, and the second adhesive layer 2c).

The release film 3 is a protective film that is first peeled when the adhesive film laminate 1 </ b> A is used, and the carrier film 4 is a support substrate that supports the adhesive film 2 even after the release film 3 is peeled off. As the release film 3 and the carrier film 4, a single-sided adhesive film in which an adhesive layer or a release agent layer 3b and an adhesive layer 4b are provided on the substrates 3a and 4a is preferably used.
Examples of the film constituting the substrates 3a and 4a include polyester film, polycarbonate film, polyamide film, polyimide film, polystyrene film, polyolefin film, polyarylate film, polyethersulfone film, polysulfone film, norbornene film, and phenoxy ether. Examples thereof include single-layer or multi-layer plastic films including mold polymer films and organic gas-resistant films.
Examples of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer or release agent layer 3b and the pressure-sensitive adhesive layer 4b include acrylic pressure-sensitive adhesives, rubber-based pressure-sensitive adhesives, and silicone-based pressure-sensitive adhesives.
Moreover, as a release agent which comprises a release agent layer, although arbitrary release agents can be used, the silicone type release agent with the outstanding peeling characteristic is desirable.

In the adhesive film laminate 1A of this embodiment, the release film 3 is peeled from the adhesive film laminate 1 before die cutting, and then the adhesive film 2 is punched on the carrier film 4 according to the dimensional pattern of the adherend. Accordingly, as shown in FIG. 3, a die-cut shape 5 (in the example of FIG. 3, a rectangular frame shape) formed in accordance with the dimension pattern of the adherend is formed on the carrier film 4. It can be processed so as to be in a two-dimensional arrangement.
Since the carrier film 4 has the pressure-sensitive adhesive layer 4b to be bonded to the adhesive film 2, the solid adhesive layers 2b and 2c having flexibility at room temperature of 25 ° C. are used as the base material 2a at the time of die cutting. It is possible to hold the adhesive film 2 on both surfaces more reliably.

Further, after the die-cutting of the adhesive film 2, as shown in FIG. 1, the die-cut adhesive film 5 is again covered with the release film 3 and wound up into a roll shape, and the die-cut adhesive film 5 is peeled off. An adhesive film laminate 1A supported between the film 3 and the carrier film 4 can also be manufactured.
In this case, since the adhesive film laminate 1A that has passed the product inspection can be wound and stored in a roll until it is used in the assembly process of the semiconductor device, for example, when used in the assembly process of the semiconductor device Therefore, it is not necessary to perform die-cutting and product inspection of the adhesive film 2, and the productivity of the assembly process of the semiconductor device can be further improved.
Since the release film 3 and the carrier film 4 have the pressure-sensitive adhesive layer or the release agent layer 3b and the pressure-sensitive adhesive layer 4b to be bonded to the adhesive film 2, respectively, they are wound around the roll, fed out from the roll, and transported. At this time, it is possible to more reliably hold the adhesive film 2 in which the solid adhesive layers 2b and 2c having flexibility at room temperature of 25 ° C. are arranged on both surfaces of the substrate 2a.

Further, as shown in FIG. 5, the adhesive film 2 has a configuration in which the die-cut shape 5 of the adhesive film 2 is a frame shape, and the carrier film 4 is cut out at a position corresponding to the space 6 in the frame of the die-cut shape 5. The laminated body 1B can also be manufactured. In this case, as shown in FIG. 6, when the release film 3 is peeled and the adhesive film 2 having a die-cut shape 5 is bonded to an adherend such as the optical glass plate 7, the base material 4 a of the carrier film 4. Since the hole 4c is removed in the second pressure-sensitive adhesive layer 4b, the second pressure-sensitive adhesive layer 4b of the carrier film 4 is attached to the adherend such as the optical glass plate 7 through the space 6 in the frame. It can be prevented from adhering (transferring) to and becoming dirty.
The step of punching the adhesive film 2 at the position of the space 6 and the step of opening the hole 4c corresponding to the space 6 in the carrier film 4 can be performed simultaneously or in separate steps.
The adhesive film laminate 1B shown in FIG. 5 can also be wound and stored in a roll shape until the assembly process of the semiconductor device is performed, similarly to the adhesive film laminate 1A of FIG.

The above-mentioned adhesive film laminates 1A and 1B are suitable for manufacturing processes of electronic device modules 10 and 10A in which an element substrate (electronic device) 8 is bonded to an optical glass plate 7 as shown in FIGS. Can be used.
The electronic apparatus 8 of this embodiment is an element substrate such as a light emitting element or a display element, and has a device 9 such as a display element on the side facing the substrate 7 such as an optical glass plate. Although the device 9 is not specifically limited, For example, it is light emitting elements and display elements, such as an organic EL element.

The die-cut shape 5 of the adhesive film 2 has a space 6 for exposing the device 9. This space 6 can pass physical stimuli such as light emitted by the device 9. The device 9 is preferably a display device that emits a physical stimulus such as light.
In addition, as a board | substrate 7 bonded with the electronic device 8, it is also possible to employ | adopt various board | substrates, such as a printed circuit board, an insulating substrate, a resin substrate, a semiconductor substrate, besides an optical glass plate (board | substrate). The substrate may be a flexible film or sheet.

As described above, the adhesive film 2b, 2c of the present embodiment is a solid material having flexibility at room temperature of 25 ° C. Therefore, when the substrate 7 and the electronic device 8 are bonded together, First, the first adhesive layer 2b is overlapped with the substrate 7 and temporarily fixed by heating and pressing, and then the second adhesive layer 2c is overlapped with the electronic device 8 and temporarily fixed by heating and pressing. Furthermore, it is preferable to raise the heating temperature and finally fix.
Here, the temperature for temporary fixing is a temperature at which the adhesive can be melted to exhibit adhesion to the adherend, and the temperature for final fixing is a temperature at which the adhesive is cured to further increase the adhesive strength. Since the curing of the adhesive is suppressed at the temporary fixing stage, even if the adhesive is cooled after temporary fixing, the adhesiveness can be exhibited by heating again. After the final fixation, the adhesive becomes heat-cured and cannot be remelted, and the heat resistance is improved.

In addition, in the method for manufacturing an electronic device module according to the present invention, assuming that the adherend of the adhesive film is, for example, optical glass and a silicon wafer, the linear expansion coefficients of these materials are shown in Table 1. .
When these adherends having greatly different thermal expansion coefficients (linear expansion coefficients) are bonded via the adhesive film according to the present invention, when the adhesive film is heated to a high temperature, it is compared with the silicon wafer as the adherend. Thus, the optical glass having a large linear expansion coefficient of about 2.5 times is pulled in the direction of expanding the entire adhesive film. If the adhesive film does not have flexibility and is firmly adhered to the adherend, it may eventually be destroyed by thermal stress.

  However, in the method of manufacturing an electronic device module according to the present invention, the adhesive layers 2b and 2c of the adhesive film 2 have flexibility, and therefore have different thermal expansion coefficients, for example, for bonding optical glass plates and semiconductor substrates. Even if it is used, it follows the displacement due to the difference between the temperature change from the time of bonding and the coefficient of thermal expansion, absorbs the shear stress to the substrate 2a, and suppresses the destruction of the adhesion between both adherends. can do.

A first embodiment of the method for manufacturing an electronic device module according to the present invention will be exemplified below.
(1) First, the above-mentioned adhesive film laminates 1A and 1B are prepared.
(2) After peeling off the release film 3 from the adhesive film laminates 1A and 1B, the die-cut adhesive film 5 on the carrier film 4 is superposed on the substrate 7, and the first adhesive layer 2b is subjected to heat treatment. The adhesive force is expressed and fixed to the substrate 7. At this stage, heat treatment is applied to the adhesive layers 2b and 2c at a temporarily fixed temperature.
Further, by peeling off the carrier film 4, a plurality of die-cut adhesive films 5 can be transferred onto the substrate 7 as shown in FIG.

(3) As shown in FIG. 8, the substrate 7 onto which the die-cut adhesive film 5 has been transferred is diced into small pieces according to the dimensional pattern of the electronic device 8.
(4) Overlay the electronic device 8 on the second adhesive layer 2c of the die-cut adhesive film 2 transferred to the small piece of the substrate 7. The adhesive force of the second adhesive layer 2c is expressed by heat treatment and fixed to the electronic device 8, and, as shown in FIG. 9, the small piece of the substrate 7 and the electronic device 8 are interposed through the die-cut adhesive film 5. And the electronic device module 10 is assembled.

  The epoxy adhesive used for the adhesive layers 2b and 2c in this embodiment does not deteriorate the adhesive performance even if it comes into contact with water when the substrate 7 such as an optical glass plate is diced. Further, even if several days elapse between the time (2) temporarily fixed to the substrate 7 and the time (4) adhesion to the electronic device 8, the adhesion performance does not deteriorate.

In the present invention, as shown in FIG. 7, after the plurality of die-cut adhesive films 5 are transferred onto the substrate 7, the substrate 7 and the electronic device 8 are bonded to each other before dicing the substrate 7 into small pieces. It can adhere | attach through the die-cut adhesive film 5. FIG.
A second embodiment of the method for manufacturing an electronic device module according to the present invention will be exemplified below.

(1) and (2) are the same as the manufacturing method of the first embodiment.
(3) Overlay the electronic device 8 on the second adhesive layer 2c of the die-cut adhesive film 5 transferred to the substrate 7, and express the adhesive force of the second adhesive layer 2c by heat treatment. And it fixes to the electronic device 8, and the board | substrate 7 and the electronic device 8 are adhere | attached through the adhesive film 5 which was die-cut.
In this case, as shown in FIG. 10, as the electronic device 8, a configuration in which a plurality of electronic devices 8 are continuous in a substrate shape, such as a semiconductor wafer, may be employed.

(4) As shown in FIG. 11, the substrate 7 to which the electronic device 8 is bonded via the die-cut adhesive film 5 is diced into small pieces according to the dimensional pattern of the electronic device 8 to form the electronic device module 10 </ b> A. assemble. In this case, the electronic device module 10 </ b> A can be configured from each individual piece obtained by dicing.
In the case where a plurality of electronic devices are arranged in a substrate shape, the electronic devices are diced together with the substrate 7. In this case, the planar dimension of the substrate 7 is usually the same as the planar dimension of the electronic device.

  Hereinafter, the present invention will be specifically described with reference to examples.

<Example 1>
The manufacturing method of the adhesive film laminated body of Example 1 regarding the manufacturing method of the electronic device module of this invention is as follows.
A flexible epoxy resin (trade name EPICLON (registered trademark) EXA-4816) manufactured by DIC Corporation as an epoxy adhesive was applied to one side of a polyethylene terephthalate (PET) resin film having a thickness of 100 μm so as to have a dry thickness of 15 μm. . After pasting a release film having a pressure-sensitive adhesive layer or release agent layer on the adhesive application surface, the same flexible epoxy resin is applied to the opposite surface of the PET resin film with the same dry film thickness. A carrier film having a pressure-sensitive adhesive layer was bonded to the adhesive application surface.
After the application of the epoxy adhesive, heat treatment was performed at 120 ° C. for 4 minutes to obtain an adhesive film comprising a three-layer structure in which the epoxy adhesive was semi-cured and sandwiched between the release film and the carrier film.
The adhesive film is two-dimensionally arranged on the carrier film by punching the adhesive film into a size and shape simulating an electronic device composed of a square frame having an outer dimension of 10 mm square and an inner diameter dimension of 8 mm square. 1 adhesive film laminate was prepared.
Moreover, about the epoxy adhesive agent used for the adhesive film laminated body of Example 1, the measurement of the storage elastic modulus in the following semi-hardened state, the measurement of the storage elastic modulus in a fully hardened state, and the bending evaluation test were done.
Moreover, about the obtained adhesive film laminated body of Example 1, when peeling film and carrier film were peeled and the epoxy adhesive layer of the adhesive film was touched, the epoxy adhesive layer has flexibility at 25 ° C. It was confirmed that it was in a dry state with no stickiness even when touching the surface of the adhesive with a finger and showed no tackiness.
Moreover, since the adhesive film laminated body of Example 1 obtained was a solid state having flexibility at 25 ° C., the operation of punching the adhesive film to a size simulating an electronic device was performed. Could be done easily.

(Thermogravimetric measurement of epoxy adhesive)
A TG curve was obtained by thermogravimetry (TG) of the epoxy adhesive used in the method for producing an adhesive film laminate of Example 1. In the obtained TG curve, an onset temperature was observed at 332 ° C., and the weight change rate at that time was −13.5%. Therefore, the decomposition onset temperature of this epoxy adhesive was determined to be 332 ° C.

(Outgas evaluation of epoxy adhesive)
Moreover, after completely curing the epoxy adhesive used in the method for producing an adhesive film laminate of Example 1, the heat resistance at 260 ° C. was evaluated by pyrolysis gas chromatograph measurement. The temperature was increased from 250 ° C. at 10 ° C. per minute and reached 260 ° C., and then maintained at 260 ° C. for 10 minutes. It was confirmed that no outgas was generated during that time.

(180 ° peel strength when temporarily fixed)
In order to evaluate the performance when the adhesive film laminate of Example 1 was used for temporarily fixing an optical glass plate, 180 ° peel strength at the time of temporarily fixing was measured by the following method.
From the adhesive film obtained by removing the release film and the carrier film from the adhesive film laminate of Example 1, five test pieces having a width of 10 mm were prepared, and the optical glass plate preheated to 100 ° C. was 100 ° C., One end of each test piece was pressure-bonded under conditions of 500 gf / cm ² for 1 second to prepare a temporarily fixed sample. When the 180 ° peel strength was measured while pulling the other end (free end) of each test piece at a peel rate of 300 mm / min, the peel strength averaged at n = 5 was 927 gf.

(Shear shear strength at final fixation)
In order to evaluate the performance when the adhesive film laminate of Example 1 was finally fixed to an optical glass plate and a silicon substrate, shear shear strength (tensile shear adhesive strength) was measured by the following method.
In the sample, an elongated optical glass plate and a silicon substrate are overlapped only at one end, and are bonded via the adhesive film of Example 1, and the other end of the optical glass plate and the other end of the silicon substrate are bonded to each other. It is the structure arranged on the opposite side of the length direction via.
First, an adhesive film prepared by processing 10 mm (width) × 10 mm (length in the tensile direction) was placed on one end of an optical glass plate having a width of 10 mm, and the sample was prepared at 100 ° C., 500 gf / cm ² , After crimping and temporarily fixing under the condition of 1 second, one end of a silicon substrate having a width of 10 mm is overlapped via an adhesive film, and after being temporarily crimped and fixed under conditions of 100 ° C. and 500 gf / cm ² for 1 second. , 150 ° C. for 1 minute, and a method of heat-curing and final fixing.
When the other end portion of the optical glass plate was held and fixed with a jig and a tensile load of 20 kgf was applied using the other end portion of the silicon substrate as a grip portion, the bonded portion was not broken every time the number of samples was 5. From this, it was found that the shear shear strength averaged at n = 5 was 20 kgf or more.

<Example 2>
As the method for producing the adhesive film laminate of Example 2 relating to the method for producing an electronic device module of the present invention, as an epoxy adhesive, a flexible epoxy resin (trade name EPICLON (registered trademark) EXA-4850 manufactured by DIC Corporation) is used. The adhesive film laminate of Example 2 is obtained in which the die-cut adhesive film is two-dimensionally arranged on the carrier film by the same production method as in Example 1 except that -150) is used. It was.
About the epoxy adhesive used for the adhesive film laminated body of Example 2, like Example 1, the measurement of the storage elastic modulus in a semi-cured state, the measurement of the storage elastic modulus in a completely cured state, and the bending evaluation test went.
Moreover, the epoxy adhesive layer used for the obtained adhesive film laminate of Example 2 was a solid with flexibility at 25 ° C.
Moreover, the obtained adhesive film laminated body of Example 2 was able to easily perform the work of punching out the adhesive film to a size simulating an electronic device.

<Comparative Example 1>
As the method for producing the adhesive film laminate of Comparative Example 1 relating to the method for producing an electronic device module of the present invention, as an epoxy adhesive, a BPA type liquid epoxy resin (trade name EPICLON (registered trademark) 840- Except for using S), an adhesive film laminate of Comparative Example 1 was obtained in which the die-cut adhesive film was two-dimensionally arranged on the carrier film by the same production method as in Example 1. .
About the epoxy adhesive used for the adhesive film laminated body of the comparative example 1, similarly to Example 1, the measurement of the storage elastic modulus in the semi-cured state, the measurement of the storage elastic modulus in the fully cured state, and the bending evaluation test went.
Moreover, the epoxy adhesive layer used for the obtained adhesive film laminate of Comparative Example 1 was solid at 25 ° C.
In addition, the adhesive film laminate of Comparative Example 1 obtained had a slightly harder adhesive layer at 25 ° C. in a semi-cured state than Examples 1 and 2, but the adhesive film was sized to simulate an electronic device. The work of punching out was able to be performed relatively easily.

(Measurement method of storage elastic modulus of epoxy adhesive layer in fully cured state)
Epoxy adhesive layer in a fully cured state having a thickness of about 0.5 mm, a width of about 5 mm, and a length of about 3 mm, using an automatic dynamic viscoelasticity measuring device (model: RSA-3) manufactured by TA Instrument The sample was measured for strain dependency, and the value in the linear region of the storage elastic modulus (E ′) when a frequency of 1 Hz was applied at an atmospheric pressure of 25 ° C. was obtained.

(Method for measuring storage elastic modulus of epoxy adhesive layer in semi-cured state)
Anton Paar's automatic dynamic viscoelasticity measuring device (model: MCR-301) is used, a flat plate with a diameter of 25 mm, strain in the linear region is added, the frequency is raised from 1 Hz and 30 ° C to 200 ° C. The uncured liquid epoxy adhesive is measured over time while heating at a temperature rate of 5 ° C./min. The storage elastic modulus increases with the progress of curing of the epoxy adhesive, and becomes constant by complete curing. The midpoint of the storage elastic modulus when the epoxy adhesive layer was uncured and the storage elastic modulus when completely cured was determined as the storage elastic modulus in a semi-cured state (for example, a curing rate of 50%).

(Bending evaluation test of epoxy adhesive)
In order to determine whether the thermosetting epoxy adhesive layer has flexibility in a completely cured state, a bending evaluation test of the epoxy adhesive was performed by the following method.
A sample for a bending evaluation test in which the thickness of the epoxy adhesive was 1 mm, the width was 15 mm, and the length was 100 mm was completely cured. The sample is suspended and fixed vertically, a load of 1 kg is suspended from the lower end of the sample, a load is applied in the vertical direction, and 135 ° and 180 ° are respectively applied to the front and back of the sample (left and right from the vertical line of the sample). Folding was performed under the condition of reciprocation / 1 min, and the number of folding operations until breaking was obtained.

  Example 1, Example 2, and Comparative Example 1 were subjected to a storage elastic modulus in a semi-cured state, a storage elastic modulus in a fully cured state, and a bending evaluation test, respectively. The measurement results are shown in Table 2.

In the results of the bending evaluation test of the epoxy adhesive used for the adhesive film shown in Table 2, the epoxy adhesives of Example 1 and Example 2 have the number of folding operations until the sample for the bending test breaks, respectively. It was 10 times and 520 times, and had sufficient flexibility not to be broken by a plurality of bending operations.
On the other hand, in the comparative example 1, in the bending evaluation test of the epoxy adhesive, since it was destroyed in the first bending operation, it did not have flexibility and applied to the epoxy adhesive related to the adhesive film of the present invention. It was impossible.
From the above results, the adhesive films of Examples 1 and 2 according to the present invention are heat-treated in a semi-cured state, which is necessary for manufacturing an electronic device module, and are in a solid state having flexibility at 25 ° C., Furthermore, since it has flexibility even in a completely cured state, it was confirmed that it has both flexibility and shape retention as a spacer.

DESCRIPTION OF SYMBOLS 1,1A, 1B ... Adhesive film laminated body, 2 ... Adhesive film, 2a ... Base material of adhesive film, 2b ... 1st adhesive layer, 2c ... 2nd adhesive layer, 3 ... Release film, 3a ... Release Film substrate, 3b ... first adhesive layer or release agent layer, 4 ... carrier film, 4a ... carrier film substrate, 4b ... second adhesive layer, 4c ... hole, 5 ... die cut Adhesive film (die-cut shape), 6 ... space, 7 ... optical glass plate (substrate), 8 ... element substrate (electronic device), 9 ... device, 10, 10A ... electronic device module.

Claims (3)

A method of manufacturing an electronic device module by bonding an electronic device and a substrate, the method including the following steps (1) to (4):
(1) Adhesive film having a three-layer structure in which a first adhesive layer and a second adhesive layer each made of a thermosetting epoxy adhesive are formed on both surfaces of a base material made of a heat-resistant resin film. And a release film having a pressure-sensitive adhesive layer or a release agent layer bonded to the first adhesive layer, and a carrier film having a pressure-sensitive adhesive layer bonded to the second adhesive layer, The base material of the adhesive film has a thickness of 20 to 500 μm, and the first adhesive layer and the second adhesive layer have a thickness of 5 to 50 μm and are flexible even in a completely cured state. The epoxy adhesive is heat-treated in a semi-cured state and is a solid having flexibility at 25 ° C., and the adhesive film is punched in accordance with a dimensional pattern of an electronic device, 2 on the carrier film Preparing an adhesive film laminate that is dimensionally arranged;
(2) After peeling off the release film from the adhesive film laminate, the die-cut adhesive film on the carrier film is superposed on a substrate, and the adhesive force of the first adhesive layer by heat treatment Expressing and fixing to the substrate and further peeling the carrier film to transfer the die-cut adhesive film onto the substrate,
(3) a step of dicing the substrate onto which the die-cut adhesive film has been transferred into small pieces in accordance with a dimensional pattern of an electronic device;
(4) An electronic device is overlaid on the second adhesive layer of the die-cut adhesive film transferred to the small piece, and the adhesive force of the second adhesive layer is expressed by heat treatment. Fixing to the electronic device, bonding the small piece of the substrate and the electronic device through the die-cut adhesive film, and assembling the electronic device module. A method of manufacturing an electronic device module by bonding an electronic device and a substrate, the method including the following steps (1) to (4):
(1) Adhesive film having a three-layer structure in which a first adhesive layer and a second adhesive layer each made of a thermosetting epoxy adhesive are formed on both surfaces of a base material made of a heat-resistant resin film. And a release film having a pressure-sensitive adhesive layer or a release agent layer bonded to the first adhesive layer, and a carrier film having a pressure-sensitive adhesive layer bonded to the second adhesive layer, The base material of the adhesive film has a thickness of 20 to 500 μm, the epoxy adhesive is heat-treated in a semi-cured state, is a solid having flexibility at 25 ° C., and the adhesive film is an electronic A step of preparing an adhesive film laminate that is die-cut according to the dimensional pattern of the device and arranged two-dimensionally on the carrier film;
(2) After peeling off the release film from the adhesive film laminate, the die-cut adhesive film on the carrier film is superposed on a substrate, and the adhesive force of the first adhesive layer by heat treatment Expressing and fixing to the substrate and further peeling the carrier film to transfer the die-cut adhesive film onto the substrate,
(3) An electronic device is overlaid on the second adhesive layer of the die-cut adhesive film transferred to the substrate, and the adhesive force of the second adhesive layer is expressed by heat treatment. Fixing to the electronic device, and bonding the substrate and the electronic device via the die-cut adhesive film,
(4) The process of dicing the board | substrate with which the said electronic device was adhere | attached through the said die-cut adhesive film according to the dimension pattern of an electronic device, and assembling it to an electronic device module.   The method of manufacturing an electronic device module according to claim 1, wherein the electronic device is a light emitting element or a display element, and the substrate is an optical glass plate.

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